EP3SE80F780C3 - Stratix III E FPGA, 80K LE, 780-FBGA | Altera
MPN: EP3SE80F780C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2585.9 | $2,585.90 |
| 10 | $2450 | $24,500.00 |
| 100 | $2300 | $230,000.00 |
| 500 | $2180 | $1,090,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
EP3SE80F780C3 Overview
An FPGA (Field Programmable Gate Array) is a programmable semiconductor containing an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory, high-speed transceivers, and a programmable interconnect fabric. FPGAs sit between microcontrollers and ASICs in the silicon hierarchy: microcontroller -> microprocessor -> programmable logic -> FPGA -> ASIC. They are selected when designers need hardware-level parallelism and deterministic latency but cannot justify the NRE cost of a custom ASIC, and they are widely used in telecommunications infrastructure, high-performance computing, test and measurement, and aerospace/defense applications.
The EP3SE80F780C3 integrates 3,200 Logic Array Blocks, up to 1,440 Kbits of MLAB memory, 270 embedded 18x18 multipliers, and Stratix III's signature Programmable Power Technology that dynamically lowers supply voltage on quiescent logic tiles. Hard IP blocks include PCI Express Gen1/Gen2 endpoints, multi-gigabit transceivers (per package variant), external memory interfaces supporting DDR/DDR2/QDRII, and dedicated PLL/DLL clock management. Designers target the device with Altera's Quartus II design suite, which provides IP cores, timing analysis, and the PowerPlay power optimization flow.
Typical applications span high-speed serial protocol bridging, digital video broadcast head-ends, software-defined radio baseband processing, military radar front-end preprocessing, ASIC prototyping, and high-end medical imaging pipelines. Its 488 user I/O pins and abundant vertical migration paths within the Stratix III E family also make it a strong fit for production systems that previously used multiple smaller FPGAs to reach equivalent logic density.
When designing with the EP3SE80F780C3, allocate sufficient PCB layers (typically 12+ layers with dedicated power and ground planes) to route the 780-ball FineLine BGA at 1.0 mm pitch, follow Altera's Stratix III pin connection guidelines for unused transceiver and clock pins, and use the Quartus II Early Power Estimator before board layout to validate thermal budgets. Stratix III E devices are also NRND - confirm lifetime-buy options with Intel/Altera before starting new designs.
This page consolidates distributor pricing, drop-in vertical-migration alternatives within the Stratix III E family, and practical Quartus II design notes not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and bring-up decisions.
Drop-in alternatives for EP3SE80F780C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F780C3 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Logic Array Blocks (LABs), Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F780C3
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EP3SE50F780C3
✅ Drop-In✓ In Stock
$890 / Unit
View Datasheet →EP3SE80F780C2
✅ Drop-In✓ In Stock
$2480 / Unit
View Datasheet →EP3SE80F780C2N
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP3SE80F780C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1290 / Unit
View Datasheet →EP3SE80F780C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Embedded Memory (bits) | 6,843,392 |
| User I/O Count | 488 |
| Logic Array Blocks | 3,200 |
| Package | 780-BBGA (FC-FBGA, FineLine BGA) |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Internal Frequency (max) | 500 MHz |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Speed Grade | C3 |
| Device Type | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Interface | Active Serial / Fast Passive Parallel / JTAG |
EP3SE80F780C3 780-bbga (fc-fbga, fineline bga) Pin Configuration Guide
Pin configuration for EP3SE80F780C3 (780-bbga (fc-fbga, fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F780C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F780C3 is suitable for 6 applications: High-Speed Serial Connectivity Bridge, Digital Video Broadcast Head-End, ASIC Prototyping Platform, Military/Aerospace Radar Front-End Preprocessing, Test and Measurement Instrumentation, Industrial High-Speed Imaging Pipeline.
High-Speed Serial Connectivity Bridge
The EP3SE80F780C3's 80,000 logic elements and Stratix III E embedded transceivers make it well suited as a multi-protocol serial bridge between PCIe Gen2, Serial RapidIO, 10 Gigabit Ethernet XAUI, and SFP+ optical links. With 488 user I/O pins and abundant LVDS capability, it can simultaneously aggregate multiple SFP+ lanes while performing low-latency packet inspection or protocol translation. Place the device on a 12+ layer PCB with continuous ground planes under the 780-FBGA to control crosstalk between multi-gigabit serial channels; the Quartus II transceiver toolkit reports eye margins per channel to validate SI performance.
Recommended
Digital Video Broadcast Head-End
In DVB head-end equipment, the EP3SE80F780C3 performs MPEG-TS multiplexing, PSI/SI table generation, and multi-channel transcoding at line-rate. Its 270 embedded 18x18 multipliers and 6.8 Mbits of memory support real-time HD-to-SD down-conversion across 30+ simultaneous channels. The 488 user I/O count accommodates ASI inputs, parallel SDI feeds, and GbE trunk interfaces without external muxing. Designers should use Quartus II's DSP Builder to map filter kernels efficiently and budget ~6 W of dynamic power for typical transcoding loads, requiring moderate airflow or heatsink attachment.
Recommended
ASIC Prototyping Platform
Engineers use the EP3SE80F780C3 to prototype complex ASIC RTL before tape-out, partitioning the design across multiple Stratix III E devices if needed. With 80K LEs, 6.8 Mbits of embedded memory, and 488 user I/O, it fits single-chip prototypes of mid-complexity ASICs and multi-FPGA partitions of larger designs. The Quartus II Multi-FPGA partitioning flow and ChipPlanner tools allow time-budgeted inter-FPGA pin assignment. Compared to ASIC tape-out, prototyping on the EP3SE80F780C3 enables software/hardware co-validation months before silicon returns, dramatically reducing respin risk for first-time-right designs.
Recommended
Military/Aerospace Radar Front-End Preprocessing
The EP3SE80F780C3 handles radar beamforming, pulse compression, and Doppler filtering at IF sample rates up to 500 MHz, leveraging its high DSP block count and parallel memory architecture. Its commercial 0-85 C operating range suits ground-based and naval installations; for avionics or space applications a military-temp (-55 C to +125 C) variant is required and must be specified separately. The Stratix III E family's lockstep configuration scrubbing and SEU mitigation features are valuable for radiation-sensitive deployments when paired with the appropriate configuration memory watchdog.
Recommended
Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and protocol analyzer manufacturers use the EP3SE80F780C3 as the central processing engine, performing real-time trigger logic, protocol decoding, and on-screen waveform rendering. Its 488 user I/O and embedded memory enable simultaneous sampling of multi-lane PCIe, USB 3.0, or DDR3 traffic for stateful protocol analysis at line rate. Designers can leverage Quartus II's SignalTap II embedded logic analyzer for in-system verification and the External Memory Interface toolkit for DDR3 timing closure. The 1.1 V core supply combined with on-chip PLL/DLL clock management provides the deterministic jitter performance required for high-bandwidth instrument front-ends.
Recommended
Industrial High-Speed Imaging Pipeline
In machine vision and high-speed line-scan camera systems, the EP3SE80F780C3 processes Bayer-to-RGB conversion, lens distortion correction, and real-time image classification at GigE Vision or CoaXPress line rates. Its 270 18x18 multipliers and abundant MLAB memory implement efficient convolution pipelines, while 488 user I/O pins interface to multiple Camera Link, CoaXPress, or 10 GigE Vision channels simultaneously. The device's commercial operating temperature range covers factory floor conditions when paired with modest airflow, and Stratix III E's Programmable Power Technology reduces dynamic consumption during idle vision cycles, lowering long-term operating cost.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F780C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F780C3 | EP3SE50F780C3 | EP3SE80F780C2 | EP3SE80F780C2N | EP3SE80F780C4N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FineLine BGA) | 780-FBGA (FineLine BGA) - same | 780-FBGA (FineLine BGA) - same | 780-FBGA (FineLine BGA) - same | 780-FBGA (FineLine BGA) - same | 780-FBGA (FineLine BGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 80,000 | 110,000 (+38%) | 50,000 (-38%) | 80,000 (same) | 80,000 (same) | 80,000 (same) |
| Embedded Memory (bits) | 6,843,392 | 8,847,360 (+29%) | 3,888,000 (-43%) | 6,843,392 (same) | 6,843,392 (same) | 6,843,392 (same) |
| User I/O Count | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
| Speed Grade | C3 | C3 (same) | C3 (same) | C2 (faster) | C2 (faster) | C4 (slower) |
| Core Voltage | 1.1 V | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) |
| Process Node | 65 nm | 65 nm (same) | 65 nm (same) | 65 nm (same) | 65 nm (same) | 65 nm (same) |
| RoHS / Lead-Free | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant (N suffix) | RoHS compliant (N suffix) |
Key Differentiators
- Highest-density Stratix III E variant in the 780-FBGA package with C3 speed grade (vs EP3SE50F780C3)
- Pin-compatible vertical migration path to higher-density Stratix III E FPGAs (vs EP3SE110F780C3)
- Faster speed grade C2 variant available in identical footprint (vs EP3SE80F780C2)
Design Notes
The 780-FineLine BGA uses 1.0 mm ball pitch and requires a 12+ layer PCB stack-up with continuous ground reference planes directly under the package. Per Altera's Stratix III Hardware Design Guidelines, allocate at least 4 inner layers for 1.1V VCC core distribution to meet the ~6-8A peak current demand during configuration and high-utilization operation. Use microvia-in-pad or stacked-via construction for the breakout, since 0.8 mm drill-to-pad clearance on standard via-in-pad technology will not escape the 1.0 mm pitch without dog-bone fanouts that hurt signal integrity for multi-gigabit transceivers.
Estimated: typical EP3SE80F780C3 designs at 70-80% utilization with 50% toggle rate dissipate approximately 6-9 W of dynamic power in commercial (0-85 C) operation. Without airflow, a heatsink with thermal resistance <= 5 C/W attached to a 25x25 mm copper spreader is recommended to keep junction temperature below 95 C. Use Quartus II PowerPlay Early Power Estimator before board layout to validate thermal budget, and add a thermal pad pattern under the BGA thermal balls per Altera's application note AN 461.
Stratix III E configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0:3]) must be pulled to the correct logic levels per the chosen configuration scheme (AS, AP, FPP, or JTAG). Leaving MSEL floating is a common board bring-up failure cause - per the Stratix III Device Handbook, MSEL must be hard-tied to VCCPGM or GND through 1 kohm or less. Also enable the ALT2GXB calibration sequence on every power-up; do not skip the gxb_powerdown assertion during initial bring-up or transceivers will fail link training silently.
Per Altera's Stratix III PCB Design Guidelines, route all multi-gigabit transceiver channels with 100 ohm differential impedance, length-matched within 150 mils of pair-to-pair tolerance, and isolated by ground-side stitching vias every 200 mils. Reference each transceiver pair to a solid ground plane (never split or moated), and keep clock pairs length-matched to within 50 mils. Avoid 90-degree bends - use 45-degree or curved traces to control impedance discontinuities at multi-gigabit data rates (3+ Gbps).
Compliance Information
RoHS compliance per Altera/Intel product page. Halogen-free status not explicitly stated in verified web data. AEC-Q100 not applicable - this is a high-end FPGA intended for industrial/commercial/aerospace, not automotive.
