EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
MPN: EP3SE110F1152I3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5429.03 | $5,429.03 |
| 10 | $5100 | $51,000.00 |
| 100 | $4750 | $475,000.00 |
| 500 | $4400 | $2,200,000.00 |
| 1,000 | $4150 | $4,150,000.00 |
EP3SE110F1152I3 Overview
What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers configure to create custom digital circuits. Stratix III E is a high-performance enhanced variant within Intel's Stratix III family, optimized for DSP, ASIC-prototype, and embedded-processor applications requiring very high logic density and embedded memory bandwidth.
Key features include 384 (18x18) multipliers for DSP, up to 8 embedded transceiver blocks supporting 3.125 Gbps data rates, and partial reconfiguration capability that allows portion-by-portion logic reprogramming during operation. The FPGA integrates hard PCIe, memory controllers, and SERDES blocks, reducing external component count.
Architecturally, Stratix III E uses ALM (Adaptive Logic Module)-based LABs, an 8-input fracturable look-up table structure, and variable-precision DSP blocks that can be configured for 9x9, 18x18, or 36x36 multiplications. The programmable power technology enables fine-grained power gating of logic, memory, and DSP regions, delivering up to 50% lower power than competing devices at equivalent performance.
Typical applications include high-end ASIC prototyping, digital signal processing (radar, medical imaging, wireless baseband), high-speed data acquisition, software-defined radio, and high-throughput networking line cards. The 8.9 Mbit embedded memory and 384 multipliers make it ideal for FFT/iFFT engines, video codecs, and encryption accelerators.
When designing with this part, follow Intel's Stratix III pin connection guidelines for unused pins, and use the Quartus II (13.0 or later) design tool chain. Because the device operates at 1.1 V core, decoupling requires low-impedance power planes rather than simple capacitor networks.
This page synthesizes distributor pricing, drop-in Stratix III E and Stratix III L alternatives with the same 1152-FBGA footprint, and practical thermal/PCB design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP3SE110F1152I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152I3 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Family, Process Technology, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE110F1152I2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1480 / Unit
View Datasheet →EP3SE110F1152C4LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3510 / Unit
View Datasheet →EP3SE110F1152C4L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3372.13 / Unit
View Datasheet →EP3SE110F1152C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2200 / Unit
View Datasheet →EP3SE110F1152C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1560 / Unit
View Datasheet →EP3SE110F1152C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3200 / Unit
View Datasheet →EP3SE110F1152C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1925 / Unit
View Datasheet →EP3SE110F1152I3 Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 107,500 |
| Total Memory Bits | 8,936,448 |
| LABs/CLBs | 4,300 |
| Number of I/O | 744 |
| Number of Logic Elements/Cells | 107,500 |
| Total RAM Bits | 8,936,448 |
| Core Operating Frequency | 500 MHz |
| Supply Voltage | 1.1 V |
| Process Technology | 65 nm CMOS (1.1 V, all-layer copper SRAM) |
| Package Type | 1152-BBGA, FCBGA (FC-FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I3 grade) |
| RoHS Status | Non-Compliant per DigiKey product page |
EP3SE110F1152I3 Pin Configuration
| Pin BALL_1 | VCC — Core supply 1.1 V |
| Pin BALL_2 | VCCIO1A — I/O bank 1A supply |
| Pin BALL_3 | GND — Ground |
| Pin BALL_4 | IO_A4 — User I/O bank 1A |
| Pin BALL_5 | DIFFIO_RX_A5 — Differential RX pair bank 1A |
Typical Applications
EP3SE110F1152I3 is suitable for 8 applications: ASIC Prototyping, Digital Signal Processing (DSP), High-Speed Data Acquisition, Telecom Line Card Processing, Software-Defined Radio (SDR), Video Processing and Codec Acceleration, Industrial Automation Control, Aerospace and Defense Signal Processing.
ASIC Prototyping
The EP3SE110F1152I3 fits ASIC prototyping roles where 107,500 logic elements, 8.9 Mbit embedded memory, and 744 user I/Os allow faithful representation of mid-complexity ASICs up to 5 million gates. Its 1152-FBGA footprint with vertical migration support to other Stratix III densities means one PCB can validate multiple ASIC tape-out candidates. The 500 MHz core supports real-time system-speed verification, while embedded hard PCIe and memory controllers reduce the discrete logic needed for I/O bridge functions. Stratix III E's partial reconfiguration allows swapping test logic blocks without halting the prototype.
Recommended
Digital Signal Processing (DSP)
For DSP workloads such as FFT/iFFT engines, FIR filtering, and video codecs, the EP3SE110F1152I3 provides 384 (18x18) hardware multipliers and variable-precision DSP blocks that can be configured for 9x9, 18x18, or 36x36 multiplications. The 8.9 Mbit embedded memory enables large coefficient tables and deep line buffers, while the 500 MHz fabric clock supports multi-Gigasample-per-second DSP pipelines. Industrial temperature rating allows deployment in outdoor telecom and defense DSP systems, making it well-suited for radar baseband, software-defined radio, and medical imaging accelerators.
Recommended
High-Speed Data Acquisition
The EP3SE110F1152I3 supports high-speed data acquisition cards combining multiple ADC channels at hundreds of MSPS. Its 744 I/Os accommodate wide parallel LVDS buses, while the embedded transceivers handle serialized inter-board links at multi-Gbps rates. The 8.9 Mbit embedded memory buffers ADC samples before DMA transfer to host processors, reducing external memory pressure. Industrial temperature operation enables deployment in test and measurement instrumentation deployed in factories and outdoor installations where commercial-grade FPGAs would fail.
Recommended
Telecom Line Card Processing
In telecom line cards, the EP3SE110F1152I3 performs packet classification, traffic shaping, and SERDES bridging between backplane and framer ASICs. Hard PCIe Gen1/Gen2 endpoints simplify host bus connectivity, while the FPGA fabric handles custom protocol offload. Industrial temperature operation ensures reliability in central-office and outdoor base-station enclosures. The 1152-FBGA footprint and 744 I/Os allow connection to multiple QSFP/SFP cages plus backplane SERDES channels without external multiplexer chips.
Recommended
Software-Defined Radio (SDR)
Software-defined radio platforms benefit from the EP3SE110F1152I3's combination of 384 multipliers, 8.9 Mbit embedded memory, and integrated transceivers supporting up to 3.125 Gbps. The FPGA can implement wideband digital down-conversion, channelization, and modulation/demodulation for cellular, WiMAX, or military radio standards. Industrial temperature rating enables outdoor tower-mounted SDR units. Quartus II DSP Builder and SOPC Builder tool flows accelerate radio waveform development and DSP algorithm validation.
Recommended
Video Processing and Codec Acceleration
For video processing applications such as broadcast encoding, surveillance analytics, and medical imaging pipelines, the EP3SE110F1152I3 provides sufficient logic and DSP resources to accelerate H.264, JPEG2000, and wavelet codecs in real time. The 744 I/Os interface to multiple camera sensors or HDMI/DVI inputs, while embedded memory buffers macroblock-level data with low jitter. Industrial temperature rating enables outdoor surveillance and digital signage installations exposed to direct sun.
Recommended
Industrial Automation Control
In industrial automation, the EP3SE110F1152I3 acts as a real-time deterministic controller combining motor-control loops, safety logic, and industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP). The industrial temperature rating (-40C to +100C) and high logic count allow integration of multiple safety functions and control loops on a single device, reducing BOM and certification complexity. Hard memory controllers interface to DDR2/DDR3 for data logging and process visualization buffer storage.
Recommended
Aerospace and Defense Signal Processing
Defense signal-processing systems leverage the EP3SE110F1152I3 for radar beamforming, electronic-warfare DSP, and secure communications. The industrial temperature grade plus 65 nm radiation-tolerant design practices support avionics and ground-mobile deployments. Integrated high-speed transceivers handle multi-Gbps digital-IF or fiber-optic links to RF front ends. The Stratix III handbook provides SEU mitigation guidance using Triple Module Redundancy (TMR) and CRC-based configuration scrubbing.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152C4N | EP3SE110F1152I2N | EP3SE110F1152C4LN | EP3SE110F1152C3N | EP3SL110F1152C2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA | 1152-FBGA, FCBGA - same | 1152-FBGA, FCBGA - same | 1152-FBGA, FCBGA - same | 1152-FBGA, FCBGA - same | 1152-FBGA, FCBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Total Memory Bits | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,025,408 (L variant has lower memory) |
| LABs/CLBs | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 |
| Operating Temperature Range | -40C to +100C (Industrial I3) | 0C to +85C (Commercial C4) | -40C to +100C (Industrial I2) | 0C to +85C (Commercial C4L) | 0C to +85C (Commercial C3) | 0C to +85C (Commercial C2) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Speed Grade | I3 (industrial) | C4 (commercial) | I2 (industrial, faster) | C4L (commercial, lower power) | C3 (commercial, faster) | C2 (commercial, L family) |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 744 |
| Series Variant | Stratix III E (Enhanced) | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L (Low Power) |
Key Differentiators
- Industrial temperature rating with same logic density as commercial variants (vs EP3SE110F1152C4N)
- Pin-compatible with I2 speed grade for higher performance (vs EP3SE110F1152I2N)
- Enhanced (E) variant with more memory than L (low-power) variant (vs EP3SL110F1152C2N)
Design Notes
The 1152-FBGA EP3SE110F1152I3 dissipates significant power under high-utilization designs (typical 5 W to 15 W at 100 MHz with full DSP utilization). With a theta_JA around 10 to 15 C/W on a standard JEDEC 4-layer test board, the junction temperature can approach or exceed the 100C industrial limit. Use at least 8 power-plane layers with thermal vias under the central GND balls, and consider a heatsink or forced-air cooling for sustained 100 percent toggle rate designs. Refer to the Stratix III handbook AN 423 for thermal modeling guidance and derating curves.
The Stratix III E 1.1 V core must be supplied by a low-noise regulator capable of 20 A peak with tight transient response. Use a multi-phase buck controller such as the LTM4628 or similar with bulk ceramic decoupling. Place 0402/0201 decoupling capacitors (0.1 uF and 0.01 uF) within 2 mm of every VCC pin ball. The Stratix III PowerPlay Power Analyzer (in Quartus II) estimates worst-case dynamic current based on toggle rate and resource utilization; budget 30 percent margin above the analyzer's output. I/O bank voltages (VCCIO) must be brought up before or simultaneously with VCC core to avoid latch-up.
The 1152-FBGA uses a 1.0 mm ball pitch with microvia-compatible land pattern. Stack-up must contain at least 6 layers: top signal, GND, two signal/power split layers, bottom GND. The two inner layers should be dedicated power planes for VCC (1.1 V) and VCCIO (one plane per voltage used). All FPGA decoupling must sit on the top side directly under the BGA with via-in-pad or short dog-bone fanout. Trace length matching is critical for DDR2/DDR3 memory interfaces: target plus or minus 25 mil tolerance across byte lanes. Use the Quartus II Pin Planner to verify I/O standard compatibility per bank before layout.
Do not assume all 744 user I/Os are simultaneously usable: each I/O bank has a VCCIO supply, and mixing incompatible I/O standards within one bank can cause contention. LVDS and LVTTL cannot share a bank. Also, the EP3SE110F1152I3 requires a 1.1 V VCC core ramp that finishes within 100 ms for proper configuration; slower ramps trigger brown-out detection. Always program the MSEL pins for the correct configuration scheme (AS, PS, JTAG, or FPP) before power-up, as changing MSEL after VCC ramp corrupts configuration. Finally, unused differential input pairs must be biased with the on-chip 100 ohm differential termination disabled or terminated externally per the pin connection guidelines.
For DDR2/DDR3 memory interfaces, the Stratix III E requires matched-impedance routing (50 ohm single-ended, 100 ohm differential) with length matching within plus or minus 25 mils across the byte lane. Address/command traces should be 2:1 or 3:1 impedance with fly-by routing for DDR3. Series termination may be required on heavily-loaded clocks. Use HyperLynx or SiSoft PI for pre-layout signal-integrity simulation. For SERDES channels at 3.125 Gbps, use the Stratix III E Transceiver Toolkit in Quartus II to characterize eye diagrams and tune pre-emphasis/equalization settings on production boards.
Compliance Information
RoHS status reported as Non-Compliant on the DigiKey product page for the EP3SE110F1152I3. The Pb-free variant EP3SE110F1152I3G is RoHS-compliant per the DigiKey listing. AEC-Q100 not applicable for FPGAs (qualification standard for automotive discrete semiconductors). Other compliance fields not specified in the provided data.
