EP3SE80F1152C3N - Stratix III E FPGA, 80K LE, 1152-FBGA | Intel
MPN: EP3SE80F1152C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2280 | $22,800.00 |
| 100 | $1995 | $199,500.00 |
| 500 | $1820 | $910,000.00 |
| 1,000 | $1690 | $1,690,000.00 |
EP3SE80F1152C3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, the FPGA sits between general-purpose microcontrollers and full custom ASICs, offering hardware-level parallelism with field-reprogrammable bitstream configurability. Stratix III E devices extend the family with enhanced transceivers, partial reconfiguration support, and higher logic density per watt compared with prior Stratix generations.
Key features of the EP3SE80F1152C3N include 80,000 logic elements (LEs), 6,843,392 memory bits, 3,200 LABs/CLBs, 744 maximum user I/Os, and Stratix III E class transceiver support (per variant). The device supports up to 717 MHz internal operation and is offered in a commercial temperature grade (C3 speed/power corner). Embedded hard IP blocks for PCIe, DDR3 memory controllers, and multi-gigabit transceivers are integrated on-die, simplifying board design.
Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs plus dedicated carry, register, and LUT resources, enabling higher packing density than traditional 4-input LUT architectures. The hierarchical routing fabric and MultiTrack interconnect reduce congestion, while the MLAB (Memory Logic Array Block) allows distributed RAM to be sprinkled across the fabric for high-speed small-buffer use cases.
Typical applications include high-performance digital signal processing for wireless baseband, ASIC and ASIC-replacement prototyping, high-speed image and video processing pipelines, test and measurement instrumentation, and high-throughput data-acquisition systems. Designers also use Stratix III E devices in wireline backhaul, radar, and software-defined radio platforms where parallel processing is essential.
When designing with the EP3SE80F1152C3N, pay careful attention to the FBGA-1152 PCB land pattern, multi-rail decoupling strategy, and JTAG/AS configuration pin budgeting. Quartus II software (legacy) or Quartus Prime with the Stratix III device support is required for synthesis, place-and-route, and bitstream generation. Given the device's NRND/EOL status on some channels, confirm lifecycle status with authorized distributors before committing to new designs.
This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives within the Stratix III E family, and PCB-level design considerations not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3SE80F1152C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152C3N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Logic Array Blocks (LABs), Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1880 / Unit
View Datasheet →EP3SE80F1152C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2685 / Unit
View Datasheet →EP3SE80F1152C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1325 / Unit
View Datasheet →EP3SE110F1152C3N
✅ Drop-In✓ In Stock
$1560 / Unit
View Datasheet →EP3SE260F1152C3N
✅ Drop-In✓ In Stock
$7500 / Unit
View Datasheet →EP3SE80F1152C3N Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements (LEs) | 80,000 |
| Total Memory Bits | 6,843,392 bits |
| Number of LABs/CLBs | 3200 |
| Number of User I/O | 744 |
| Number of Outputs | 744 |
| Package / Case | 1152-BBGA, FCBGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (commercial, C3 grade) |
| Speed/Power Grade | C3 |
| Process Technology | 40 nm CMOS |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Memory | SRAM-based, volatile (needs external config device) |
| RoHS Status | Compliant |
EP3SE80F1152C3N 1152-bbga, fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SE80F1152C3N (1152-bbga, fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152C3N is suitable for 7 applications: Wireless Baseband DSP, ASIC Prototyping and Emulation, High-Speed Image and Video Processing, Test and Measurement Instrumentation, Wireline Backhaul and Software-Defined Radio, Radar and Lidar Front-End Processing, Industrial Automation and Machine Vision.
Wireless Baseband DSP
The EP3SE80F1152C3N's 80,000 LEs and 6.84 Mbit embedded block RAM make it a strong match for wireless baseband DSP pipelines implementing LTE, WiMAX, or proprietary PHY layers. Its Stratix III E DSP blocks deliver hundreds of parallel 18x18 multipliers needed for FFT, channel estimation, and FEC decoding. Compared with Stratix IV/V, the device trades modern transceiver upgrades for design reuse, ideal for mature baseband programs. Place the device between ADC/DAC channels and an external host processor, leveraging its 744 I/Os for wide parallel data buses.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP3SE80F1152C3N as a target for ASIC prototyping because the Stratix III E ALM structure closely mirrors ASIC cell libraries and the 1152-FBGA package exposes 744 user I/Os for high-fidelity chip-to-chip emulation. The 80K-LE fabric plus 6.84 Mbit block RAM holds substantial portions of an ASIC RTL block-by-block. Multi-FPGA partitioning tools (e.g., Certify, Synopsys HAPS flow) map gates across multiple EP3SE80F1152C3N devices on the same PCB to emulate SoCs exceeding 1M gates.
Recommended
High-Speed Image and Video Processing
The EP3SE80F1152C3N's 744 user I/Os support wide parallel camera and display interfaces (LVDS, sub-LVDS, CMOS parallel), while 6.84 Mbit block RAM buffers line-scan and frame-scan data. Designers use the device for real-time video analytics, multi-camera stitching, and medical imaging pre-processing. The Stratix III E DSP blocks accelerate convolution, Sobel, and color-space conversion kernels, achieving multi-Gpixel/s throughput per the Altera Stratix III E handbook.
Recommended
Test and Measurement Instrumentation
Test and measurement OEMs use the EP3SE80F1152C3N as the processing engine inside oscilloscopes, logic analyzers, and protocol analyzers because its 80K LEs run multi-channel triggering state machines while the 6.84 Mbit RAM stores deep acquisition buffers. The 744 I/Os comfortably route 32+ high-speed ADC/DAC channels, and the Stratix III E PLL/memory controller IP block simplifies DDR3 capture memory interfacing per Altera IP catalog.
Recommended
Wireline Backhaul and Software-Defined Radio
Wireline backhaul platforms and software-defined radio cards leverage the EP3SE80F1152C3N's Stratix III E transceiver IP and DSP blocks for multi-gigabit packet processing, FEC offload, and digital up/down conversion. The device fits between the optical/fronthaul PHY and the host CPU, accelerating bulk crypto and baseband processing. For higher SERDES needs, designers migrate to EP3SE260 variants or Stratix IV/V devices while preserving board footprint.
Recommended
Radar and Lidar Front-End Processing
Radar and Lidar pre-processors use the EP3SE80F1152C3N to implement real-time FFT, CFAR detection, and point-cloud pipelines with deterministic latency. The 80K LEs comfortably implement 1024-point complex FFTs, while 6.84 Mbit block RAM stores window coefficients and intermediate spectra. The 744 I/Os feed multiple LVDS radar ADC channels directly into the fabric. For automotive/aerospace radar with higher channel counts, designers step up to EP3SE260 or move to Stratix 10 devices.
Recommended
Industrial Automation and Machine Vision
Factory automation controllers and machine vision inspection systems leverage the EP3SE80F1152C3N to fuse multi-camera GigE Vision, CoaXPress, and parallel LVDS streams while running real-time defect detection in the fabric. The 80K LEs run convolutional neural network inference engines for inline quality control, and the 744 I/Os handle digital I/O and encoder feedback per Altera Industrial IP library. Industrial temperature variants may require screening beyond the standard C3 commercial grade.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C3N | EP3SE260F1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 260,000 (+225%) |
| Max User I/O | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed/Power Grade | C3 | C3 | C2 (slower, lower power) | C2 (slower, lower power) | C3 | C3 |
| Lead-Free Suffix (N) | Yes (N suffix) | No N suffix | Yes (N suffix) | No N suffix | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Pin-compatible silicon siblings for speed/power trade-offs (vs EP3SE80F1152C2N)
- Higher density option with same package (vs EP3SE260F1152C3N)
- Mid-density mid-price option (vs EP3SE110F1152C3N)
Design Notes
The 1152-ball FineLine BGA package requires a 1.0 mm pitch PCB land pattern with laser-drilled microvias and a 4-6 layer stackup with continuous GND planes for power integrity. Per Intel Stratix III hardware design guidelines, route all high-speed transceiver differential pairs with 100 ohm differential impedance and length-match within 5 mils; add 0402-sized 0.1 uF decoupling caps adjacent to every VCC pin and bulk 22-47 uF tantalum or polymer caps near each supply island. A solid ground plane beneath the BGA is mandatory to control return paths for the 744 user I/Os.
Estimated: at 80% utilization of 80K LEs switching at 200 MHz, the EP3SE80F1152C3N can dissipate 8-12 W. The FBGA-1152 has a typical theta_JA of approximately 8-12 C/W with a 4-layer JEDEC board per Altera thermal model, implying 60-100 C temperature rise above ambient. Heatsink or top-side cooling is recommended for closed enclosures; place multiple thermal vias in the BGA land pattern to conduct heat to the bottom-side copper pour per the Stratix III hardware design guide.
Configuration mode selection (AS, AP, FPP, JTAG) drives different MSEL pin strapping - leaving MSEL floating is a common debugging pitfall. The EP3SE80F1152C3N uses SRAM-based configuration, so an external EPCS or EPCQ configuration device is required for standalone boot; verify CFG_DONE and nSTATUS pull-up values during board bring-up per Intel Stratix III configuration handbook. Also check JTAG chain ordering when multiple FPGAs share a TCK signal - TAP ordering mistakes mimic silicon failures.
Stratix III E transceivers support multi-gigabit rates up to 6.5 Gbps and require AC-coupled channels with proper TX/RX termination. Route each transceiver channel with controlled 50 ohm single-ended or 100 ohm differential impedance; avoid right-angle bends and keep via stubs under 100 mils. Add external AC coupling capacitors (0.1 uF X7R) in line with each TX pair per Altera Stratix III transceiver user guide to maintain DC bias isolation.
Compliance Information
RoHS compliant per Altera (Intel) product page; lead-free (N suffix indicates lead-free terminal finish). NRND/EOL status confirmed via DigiKey and distributor channel; not AEC-Q100 qualified.