EP3SL50F780I4G - 47,500 Logic Elements FPGA | Altera
MPN: EP3SL50F780I4G β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SL50F780I4G Overview
A field-programmable gate array is an integrated circuit built from configurable logic blocks, programmable routing, input/output resources, and dedicated functional blocks. Designers configure these resources to implement processors, interfaces, protocol bridges, digital-signal-processing pipelines, and control logic. FPGAs differ from fixed-function ASICs because their logic can be revised after fabrication, making them useful for evolving standards, late design changes, prototypes, and production equipment requiring field updates.
The EP3SL50F780I4G provides 47,500 logic elements, 2,184,192 embedded-memory bits, and 488 I/O according to the verified distributor listing. These headline resources place the device in high-density programmable-logic designs where substantial parallel processing and multiple external interfaces are required. The 780-BBGA, FCBGA construction supports the high pin count associated with 488 I/O and is intended for advanced surface-mount assemblies using appropriate BGA assembly and inspection processes.
Stratix III L devices use SRAM-based configuration memory, so the configured FPGA design is normally loaded at power-up from an external configuration source. Implementation therefore requires attention to configuration pins, clock distribution, power sequencing, decoupling, and signal integrity. Because detailed process technology, transceiver count, maximum clock frequency, operating voltage, temperature grade, and thermal metrics are not present in the supplied data, those parameters remain explicitly unverified rather than being inferred.
Typical applications include telecommunications infrastructure, industrial automation and control, test and measurement equipment, medical imaging hardware, aerospace and defense electronics, video processing, and high-speed data acquisition. In these systems, the device can implement multiple processing and interface functions in one programmable device. A 488-I/O resource count can simplify system partitioning when many external memories, converters, processors, or backplane transceivers must be connected.
The primary design constraint is package complexity. A 780-ball FCBGA assembly requires controlled impedance routing, multiple supply rails with local decoupling, reliable power delivery, thermal analysis, and manufacturer-qualified PCB assembly. Firmware, configuration storage, and JTAG or other supported debug resources must also be validated against the complete manufacturer documentation before release.
This page consolidates verified stock, package, I/O, logic-element, and embedded-memory data with practical engineering guidance and same-family configuration context. It does not invent a missing block diagram, pin assignment, speed grade, power specification, or lifecycle claim.
Drop-in alternatives for EP3SL50F780I4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F780I4G (same form factor and footprint) β differing in Package, Speed Grade, Mounting Type, Process Technology, Series.
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| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix III L |
| Logic Elements | 47,500 |
| Embedded Memory | 2,184,192 bits |
| I/O Count | 488 |
| Package | 780-BBGA, FCBGA |
| Package Designation | F780 |
| Configuration Technology | SRAM-based (engineering interpretation; verify against the manufacturer configuration documentation) |
| Mounting Type | Surface Mount |
| Package Pin Count | 780 balls |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
| Lifecycle Status | unknown |
EP3SL50F780I4G 780 balls Pin Configuration Guide
Pin configuration for EP3SL50F780I4G (780 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F780I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F780I4G is suitable for 8 applications: Telecommunications Infrastructure, Industrial Automation and Control, Test and Measurement Equipment, Medical Imaging Hardware, Video Processing and Display Systems, High-Speed Data Acquisition, Aerospace and Defense Electronics, Legacy Platform Modernization.
Telecommunications Infrastructure
EP3SL50F780I4G can support telecommunications infrastructure designs that require substantial parallel logic, embedded buffering, and many external connections. Its verified 47,500 logic elements and 2,184,192 embedded-memory bits are suitable for packet processing, protocol adaptation, traffic management, and control functions when the final configuration fits the available resources. The 488-I/O count can connect processors, memories, network interfaces, and management circuitry through a single programmable device. Because the supplied data does not verify transceiver count, maximum data rate, supported I/O standards, or power consumption, the FPGA should not be selected for a line-card or backplane design until timing, signal-integrity, and manufacturer reference-design checks are complete. Its Stratix III L architecture is especially relevant for teams maintaining legacy programmable systems.
Recommended
Industrial Automation and Control
EP3SL50F780I4G is a potential fit for industrial automation systems that combine motion control, machine vision pre-processing, sensor aggregation, and deterministic control logic. The verified 47,500 logic elements provide capacity for multiple interface and control blocks, while 2,184,192 embedded-memory bits can support FIFOs, lookup tables, and temporary data storage. A 488-I/O resource count can reduce the number of separate interface devices when the system must connect many sensors, actuators, converters, or industrial networks. The 780-BBGA, FCBGA package requires a controlled assembly flow and a board designed for its exact land pattern. Industrial deployment also requires verification of temperature, reliability, supply rails, and safety requirements; those values are not present in the supplied data.
Recommended
Test and Measurement Equipment
EP3SL50F780I4G can be considered for test and measurement platforms that acquire, buffer, process, and route multiple digital channels. Its verified 47,500 logic elements support acquisition sequencers, trigger logic, format conversion, and instrument-control functions, while 2,184,192 embedded-memory bits can be used for sample buffers or waveform lookup data. The 488-I/O count can provide useful flexibility for connecting converters, memories, processors, and back-end interfaces. The final design must validate supported I/O voltages, differential interfaces, clock rates, and timing constraints against the manufacturer documentation, because the supplied results do not state those limits. The F780 780-BBGA, FCBGA package also requires careful high-speed layout and thermal planning.
Recommended
Medical Imaging Hardware
EP3SL50F780I4G may serve in medical imaging hardware where image data must be captured, transformed, buffered, and transferred among processing elements. The verified 47,500 logic elements can implement image pipelines and control functions, while 2,184,192 embedded-memory bits can hold line buffers, lookup tables, or intermediate data. Its 488 I/O can connect image sensors, analog-to-digital converters, memory devices, and host processors. Medical designs require strict validation of data integrity, latency, reliability, and regulatory suitability, but the supplied data does not provide medical qualification, temperature grade, safety certification, or power figures. The 780-BBGA, FCBGA package therefore needs a manufacturer-supported implementation and a board-level signal-integrity and thermal review before use.
Recommended
Video Processing and Display Systems
EP3SL50F780I4G is relevant to video processing and display systems that need configurable timing generators, format conversion, frame buffers, and control logic. The verified 47,500 logic elements provide capacity for parallel pixel processing, while 2,184,192 embedded-memory bits can support small buffers, pattern generation, and lookup-based transformations. A 488-I/O count is useful when several video inputs, outputs, memories, and control interfaces must coexist. The 780-BBGA, FCBGA package supports a high pin count but introduces fine-pitch routing, controlled-impedance, and assembly constraints. Since the supplied data does not specify supported display interfaces, clock limits, video throughput, or power consumption, system architects must confirm those parameters in the official device documentation and representative reference designs.
Recommended
High-Speed Data Acquisition
EP3SL50F780I4G can be evaluated for data-acquisition systems that coordinate converters, memory, packetizers, and downstream processors. Its verified 47,500 logic elements are appropriate for channel control, filtering, formatting, and protocol logic, while 2,184,192 embedded-memory bits can provide FIFOs, capture windows, or temporary storage. The 488-I/O count can simplify connection to parallel data sources and control networks. In a high-speed design, the key risk is not the headline logic count but the unverified speed grades, I/O standards, transceiver capability, power rails, and timing limits. Designers must obtain the manufacturerβs package, pin, power, and timing documentation, then simulate the complete interface and perform signal-integrity validation before selecting EP3SL50F780I4G.
Recommended
Aerospace and Defense Electronics
EP3SL50F780I4G may be considered for aerospace and defense electronics requiring configurable processing, secure hardware updates, and multiple interfaces. The verified 47,500 logic elements and 2,184,192 embedded-memory bits can support control, communications, and signal-processing functions, while 488 I/O can connect sensors, memories, and mission-processing subsystems. The F780 780-BBGA, FCBGA package enables high connection density but requires controlled fabrication, inspection, and thermal management. The supplied data does not establish military temperature grade, radiation performance, export status, reliability level, or lifecycle availability. Those qualifications are essential for aerospace and defense selection and must be confirmed directly through the manufacturer and applicable quality documentation before design approval.
Recommended
Legacy Platform Modernization
EP3SL50F780I4G can help extend the life of an existing programmable system when the verified package and architecture fit the original design. Its 47,500 logic elements, 2,184,192 embedded-memory bits, and 488 I/O provide a substantial resource base for protocol bridges, interface adapters, and incremental functional updates. The 780-BBGA, FCBGA F780 package is especially important for legacy board reuse: the complete land pattern and ball map must match the existing assembly. The supplied data does not confirm the device lifecycle, configuration file compatibility, software support, or whether a newer ordering code is electrically identical. Validate those items through the manufacturerβs ordering guide and the current FPGA toolchain before using the part in a legacy design.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F780I4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Altera |
| Package | 780-BBGA, FCBGA (F780) |
| Logic Elements | 47,500 |
| Embedded Memory | 2,184,192 bits |
| I/O Count | 488 |
| Configuration Technology | SRAM-based (engineering interpretation; verify) |
| Lifecycle Status | unknown |
Key Differentiators
- Verified high-density resource combination (vs EP3SE50F780I4G)
- F780 package identity (vs EP3SL50F484I4G)
- Transparent distinction between verified and missing specifications (vs Generic search-result cross references)
Design Notes
Use the official 780-ball F780 land pattern and ball map before routing begins. The verified package description establishes the package family but does not provide the individual ball assignments. Confirm signal integrity, layer stack-up, escape fanout, via construction, plane continuity, and return-path strategy from the manufacturer package guidelines. Because the part has 488 I/O, early floorplanning and controlled-impedance routing are important for avoiding congestion and signal-integrity problems in the fine-pitch BGA.
Power design must be based on the manufacturerβs voltage, current, sequencing, and power-estimation data, none of which is included in the supplied verified snippets. Do not infer the rail count from the package or family name. After obtaining the datasheet and power estimator, identify all required rails, add local high-frequency decoupling at the supply-entry locations, verify transient response at the BGA balls, and simulate startup sequencing before layout release.
The 780-BBGA, FCBGA package requires a board-level thermal strategy tied to actual power dissipation and airflow. The verified data does not provide junction temperature, thermal resistance, or power consumption, so any thermal estimate would be speculative. Use the manufacturerβs thermal model and power estimate for the selected configuration, then evaluate copper spreading, thermal vias, chassis conduction, and ambient conditions at the maximum system workload.
Treat the 488-I/O count as an interface resource, not a guaranteed performance specification. The supplied data does not identify supported single-ended or differential standards, maximum data rates, transceiver resources, or I/O voltage limits. Confirm the exact bank assignments and electrical constraints in the manufacturer documentation, and simulate clock, memory, converter, and high-speed parallel interfaces with the intended board stack-up and termination scheme.
Do not infer pin compatibility, configuration compatibility, or lifecycle status from a similar EP3SL50 or EP3SE50 ordering code. The verified data identifies only the targetβs headline resources and F780 package, while the supplied cross-reference search contains no validated replacement. For legacy boards, confirm the complete manufacturer part number, package revision, ball map, configuration image, and software support before purchasing or substituting any device.
Compliance Information
The verified web data does not provide compliance declarations. RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status remain unknown.