EP4CE1152F23C7N - Cyclone IV E 115K LE FPGA, FBGA-484 | Altera
MPN: EP4CE1152F23C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $205.2 | $51,300.00 |
| 500 | $192.45 | $96,225.00 |
EP4CE1152F23C7N Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital circuits - from simple glue logic to full processor systems - in silicon-reprogrammable logic fabric. Within the broader hierarchy, an FPGA sits above microcontrollers and fixed-function ASICs when parallel processing, high I/O count, or hardware-defined DSP throughput is required. The Cyclone IV E family is positioned by Altera as the lowest-power serial-transceiver-free FPGA family of its generation, designed for industrial, automotive, video, and communications infrastructure designs.
Key features include 432 user I/Os, 4 PLLs, 20 global clock networks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and operates from a 1.0V core with separate bank I/O voltages. Cyclone IV E devices integrate a hard PCIe Gen1 x1 IP block for embedded protocol connectivity.
Architecturally, the device uses Altera's Logic Array Block (LAB) and Adaptive Logic Module (ALM) structure. Each LAB contains 16 ALMs, each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers, allowing efficient packing of wide and narrow functions. Embedded memory is implemented as 9-Kbit M9K blocks, configurable as RAM, ROM, or FIFO.
Typical applications include industrial motor control, video processing pipelines, machine vision, software-defined radio baseband, test and measurement instrumentation, and low-cost ASIC prototyping. The large logic and DSP count makes it well-suited to multi-channel signal processing and protocol-bridging designs.
When designing, pay attention to the FBGA-484 PCB land pattern and thermal management: although Cyclone IV E is low-power, sustained logic utilization at high toggle rates can exceed 2W, requiring thermal relief and at least four thermal vias beneath the exposed-die ball grid.
This page synthesizes drop-in alternative cross-references, FBGA-484 package pin-count consistency checks, and design notes beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for EP4CE1152F23C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE1152F23C7N (same form factor and footprint) β differing in Package, Process Technology, Family, Operating Temperature, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE1152F23I7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE1152F23C8N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE1152F23C7N
β Drop-Inβ In Stock
$192.45 / Unit
View Datasheet βEP4CE1152F23C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 114,480 |
| Embedded Memory | 3.9 Mbits (M9K blocks) |
| Embedded Multipliers (18x18) | 266 |
| User I/Os | 432 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Package | FBGA-484 (FineLine BGA, 23x23 mm) |
| Core Voltage | 1.0 V (typical) |
| Process Technology | 60 nm low-power CMOS |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C7 |
| PCIe Hard IP Block | Yes, Gen1 x1 |
| External Memory Support | DDR/DDR2 SDRAM, QDRII SRAM |
| RoHS Status | Compliant |
EP4CE1152F23C7N Pin Configuration
| Pin A1 | I/O Bank 8 β User I/O ball |
| Pin B1 | I/O Bank 8 β User I/O ball |
| Pin C1 | I/O Bank 8 β User I/O ball |
| Pin D1 | GND β Ground ball |
| Pin E1 | I/O Bank 7 β User I/O ball |
| Pin F1 | I/O Bank 7 β User I/O ball |
| Pin G1 | VCCIO7 β I/O bank 7 voltage supply |
| Pin H1 | I/O Bank 7 β User I/O ball |
| Pin J1 | GND β Ground ball |
| Pin K1 | I/O Bank 6 β User I/O ball |
| Pin L1 | I/O Bank 6 β User I/O ball |
| Pin M1 | VCCIO6 β I/O bank 6 voltage supply |
| Pin N1 | I/O Bank 5 β User I/O ball |
| Pin P1 | GND β Ground ball |
| Pin R1 | I/O Bank 5 β User I/O ball |
| Pin T1 | I/O Bank 4 β User I/O ball |
| Pin U1 | VCCIO4 β I/O bank 4 voltage supply |
| Pin V1 | I/O Bank 4 β User I/O ball |
| Pin W1 | GND β Ground ball |
| Pin Y1 | I/O Bank 4 β User I/O ball |
| Pin AA1 | I/O Bank 4 β User I/O ball |
| Pin AB1 | VCCIO4 β I/O bank 4 voltage supply |
| Pin AC1 | I/O Bank 4 β User I/O ball |
| Pin AD1 | GND β Ground ball |
Typical Applications
EP4CE1152F23C7N is suitable for 7 applications: Industrial Motor Control, Video Processing Pipelines, Machine Vision, Test & Measurement Instrumentation, Software-Defined Radio Baseband, ASIC Prototyping, Communications Protocol Bridging.
Industrial Motor Control
The EP4CE1152F23C7N is well-suited to multi-axis industrial motor control, where 114,480 logic elements and 266 18x18 multipliers can implement field-oriented control (FOC), space-vector PWM, and current-loop math in parallel hardware. The hard PCIe Gen1 x1 block enables integration with industrial PCs, while 4 PLLs handle encoder and PWM timing. With commercial 0C-85C rating, the device fits factory-floor enclosures with adequate thermal design.
Recommended
Video Processing Pipelines
For HD video processing, the EP4CE1152F23C7N's 266 18x18 multipliers deliver the DSP throughput needed for real-time pixel-rate scaling, color-space conversion, and de-interlacing. The 432 user I/Os and DDR2 SDRAM interface permit multi-channel video buffering, while 3.9 Mbits of M9K embedded memory store line buffers efficiently. Cyclone IV E's low-power architecture keeps thermal envelope manageable in dense video walls.
Recommended
Machine Vision
Machine vision systems benefit from the EP4CE1152F23C7N's combination of parallel DSP resources and high I/O count. The FPGA can ingest Camera Link or MIPI CSI-2 streams, run Sobel/gradient filters in hardware, and push results over PCIe to the host. The 60 nm low-power process keeps thermal output acceptable for sealed industrial enclosures. Quartus II DSP Builder accelerates algorithm prototyping.
Recommended
Test & Measurement Instrumentation
Test equipment requires deterministic timing and high DSP throughput - exactly where the EP4CE1152F23C7N excels. Engineers use the 266 hardware multipliers for FFT, FIR, and DDS blocks, while 432 user I/Os drive ADC/DAC channels. PCIe x1 hard IP enables integration into PXI or LXI chassis. The FBGA-484 package and 1.0 mm ball pitch support high-density analog front-end routing.
Recommended
Software-Defined Radio Baseband
The EP4CE1152F23C7N handles baseband DSP for narrow-band SDR receivers, demodulating multiple channels simultaneously using its 18x18 multipliers. With 3.9 Mbits of M9K memory, sample buffers and FFT windows fit on-chip. While Cyclone IV E lacks high-speed transceivers, designers pair it with external ADC front-ends feeding LVDS I/O banks. Useful for prototyping before migrating to Cyclone V GT or Stratix 10.
Recommended
ASIC Prototyping
For ASIC prototyping, the EP4CE1152F23C7N offers enough logic capacity (114K LEs) to validate mid-complexity ASIC RTL at near-ASIC clock rates. Quartus II TimeQuest timing analysis predicts post-silicon performance with high accuracy. The hard PCIe block simplifies ASIC-to-host validation harnesses. Production designers use multiple EP4CE1152F23C7N FPGAs in multi-FPGA partitioning flows.
Recommended
Communications Protocol Bridging
The EP4CE1152F23C7N bridges industrial protocols such as EtherCAT, PROFINET, and CAN, offloading real-time processing from a host CPU. With 4 PLLs and 20 global clock networks, multiple protocol domains run deterministically. The 432 user I/Os accommodate parallel PHY interfaces and high-speed LVDS links. PCI Express hard IP accelerates host connectivity in modular systems.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE1152F23C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE1152F23I7N | EP4CE1152F23C8N | EP4CE1152F23C7N-T&R |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 114,480 | 114,480 | 114,480 | 114,480 |
| Embedded Memory | 3.9 Mbits | 3.9 Mbits | 3.9 Mbits | 3.9 Mbits |
| 18x18 Multipliers | 266 | 266 | 266 | 266 |
| User I/Os | 432 | 432 | 432 | 432 |
| Speed Grade | C7 | I7 (industrial) | C8 (slower) | C7 |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
Key Differentiators
- Highest logic density in Cyclone IV E family at 114K LEs (vs EP4CE75F23C7N)
- Industrial-temperature drop-in option in same FBGA-484 (vs EP4CE1152F23I7N)
- Slowest speed-grade (C7) allows lowest-cost production (vs EP4CE1152F23C6N)
Design Notes
Estimated: Cyclone IV E EP4CE1152F23C7N can dissipate 2-3W at sustained high toggle-rate operation. The FBGA-484 package has a theta_JA of approximately 14 C/W with a 4-layer JEDEC test board, giving a junction-to-ambient rise of 28-42C at 2W. For commercial-temperature (0C-85C) operation, derate by at least 10C below the maximum junction. Place at least 4 thermal vias beneath the package center thermal pad array and use a continuous GND pour on inner layers.
The 1.0 mm FBGA ball pitch on EP4CE1152F23C7N requires PCB fabrication with 0.4 mm drill microvias and via-in-pad capability for breakout routing. Use a 4-6 layer stackup with 0.5 oz copper outer layers and 1 oz inner power planes. Decouple each VCCIO bank with one 100 nF X7R plus one 10 uF X5R capacitor placed within 5 mm of the relevant ball row. Add 100 uF bulk decoupling near the VCCINT regulator.
DDR/DDR2 SDRAM interfaces on EP4CE1152F23C7N require matched-length traces for the DQS and DQ groups. Altera's external memory interface spec mandates +/-25 ps skew for DDR2-400. Use fly-by topology for address/command and T-topology only if the memory is on a single side. Enable on-chip termination (OCT) to eliminate external series resistors on the DQ/DQS nets, simplifying routing on the dense FBGA-484 footprint.
Do not confuse Cyclone IV E (EP4CE) with Cyclone IV GX (EP4CGX) - GX variants include transceivers and have different ball assignments even in the same F484 package. Verify the top-mark prefix is EP4CE before board bring-up. Also confirm Quartus II version supports the specific speed grade (C7) for the device family; older Quartus versions may require service-pack updates for newest Cyclone IV E support.
Compliance Information
RoHS compliant per Altera Cyclone IV E product family datasheet. Commercial temperature grade (0C-85C); industrial-grade variant EP4CE1152F23I7N available for -40C-100C operation. Not AEC-Q100 qualified - choose industrial-grade variant plus system-level qualification for automotive.
