EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
MPN: EP3SE80F1152C4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1285 | $1,285.00 |
| 10 | $1195 | $11,950.00 |
| 100 | $1080 | $108,000.00 |
| 500 | $980 | $490,000.00 |
| 1,000 | $895 | $895,000.00 |
EP3SE80F1152C4 Overview
What is a Stratix III E FPGA? Stratix III E is the enhanced-logic-and-memory variant of Intel's Stratix III 65 nm FPGA portfolio, an SRAM-programmable logic device that sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. Compared with the Stratix III L variant (logic-optimized) and the Cyclone series (cost-optimized), the E family triples on-chip memory bandwidth by adding dedicated MLAB + M9K + M144K TriMatrix memory blocks, and it is typically chosen when a design needs both rich logic capacity and many megabits of distributed/Block RAM.
Key features include 80,000 logic elements (LEs), 3,200 Logic Array Blocks (LABs), 6,843,392 total RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, MultiTrack interconnect with hierarchical routing, and 744 general-purpose I/Os split across 16 or more I/O banks supporting multiple single-ended and differential I/O standards. The 65 nm low-k process and an adaptive logic module (ALM) architecture deliver roughly twice the performance-per-logic-element of the prior Stratix II generation while cutting dynamic power by 50%.
Architecturally, the EP3SE80F1152C4 uses the ALM-8 (8-input fracturable LUT) building block, TriMatrix embedded memory (MLAB / M9K / M144K), and dedicated variable-precision DSP blocks. The hard memory controller and high-speed transceivers (not present on this specific part number variant) are bypassed in favor of fabric-only I/O, which keeps die cost down for designs that need abundant user I/O and on-chip memory but not multi-gigabit serial links.
Typical applications include high-performance digital signal processing, video processing and image pre-processing pipelines, ASIC prototyping, multi-channel protocol aggregation (e.g., 10/40 Gbps Ethernet bridges), and embedded control with large on-chip memory footprints. The 1152-BGA package also enables dense PCB layouts for line cards and mezzanine modules.
When designing with the EP3SE80F1152C4, plan for JTAG-based configuration with EPCS serial configuration devices, plan derating for FBGA solder-joint reliability under thermal cycling, and validate signal-integrity on the 744 I/Os with the Quartus II SignalTap and TimeQuest timing analyzer tool flow. The device is in active production but is now positioned as a mature-node FPGA; lead times should be confirmed with authorized distributors.
Drop-in alternatives for EP3SE80F1152C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152C4 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F1152C3N
✅ Drop-In✓ In Stock
$1690 / Unit
View Datasheet →EP3SE80F1152C3
✅ Drop-In✓ In Stock
$1880 / Unit
View Datasheet →EP3SE80F1152C2N
✅ Drop-In✓ In Stock
$2685 / Unit
View Datasheet →EP3SE80F1152C2
✅ Drop-In✓ In Stock
$1325 / Unit
View Datasheet →EP3SE110F1152C4
✅ Drop-In✓ In Stock
$2200 / Unit
View Datasheet →EP3SE80F1152C4 Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Family | Stratix III Enhanced |
| Device Type | FPGA |
| Logic Elements | 80,000 |
| Logic Array Blocks (LABs) | 3200 |
| Total RAM Bits | 6,843,392 |
| User I/Os | 744 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm CMOS |
| Internal Frequency (max) | 800 MHz |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) |
| RoHS Status | Compliant |
EP3SE80F1152C4 1152-ball fc-fbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP3SE80F1152C4 (1152-ball fc-fbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152C4 is suitable for 6 applications: ASIC Prototyping and Emulation, High-Performance DSP and Baseband Processing, Video and Image Processing Pipelines, Industrial Control and Motion Control, Telecom Line Cards and Protocol Aggregation, Medical Imaging Front-End Processing.
ASIC Prototyping and Emulation
The EP3SE80F1152C4 fits ASIC prototyping platforms because its 80,000 logic elements and 6,843,392 bits of on-chip TriMatrix memory (MLAB + M9K + M144K blocks) deliver the fabric density and memory bandwidth required to map large SoC RTL into a single device. With 744 user I/Os across multiple banks, engineers can break out peripheral buses, memory interfaces, and trace ports without external muxes. The 1152-FBGA package exposes enough pins for ASIC-to-FPGA partition debugging, and Quartus II's TimeQuest timing analyzer converges quickly on the Stratix III E architecture for >100 MHz multi-clock domain emulation.
Recommended
High-Performance DSP and Baseband Processing
The EP3SE80F1152C4's variable-precision DSP blocks (each with multiple 18x18 multipliers and hardware accumulate chains) make it well-suited for multi-channel baseband DSP, software-defined radio pre-processing, and fixed/floating-point signal chains. The 80K LE fabric and 6.8 Mbit of fast block RAM allow FFT window buffers and channelizer coefficient tables to sit on-die, removing external memory latency. Operating at 0C to +85C with 1.1 V core, it fits into line-card and base-station mezzanine designs where processing density per square inch is critical.
Recommended
Video and Image Processing Pipelines
For broadcast video routers, multi-stream transcoders, and machine-vision front-ends, the EP3SE80F1152C4 provides 744 I/Os that can drive parallel LVDS/CMOS camera interfaces, BT.656/1120 video buses, and HDMI/DVI bridge logic without external muxing. The TriMatrix memory and 800 MHz fabric combine to support line buffers and pixel-domain processing at 1080p60 and beyond. The 1.1 V core and Stratix III E power-optimized ALM architecture reduce dynamic power compared with the prior Stratix II generation, important in fanless video-wall controllers.
Recommended
Industrial Control and Motion Control
In multi-axis servo drives, CNC controllers, and high-channel-count industrial PCs, the EP3SE80F1152C4 integrates deterministic logic, quadrature decoder IP, EtherCAT / PROFINET MACs, and safety logic in one part. Its 744 I/Os accommodate dozens of incremental encoder inputs and PWM outputs, while the 80K LE fabric absorbs the deterministic cycle budgets of multiple motor-control loops. The 0C to +85C commercial range fits indoor cabinet environments; the I4 industrial variant extends to -40C to +100C for harsh factory-floor deployment.
Recommended
Telecom Line Cards and Protocol Aggregation
Stratix III E FPGAs are widely deployed in carrier-grade line cards for protocol bridging (SONET/SDH, OTN, Ethernet), packet classification, and traffic shaping. The EP3SE80F1152C4's 6.8 Mbit on-chip memory supports deep FIFO queues for back-pressure handling, while 744 I/Os expose multiple SGMII / LVDS links. The 65 nm low-k process and 1.1 V core keep per-port power competitive with ASIC counterparts, while the FPGA programmability enables late-stage feature additions on shipping hardware.
Recommended
Medical Imaging Front-End Processing
In ultrasound beamformers, CT pre-processors, and digital X-ray detectors, the EP3SE80F1152C4 is used as a parallel channel aggregator and digital down-converter, thanks to its high DSP block count and abundant TriMatrix memory for channel data buffering. The 744 I/Os interface to multi-channel ADC arrays without external demux. Stable long-lifecycle supply (Stratix III E remains in active production) and the availability of -40C to +100C I-grade variants make the family attractive for regulated medical programs that require 10+ year component continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152C4N | EP3SE80F1152C3N | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C4 |
|---|---|---|---|---|---|---|---|
| Package | 1152-FBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 |
| RAM Bits | 6,843,392 | 6,843,392 | 6,843,392 | 6,843,392 | 6,843,392 | 6,843,392 | 8,847,360 (approx) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C4 (fastest) | C4 | C3 (-1 speed bin) | C3 (-1 speed bin) | C2 (-2 speed bin) | C2 (-2 speed bin) | C4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Terminal Finish | SnPb (e1) | Pb-free (e3) | Pb-free (e3) | SnPb (e1) | Pb-free (e3) | SnPb (e1) | SnPb (e1) |
| Approx. Unit Price @ qty 100 (USD) | 1080.00 | 1095.00 | 1035.00 | 1020.00 | 985.00 | 965.00 | 1320.00 |
Key Differentiators
- Memory-rich Stratix III E variant with 6.8 Mbit TriMatrix RAM (vs Stratix III L (Logic-optimized) variants)
- Lowest power Stratix III generation via 65 nm low-k process and ALM architecture (vs Stratix II (90 nm) predecessors)
- Same-die speed grade options enable cost/performance tuning (vs EP3SE80F1152C2N (C2 speed bin))
Design Notes
Estimated: at typical Stratix III E utilization (~70% LE, ~50% toggle rate, 200 MHz fabric), the EP3SE80F1152C4 dissipates roughly 4-7 W. The 1152-FBGA package has a published theta_JA near 11 C/W with a 4-layer JEDEC test board; therefore a 70C ambient would place the die at roughly 110-145C, which exceeds the 85C commercial junction spec. A 4-layer PCB with a continuous ground plane and bottom-side thermal pad stitching under the BGA, plus 200-400 LFM of airflow, is the minimum thermal mitigation. For fanless systems, a heat spreader bonded with thermal interface material is recommended.
The 1152-ball FBGA has a 1.0 mm ball pitch. PCB design must use microvia stack-ups (laser-drilled 4-mil vias on a 1-6-1 build-up or equivalent) to fan out the inner balls without violating the 0.2 mm via-to-pad clearance. Reference the Stratix III E Device Handbook, Chapter 9, for the recommended fan-out pattern. All VCCINT and GND balls must be solidly stitched into the inner planes; a missing GND ball can cause PowerPlane noise that triggers spurious Single Event Upsets (SEU) in the configuration SRAM. Decoupling: 0.1 uF X7R per VCC pin plus bulk 22 uF X5R per VCC rail within 200 mils.
Because the EP3SE80F1152C4 drives up to 744 user I/Os across multiple I/O banks, mixed-voltage banks (1.5V, 1.8V, 2.5V, 3.3V LVCMOS, plus LVDS and SSTL) must reference a common VREF. Use IBIS models (Stratix III E device IBIS package) for board-level SI simulation of LVDS-25 and DDR2/DDR3 SSTL interfaces. Series-termination resistors should be tuned to within +/-10% of the impedance target; failing to dampen 50 MHz+ DDR edges can create reflections that fail the Quartus TimeQuest DDR timing margin check.
Stratix III E FPGAs are SRAM-based, so the configuration bitstream must be reloaded after every power cycle. A dual-image boot strategy with an EPCS16 / EPCS64 / EPCQ256 serial flash is recommended for field-recoverable upgrades. Connect MSEL[0..3] to the appropriate pull-up/pull-down combination to select AS (active serial), Fast Passive Parallel (FPP), or JTAG-only configuration; leaving MSEL floating causes intermittent config failures. After configuration, assert nCONFIG high and observe nSTATUS going high within 1 ms; persistent nSTATUS-low indicates a bitstream CRC mismatch.
Common pitfalls with the EP3SE80F1152C4: (1) Quoting Str atix II timing closures when designing for Stratix III - the ALM-8 architecture introduces different retiming rules; always run Quartus II v13.0sp1 or later. (2) Assuming the -C4 speed grade is a 'free upgrade' over -C3; the C4 die is actually a separately-tested speed bin and not all lots are available. (3) Using a SnPb-finish variant on a Pb-free production line (or vice versa) creates mixed-alloy solder joint reliability issues - match the terminal finish to your reflow profile. (4) Forgetting to enable the Configuration Bitstream Encryption (AES) key in the bitstream options for production releases, exposing the design to bitstream readback attacks.
Compliance Information
RoHS and REACH compliance stated by DigiKey/Octopart listings; the C4 (no N suffix) variant uses SnPb (e1) terminal finish, while the C4N variant is Pb-free (e3). AEC-Q100 is not applicable for FPGAs. Conflict-minerals compliance per Intel's published CMRT filing.
