Intel

EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

MPN: EP3SL70F780I4LN ⚠ Last Time Buy

In Stock Ships in 1-3 business days

0.9 V Vdss 780-ball FC-FBGA Package 375 MHz Speed 2,699,264 bits Memory

From $1245 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$1850	$1,850.00
10	$1720	$17,200.00
100	$1495	$149,500.00
250	$1380	$345,000.00
500	$1245	$622,500.00

ℹ️ All prices are in USD

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EP3SL70F780I4LN Overview

The Intel (Altera) EP3SL70F780I4LN is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs in a 780-pin FC-FBGA package. It is fabricated on a 65 nm process node, operates with a 0.9 V core supply, and supports user I/O voltages up to 3.3 V LVDS/LVCMOS for high-speed parallel interfaces. The Stratix III L series is the logic-optimized variant of the Stratix III family, positioned for ASIC prototyping, high-throughput DSP pipelines, and wire-speed packet processing.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing channels, and embedded hard IP such as block RAM, DSP slices, transceivers, and PLLs. FPGAs occupy a position in the digital design hierarchy between microcontrollers (software-defined I/O) and ASICs (fixed-function silicon), combining ASIC-class parallelism with the design flexibility of software-reconfigurable logic. They are widely used for prototyping, low-volume production, and applications whose algorithms evolve faster than ASIC respins.

Key features of the EP3SL70F780I4LN include a high logic-to-memory ratio that suits compute-bound designs such as FFT engines, video processing, and multi-channel DSP filtering. The device integrates 488 user I/Os, providing abundant pin count for parallel bus interfaces, memory buses, and LVDS links. The 780-ball flip-chip BGA package enables a high-pin-count escape with controlled impedance and excellent thermal performance. Internal signal integrity is maintained by Altera's Adaptive Logic Module (ALM) architecture, which combines 8-input fracturable lookup tables with dedicated register chains.

Architecturally, the Stratix III L series uses a 65 nm low-power CMOS process and a tiered power management scheme that lets unused logic regions enter a near-zero static current state, reducing dynamic power versus earlier Stratix generations. Each LAB contains 10 ALMs paired with carry-chain and cascade resources, while the routing fabric is segmented to optimize timing closure on high-utilization designs. The embedded memory is organized into M9K and M144K blocks to balance area efficiency with deep FIFO and shift-register requirements.

Typical applications for the EP3SL70F780I4LN include ASIC prototyping and emulation, high-definition video and image processing pipelines, multi-channel DSP systems (radar, sonar, telecom baseband), wire-speed packet processing in networking line cards, and military/aerospace signal processing where radiation tolerance and long-life-cycle silicon matter. The 488 I/O budget also makes it a practical bridge between multiple external memory devices and high-speed serial links.

When designing with the EP3SL70F780I4LN, observe that the FBGA-780 package requires a multi-layer PCB with microvia stackups and matched-length impedance control on all LVDS pairs. Quartus II (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and timing closure. Power-rail sequencing on VCC, VCCAUX, and VCCIO must follow the datasheet ramp-order to avoid in-rush latch-up, and a heatsink or thermal pad is recommended because 65 nm Stratix III devices can dissipate 5 to 15 W under typical utilization.

This page synthesizes distributor pricing, verified drop-in Stratix III alternatives, comparison data against EP3SE80F780 and EP3SL110 families, and practical PCB/timing design notes that are not compiled in a single place on the Altera datasheet.

Drop-in alternatives for EP3SL70F780I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3SL70F780I4LN (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Family, Operating Temperature.

EP3SL70F780I3N

Intel

Speed Grade: I3 (industrial)

Process Technology: 65 nm CMOS

Family: Stratix III L