Intel

EP4CE40F23C8 - Cyclone IV E FPGA, 39.6K LE, 484-FBGA | Intel

MPN: EP4CE40F23C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA (F23) Package 20 Speed 1,161,216 bits (1134 Kbit) Memory
From $54.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $78.5 $78.50
10 $74.2 $742.00
100 $67.9 $6,790.00
500 $61.4 $30,700.00
1,000 $54.8 $54,800.00
ℹ️ All prices are in USD

EP4CE40F23C8 Overview

The Intel (formerly Altera) EP4CE40F23C8 is a member of the Cyclone IV E family of low-power, high-volume FPGAs, fabricated on a 60 nm process and packaged in a 484-ball FineLine BGA with 328 user I/O pins. The device integrates 39,600 logic elements, 1,161,216 bits of embedded memory (1134 Kbit), and 116 embedded 18x18 multipliers, making it well-suited for cost-sensitive parallel processing, motor control, video bridging, and industrial communication designs. It is built around a logic-structure of 4-input look-up tables (LUTs), true dual-port M9K memory blocks, and embedded multiplier blocks with optional pre-adder support.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are customized after manufacturing via a configuration bitstream. Within the broader programmable-logic hierarchy, FPGAs sit between simple CPLDs (Complex Programmable Logic Devices) and full Application-Specific Integrated Circuits (ASICs), offering higher logic density than CPLDs and far lower NRE cost than ASICs. The Cyclone IV E family in particular targets low static and dynamic power consumption, making the architecture attractive for power-budgeted applications such as handheld test equipment and factory-floor controllers.

Key features of the EP4CE40F23C8 include four general-purpose PLLs per device, support for external memory interfaces such as DDR2, DDR, LPDDR2, and QDR II SRAM, 20 global clock networks, and 66 LVDS channels (33 pairs). The configuration scheme supports Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG modes. I/O standards supported include LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS, with per-pin dynamic on-chip termination. Operating junction temperature spans 0 C to 85 C (commercial, suffix C8).

Typical applications span industrial motor-control inverters, video format converters, low-cost PCIe endpoint bridges, factory automation controllers, and low-power software-defined radio front-ends. In motor-control designs the embedded multipliers and dedicated PLLs accelerate field-oriented control (FOC) algorithms, while in display-port interface bridging the 328 user I/Os and LVDS channels provide ample bandwidth without an external transceiver.

When designing with this part, allocate at least 1 sq-in of solid ground plane beneath the 484-ball FBGA and follow Intel's recommended 4-layer PCB stack-up for the impedance-controlled pairs. The configuration flash must be a 16-bit or 32-Mbit AS-mode EPCS device selected to match the cyclone IV E bitstream size.

This page consolidates distributor pricing, drop-in alternatives, and practical PCB design notes not found in the manufacturer datasheet alone, giving engineers a single reference for both the electrical characterization and the supply-chain profile of the EP4CE40F23C8.

Drop-in alternatives for EP4CE40F23C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE40F23C8 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Embedded Memory, RoHS Status.

Intel
Package: FBGA-484 (23 x 23 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power
Speed Grade: C6 (commercial, mid-tier)
Compare with EP4CE40F23C8 →
Intel
Package: 484-ball FBGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch)
Speed Grade: 6
Compare with EP4CE40F23C8 →
Intel
Process Technology: 60 nm low-power
RoHS Status: Compliant (lead-free FBGA)
Compare with EP4CE40F23C8 →
Intel
Package: 484-ball FineLine BGA (FBGA)
Process Technology: 60 nm low-power CMOS
Speed Grade: C7
Compare with EP4CE40F23C8 →
Intel
Package: 484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm
Process Technology: 60 nm (TSMC low-power)
Speed Grade: 8 (industrial low-power process, 8-stage logic)
Compare with EP4CE40F23C8 →
Intel
Process Technology: 60 nm low-power CMOS
Compare with EP4CE40F23C8 →
Intel
Package: FBGA-484 (23x23 mm, 1.0 mm pitch)
Compare with EP4CE40F23C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE40F23C8N

✅ Drop-In
Intel
📦 484-ball FBGA (F23)
Cyclone IV E · 39,600 · 2475 LAB · 1134 Kbit · 66 · 4 · 328 · 200 MHz

✓ In Stock

$52.95 / Unit

View Datasheet →

EP4CE40F23C7N

✅ Drop-In
Intel
📦 484-ball FBGA (F23)
Cyclone IV E · 39,600 · 1,161,216 bits · 116 · 328 · 4 · 66.5 · 60 nm low-power CMOS

✓ In Stock

$21.8 / Unit

View Datasheet →

EP4CE40F23C7

✅ Drop-In
Intel
📦 484-ball FBGA (F23)
Cyclone IV E · EP4CE40 · 39,600 · 2,475 · 1,161,216 bits · 66 · 4 · 20

✓ In Stock

$102 / Unit

View Datasheet →

EP4CE40F23C6N

✅ Drop-In
Intel
📦 484-ball FBGA (F23)
Cyclone IV E · Cyclone IV E (low-cost, low-power FPGA) · 39,600 · 2,475 · 1,161,216 (1134 Kbit) · 116 · 4 · 328

✓ In Stock

$76.8 / Unit

View Datasheet →

EP4CE40F23C6

✅ Drop-In
Intel
📦 484-ball FBGA (F23)
Cyclone IV E · 39,600 · 1,161,216 bits (1134 Kbits) · 116 · 328 · 4 · 20 · AS, AP, FPP, JTAG

✓ In Stock

$71.4 / Unit

View Datasheet →

EP4CE40F23C8 Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 39,600
Embedded Memory 1,161,216 bits (1134 Kbit)
Embedded 18x18 Multipliers 116
Maximum User I/O 328
Package 484-ball FBGA (F23)
Process Technology 60 nm
Core Voltage 1.2 V
Number of PLLs 4
Global Clock Networks 20
LVDS Channels 66 (33 pairs)
Operating Junction Temperature 0 C to 85 C (commercial)
Configuration Modes AS, PS, FPP, JTAG
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

EP4CE40F23C8 484-ball fbga (f23) Pin Configuration Guide

Pin configuration for EP4CE40F23C8 (484-ball fbga (f23) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (f23) package pinout diagram for EP4CE40F23C8

No detailed pinout data available for EP4CE40F23C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE40F23C8 is suitable for 6 applications: Industrial Motor Control (FOC / AC Drives), Video Format Conversion / Display Bridging, Low-Power Industrial Communication Gateways, Test & Measurement Front-End (DAQ / Logic Analyzer), Software-Defined Radio / Digital Signal Processing, Automotive Infotainment / ADAS HMI.

🏭

Industrial Motor Control (FOC / AC Drives)

The EP4CE40F23C8 fits field-oriented-control (FOC) motor drives because its 116 embedded 18x18 multipliers accelerate the Park/Clarke transforms and the four PLLs synthesize the PWM-aligned carrier clocks for three-phase inverters. With 39,600 logic elements and 1134 Kbit of M9K memory it can hold encoder capture buffers and current-loop lookup tables on-chip, removing external SRAM. The 328 user I/Os accept parallel ADC sampling from multi-shunt current sensors and emit center-aligned PWM to gate drivers. Compared with discrete DSP + CPLD solutions, the EP4CE40F23C8 consolidates control logic, commutation timing, and protection interlocks into a single 484-FBGA device, simplifying the BOM and shortening time-to-market for industrial inverter designs.

📺

Video Format Conversion / Display Bridging

The 328 user I/Os and 66 LVDS channels of the EP4CE40F23C8 make it well suited to bridging parallel RGB/CMOS camera interfaces to LVDS display panels, or to upscaling standard-definition video to 720p in industrial HMIs. The M9K memory blocks act as line buffers, eliminating the need for an external frame buffer in many single-channel pipelines. The four PLLs generate the pixel clock and the LVDS reference clocks with sub-100 ps jitter, which is critical for clean panel timing. Compared with a dedicated video processor ASIC, the FPGA approach allows field upgrades via configuration bitstream and lets the same hardware serve multiple panel resolutions, reducing SKU count for display product lines.

🌐

Low-Power Industrial Communication Gateways

In EtherCAT, PROFINET, or Modbus TCP gateway designs, the EP4CE40F23C8 provides the deterministic parallel fabric to bridge real-time Ethernet MACs to legacy fieldbuses without an external processor. Its 1,161,216 bits of embedded memory can hold protocol stacks, and the four PLLs synthesize RGMII / MII / SPI reference clocks with low jitter. The 60 nm low-power Cyclone IV E process keeps static power low, which matters in always-on industrial gateways that must dissipate heat inside sealed IP65 enclosures. Engineers can implement Modbus RTU master, PROFINET IRT, or EtherCAT slave state machines alongside an external PHY, all in the same 484-FBGA package, with sufficient logic headroom for proprietary diagnostic layers.

📺

Test & Measurement Front-End (DAQ / Logic Analyzer)

Bench-top data-acquisition and logic-analyzer front-ends use the EP4CE40F23C8 to implement timing/skew calibration, trigger engines, and on-the-fly sample compression. The 116 multipliers enable real-time FIR filtering of ADC data streams, while the M9K memory blocks implement deep capture FIFO buffers at sample rates up to 200 MSPS. The 328 I/Os accept parallel LVDS or LVTTL ADC data, and the four PLLs generate per-channel sampling clocks with adjustable phase shift for interleaved ADC architectures. Compared with an FPGA-less DAQ that requires an external DSP, the EP4CE40F23C8 reduces system latency to under 1 us end-to-end and lets the firmware engineer ship protocol-aware compression (e.g., LZ4 on-chip).

🌐

Software-Defined Radio / Digital Signal Processing

The 116 18x18 multipliers and 39,600 LEs make the EP4CE40F23C8 a viable target for low-to-mid bandwidth software-defined radio (SDR) baseband processing, including DVB-T/DVB-T2 demodulation, LTE physical-layer channel estimation, or amateur-radio digital modes. The four PLLs generate baseband I/Q clocks and DAC/ADC sample clocks, while the M9K blocks buffer FFT window data at sample rates up to 80 MSPS. Compared with general-purpose DSP microcontrollers that peak at a few hundred MMACS, the FPGA delivers thousands of MMACS for the same power budget, enabling real-time FFTs of 1024-4096 points. The 484-FBGA package also supports LVDS interconnect to high-speed ADCs such as the AD9230 family.

🚗

Automotive Infotainment / ADAS HMI

Although the EP4CE40F23C8 is commercial-grade, designers use it as a development and pre-production FPGA for automotive HMI prototyping, including cluster displays, head-up displays, and surround-view camera aggregation. The 328 user I/Os accept multiple CSI-2 / parallel camera inputs, while the LVDS channels drive automotive-grade LCD panels directly. The 116 hardware multipliers accelerate image-pipeline functions such as lens-distortion correction, lane-departure overlay blending, and surround-view stitching. For production-intent automotive designs, designers migrate the verified RTL to Cyclone V or Cyclone 10 LP industrial-grade parts; the EP4CE40F23C8 serves as the high-visibility engineering vehicle during algorithm validation.

Recommended Products Summary

EP4CE40F23C8N Intel Used in: Industrial Motor Control (FOC / AC Drives), Test & Measurement Front-End (DAQ / Logic Analyzer) EPCS16SI16N Serial configuration flash for AS mode Used in: Industrial Motor Control (FOC / AC Drives), Low-Power Industrial Communication Gateways, Software-Defined Radio / Digital Signal Processing EP4CE40F23C7N Intel Used in: Video Format Conversion / Display Bridging, Automotive Infotainment / ADAS HMI EPCS64SI16N Larger configuration flash for multi-image firmware Used in: Video Format Conversion / Display Bridging, Test & Measurement Front-End (DAQ / Logic Analyzer), Automotive Infotainment / ADAS HMI EP4CE30F23C8N Cost-down variant if logic utilization stays under 70% Used in: Low-Power Industrial Communication Gateways EP4CE40F23C6N Intel Used in: Software-Defined Radio / Digital Signal Processing
What is the EP4CE40F23C8 and what family does it belong to?
The EP4CE40F23C8 is a Cyclone IV E Field-Programmable Gate Array (FPGA) from Intel (formerly Altera). It integrates 39,600 logic elements, 1,161,216 bits of embedded memory (1134 Kbit), 116 18x18 multipliers, and 328 user I/Os in a 484-ball FBGA package. It is the mid-density member of the low-power Cyclone IV E family, fabricated on a 60 nm process node.
How many logic elements and memory bits does the EP4CE40F23C8 have?
The EP4CE40F23C8 contains 39,600 4-input-LUT-based logic elements, 1,161,216 bits of embedded SRAM (1134 Kbit) organized into M9K blocks, and 116 embedded 18x18 hardware multipliers. This resource mix is appropriate for designs needing parallel DSP blocks (FOC motor control, video processing) and moderate on-chip buffering.
What package does the EP4CE40F23C8 use and how many I/O pins does it expose?
The EP4CE40F23C8 is housed in a 484-ball FineLine BGA package (Intel package code F23, 23x23 mm body). Up to 328 user I/O balls are usable depending on the I/O standard and configuration scheme chosen; this makes the part one of the highest-I/O-density members of the Cyclone IV E family.
Where can I download the EP4CE40F23C8 datasheet PDF?
The official Cyclone IV E device datasheet (DC datasheet chapter) is hosted by Intel at intel.com under the Cyclone IV device documentation page (document number CV-51002 in the Intel documentation set). For ordering-specific information such as package marking, refer to the device pin-out files at the same Intel documentation portal.
What is the operating temperature range of the EP4CE40F23C8?
The EP4CE40F23C8 carries the C8 speed/temperature grade suffix, which designates a commercial-temperature device with junction temperature 0 C to 85 C. Industrial-temperature equivalents (suffix I7/I8) operate from -40 C to 100 C junction, and military/extended grades are not offered in the Cyclone IV E family.
How much does the EP4CE40F23C8 cost and is it in stock at distributors?
As of 2026-09-10, the EP4CE40F23C8 lists at approximately $78.50 for qty 1 and scales down to about $54.80 at qty 1000 on Octopart-listed distributors. Stock fluctuates because the part has been on Intel's NRND roadmap; check distributor real-time inventory before placing volume orders and request a quote for production quantities.
What is the lead time for the EP4CE40F23C8 in 2026?
Lead time for the EP4CE40F23C8 in 2026 ranges from immediate-ship (DigiKey shows 'Ships today') when broker or excess inventory is available, to 12-16 weeks for fresh factory orders from authorized distributors. Because Cyclone IV E is on Intel's NRND roadmap, lead times can stretch further; plan ahead and consider Cyclone 10 LP as a long-term replacement.
Can I drop-in replace the EP4CE40F23C8 with EP4CE40F23C8N?
Yes. The EP4CE40F23C8N is the RoHS-compliant variant of the EP4CE40F23C8 in the same 484-ball FBGA F23 package, same die, same speed grade, and same Cyclone IV E family. It is a true pin-compatible drop-in replacement, differing only in the lead-free terminal finish and the N suffix marking. Functionally and parametrically they are identical.
What is the best cross-brand drop-in replacement for the EP4CE40F23C8?
There is no true drop-in cross-brand replacement for the EP4CE40F23C8 because no competing FPGA vendor (Lattice, Xilinx/AMD, Microchip) ships a 484-ball FBGA part with the same Cyclone IV E logic-element count and pinout. Lattice ECP5 and AMD Spartan-6 LX45 are the closest functional alternatives but require a PCB redesign and bitstream rewrite, not a drop-in swap.
EP4CE40F23C8 vs EP4CE40F23C6N - which should I choose?
The EP4CE40F23C6N is a slower speed grade (C6 vs C8), meaning worst-case timing closure is tighter and core PLL VCO ranges shift slightly; choose C8 for new designs where you need the extra timing margin. Otherwise both parts share the same 39,600 LE / 1134 Kbit memory / 484-FBGA / commercial temperature envelope, so the C8 is generally the safer pick today.
EP4CE40F23C8 vs EP4CE30F23C8N - which is better for my application?
The EP4CE30F23C8N has 29,440 logic elements (about 26% fewer than the 39,600 LE EP4CE40F23C8) in the same 484-ball F23 FBGA package. If your design uses less than 60% of the EP4CE40's logic, the EP4CE30 is a cost-down option. If you are near the resource limit, the EP4CE40F23C8 is the correct choice; do not undersize the FPGA on a production board.
What configuration flash should be paired with the EP4CE40F23C8?
Use an Intel EPCS16 (16 Mbit) or EPCS64 (64 Mbit) serial configuration flash in Active Serial (AS) mode. The EP4CE40 bitstream ranges roughly 7-10 Mbit depending on utilization, so the EPCS16 is normally sufficient. Match the flash VCCIO to the FPGA's MSEL[3:0] settings (typically 3.3 V for AS standard mode) and follow Intel's AS configuration schematics in CV-52002.
When should I choose the EP4CE40F23C8 over a Cyclone 10 LP part?
Choose the EP4CE40F23C8 when your design is locked to the Quartus II 13.x toolchain, when you have a long-stable production board, or when you need the 60 nm Cyclone IV E silicon's exact I/O behaviour. Choose Cyclone 10 LP (10CL040) for new designs because it is in active production on a 60 nm low-power process and has Intel's longer-term supply commitment.
Hey Google, what can replace an EP4CE40F23C8 on the same board?
The only same-footprint drop-in replacements for the EP4CE40F23C8 are its speed-grade siblings in the EP4CE40 family: EP4CE40F23C7, EP4CE40F23C7N, EP4CE40F23C6, and EP4CE40F23C6N. All share the 484-ball F23 FBGA package. They differ only in core speed grade and lead-free marking, not in pinout or logic resources.
What are the key specifications of the EP4CE40F23C8 that engineers should know?
The EP4CE40F23C8 integrates 39,600 logic elements, 1,161,216 bits of embedded memory (1134 Kbit), 116 18x18 multipliers, 4 PLLs, 20 global clocks, 66 LVDS channels, and 328 user I/Os. The 60 nm core runs from a 1.2 V supply with separate 2.5 V/3.3 V PLL analog and 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O rails. Commercial 0 C to 85 C junction temperature, 484-ball F23 FBGA.

Engineering reference data for EP4CE40F23C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE40F23C8 when your design targets the Cyclone IV E family and needs the fastest commercial speed grade (C8) for timing closure headroom in DSP-heavy or LVDS-heavy applications. Choose the EP4CE40F23C8N if your product must be RoHS-compliant for EU or US sale; the N variant is functionally identical and pin-compatible. Choose EP4CE40F23C7N or EP4CE40F23C6N when budget pressure outweighs the need for the C8 timing margin, or when the design has substantial timing slack. All five options share the same 484-ball F23 FBGA footprint and identical 39,600 LE / 1134 Kbit / 116 multipliers / 328 I/O resource envelope, so PCB layout reuse is guaranteed across the family. For new designs in 2026, also evaluate Cyclone 10 LP (10CL040YF484I8G) for active-production silicon with longer-term supply assurance.

Comparison with Alternatives

Parameter This Product EP4CE40F23C8N EP4CE40F23C7N EP4CE40F23C7 EP4CE40F23C6N EP4CE40F23C6
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 484-ball FBGA (F23) 484-ball FBGA (F23) - same 484-ball FBGA (F23) - same 484-ball FBGA (F23) - same 484-ball FBGA (F23) - same 484-ball FBGA (F23) - same
Logic Elements 39,600 39,600 39,600 39,600 39,600 39,600
Speed Grade C8 (fastest) C8 C7 C7 C6 C6
RoHS / Pb-Free Non-RoHS (SnPb) RoHS / Pb-free (N suffix) RoHS / Pb-free (N suffix) Non-RoHS (SnPb) RoHS / Pb-free (N suffix) Non-RoHS (SnPb)
Embedded Memory 1,161,216 bits 1,161,216 bits 1,161,216 bits 1,161,216 bits 1,161,216 bits 1,161,216 bits
Embedded 18x18 Multipliers 116 116 116 116 116 116
User I/O 328 328 328 328 328 328
Operating Temperature 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial) 0 C to 85 C (commercial)

Key Differentiators

  • Same 484-ball F23 FBGA, fully pin-compatible speed-grade siblings (vs EP4CE40F23C6N)
  • RoHS/Pb-free compliance via N-suffix variant (vs EP4CE40F23C8 (this part))
  • Same 39,600 LE, 1134 Kbit memory, 116 multipliers, 328 I/O across all C-grade siblings (vs EP4CE30F23C8N)

Design Notes

Use Intel's recommended 4-layer PCB stack-up for the 484-ball F23 FBGA: 1-oz outer copper, 0.5-oz inner copper, and a high-Tg FR-4 dielectric with a target 50 ohm single-ended / 100 ohm differential impedance on the LVDS pairs. Place a continuous ground plane directly under the BGA to provide a low-impedance return path for the high-speed transceivers, and route all configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0], DATA0/ASDO, DCLK) as microstrip-length-matched traces on the top layer.

Decouple each VCCINT, VCCA, VCCIO bank, and VCCPD pin with a 0.1 uF X7R ceramic capacitor placed within 100 mil of the package ball, plus a bulk 10 uF X5R per supply rail. Use a ferrite bead on VCCA (PLL analog supply) and isolate it from VCCINT by at least 20 mil of ground copper to minimize PLL jitter. The Cyclone IV E typical ICCINT for the EP4CE40 is roughly 0.5-1.5 A depending on utilization; size your regulator for 1.5x headroom and add a power-good signal to drive nCONFIG of downstream devices.

Estimated: at 100% utilization the EP4CE40F23C8 consumes approximately 1.0-1.4 W of dynamic power plus about 0.1-0.2 W of static power (60 nm Cyclone IV E). Do not assume the C8 speed grade automatically gives faster PLLs - the PLL VCO range is identical across C6/C7/C8; speed grade only affects register-to-register timing margins. When migrating from a Cyclone III design, double-check that all MSEL pull-ups/pull-downs match the Cyclone IV E configuration scheme, because the MSEL encoding changed slightly. Finally, do not omit the EPCS configuration flash in AS mode - PS/FPP modes require an external host CPU and complicate field firmware upgrades.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

EP4CE40F23C8 has SnPb terminal finish and is non-RoHS; choose EP4CE40F23C8N for RoHS-compliant production. FPGAs are not AEC-Q100 qualified (industrial / commercial grades only). REACH compliance and conflict-minerals statement per Intel product page.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CE40F23C8 EP4CE40F23C8N EP4CE40F23C7N EP4CE40F23C7 EP4CE40F23C6N EP4CE40F23C6 Cyclone IV E Cyclone 10 LP FPGA Field-Programmable Gate Array CPLD Look-Up Table M9K memory block 18x18 multiplier LVDS PLL Active Serial configuration EPCS configuration flash 484-ball FBGA FineLine BGA F23 package RoHS REACH Quartus II Qsys Platform Designer
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