EP3SE80F1152C3 - Stratix III E FPGA 80K LE FBGA-1152 | Intel
MPN: EP3SE80F1152C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2682.32 | $2,682.32 |
| 10 | $2548.2 | $25,482.00 |
| 100 | $2280 | $228,000.00 |
| 500 | $2055 | $1,027,500.00 |
| 1,000 | $1880 | $1,880,000.00 |
EP3SE80F1152C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit within the programmable logic hierarchy alongside CPLDs and sit above fixed-function ASICs in flexibility. The Stratix III E family is positioned for high-performance DSP, high-speed serial I/O, and embedded-processor applications where designers need hardware-level parallelism without the NRE cost of an ASIC. Designers typically choose an FPGA like the EP3SE80F1152C3 over a microcontroller when they need parallel processing, custom I/O timing, or hardware-accelerated algorithms such as FFT, FIR filtering, or video processing.
Key features of the EP3SE80F1152C3 include up to 6.84 Mbits of M9K and M144K block RAM, 384 18x18 multipliers for DSP, twelve full-duplex transceivers supporting rates up to 6.375 Gbps (C3 speed grade), and Quartus II design-software support with IP cores for PCI Express, DDR2/DDR3, Ethernet MAC, and many standard interfaces. The device is offered in a commercial temperature grade (0 to 85 C) under the speed grade C3, which trades off maximum internal frequency versus power optimization.
Typical applications include high-speed DSP and baseband processing in wireless infrastructure, ASIC prototyping for SoC designs, high-end image processing for medical imaging and machine vision, and high-speed serial backplane interfaces for networking and storage systems. The 1152-ball FBGA package provides ample routing channels for the 744 user I/Os and the integrated transceivers. The high logic density combined with embedded memory and DSP blocks makes this device well-suited to designs that previously required multiple FPGAs or a discrete DSP plus FPGA architecture.
When designing with the EP3SE80F1152C3, ensure your PCB footprint is rated for the 35x35 mm FBGA-1152 substrate with appropriate microvia stack-ups. Use the Quartus II power analyzer early in the design cycle to size decoupling networks and thermal solution, since DSP-heavy and transceiver-active designs can exceed 10 W of power dissipation. The C3 speed grade is appropriate for cost-sensitive commercial applications; if you need higher Fmax or wider temperature tolerance, the I3 industrial grade or C4 higher-speed grade variants are available on the same pinout.
This page synthesizes distributor inventory, same-family Stratix III E drop-in alternatives, and design notes not found in the manufacturer datasheet. Engineers can evaluate commercial availability, parametric match percentages, and packaging reuse across the Stratix III E family without downloading datasheets from multiple distributors.
Drop-in alternatives for EP3SE80F1152C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152C3 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$895 / Unit
View Datasheet →EP3SE80F1152C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1690 / Unit
View Datasheet →EP3SE80F1152C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2685 / Unit
View Datasheet →EP3SE80F1152C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1325 / Unit
View Datasheet →EP3SE80F1152I4
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP3SE80F1152I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2100 / Unit
View Datasheet →EP3SE80F1152I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1950 / Unit
View Datasheet →EP3SE80F1152C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F1152C3 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix III E |
| Logic Elements | 80,000 |
| Logic Array Blocks (LABs) | 3,200 |
| User I/Os | 744 |
| Embedded Memory | 6,843,392 bits |
| Internal Frequency | 800 MHz |
| Maximum DSP Block Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.1 V |
| Speed Grade | C3 |
| Operating Temperature | 0 to 85 C (Commercial) |
| Package | FBGA-1152, 35x35 mm |
| Transceivers | 12 full-duplex channels (family-dependent) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per distributor listing) |
| Design Software | Quartus II |
EP3SE80F1152C3 fbga-1152, 35x35 mm Pin Configuration Guide
Pin configuration for EP3SE80F1152C3 (fbga-1152, 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152C3 is suitable for 6 applications: Wireless Baseband DSP Processing, High-Speed Serial Backplane Interface, ASIC Prototyping Platform, Medical Imaging and Machine Vision, Video Processing and Broadcast, Industrial Test and Measurement Instrumentation.
Wireless Baseband DSP Processing
The EP3SE80F1152C3's 384 18x18 multipliers and 6.84 Mbits of embedded block RAM make it ideal for wireless baseband DSP processing in 3G/4G radio units. The device's 800 MHz internal frequency enables real-time FFT, channelization, and crest-factor reduction for LTE and WiMAX systems. Designers typically implement 64 to 128 channels of DDC/DUC per FPGA, with the Stratix III E's M9K memory tiles providing the data buffering needed between filter stages. Compared to a discrete DSP plus FPGA partition, the EP3SE80F1152C3 reduces bill-of-material cost and PCB area while increasing throughput.
Recommended
High-Speed Serial Backplane Interface
With up to 12 full-duplet transceiver channels (in the -3 speed grade variants of the family), the EP3SE80F1152C3 fits high-speed serial backplane interfaces such as Serial RapidIO, PCI Express Gen1, and proprietary 3.125 Gbps links for storage and switching systems. The 1152-ball FBGA package is designed for high-speed signal-integrity layouts with matched-length transceiver pairs and integrated 100-ohm differential impedance. For a typical 4x PCIe Gen1 root complex or endpoint, the device consumes approximately 4-6 W of transceiver power and provides ample logic for protocol-stack MAC layers.
Recommended
ASIC Prototyping Platform
ASIC prototyping engineers select the EP3SE80F1152C3 for its high logic density (80K LE) and abundant 744 user I/Os, which approximate mid-complexity SoCs. The Stratix III E supports multi-FPGA partitioning tools such as Synopsys Certify and Mentor Graphics Precision, allowing one or more EP3SE80F1152C3 devices to host a 5-10 million-gate ASIC design. The 6.84 Mbit embedded memory and 384 multipliers provide realistic timing for memory controllers, DSP blocks, and standard I/O bridges during pre-silicon validation, with debug visibility through SignalTap II embedded logic analyzers.
Recommended
Medical Imaging and Machine Vision
The EP3SE80F1152C3's parallel DSP architecture is well-suited to medical imaging pipelines such as CT reconstruction, ultrasound beamforming, and MRI back-end processing. Its 800 MHz fabric can sustain 4 to 8 channels of ultrasound beamforming at 40 MHz per channel, with the embedded memory tiles storing per-channel apodization tables and beamformed samples. For machine vision, the high I/O count (744) interfaces directly to multi-megapixel image sensors via LVDS or sub-LVDS, with the Stratix III E's hard memory controllers handling pixel reordering and Bayer interpolation in real time.
Recommended
Video Processing and Broadcast
Broadcast and pro-AV applications leverage the EP3SE80F1152C3 for multi-stream video processing at resolutions up to 4K at 60 fps. The device's embedded memory and DSP blocks accelerate deinterlacing, scaling, color-space conversion, and motion-adaptive noise reduction without external frame buffers in some pipeline stages. The 1152-ball FBGA supports the high pin count required for parallel RGB/YCbCr interfaces, HD-SDI, and HDMI input/output bridging, while the Stratix III E's hard PCIe core provides a path to host CPU or capture-card architectures.
Recommended
Industrial Test and Measurement Instrumentation
The EP3SE80F1152C3 is widely used in high-end oscilloscopes, protocol analyzers, and signal generators where its combination of high logic density, abundant I/Os, and embedded DSP enables real-time waveform processing and protocol decoding. Designers implement custom trigger logic, eye-diagram analysis, and on-chip FFT spectrum analysis using the device's parallel multiplier array. The commercial 0 to 85 C temperature range is adequate for laboratory and controlled industrial environments, in contrast to the industrial -40 to 100 C EP3SE80F1152I4 variant for field-deployed test equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152C4 | EP3SE80F1152I4 | EP3SE80F1152C2 | EP3SE80F1152C3N | EP3SE80F1152I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1152 | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 |
| Speed Grade | C3 | C4 (higher Fmax, +15%) | I4 (industrial, lower Fmax) | C2 (lower Fmax, -10%) | C3 (identical) | I4 (industrial, lower Fmax) |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C | -40 to 100 C (Industrial) | 0 to 85 C | 0 to 85 C | -40 to 100 C (Industrial) |
| Embedded Memory | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | Obsolete (channel stock only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-die, faster speed grade option exists for performance-critical paths (vs EP3SE80F1152C4)
- Industrial-temperature variant available on the same FBGA-1152 footprint (vs EP3SE80F1152I4)
- Higher-density same-package upgrade paths exist within Stratix III E family (vs EP3SE260F1152C3)
Design Notes
Estimated: The EP3SE80F1152C3 dissipates between 4 W (logic-only, low toggle rate) and 12 W (DSP-heavy with transceivers active). The 35x35 mm FBGA-1152 package has a typical theta_JA of approximately 8 to 12 C/W with a 4-layer JEDEC test board; with all balls connected to internal ground/power planes, real designs may achieve 6 to 10 C/W. At 10 W dissipation and 9 C/W theta_JA, junction temperature rises 90 C above ambient; a heatsink or top-side airflow is required for reliable 0 to 85 C commercial operation.
The FBGA-1152 package at 35x35 mm with 1.0 mm ball pitch requires a multilayer PCB stack-up with microvia technology (laser-drilled or stacked microvias) for breakout routing. Use 4-6 PCB layers with dedicated ground and power planes on layers 2 and 5 for high-speed signal-integrity. Route all 12 transceiver pairs on the top layer with 100-ohm differential impedance and matched-length skew control under 5 ps. The Stratix III handbook provides reference stack-ups and via patterns; do not attempt to escape this BGA on a 2-layer board.
The EP3SE80F1152C3 requires multiple supply rails: 1.1 V core, 2.5 V or 3.0 V auxiliary, 1.2 V to 1.5 V transceiver PLL, and dedicated JTAG/programming voltages. Use a sequencer IC (e.g., LTC2937 or UCD90120A) to enforce proper power-up and power-down sequencing per Intel's Stratix III power management guidelines. Decoupling capacitor selection must include both bulk capacitors (47 to 100 uF polymer) for transient suppression and high-frequency MLCCs (0.1 uF and 1 uF X7R) placed within 100 mil of each BGA ball pair.
For multi-Gbps transceiver operation on the EP3SE80F1152C3, maintain 100-ohm differential impedance with trace width and spacing per your PCB manufacturer's stack-up calculator. Keep AC-coupling capacitors within 200 mil of the receiver pins. Avoid right-angle bends on any high-speed trace - use 45-degree bends or smooth curves. Reference the Stratix III Transceiver Design Guide for pre-emphasis, equalization, and signal-integrity simulation workflows before tape-out.
Common pitfalls with the EP3SE80F1152C3 include: (1) ignoring speed-grade implications - C3 is fine for most commercial designs but C4 or I4 may be needed for high-Fmax paths; (2) using non-microvia PCBs which cannot reliably escape the FBGA-1152; (3) overlooking configuration scheme - the device requires a separate EPCS or EPCQ configuration flash, not auto-load from internal flash; (4) failing to assign unused I/Os and clock pins correctly, causing Quartus II fitter errors. Always run the full Quartus II compilation including power analyzer before declaring a design complete.
Compliance Information
RoHS compliance inferred from distributor listings. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in available data; conservative assumption is unknown. The C3N suffix variant explicitly indicates lead-free finish.
