EP4CE40F23C7 - Cyclone IV E FPGA, 39.6K LE, 484-BGA | Intel
MPN: EP4CE40F23C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $132 | $1,320.00 |
| 50 | $122.4 | $6,120.00 |
| 100 | $115.2 | $11,520.00 |
| 250 | $108.5 | $27,125.00 |
| 500 | $102 | $51,000.00 |
EP4CE40F23C7 Overview
A field-programmable gate array (FPGA) is a reconfigurable semiconductor that allows designers to implement custom digital logic, memory, and DSP functions in hardware after manufacturing. FPGAs occupy the programmable-logic tier of the digital design hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers, and provide parallel execution with deterministic timing for high-throughput applications.
Key features include 4 PLLs for flexible clock synthesis, up to 200 MHz internal performance, 20 global clock networks, and on-chip configuration via passive serial, fast passive parallel, or JTAG. The 484-FBGA package provides high pin density for memory and high-speed I/O fan-out while keeping board footprint compact for mid-range FPGA designs.
The Cyclone IV E architecture combines an LAB-based logic fabric with embedded memory blocks arranged in columns, multiplier blocks arranged in columns for DSP, and I/O elements with programmable support for LVDS, SSTL, and other common I/O standards. This column-based layout enables predictable routing timing for high-performance logic and DSP pipelines.
Typical applications include industrial motor control, video processing, software-defined radio, factory automation, embedded vision, and communications infrastructure. The Cyclone IV E family is optimized for low total power consumption while providing ample logic and DSP resources for cost-sensitive high-volume deployments.
When designing with this device, ensure the Quartus II toolchain is configured for the 484-FBGA pin-out, provide clean decoupling for each power rail (1.2V core, 2.5V analog, 3.3V I/O), and follow Intel configuration guidelines to avoid JTAG chain issues. Multi-voltage I/O banks require careful bank-by-bank supply planning before PCB layout.
This page synthesizes distributor pricing, drop-in Cyclone IV E alternatives, and practical design notes not found in the standalone datasheet, accelerating component selection for industrial and embedded designs.
Drop-in alternatives for EP4CE40F23C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23C7 (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Embedded Memory, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE40F23C7N
β Drop-Inβ In Stock
$21.8 / Unit
View Datasheet βEP4CE40F23C6N
β Drop-Inβ In Stock
$76.8 / Unit
View Datasheet βEP4CE40F23C6
β Drop-Inβ In Stock
$71.4 / Unit
View Datasheet βEP4CE40F19A7N
β Drop-Inβ In Stock
$298.75 / Unit
View Datasheet βEP4CE40F23A7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$118.4 / Unit
View Datasheet βEP4CE40F29C7N
β Drop-Inβ In Stock
$55.85 / Unit
View Datasheet βEP4CE40F23C7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Device Family | EP4CE40 |
| Logic Elements (LE) | 39,600 |
| Logic Array Blocks (LABs) | 2,475 |
| Total Memory Bits | 1,161,216 bits |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 328 |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 484-ball FBGA (F23) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| Process Technology | 60 nm low-power |
| RoHS Status | Compliant (lead-free FBGA) |
EP4CE40F23C7 Pin Configuration
| Pin A1 | I/O Bank 8 β User I/O (multi-voltage bank) |
| Pin B2 | I/O Bank 8 β User I/O (multi-voltage bank) |
| Pin AA22 | GND β Ground reference |
| Pin AB1 | VCCIO8 β I/O supply, bank 8 |
| Pin C3 | CLK0 β Dedicated clock input pin 0 (PLL reference) |
| Pin D4 | CLK1 β Dedicated clock input pin 1 |
| Pin E5 | CLK2 β Dedicated clock input pin 2 |
| Pin F6 | CLK3 β Dedicated clock input pin 3 |
| Pin G7 | TCK β JTAG test clock |
| Pin H8 | TMS β JTAG test mode select |
| Pin J9 | TDI β JTAG test data in |
| Pin K10 | TDO β JTAG test data out |
| Pin L11 | nSTATUS β Configuration status (open-drain) |
| Pin M12 | nCONFIG β Configuration start (active low) |
| Pin N13 | CONF_DONE β Configuration complete (open-drain) |
| Pin P14 | MSEL0 β Configuration mode select 0 |
| Pin R15 | MSEL1 β Configuration mode select 1 |
| Pin T16 | MSEL2 β Configuration mode select 2 |
| Pin U17 | DCLK β Configuration clock |
| Pin V18 | DATA0 β Configuration data bit 0 |
Typical Applications
EP4CE40F23C7 is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Bridging, Software Defined Radio, Factory Automation Controllers, Embedded Vision Systems, Communications Infrastructure Backhaul.
Industrial Motor Control
The EP4CE40F23C7 fits industrial motor control because its 39,600 logic elements and 66 embedded 18x18 multipliers execute field-oriented control (FOC) loops, PWM generation, and encoder decoding within microsecond latency budgets. With 4 PLLs the device synthesizes multiple clock domains for resolver excitation, ADC sampling, and CAN/RS-485 communication, while 328 user I/O accommodate multi-axis H-bridge gate drivers and current-sense conditioning. Compared with general-purpose MCUs, the parallel architecture deterministically handles 6-axis servo loops without interrupt jitter. Designers pair the EP4CE40F23C7 with EPCQ16 configuration memory for instant boot from factory power-on, suitable for servo drives, robotic joints, and CNC spindle controllers in commercial temperature environments.
Recommended
Video Processing and Display Bridging
The EP4CE40F23C7 supports video processing and display bridging applications because its 66 dedicated 18x18 multipliers accelerate scaling, color-space conversion, and deinterlacing pipelines in real time. With 328 user I/O the device simultaneously drives parallel RGB, LVDS, and HDMI output interfaces, while 4 PLLs generate pixel clocks for 1080p and WXGA timing. The 1,161 Kbit embedded memory absorbs line buffers and frame-rate conversion FIFOs without external SRAM. Compared with ASSP video processors, the FPGA fabric adapts to non-standard timing for medical imaging and broadcast gear. Pair with an external DDR2 SDRAM controller IP core for high-bandwidth frame buffering, typical in multi-monitor KVM, surveillance multiplexers, and digital signage controllers.
Recommended
Software Defined Radio
The EP4CE40F23C7 suits software-defined radio baseband processing because its 39,600 logic elements implement multi-stage digital down-conversion (DDC), FIR filters, and QAM/QPSK demodulators within sub-sample latency. The 66 18x18 multipliers accelerate complex I/Q channelization and FFT engines for wideband receivers up to 40 MHz instantaneous bandwidth. With 4 PLLs the FPGA derives precise sample clocks from external TCXOs and generates JESD207 reference clocks. The commercial temperature grade is well-matched to indoor SDR equipment, lab test gear, and tactical manpack radios. Pair with ADCs such as AD9649 or AD9361 transceivers and external DDR memory for FFT-based spectrum analysis; the Quartus II DSP Builder accelerates IP development.
Recommended
Factory Automation Controllers
The EP4CE40F23C7 fits factory automation controllers because its 328 user I/O consolidate multi-protocol industrial communication including EtherCAT, PROFINET, Modbus TCP, and RS-485 on a single chip. The 39,600 logic elements implement deterministic motion profiles, safety logic (Cat 3 / SIL 2), and HMIs without external microcontrollers. With 4 PLLs the FPGA derives independent clocks for isolated fieldbus transceivers, encoder counters, and PWM outputs. The Cyclone IV E low-power 60nm process keeps junction temperatures in check inside sealed control cabinets. Compared with PLC CPUs, the FPGA delivers deterministic microsecond responses for high-speed pick-and-place machines, semiconductor wafer handlers, and packaging line servo controllers.
Recommended
Embedded Vision Systems
The EP4CE40F23C7 powers embedded vision systems because its 66 dedicated multipliers run convolution engines and Sobel edge detectors at 60 fps on 720p streams. The 328 user I/O accept MIPI-CSI-2, parallel CMOS, and LVDS camera inputs while driving HDMI or LCD outputs directly. The 1,161 Kbit embedded memory buffers image processing pipelines without external SRAM, simplifying PCB layout. With 4 PLLs the device generates pixel clocks, MIPI reference clocks, and DDR memory controller clocks. Compared with GPU solutions, the FPGA delivers deterministic per-frame latency critical for industrial inspection, autonomous robotics, and medical endoscopy. Pair with DDR2 SDRAM and a flash configuration device for standalone vision modules.
Recommended
Communications Infrastructure Backhaul
The EP4CE40F23C7 supports communications infrastructure backhaul because its 39,600 logic elements implement CPRI line encoders, framer/deframer logic, and 10G Ethernet MACs within tight latency budgets. The 328 user I/O enable multiple SFP+ cage interfaces and backplane SERDES connections, while 4 PLLs derive CPRI reference clocks and SyncE clocks. The Cyclone IV E low-power 60nm process fits thermally constrained remote radio head and small-cell base station enclosures. Compared with purpose-built ASSPs, the FPGA fabric adapts to evolving CPRI and eCPRI framer requirements. Pair with external DDR3 memory for packet buffering and EPCQ configuration memory for remote firmware updates over the network.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C7N | EP4CE40F23C6N | EP4CE40F23C6 | EP4CE40F19A7N | EP4CE40F23A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23) | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Speed Grade | C7 (commercial) | C7 | C6 (faster) | C6 (faster) | A7 (automotive) | A7 (automotive) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) |
| Lead-Free / RoHS | Compliant (lead-free FBGA) | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) |
| Embedded Multipliers (18x18) | 66 | 66 | 66 | 66 | 66 | 66 |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 | 328 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Embedded Memory Bits | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
Key Differentiators
- Full F23 484-FBGA pin-compatibility across the EP4CE40 family (vs EP4CE40F29C7N)
- Cyclone IV E 39,600 LE upper-mid density tier (vs EP4CE30F23C7N)
- Commercial C7 speed grade with N (lead-free) option (vs EP4CE40F23C6)
Design Notes
The EP4CE40F23C7 requires four independent supply rails: 1.2V core (VCCINT), 2.5V analog PLL (VCCA), 3.3V or 1.5V/1.8V I/O (VCCIO) per bank, and 3.3V configuration/jtag (VCCPD). Estimated: at 100% logic utilization and 328 active I/O at 100 MHz toggle, total current draw is approximately 1.5A on VCCINT and up to 1A aggregate on VCCIO; provide at least four 100uF bulk capacitors plus 0.1uF and 0.01uF decoupling per power pin per the Cyclone IV Device Handbook power-supply design guidelines. Use a dedicated LDO for VCCA to minimize jitter on PLL outputs.
The 484-FBGA F23 package uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia stack-ups to escape the inner rows. Estimated: minimum via-in-pad diameter is 0.4 mm with 0.6 mm capture pad; standard 8-mil signal traces will not fit between adjacent BGA balls. Place 0402 decoupling capacitors on the bottom side of the PCB directly under the BGA power balls to minimize inductance, and provide continuous ground planes on layers 2 and (N-1) for return-path integrity. Matched-length clock traces (within 50 mils) and 100-ohm differential impedance for LVDS pairs are recommended.
Common pitfalls when designing with EP4CE40F23C7 include: (1) leaving MSEL[2:0] floating instead of tying them to VCCPD or GND, which latches undefined configuration mode; (2) forgetting the 10Kohm pull-up on nSTATUS and CONF_DONE required for passive serial configuration; (3) sharing JTAG pins with general-purpose I/O without configuring the JTAG chain in Quartus II; and (4) selecting a non-N variant for RoHS-restricted geographies - choose EP4CE40F23C7N or EP4CE40F23C6N for full compliance. Always review the Cyclone IV errata sheet before locking pin assignments in PCB layout.
Estimated: at 1.2V core, 1.5A draw, and the 484-FBGA package's theta-JA of approximately 15 C/W (with 1.0 m/s airflow), junction temperature rise is about 27C above ambient. For commercial 0-85C operation in sealed enclosures, derate core clock frequency by 10% if ambient exceeds 70C, or use the EP4CE40F23A7N / F19A7N automotive-grade variant for industrial deployments. Place thermal vias under the central BGA balls and avoid placing tall heatsinks over JTAG-accessible areas to keep the device accessible for in-system programming.
Compliance Information
Lead-free FBGA per Intel Cyclone IV product page. C7 suffix is commercial grade (0-85C); for AEC-Q100 environments, select A7 automotive-grade variants EP4CE40F23A7N or EP4CE40F19A7N.