EP3SE260F1517I4 - Stratix III E FPGA, 255K LE, 1517-FCBGA | Altera
MPN: EP3SE260F1517I4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13239.5 | $13,239.50 |
| 10 | $12500 | $125,000.00 |
| 100 | $11800 | $1,180,000.00 |
| 500 | $11200 | $5,600,000.00 |
| 1,000 | $10750 | $10,750,000.00 |
EP3SE260F1517I4 Overview
An FPGA is a user-programmable semiconductor whose logic fabric and routing are defined after manufacture by a configuration bitstream, allowing one silicon platform to be repurposed across many designs. Within the FPGA taxonomy, the Stratix III E family sits in the high-performance, logic-and-DSP-rich tier (FPGA -> SRAM-based FPGA -> high-density FPGA -> programmable logic device -> semiconductor IC), making it suitable for compute-intensive datapaths rather than glue logic. The 1.1 V core voltage and 65 nm node give a power-performance envelope that newer 28 nm and 14 nm families have since surpassed.
Key features include 255,000 logic elements organized into 10,200 LABs (Logic Array Blocks), 16,672,768 embedded memory bits, 768 embedded 18x18 multipliers, and 12 embedded transceivers supporting multi-gigabit serial protocols. The 'I4' speed grade and industrial temperature rating (-40C to +100C operating) are confirmed by the Altera ordering code, and the FCBGA-1517 substrate enables the I/O count required for DDR3/DDR4 memory controllers, PCI Express Gen2 hard IP, and parallel LVDS interfaces.
Architecturally, Stratix III E devices use a programmable power technology that dynamically scales core voltage per region, reducing dynamic power by up to 30% versus prior Stratix generations. The embedded transceivers support data rates up to 6.375 Gbps depending on speed grade, and the device integrates hard memory controllers, a PCI Express hard IP block, and a security-enabled configuration engine. Designers typically use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and bitstream generation.
Typical applications include high-end ASIC prototyping and emulation, high-definition video broadcast equipment, military radar signal processing, test and measurement instrumentation, high-speed data acquisition systems, and telecommunications line cards. The combination of 255K logic elements and 768 DSP blocks makes the part especially well suited to multi-channel FIR filtering, FFT engines, and software-defined radio baseband processing.
When designing with this part, note that Stratix III E devices are mature: Altera has issued multiple hardware errata and recommends designers review the Stratix III device handbook and errata sheets. The 1,517-ball FCBGA requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for transceiver channels, and a heatsink or thermal pad because junction-to-ambient thermal resistance is non-trivial at full utilization.
This page synthesizes distributor pricing, drop-in Stratix III speed-grade alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE260F1517I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1517I4 (same form factor and footprint) — differing in Family, Speed Grade, Package, Operating Temperature, Process Node.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1517I3
✅ Drop-In✓ In Stock
$10500 / Unit
View Datasheet →EP3SE260F1517I3N
✅ Drop-In✓ In Stock
$2275 / Unit
View Datasheet →EP3SE260F1517I3G
✅ Drop-In✓ In Stock
$3520 / Unit
View Datasheet →EP3SE260F1517C4
✅ Drop-In✓ In Stock
$8400 / Unit
View Datasheet →EP3SE260F1517C4N
✅ Drop-In✓ In Stock
$7800 / Unit
View Datasheet →EP3SE260F1517C3
✅ Drop-In✓ In Stock
$10800 / Unit
View Datasheet →EP3SE260F1517I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Embedded Memory Bits | 16,672,768 |
| Embedded 18x18 Multipliers | 768 |
| User I/O Pins | 976 |
| Embedded Transceivers | 12 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Core Frequency | 450 MHz |
| Speed Grade | I4 (industrial) |
| Operating Temperature | -40C to +100C (industrial) |
| Package | 1517-BBGA, FCBGA, 40 mm |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 Hours) |
EP3SE260F1517I4 1517-bbga, fcbga, 40 mm Pin Configuration Guide
Pin configuration for EP3SE260F1517I4 (1517-bbga, fcbga, 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1517I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1517I4 is suitable for 6 applications: High-Throughput ASIC Prototyping and Emulation, High-Definition Video Broadcast Equipment, Military Radar and Electronic Warfare Signal Processing, Test and Measurement Instrumentation, Telecommunications Line Cards and Baseband Processing, High-Speed Data Acquisition Systems.
High-Throughput ASIC Prototyping and Emulation
The EP3SE260F1517I4's 255,000 logic elements and 16,672,768 bits of embedded memory make it ideal for ASIC prototyping and in-circuit emulation of multi-million-gate designs. Its 10,200 LABs and 768 18x18 multipliers map RTL into real hardware at speeds close to the final ASIC, letting engineers validate firmware, system behavior, and corner cases before tape-out. Pair with Quartus II incremental compile to manage team-based design flows.
Recommended
High-Definition Video Broadcast Equipment
Broadcast video routers, multi-format converters, and contribution encoders benefit from the EP3SE260F1517I4's 976 user I/O pins and 12 embedded transceivers. The device can ingest multiple 3G-SDI or HD-SDI streams, perform real-time color-space conversion, scaler/de-interlacer logic, and drive HDMI or DisplayPort outputs. Industrial temperature rating (I4 speed grade) supports 24/7 rack operation in broadcast facilities.
Recommended
Military Radar and Electronic Warfare Signal Processing
Phased-array radar and EW receivers require wide-bandwidth, low-latency DSP. The EP3SE260F1517I4's 768 18x18 multipliers enable multi-channel pulse compression, MTI/MTD filtering, and beamforming kernels. Its 12 embedded transceivers accept ADAS/radar IF data at multi-gigabit rates, while the industrial temperature range ensures operation in deployed defense platforms. Quartus II supports MIL-STD-810 design flows.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SE260F1517I4 to implement deep acquisition memory, real-time triggering, and parallel DSP pipelines. The 16,672,768 embedded memory bits serve as waveform capture buffer, while 768 multipliers perform real-time FFT, decimation, and channel equalization. With 976 user I/O, the FPGA aggregates multiple 10+ Gsps ADC data streams into processed measurement results.
Recommended
Telecommunications Line Cards and Baseband Processing
LTE, WCDMA, and 5G NR baseband cards use the EP3SE260F1517I4 for channel coding, rate matching, FFT/iFFT, and MIMO detection. Its 768 hardware multipliers accelerate the 1,536-point FFT used in LTE downlink, while 12 embedded transceivers backhaul CPRI/OBSAI to remote radio heads. Industrial temperature rating and high I/O count make it ideal for central-office equipment.
Recommended
High-Speed Data Acquisition Systems
Scientific, medical imaging, and industrial inspection DAQs leverage the EP3SE260F1517I4 to ingest multiple lanes from 10+ Gsps ADCs. The device's 976 user I/O accept LVDS or SERDES data from front-end ADCs, while embedded memory and DSP blocks perform real-time channel calibration, beamforming (in ultrasound), or image reconstruction. Industrial temperature rating supports harsh industrial environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1517I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1517I3 | EP3SE260F1517C4 | EP3SE260F1517C3 |
|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA, 40 mm | 1517-BBGA, FCBGA, 40 mm - same | 1517-BBGA, FCBGA, 40 mm - same | 1517-BBGA, FCBGA, 40 mm - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | I4 (industrial) | I3 (industrial, slower) | C4 (commercial) | C3 (commercial, slower) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/O Pins | 976 | 976 | 976 | 976 |
| Embedded Transceivers | 12 | 12 | 12 | 12 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- I4 speed grade delivers highest Fmax in the EP3SE260 family (vs EP3SE260F1517I3)
- Industrial temperature range supports harsh-environment deployments (vs EP3SE260F1517C4)
- 976 user I/O maximizes connectivity versus the 1152-ball variant (vs EP3SE260F1152I4)
Design Notes
Estimated: at full utilization (255K LE, 12 transceivers at 6.375 Gbps), the EP3SE260F1517I4 can dissipate 15-20 W. The 1,517-ball FCBGA exposes a large thermal pad on the bottom; designers must solder this pad to a copper pour connected through thermal vias to an internal ground plane. A heatsink with thermal interface material is strongly recommended for industrial-temperature deployments in enclosed chassis. Without adequate cooling, junction temperature can exceed 100C and trigger thermal runaway.
The 1,517-ball FCBGA at 1.0 mm pitch requires a PCB with microvia (laser-drilled) stack-up, sequential lamination, and 1-oz copper on outer layers. Use a 2oz copper pour on inner ground/power planes adjacent to the BGA for thermal spreading. Matched-length routing is required for all 12 transceiver channels; consult the Altera Stratix III device handbook board design guidelines for via pattern, AC coupling capacitor placement, and reference plane stitching.
Three common pitfalls with this device: (1) using the wrong speed grade - the I4 vs I3 vs C4 vs C3 differences matter for Fmax; (2) omitting the configuration device (EPCS or compatible) - the FPGA needs an external flash for non-volatile bitstream; (3) ignoring pinout differences between F1517 and F1152 packages - they share the same die but have different ball maps and user-I/O counts, so a single Quartus pin assignment file does not transfer between packages.
Estimated: at 1.1 V core with peak utilization, the EP3SE260F1517I4 draws 8-12 A from the core rail. Designers must use a multi-phase buck regulator with at least 25 A capacity, low-ESR ceramic output capacitors, and a power plane cutout beneath the BGA. The Stratix III E family's programmable power technology lets Quartus place unused LABs in low-power mode; leverage this by compiling with the 'power optimization' toggle to reduce dynamic power by 20-30%.
Compliance Information
RoHS, lead-free, and halogen-free status were not present in the verified web data and are marked unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Consult Altera/Intel product page or contact authorized distributor for full compliance documentation.