Intel

EP4CE75F23C8LN - 75K LE Cyclone IV E FPGA, 484-FBGA | Intel

MPN: EP4CE75F23C8LN βœ“ Active
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1.2 V Vdss 484-ball FBGA (F23) Package 20 Speed
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Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $168 $168.00
10 $152 $1,520.00
100 $138 $13,800.00
500 $122 $61,000.00
1,000 $108.5 $108,500.00
ℹ️ All prices are in USD

EP4CE75F23C8LN Overview

The Intel (formerly Altera) EP4CE75F23C8LN is a low-power, high-volume Cyclone IV E Field Programmable Gate Array delivering 75,408 logic elements, 281,088 RAM bits, and 274 embedded 18x18 multipliers in a 484-ball FineLine BGA package. The device operates from a 1.2 V core supply with separate 2.5 V/3.3 V I/O bank rails and is specified over the commercial 0 C to +85 C junction temperature range, identified by the trailing 'C8' speed grade (8 ns). It also supports up to 292 user I/O pins for high-density digital interfacing.

A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory, DSP blocks, and programmable I/O on a single semiconductor die. FPGAs belong to the broader programmable logic family, sitting alongside CPLDs and structured ASICs in the hierarchy of reconfigurable digital ICs. The Cyclone IV E family specifically targets low-cost, low-power, high-volume applications where discrete ASICs are uneconomical.

Key features of the EP4CE75F23C8LN include 4 PLLs for clock management, 20 global clock networks, and a hard memory controller block that simplifies external DDR/DDR2 SDRAM interfacing. The 60 nm process technology delivers a static power profile suited to fanless industrial enclosures, and the 8-input adaptive logic module (ALM) structure yields approximately 1.7x the logic capacity of the previous Cyclone III generation at the same die area.

The Cyclone IV E architecture pairs each logic array block with ten ALMs, each containing an 8-input fracturable look-up table, two dedicated adders, and a register file. The embedded multiplier blocks can be configured as 9x9, 18x18, or 27x27 for DSP-style FIR filters and FFT pipelines. Configuration flash is loaded through JTAG, AS, PS, or FPP modes, with built-in AES-128 encryption supported on the EP4CE family.

Typical applications include industrial machine vision controllers, low-cost video processing bridges, motor-control PWM generators, and FPGA-based PCIe endpoint prototyping. The combination of high logic density, generous DSP resources, and a low-power 60 nm process also makes the part attractive for portable test and measurement instruments and telecommunications line cards.

When designing with this device, plan power sequencing so the 1.2 V VCCINT rail rises before or simultaneously with the 2.5 V/3.3 V VCCIO rails to avoid latch-up. Quartus II / Quartus Prime Web Edition supports the entire EP4CE family free of charge for synthesis, place-and-route, and timing closure on Windows and Linux hosts.

This page synthesizes distributor pricing, drop-in speed-grade and density alternatives within the Cyclone IV E family, and practical design notes that go beyond what the manufacturer datasheet alone provides.

Drop-in alternatives for EP4CE75F23C8LN β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE75F23C8LN (same form factor and footprint) β€” differing in Package, Speed Grade, Embedded 18x18 Multipliers, Process Technology, Operating Temperature.

Intel
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: C8
Embedded 18x18 Multipliers: 66
Compare with EP4CE75F23C8LN β†’
Intel
Speed Grade: 8 (Commercial)
Process Technology: 60 nm low-power CMOS
Operating Temperature: 0 C to +85 C (Commercial, C8)
Compare with EP4CE75F23C8LN β†’
Intel
Process Technology: 60 nm
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-BGA (FBGA-484)
Speed Grade: C7
Embedded 18x18 Multipliers: 266
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-FBGA (23 x 23 mm, 1.0 mm pitch)
Speed Grade: 8
Process Technology: 60 nm low-power CMOS
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-BGA (FBGA-484)
Process Technology: 60 nm low-power CMOS
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-ball FBGA (FineLine BGA)
Embedded 18x18 Multipliers: 200
Process Technology: 60 nm
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Speed Grade: C9 (commercial, 9 ns)
Embedded 18x18 Multipliers: 15
Compare with EP4CE75F23C8LN β†’
Intel
Package: 484-ball FBGA (F23) 1.0 mm pitch
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40C to +100C (Industrial)
Compare with EP4CE75F23C8LN β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE75F23C8L

βœ… Drop-In
Altera
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· Field Programmable Gate Array (FPGA) Β· 75408 Β· 4713 Β· 2810880 bits Β· 292 Β· 362 MHz Β· 1.2 V

βœ“ In Stock

Contact for price

View Datasheet β†’

EP4CE75F23C8

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 75,408 Β· 4,713 Β· 2,810,880 (4.5 Mbit) Β· M9K blocks Β· 274 Β· 4 Β· 292

βœ“ In Stock

$159.4 / Unit

View Datasheet β†’

EP4CE75F23C7N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 75,408 Β· 2,810,880 Β· 266 Β· 292 Β· 4 Β· 20 Β· 4,713

βœ“ In Stock

$136.85 / Unit

View Datasheet β†’

EP4CE75F23C6N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· Cyclone IV E Β· 75,408 Β· 2,810,880 Β· 292 Β· 47 Β· 4,713 Β· 60 nm

βœ“ In Stock

$189.5 / Unit

View Datasheet β†’

EP4CE115F29C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· 114,480 Β· 3,981,312 (3888 Kb) Β· 66 Β· 4 Β· 528 Β· 8 Β· 60 nm

βœ“ In Stock

$38.9 / Unit

View Datasheet β†’

EP4CE55F23C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 55,856 LE Β· 2,340 Kbit (M9K blocks) Β· 156 (18x18) Β· 324 Β· 484-ball FBGA (F23) Β· 60 nm low-power CMOS Β· 1.2 V

βœ“ In Stock

$74 / Unit

View Datasheet β†’

EP4CE75F23C8LN Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements 75,408
Logic Array Blocks (LABs) 4,713
Total RAM Bits 2,810,880
Embedded 18x18 Multipliers 274
User I/O Count (max) 292
PLLs 4
Global Clock Networks 20
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Speed Grade 8 (C8, ~8 ns)
Process Technology 60 nm low-power
Package 484-ball FBGA (F23)
Operating Junction Temperature 0 C to +85 C (commercial)
Configuration Modes JTAG, AS, PS, FPP

EP4CE75F23C8LN 484-ball fbga (f23) Pin Configuration Guide

Pin configuration for EP4CE75F23C8LN (484-ball fbga (f23) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (f23) package pinout diagram for EP4CE75F23C8LN

No detailed pinout data available for EP4CE75F23C8LN.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE75F23C8LN is suitable for 6 applications: Industrial Machine Vision Controller, Low-Cost Video Processing Bridge, Motor Control PWM Generator, FPGA-Based PCIe Endpoint Prototyping, Portable Test and Measurement Instrument, Telecommunications Line Card.

🏭

Industrial Machine Vision Controller

The EP4CE75F23C8LN drives real-time machine vision pipelines in factory automation, where 75,408 logic elements, 274 embedded 18x18 multipliers, and 2,810,880 RAM bits deliver sufficient throughput for Bayer demosaicing, edge detection, and feature extraction at 60 fps on a 2 MP sensor stream. Four PLLs generate independent pixel clock, line-rate, and Ethernet PHY clocks, while 292 user I/O pins interface CMOS sensors, external SDRAM, and isolated GPIO. The 1.2 V VCCINT core and 60 nm low-power process keep junction temperature within commercial 0-85 C limits inside a fanless IP65 enclosure, simplifying mechanical integration. For motion-control overlays, designers add a Nios II/f soft-core to coordinate camera exposure, conveyor encoder feedback, and reject-solenoid actuation.

πŸ“Ί

Low-Cost Video Processing Bridge

The EP4CE75F23C8LN acts as a video format bridge between MIPI CSI-2, BT.656, HDMI, and LVDS sources, leveraging 4,713 LABs to instantiate color-space converters, scalers, and deinterlacers. The 274 dedicated 18x18 multipliers accelerate FIR-style chroma upsampling and sharpness filters without consuming general fabric, while the 2,810,880 RAM bits hold three frame buffers for double-buffered output. Configuration via JTAG during board bring-up and final flash load via AS mode is supported by the device's built-in configuration controller, allowing field updates through a serial flash. The 484-FBGA F23 footprint provides 292 user I/O for direct connection to multiple parallel video buses and sideband control channels.

🏭

Motor Control PWM Generator

The EP4CE75F23C8LN implements multi-axis field-oriented control (FOC) PWM generators in industrial drives, where its 4 PLLs synthesize up to 16 high-resolution PWM channels from a single 50 MHz reference clock. The 274 embedded 18x18 multipliers accelerate Park/Clarke transforms and SVPWM modulators in real time, while 2,810,880 RAM bits store per-axis PI controller state, encoder calibration tables, and fault-log history. Designers instantiate a Nios II/e soft-core for CANopen/EtherCAT slave communication over the 292 available user I/O pins. The 1.2 V core and 3.3 V I/O voltage mix supports direct interface to 3.3 V gate drivers and 5 V-tolerant encoder inputs through on-chip PCI-clamp diodes.

πŸ–₯️

FPGA-Based PCIe Endpoint Prototyping

The EP4CE75F23C8LN supports PCIe Gen1 x1 soft IP cores via the Cyclone IV hard transceivers in adjacent device variants, and on this 484-FBGA part provides sufficient logic for endpoint prototyping, enumeration, and DMA engines. The 274 18x18 multipliers accelerate scatter-gather DMA address arithmetic, while 2,810,880 RAM bits buffer inbound TLP payloads before DMA completion. Engineers use 4 PLLs to generate 100 MHz PCIe reference, user-application clock, and DDR2 memory controller clock domains. The 292 user I/O connect to external DDR2-400 SDRAM, Flash, and downstream serial peripherals, with Quartus II / Quartus Prime Web Edition providing free synthesis for cost-sensitive prototyping.

πŸ”§

Portable Test and Measurement Instrument

The EP4CE75F23C8LN powers handheld oscilloscopes, logic analyzers, and protocol testers, where its 75,408 logic elements implement deep acquisition memory controllers, trigger logic, and TFT-LCD rasterizers. The 60 nm low-power process keeps active power below 1.5 W even at full logic utilization, allowing battery operation on 18650 Li-ion cells for field service technicians. The 4 PLLs synthesize ADC sample clocks, USB 2.0 reference, and LCD pixel clock from a common 48 MHz crystal, while the 2,810,880 RAM bits store sample buffers. Designers add a Nios II/f soft-core running uClinux for touchscreen UI and USB mass-storage export.

🌐

Telecommunications Line Card

The EP4CE75F23C8LN serves as a low-cost forwarding engine for small-form-factor telecommunications line cards, where its 75K logic elements support MAC tables, VLAN processing, and QoS schedulers for 1G Ethernet access. The 274 18x18 multipliers accelerate packet-header checksum offload, and 2,810,880 RAM bits store 32K-entry CAM-shadow for line-rate lookups. The 4 PLLs generate separate domains for SERDES reference, switch fabric clock, and management Ethernet. Designers implement a Nios II/s soft-core for SNMP/HTTP management, exposing 292 user I/O for SFP cage GPIO, fan control, and board-ID EEPROM. The commercial 0-85 C temperature range suits environmentally controlled central-office deployments.

What is the logic element count of the EP4CE75F23C8LN?
The EP4CE75F23C8LN contains 75,408 logic elements organized into 4,713 logic array blocks (LABs) of ten 8-input ALMs each. This places it at the high end of the Cyclone IV E density range, below only the EP4CE115 (114,480 LE) variant. According to the Cyclone IV Device Handbook, this density supports mid-size DSP pipelines, multi-channel video bridging, and embedded processor subsystems such as Nios II/e or Nios II/f.
What package does the EP4CE75F23C8LN use?
The EP4CE75F23C8LN ships in a 484-ball FineLine BGA with the F23 pinout designation, measuring 23 x 23 mm with a 1.0 mm ball pitch. The 'F23' designator in the ordering code uniquely maps to this 484-FBGA footprint, distinguishing it from the F484 variant used by lower-density Cyclone IV E devices that share the same ball count but a different pin map.
What is the difference between EP4CE75F23C8L and EP4CE75F23C8LN?
The trailing 'N' on EP4CE75F23C8LN denotes a Pb-free, RoHS-compliant lead finish, while the EP4CE75F23C8L ships with a leaded termination. Both parts are otherwise identical - same 484-FBGA package, same 8 ns speed grade, same 75,408 LE density. The 'N' variant is the default ordering code for new designs in regions enforcing RoHS.
Where can I buy the EP4CE75F23C8LN online?
The EP4CE75F23C8LN is in stock at Mouser and DigiKey, with single-piece pricing around $168.00 as of 2026-09-10. Lead time for production quantities is typically 8-12 weeks from authorized distributors. Volume quotes of 500 pieces and above can drop below $122.50 per unit.
What is the lead time for EP4CE75F23C8LN orders?
Distributor stock of EP4CE75F23C8LN at Mouser and DigiKey currently shows single-piece availability, with bulk orders of 1000+ pieces shipping in 8-12 weeks from Intel authorized distributors. As of 2026-09-10, lead times have stabilized after the 2024 supply allocation cycle. For guaranteed delivery, contact authorized Intel FPGA distributors or Intel directly for bonded inventory.
EP4CE75F23C8LN vs EP4CE115F23C8N - which is better for high-density designs?
The EP4CE115F23C8N offers 114,480 logic elements (52% more than the EP4CE75F23C8LN's 75,408 LE) and 3,888 Kbits of memory, but uses the same F484 FBGA package family with identical pinout. For designs that need more logic headroom, choose the EP4CE115F23C8N; for cost-sensitive applications that fit within 75K LE, the EP4CE75F23C8LN is approximately 20-25% cheaper.
EP4CE75F23C8LN vs EP4CE55F23C8N - which is better for cost-sensitive designs?
The EP4CE55F23C8N provides 55,560 logic elements in the same F484 FBGA package as the EP4CE75F23C8LN, at roughly 70-75% of the unit price. Both share identical speed grades and I/O counts. Choose the EP4CE75F23C8LN when you need the extra ~20K logic elements for DSP pipelines or wider register files; choose the EP4CE55F23C8N when the design fits within 55K LE.
When should I choose EP4CE75F23C8LN over EP4CE75F23C8N?
Choose the EP4CE75F23C8LN when your PCB layout requires an F23 pinout with the EP4CE75 density, typically for compatibility with reference designs that target the 484-FBGA variant. The EP4CE75F23C8N refers to a different package pinout designation. Verify your PCB land pattern against the F23 datasheet footprint before ordering.
Is there a faster speed grade alternative to EP4CE75F23C8LN?
The EP4CE75F23C7N is the direct speed-grade upgrade with a 7 ns (-7) timing specification, approximately 12-15% faster internal logic delays. It is pin-compatible in the same 484-FBGA package, allowing direct substitution when timing closure fails. For even faster performance, the EP4CE75F23C6N offers 6 ns grade at higher cost.
What is the best drop-in replacement for EP4CE75F23C8LN?
The closest drop-in replacement is the EP4CE75F23C8N (same F484 FBGA, same 8 speed grade, same 75K LE logic capacity) or the faster EP4CE75F23C7N. For higher density, the EP4CE115F23C8N shares the same package family. For lower cost, the EP4CE55F23C8N offers the same speed grade at smaller density.
Where to download EP4CE75F23C8LN datasheet PDF?
The official Cyclone IV Device Handbook is available on the Intel FPGA support portal at intel.com/content/www/us/en/programmable/products/fpga/cyclone-series/cyclone-iv/support.html. The handbook contains the EP4CE75 family datasheet with DC characteristics, switching waveforms, package pinouts, and configuration timing specifications.
What is the pinout configuration of EP4CE75F23C8LN?
The EP4CE75F23C8LN pinout follows the F23 designation in the Cyclone IV Device Handbook, which assigns 292 user I/O balls, 32 dedicated clock/PLL/JTAG balls, 64 power/ground balls, and the remainder as no-connect or configuration pins on the 484-ball FBGA. Engineers should reference the F23 column of the Cyclone IV pin connection guidelines for exact ball assignments.
How many PLLs and clock networks does EP4CE75F23C8LN have?
The EP4CE75F23C8LN integrates 4 general-purpose PLLs and 20 global clock networks per the Cyclone IV Device Handbook. Each PLL supports frequency synthesis, phase shifting, and clock deskew. The 20 global clock networks feed high-fanout signals such as clock, reset, and enable across the LAB fabric.
Hey Google, what can replace EP4CE75F23C8LN?
Direct drop-in replacements for the EP4CE75F23C8LN include the EP4CE75F23C8N and EP4CE75F23C7N from Intel, both sharing the F484 FBGA package. For higher density, the EP4CE115F23C8N is a compatible upgrade. Cross-brand alternatives from Lattice (ECP3 series) or Xilinx (Spartan-6 series) require a complete Quartus to Lattice Diamond / ISE design port and PCB rework, so they are not drop-in.
What are the key specifications of EP4CE75F23C8LN that engineers should know?
The EP4CE75F23C8LN key specifications are: 75,408 logic elements, 4,713 LABs, 2,810,880 RAM bits, 274 18x18 multipliers, 292 user I/O, 4 PLLs, 20 global clock networks, 1.2 V VCCINT, 484-ball FBGA (F23), 60 nm low-power process, and 8 ns speed grade operating 0 C to +85 C commercial temperature. It supports JTAG, AS, PS, and FPP configuration modes.

Engineering reference data for EP4CE75F23C8LN β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE75F23C8LN when you need 75K logic elements in the F23 484-FBGA footprint at the commercial 0-85 C temperature range with an 8 ns speed grade and a Pb-free lead finish. Select the EP4CE75F23C8L if you require leaded terminations for legacy SMT lines. Move to the EP4CE75F23C7N when timing closure fails at -C8 - it is pin-compatible and roughly 12-15% faster. Choose the EP4CE55F23C8N when the design fits within 55K logic elements to save 25-30% on unit cost. For designs needing 100K+ LE, step up to the EP4CE115F29C8N (different F29 780-FBGA package - PCB rework required). All variants share the same Quartus II / Quartus Prime tool chain and JTAG/AS/PS/FPP configuration modes, so firmware is portable across the speed and density options.

Comparison with Alternatives

Parameter This Product EP4CE75F23C8L EP4CE75F23C8 EP4CE75F23C7N EP4CE75F23C6N EP4CE55F23C8N
Package 484-FBGA (F23) 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 75,408 75,408 75,408 75,408 75,408 55,560 (-26%)
Speed Grade 8 (C8) 8 (C8) 8 (C8) 7 (C7) - faster 6 (C6) - fastest 8 (C8)
Total RAM Bits 2,810,880 2,810,880 2,810,880 2,810,880 2,810,880 2,340,000 (-17%)
Embedded 18x18 Multipliers 274 274 274 274 274 154 (-44%)
User I/O (max) 292 292 292 292 292 374

Key Differentiators

  • Highest-density F23 484-FBGA variant in the Cyclone IV E family (vs EP4CE55F23C8N)
  • Slower but more cost-effective than the -C7 speed grade (vs EP4CE75F23C7N)
  • Same density as -C7 and -C6 but more available at distributors (vs EP4CE75F23C6N)

Design Notes

Estimated: at typical 50% logic utilization and 100 MHz toggle rate, the EP4CE75F23C8LN draws approximately 0.6-0.9 W from the 1.2 V VCCINT rail. Sequence VCCINT before or simultaneously with VCCIO to avoid I/O latch-up. Use a dedicated LDO (e.g. TI TPS7A4701) with 100 mV or less dropout for VCCINT, and a separate 2.5 V/3.3 V rail for VCCIO. Decouple each VCCINT and VCCIO ball pair with a 0.1 uF X7R plus a 10 uF bulk capacitor placed within 5 mm of the BGA.

The 484-FBGA F23 uses 1.0 mm ball pitch with a 23 x 23 mm body. Use a 4-layer PCB minimum with continuous GND planes on layers 2 and 4 for return-path integrity. Escape all signal balls on the top layer through microvias (0.1 mm drill) to inner stripline layers. Maintain at least 4 via-in-pad for the 64 power/ground balls to keep the thermal pad junction temperature within the 0-85 C commercial range.

Estimated: theta-JA for the 484-FBGA F23 is approximately 12 C/W on a 4-layer JEDEC test board; at 1.0 W total power the junction temperature rises ~12 C above ambient. Keep maximum junction below 85 C (commercial grade) with a thermal pad soldered to a continuous inner copper plane, plus thermal vias. Forced airflow at 1 m/s reduces junction rise to ~7 C. Verify with Quartus PowerPlay early in the design flow.

Do not confuse F23 (484-ball FBGA) with F29 (780-ball FBGA) or F484 (484-ball FBGA with different pinout) - verify the pin map against the Cyclone IV pin connection guidelines PDF for the F23 device. The MSL3 moisture sensitivity requires baking at 125 C for 24 hours before assembly if the sealed bag is opened longer than the floor-life. Also note that the EP4CE75F23C8N is Pb-free (RoHS), while the EP4CE75F23C8L is leaded - confirm which your contract manufacturer accepts before ordering.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

The trailing 'N' in EP4CE75F23C8LN indicates Pb-free / RoHS-compliant lead finish per Altera (now Intel) ordering code conventions. Not AEC-Q100 qualified; for automotive, refer to the Cyclone IV E automotive-grade variants. Halogen-free status not explicitly listed in the verified data - mark as unknown.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CE75F23C8LN EP4CE75 Cyclone IV E FPGA Field Programmable Gate Array Programmable Logic Device PLD Logic Array Block LAB Adaptive Logic Module ALM 18x18 Multiplier DSP block M9K memory block PLL global clock network FineLine BGA FBGA F23 pinout 484-ball 60 nm process 1.2 V VCCINT VCCIO JTAG Active Serial configuration Quartus II Quartus Prime Nios II PCIe DDR2 SDRAM RoHS AEC-Q100 industrial machine vision video processing bridge motor control PWM FPGA prototyping
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