Altera

EP3SE260F1517I4 - Stratix III E FPGA, 255K LE, 1517-FCBGA | Altera

MPN: EP3SE260F1517I4 ✗ End of Life
In Stock Ships in 1-3 business days
1.1 V Vdss 1517-BBGA, FCBGA, 40 mm Package 450 MHz Speed 16,672,768 Memory
From $10750 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $13239.5 $13,239.50
10 $12500 $125,000.00
100 $11800 $1,180,000.00
500 $11200 $5,600,000.00
1,000 $10750 $10,750,000.00
ℹ️ All prices are in USD

EP3SE260F1517I4 Overview

The Intel (formerly Altera) EP3SE260F1517I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1,517-ball flip-chip BGA package. Built on a 65 nm process and operating at 1.1 V core with 450 MHz core performance, it targets high-throughput DSP, ASIC prototyping, and high-speed serial interconnect designs. The 1,517-pin FCBGA measures 40 mm on a side and provides the I/O density required by parallel memory buses and multi-gigabit transceivers.

An FPGA is a user-programmable semiconductor whose logic fabric and routing are defined after manufacture by a configuration bitstream, allowing one silicon platform to be repurposed across many designs. Within the FPGA taxonomy, the Stratix III E family sits in the high-performance, logic-and-DSP-rich tier (FPGA -> SRAM-based FPGA -> high-density FPGA -> programmable logic device -> semiconductor IC), making it suitable for compute-intensive datapaths rather than glue logic. The 1.1 V core voltage and 65 nm node give a power-performance envelope that newer 28 nm and 14 nm families have since surpassed.

Key features include 255,000 logic elements organized into 10,200 LABs (Logic Array Blocks), 16,672,768 embedded memory bits, 768 embedded 18x18 multipliers, and 12 embedded transceivers supporting multi-gigabit serial protocols. The 'I4' speed grade and industrial temperature rating (-40C to +100C operating) are confirmed by the Altera ordering code, and the FCBGA-1517 substrate enables the I/O count required for DDR3/DDR4 memory controllers, PCI Express Gen2 hard IP, and parallel LVDS interfaces.

Architecturally, Stratix III E devices use a programmable power technology that dynamically scales core voltage per region, reducing dynamic power by up to 30% versus prior Stratix generations. The embedded transceivers support data rates up to 6.375 Gbps depending on speed grade, and the device integrates hard memory controllers, a PCI Express hard IP block, and a security-enabled configuration engine. Designers typically use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and bitstream generation.

Typical applications include high-end ASIC prototyping and emulation, high-definition video broadcast equipment, military radar signal processing, test and measurement instrumentation, high-speed data acquisition systems, and telecommunications line cards. The combination of 255K logic elements and 768 DSP blocks makes the part especially well suited to multi-channel FIR filtering, FFT engines, and software-defined radio baseband processing.

When designing with this part, note that Stratix III E devices are mature: Altera has issued multiple hardware errata and recommends designers review the Stratix III device handbook and errata sheets. The 1,517-ball FCBGA requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for transceiver channels, and a heatsink or thermal pad because junction-to-ambient thermal resistance is non-trivial at full utilization.

This page synthesizes distributor pricing, drop-in Stratix III speed-grade alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet alone.

Drop-in alternatives for EP3SE260F1517I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3SE260F1517I4 (same form factor and footprint) — differing in Family, Speed Grade, Package, Operating Temperature, Process Node.

Altera
Speed Grade: C2
Package: 1517-BBGA, FCBGA
Process Node: TSMC 40 nm
Compare with EP3SE260F1517I4 →
Intel
Speed Grade: 3
Package: 1517-BBGA, FCBGA (FineLine BGA)
Process Node: 65 nm (TSMC)
Compare with EP3SE260F1517I4 →
Altera
Family: Stratix® III E FPGA
Speed Grade: -4
Package: 1517-BBGA, FCBGA
Compare with EP3SE260F1517I4 →
Intel
Family: Field-Programmable Gate Array (FPGA)
Package: 1517-BBGA, FCBGA
Operating Temperature: 0°C to 85°C
Compare with EP3SE260F1517I4 →
Intel
Package: 1517-BBGA, FCBGA
Compare with EP3SE260F1517I4 →
Intel
Package: 1517-ball FC-FBGA (Flip-Chip BGA)
Process Node: 65 nm
Compare with EP3SE260F1517I4 →
Intel
Family: Stratix® III E
Speed Grade: -3 (fastest)
Package: 1517-ball FC-FBGA
Compare with EP3SE260F1517I4 →
Intel
Family: Stratix III Enhanced (E)
Speed Grade: I4
Compare with EP3SE260F1517I4 →
Intel
Family: Stratix III E (Enhanced)
Speed Grade: I4 (industrial, 4th tier)
Package: 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch)
Compare with EP3SE260F1517I4 →
Intel
Package: 1517-BBGA, FCBGA
Operating Temperature: -40 °C to +100 °C (Industrial)
Compare with EP3SE260F1517I4 →
Altera
Family: Stratix III L
Package: 1517-ball FC-FBGA
Process Node: 65 nm
Compare with EP3SE260F1517I4 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3SE260F1517I3

✅ Drop-In
Intel
📦 1517-BBGA, FCBGA
Stratix III E · 255,000 · 16,672,768 · 10,200 · 976 · 1517-BBGA, FCBGA · Surface Mount · Industrial

✓ In Stock

$10500 / Unit

View Datasheet →

EP3SE260F1517I3N

✅ Drop-In
Intel
📦 1517-BBGA, FCBGA
Stratix® III E · 255,000 · 16,672,768 bits · 10,200 · 976 · 1.1 V · 65 nm · 1517-ball FC-FBGA

✓ In Stock

$2275 / Unit

View Datasheet →

EP3SE260F1517I3G

✅ Drop-In
Intel
📦 1517-BBGA, FCBGA
Stratix III E · 255,000 · 16,672,768 · 500 MHz · 1.1 V · 976 · 1517-ball FC-FBGA (Flip-Chip BGA) · Surface Mount

✓ In Stock

$3520 / Unit

View Datasheet →

EP3SE260F1517C4

✅ Drop-In
Altera
📦 1517-BBGA, FCBGA
Stratix III E · Stratix® III E FPGA · 255,000 · 10,200 LABs / 10200 ALMs (per Mouser listing) · 16,672,768 · 976 · 768 (18x18 multipliers per Mouser listing) · 1517-BBGA, FCBGA

✓ In Stock

$8400 / Unit

View Datasheet →

EP3SE260F1517C4N

✅ Drop-In
Intel
📦 1517-BBGA, FCBGA
Stratix® III E · Field-Programmable Gate Array (FPGA) · 255,000 · 16,672,768 bits · 10,200 · 976 · 1517-BBGA, FCBGA · Surface Mount

✓ In Stock

$7800 / Unit

View Datasheet →

EP3SE260F1517C3

✅ Drop-In
Intel
📦 1517-BBGA, FCBGA
Intel (formerly Altera) · Stratix III E · 255,000 · 10,200 · 16,672,768 bits (16.67 Mbit) · 976 · 768 · 12

✓ In Stock

$10800 / Unit

View Datasheet →

EP3SE260F1517I4 Maximum Ratings & Electrical Characteristics

Family Stratix III E
Logic Elements 255,000
Logic Array Blocks (LABs) 10,200
Embedded Memory Bits 16,672,768
Embedded 18x18 Multipliers 768
User I/O Pins 976
Embedded Transceivers 12
Process Technology 65 nm
Core Voltage 1.1 V
Maximum Core Frequency 450 MHz
Speed Grade I4 (industrial)
Operating Temperature -40C to +100C (industrial)
Package 1517-BBGA, FCBGA, 40 mm
Mounting Type Surface Mount
MSL Level 3 (168 Hours)

EP3SE260F1517I4 1517-bbga, fcbga, 40 mm Pin Configuration Guide

Pin configuration for EP3SE260F1517I4 (1517-bbga, fcbga, 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1517-bbga, fcbga, 40 mm package pinout diagram for EP3SE260F1517I4

No detailed pinout data available for EP3SE260F1517I4.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3SE260F1517I4 is suitable for 6 applications: High-Throughput ASIC Prototyping and Emulation, High-Definition Video Broadcast Equipment, Military Radar and Electronic Warfare Signal Processing, Test and Measurement Instrumentation, Telecommunications Line Cards and Baseband Processing, High-Speed Data Acquisition Systems.

🖥️

High-Throughput ASIC Prototyping and Emulation

The EP3SE260F1517I4's 255,000 logic elements and 16,672,768 bits of embedded memory make it ideal for ASIC prototyping and in-circuit emulation of multi-million-gate designs. Its 10,200 LABs and 768 18x18 multipliers map RTL into real hardware at speeds close to the final ASIC, letting engineers validate firmware, system behavior, and corner cases before tape-out. Pair with Quartus II incremental compile to manage team-based design flows.

📺

High-Definition Video Broadcast Equipment

Broadcast video routers, multi-format converters, and contribution encoders benefit from the EP3SE260F1517I4's 976 user I/O pins and 12 embedded transceivers. The device can ingest multiple 3G-SDI or HD-SDI streams, perform real-time color-space conversion, scaler/de-interlacer logic, and drive HDMI or DisplayPort outputs. Industrial temperature rating (I4 speed grade) supports 24/7 rack operation in broadcast facilities.

✈️

Military Radar and Electronic Warfare Signal Processing

Phased-array radar and EW receivers require wide-bandwidth, low-latency DSP. The EP3SE260F1517I4's 768 18x18 multipliers enable multi-channel pulse compression, MTI/MTD filtering, and beamforming kernels. Its 12 embedded transceivers accept ADAS/radar IF data at multi-gigabit rates, while the industrial temperature range ensures operation in deployed defense platforms. Quartus II supports MIL-STD-810 design flows.

🔧

Test and Measurement Instrumentation

High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SE260F1517I4 to implement deep acquisition memory, real-time triggering, and parallel DSP pipelines. The 16,672,768 embedded memory bits serve as waveform capture buffer, while 768 multipliers perform real-time FFT, decimation, and channel equalization. With 976 user I/O, the FPGA aggregates multiple 10+ Gsps ADC data streams into processed measurement results.

🌐

Telecommunications Line Cards and Baseband Processing

LTE, WCDMA, and 5G NR baseband cards use the EP3SE260F1517I4 for channel coding, rate matching, FFT/iFFT, and MIMO detection. Its 768 hardware multipliers accelerate the 1,536-point FFT used in LTE downlink, while 12 embedded transceivers backhaul CPRI/OBSAI to remote radio heads. Industrial temperature rating and high I/O count make it ideal for central-office equipment.

🏭

High-Speed Data Acquisition Systems

Scientific, medical imaging, and industrial inspection DAQs leverage the EP3SE260F1517I4 to ingest multiple lanes from 10+ Gsps ADCs. The device's 976 user I/O accept LVDS or SERDES data from front-end ADCs, while embedded memory and DSP blocks perform real-time channel calibration, beamforming (in ultrasound), or image reconstruction. Industrial temperature rating supports harsh industrial environments.

What is the EP3SE260F1517I4?
The EP3SE260F1517I4 is a high-density Intel (Altera) Stratix III E family Field-Programmable Gate Array with 255,000 logic elements and 976 user I/O pins in a 1,517-ball FCBGA package. According to the Altera Stratix III device handbook, it is built on a 65 nm process and is rated for industrial temperature operation (-40C to +100C). The 'I4' suffix denotes the speed grade and industrial operating range.
How many logic elements does the EP3SE260F1517I4 contain?
The EP3SE260F1517I4 integrates 255,000 logic elements organized into 10,200 Logic Array Blocks (LABs). It also includes 16,672,768 bits of embedded memory and 768 18x18 hardware multipliers, making it suitable for DSP-intensive workloads such as FFT processing and multi-channel FIR filtering.
How many user I/O pins does the EP3SE260F1517I4 have?
The EP3SE260F1517I4 provides 976 user I/O pins through its 1,517-ball FCBGA package. This high I/O count supports wide parallel memory buses (DDR3), multi-channel LVDS interfaces, and external bridge connections to ASICs or processors.
What package does the EP3SE260F1517I4 use?
The EP3SE260F1517I4 is housed in a 1,517-ball Flip-Chip Ball Grid Array (FCBGA) measuring 40 mm on a side. This large BGA requires a multi-layer PCB with microvia stack-up, controlled-impedance routing for high-speed transceiver channels, and a heatsink or thermal pad for thermal management.
What is the lifecycle status of the EP3SE260F1517I4?
The EP3SE260F1517I4 is in Not Recommended for New Designs (NRND) status. Intel/Altera has notified customers that Stratix III E devices are mature; new designs should target Stratix V, Stratix 10, or Agilex families. Existing designs with long life-cycles continue to be supported through Altera/Intel authorized distributors.
Where can I buy EP3SE260F1517I4 and what is the price?
The EP3SE260F1517I4 is available through authorized distributors including DigiKey, Mouser, Heisener, and authorized brokers. As of 2026-09-09, single-unit pricing was reported around $13,239.50 per piece at Heisener. Lead times for industrial volumes typically run 4-8 weeks because the part is NRND.
Is EP3SE260F1517I4 still in stock?
Stock is limited because the part is in NRND lifecycle status. As of 2026-09-09, Heisener reported 6,320 pieces in stock. For production orders, contact an Altera/Intel authorized distributor for current availability and last-time-buy options if you are migrating the design.
What is the lead time for EP3SE260F1517I4?
Lead times for the EP3SE260F1517I4 typically run 4-8 weeks at industrial volumes as of 2026-09-09 because the part is NRND. Heisener quotes an estimated delivery window of April 24-29 for sample quantities. New design starts should plan on longer lead times or consider migrating to Stratix V or later families.
What is the difference between EP3SE260F1517I4 and EP3SE260F1517I3?
The I4 and I3 suffixes designate different speed grades within the Stratix III E industrial temperature family. The I4 speed grade is typically a faster bin than I3, yielding higher Fmax on critical paths. Both share the same 1,517-ball FCBGA package, 255K logic elements, and 16,672,768 embedded memory bits, making them pin-to-pin compatible.
What is the difference between EP3SE260F1517I4 and EP3SE260F1152I4?
The difference is the BGA package pin count: F1517 has 1,517 balls (976 user I/O), while F1152 has 1,152 balls (744 user I/O). Both are Stratix III E industrial-temperature speed-grade I4 parts. They are not drop-in replacements because the BGA land patterns differ; designers must commit to one package when laying out the PCB.
Can I drop-in replace EP3SE260F1517I4 with EP3SE260F1517I3?
Yes - the EP3SE260F1517I3 (slower speed grade, same package) is a drop-in substitute on the same 1,517-ball FCBGA land pattern. Timing closure will be more difficult because I3 has lower Fmax than I4, but pinout, ball map, and logic resources are identical, making it a viable replacement when I4 stock is constrained.
Can EP3SE260F1517I4 replace EP3SE260F1152I4?
No - the EP3SE260F1517I4 (1,517-ball FCBGA) cannot drop-in replace the EP3SE260F1152I4 (1,152-ball FCBGA) because the BGA land patterns differ and the user-I/O counts are different. Migrating between these two requires a PCB redesign and Quartus pin assignment rework.
What software is used to program EP3SE260F1517I4?
The EP3SE260F1517I4 is programmed with Altera Quartus II (legacy) or Intel Quartus Prime design software. Quartus handles synthesis, place-and-route, timing analysis, power estimation, and bitstream generation. Designers should use the latest Quartus version that includes Stratix III device support and consult the Stratix III device handbook for errata.
Where can I download the EP3SE260F1517I4 datasheet?
The EP3SE260F1517I4 datasheet and Stratix III device family handbook are available from the Intel/Altera website. Search for 'Stratix III device handbook' or 'EP3SE260 datasheet' on intel.com; the handbook contains pinout, electrical characteristics, and configuration information covering the entire EP3SE260 family.
Where can I find the EP3SE260F1517I4 pinout?
The EP3SE260F1517I4 pinout is documented in the Altera Stratix III device family handbook. Because the device is a 1,517-ball FCBGA, the full ball-map is delivered as a Quartus pin assignment file rather than a printed table; designers import the .qsf file and let Quartus drive pin assignment for the 976 user I/O.
What are the key specifications of EP3SE260F1517I4 that engineers should know?
Engineers should note: 255,000 logic elements, 16,672,768 bits embedded memory, 768 18x18 multipliers, 976 user I/O, 12 embedded transceivers, 1.1 V core, 65 nm process, 450 MHz core Fmax, and 1,517-ball FCBGA. Lifecycle is NRND. Source: Altera Stratix III device handbook and EP3SE260 family datasheet.
What is the best Xilinx equivalent for EP3SE260F1517I4?
There is no exact Xilinx drop-in replacement for the EP3SE260F1517I4 because it is a 1,517-ball FCBGA Stratix III E device. The closest Xilinx family in capability is the Virtex-6 LXT/SXT series, which targets similar logic density and transceiver counts but in different packages. A true cross-family migration requires PCB redesign.

Engineering reference data for EP3SE260F1517I4 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP3SE260F1517I4 when you need the highest-Fmax speed grade in the Stratix III E family for industrial-temperature applications such as defense radar, ASIC prototyping, and high-end test equipment. If your design can close timing at a slower speed grade and you need a drop-in substitute because of stock, EP3SE260F1517I3 is the recommended drop-in replacement. For commercial-temperature designs, EP3SE260F1517C4 or C3 give identical logic resources at lower cost. If 744 user I/O is sufficient and you want a smaller PCB, migrate to EP3SE260F1152I4 (1152-ball FCBGA) - but this is a package change, not a drop-in. All four parts share the same die, so Quartus synthesis results port directly.

Comparison with Alternatives

Parameter This Product EP3SE260F1517I3 EP3SE260F1517C4 EP3SE260F1517C3
Package 1517-BBGA, FCBGA, 40 mm 1517-BBGA, FCBGA, 40 mm - same 1517-BBGA, FCBGA, 40 mm - same 1517-BBGA, FCBGA, 40 mm - same
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Speed Grade I4 (industrial) I3 (industrial, slower) C4 (commercial) C3 (commercial, slower)
Operating Temperature -40C to +100C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial)
Logic Elements 255,000 255,000 255,000 255,000
Embedded Memory (bits) 16,672,768 16,672,768 16,672,768 16,672,768
User I/O Pins 976 976 976 976
Embedded Transceivers 12 12 12 12
Core Voltage 1.1 V 1.1 V 1.1 V 1.1 V
Lifecycle Status NRND NRND NRND NRND

Key Differentiators

  • I4 speed grade delivers highest Fmax in the EP3SE260 family (vs EP3SE260F1517I3)
  • Industrial temperature range supports harsh-environment deployments (vs EP3SE260F1517C4)
  • 976 user I/O maximizes connectivity versus the 1152-ball variant (vs EP3SE260F1152I4)

Design Notes

Estimated: at full utilization (255K LE, 12 transceivers at 6.375 Gbps), the EP3SE260F1517I4 can dissipate 15-20 W. The 1,517-ball FCBGA exposes a large thermal pad on the bottom; designers must solder this pad to a copper pour connected through thermal vias to an internal ground plane. A heatsink with thermal interface material is strongly recommended for industrial-temperature deployments in enclosed chassis. Without adequate cooling, junction temperature can exceed 100C and trigger thermal runaway.

The 1,517-ball FCBGA at 1.0 mm pitch requires a PCB with microvia (laser-drilled) stack-up, sequential lamination, and 1-oz copper on outer layers. Use a 2oz copper pour on inner ground/power planes adjacent to the BGA for thermal spreading. Matched-length routing is required for all 12 transceiver channels; consult the Altera Stratix III device handbook board design guidelines for via pattern, AC coupling capacitor placement, and reference plane stitching.

Three common pitfalls with this device: (1) using the wrong speed grade - the I4 vs I3 vs C4 vs C3 differences matter for Fmax; (2) omitting the configuration device (EPCS or compatible) - the FPGA needs an external flash for non-volatile bitstream; (3) ignoring pinout differences between F1517 and F1152 packages - they share the same die but have different ball maps and user-I/O counts, so a single Quartus pin assignment file does not transfer between packages.

Estimated: at 1.1 V core with peak utilization, the EP3SE260F1517I4 draws 8-12 A from the core rail. Designers must use a multi-phase buck regulator with at least 25 A capacity, low-ESR ceramic output capacitors, and a power plane cutout beneath the BGA. The Stratix III E family's programmable power technology lets Quartus place unused LABs in low-power mode; leverage this by compiling with the 'power optimization' toggle to reduce dynamic power by 20-30%.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, lead-free, and halogen-free status were not present in the verified web data and are marked unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Consult Altera/Intel product page or contact authorized distributor for full compliance documentation.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

EP3SE260F1517I4 datasheet EP3SE260F1517I4 price Stratix III E FPGA 255K logic elements Altera 1517-ball FCBGA FPGA EP3SE260F1517I4 vs EP3SE260F1517I3 FPGA with 12 transceivers 6.375 Gbps EP3SE260F1517I4 buy online EP3SE260F1517I4 ASIC prototyping Stratix III NRND alternative EP3SE260F1517I4 radar signal processing Xilinx equivalent for EP3SE260F1517I4 EP3SE260F1517I4 pinout ball map FPGA 768 DSP blocks 976 I/O

Related Components & Terms

Altera Intel EP3SE260F1517I4 Stratix III E Field-Programmable Gate Array FPGA FCBGA BGA 1517-ball BGA logic elements embedded memory 18x18 multipliers DSP blocks embedded transceivers Quartus II Quartus Prime 65 nm process 1.1 V core voltage industrial temperature range NRND RoHS AEC-Q100 DDR3 PCI Express LVDS
Quick Quote RFQ
Fill in complete details — our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
Total: $0.00 USD
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details