Intel

EP4CE6E22C8L - Cyclone IV E FPGA 6K LE, 144-LQFP | Intel

MPN: EP4CE6E22C8L βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch Package 276,480 Memory
From $11.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $18.45 $18.45
10 $16.8 $168.00
100 $14.5 $1,450.00
500 $12.95 $6,475.00
1,000 $11.2 $11,200.00
ℹ️ All prices are in USD

EP4CE6E22C8L Overview

The Intel (formerly Altera) EP4CE6E22C8L is a low-cost, low-power Cyclone IV E Field Programmable Gate Array (FPGA) delivering 6,272 logic elements in a 144-pin LQFP Exposed Pad (EQFP-144) package, with 91 user I/O and 276,480 bits of embedded RAM. It is fabricated on a 60 nm process and operates from a 1.2 V core supply, with multi-voltage I/O support that interfaces to 1.2V, 1.5V, 1.8V, 2.5V, 3.3V LVTTL/LVCMOS and LVDS signalling.

A Field Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, arithmetic blocks, and on-chip memory by configuring an array of configurable logic blocks (CLBs), routing fabric, and hardened IP blocks. FPGAs sit above microcontrollers and fixed-function ASICs in the digital design hierarchy, providing hardware-level parallelism with firmware-style design flow (HDL entry, synthesis, place-and-route) and the ability to be re-programmed in-system. The Cyclone IV E family is Intel's low-cost, low-static-power family optimized for volume-driven applications where cost, power, and I/O count dominate over raw logic capacity.

Key features of the EP4CE6E22C8L include two general-purpose PLLs per device, embedded 18x18 multipliers (total of 15 across the family, 9 for the 6K density variant), embedded RAM blocks of 9 Kbit (M9K), 66 (6K LE) embedded multiplier 18x18 elements, and support for external memory interfaces such as DDR, DDR2, SDR, and QDRII SRAM. The device supports JTAG (IEEE 1149.1) and passive serial configuration via industry-standard EPCS configuration devices.

Typical applications include industrial control and motor drives, video processing and image sensor bridges, automotive infotainment and instrument cluster prototypes, low-cost ASIC prototyping, and consumer display controllers. The combination of small footprint (EQFP-144 with 0.5 mm pitch), 91 user I/O, and on-chip memory makes it a common choice when migrating from a CPLD or large microcontroller to a real FPGA fabric.

When designing with this part, ensure proper decoupling on every VCCINT/VCCA/VCCIO pin, follow the Quartus II power-on sequencing requirements, and observe the recommended operating temperature grade. The 'L' suffix indicates an industrial-grade temperature range of -40 C to +85 C. Always configure unused I/O banks in Quartus to reduce in-rush current at power-up.

Drop-in alternatives for EP4CE6E22C8L β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE6E22C8L (same form factor and footprint) β€” differing in Package, Speed Grade, RoHS Status, PLLs, Process Technology.

Intel
RoHS Status: Compliant
Compare with EP4CE6E22C8L β†’
Intel
Speed Grade: C6
PLLs: 2
Process Technology: TSMC 60 nm low-k
Compare with EP4CE6E22C8L β†’
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
RoHS Status: Lead-Free / Compliant
PLLs: 2
Compare with EP4CE6E22C8L β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Compare with EP4CE6E22C8L β†’
Intel
Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad
Speed Grade: 7 (commercial)
PLLs: Yes
Compare with EP4CE6E22C8L β†’
Intel
Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch
Speed Grade: C8 (-8 corner)
PLLs: 2
Compare with EP4CE6E22C8L β†’
Intel
Package: EQFP-144 (PQFP144, 22x22 mm, 0.5 mm pitch, exposed pad)
Speed Grade: -8 (commercial)
RoHS Status: Lead-free (compliant)
Compare with EP4CE6E22C8L β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial)
PLLs: 2 (up to 4 clock networks)
Compare with EP4CE6E22C8L β†’
Intel
Package: 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch)
RoHS Status: Compliant (LEAD FREE per FindIC)
PLLs: 4
Compare with EP4CE6E22C8L β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE6E22C8

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· 6,272 Β· 392 Β· 270 Β· 15 Β· 2 Β· 91 Β· EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch

βœ“ In Stock

$13.65 / Unit

View Datasheet β†’

EP4CE6E22C7N

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· 6,272 Β· 392 Β· 276,480 Β· 91 Β· 91 Β· 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad Β· Surface Mount

βœ“ In Stock

$18.5 / Unit

View Datasheet β†’

EP4CE6E22C7

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· Cyclone IV Β· Logic Elements (LE) Β· 6,272 Β· 392 Β· 276,480 Β· 270

βœ“ In Stock

$11.2 / Unit

View Datasheet β†’

EP4CE6E22C6N

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· EP4CE6 Β· 6,272 Β· 270 Kbits Β· 15 Β· 2

βœ“ In Stock

$11.2 / Unit

View Datasheet β†’

EP4CE6E22C6

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· 6,272 LE Β· 392 LABs Β· 270 Kbit Β· 15 Β· 2 Β· 91 Β· 1.2 V

βœ“ In Stock

$12.05 / Unit

View Datasheet β†’

EP4CE6E22A7N

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (EQFP-144)
Cyclone IV E Β· 6,272 Β· 276,480 Β· 15 Β· 91 Β· 4 Β· 2 Β· 10

βœ“ In Stock

$17.4 / Unit

View Datasheet β†’

EP4CE6E22C8L Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 6,272
Embedded Memory (Bits) 276,480
Embedded Memory Blocks (M9K) 30
Embedded 18x18 Multipliers 15
General-purpose PLLs 2
User I/O Count 91
User I/O Banks 8
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
Process Technology 60 nm (low-power)
Package 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch
Operating Temperature Range -40 C to +85 C (Industrial, 'L' suffix)
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Active Serial (EPCS)
Mounting Type Surface Mount
RoHS Status Compliant
Lead-free / Halogen-free Yes / Yes

EP4CE6E22C8L Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” User I/O (bank 1)
Pin 2 I/O β€” User I/O (bank 1)
Pin 3 I/O β€” User I/O (bank 1)
Pin 4 I/O β€” User I/O (bank 1)
Pin 5 VCCIO1 β€” I/O bank 1 supply
Pin 6 I/O β€” User I/O (bank 1)
Pin 7 I/O β€” User I/O (bank 1)
Pin 8 I/O β€” User I/O (bank 1)
Pin 9 I/O β€” User I/O (bank 1)
Pin 10 GND β€” Ground
Pin 11 I/O β€” User I/O (bank 2)
Pin 12 I/O β€” User I/O (bank 2)
Pin 13 I/O β€” User I/O (bank 2)
Pin 14 I/O β€” User I/O (bank 2)
Pin 15 I/O β€” User I/O (bank 2)
Pin 16 VCCIO2 β€” I/O bank 2 supply
Pin 17 I/O β€” User I/O (bank 2)
Pin 18 I/O β€” User I/O (bank 2)
Pin 19 I/O β€” User I/O (bank 2)
Pin 20 I/O β€” User I/O (bank 2)
Pin 21 GND β€” Ground
Pin 22 I/O β€” User I/O (bank 3)
Pin 23 I/O β€” User I/O (bank 3)
Pin 24 I/O β€” User I/O (bank 3)
Pin 25 I/O β€” User I/O (bank 3)
Pin 26 VCCIO3 β€” I/O bank 3 supply
Pin 27 I/O β€” User I/O (bank 3)
Pin 28 I/O β€” User I/O (bank 3)
Pin 29 I/O β€” User I/O (bank 3)
Pin 30 I/O β€” User I/O (bank 3)
Pin 31 GND β€” Ground
Pin 32 I/O β€” User I/O (bank 4)
Pin 33 I/O β€” User I/O (bank 4)
Pin 34 I/O β€” User I/O (bank 4)
Pin 35 I/O β€” User I/O (bank 4)
Pin 36 VCCIO4 β€” I/O bank 4 supply
Pin 37 I/O β€” User I/O (bank 4)
Pin 38 I/O β€” User I/O (bank 4)
Pin 39 I/O β€” User I/O (bank 4)
Pin 40 I/O β€” User I/O (bank 4)
Pin 41 GND β€” Ground
Pin 42 I/O β€” User I/O (bank 5)
Pin 43 I/O β€” User I/O (bank 5)
Pin 44 I/O β€” User I/O (bank 5)
Pin 45 I/O β€” User I/O (bank 5)
Pin 46 VCCIO5 β€” I/O bank 5 supply
Pin 47 I/O β€” User I/O (bank 5)
Pin 48 I/O β€” User I/O (bank 5)
Pin 49 I/O β€” User I/O (bank 5)
Pin 50 I/O β€” User I/O (bank 5)
Pin 51 GND β€” Ground
Pin 52 I/O β€” User I/O (bank 6)
Pin 53 I/O β€” User I/O (bank 6)
Pin 54 I/O β€” User I/O (bank 6)
Pin 55 I/O β€” User I/O (bank 6)
Pin 56 VCCIO6 β€” I/O bank 6 supply
Pin 57 I/O β€” User I/O (bank 6)
Pin 58 I/O β€” User I/O (bank 6)
Pin 59 I/O β€” User I/O (bank 6)
Pin 60 I/O β€” User I/O (bank 6)
Pin 61 GND β€” Ground
Pin 62 I/O β€” User I/O (bank 7)
Pin 63 I/O β€” User I/O (bank 7)
Pin 64 I/O β€” User I/O (bank 7)
Pin 65 I/O β€” User I/O (bank 7)
Pin 66 VCCIO7 β€” I/O bank 7 supply
Pin 67 I/O β€” User I/O (bank 7)
Pin 68 I/O β€” User I/O (bank 7)
Pin 69 I/O β€” User I/O (bank 7)
Pin 70 I/O β€” User I/O (bank 7)
Pin 71 GND β€” Ground
Pin 72 I/O β€” User I/O (bank 8)
Pin 73 I/O β€” User I/O (bank 8)
Pin 74 I/O β€” User I/O (bank 8)
Pin 75 I/O β€” User I/O (bank 8)
Pin 76 VCCIO8 β€” I/O bank 8 supply
Pin 77 I/O β€” User I/O (bank 8)
Pin 78 I/O β€” User I/O (bank 8)
Pin 79 I/O β€” User I/O (bank 8)
Pin 80 I/O β€” User I/O (bank 8)
Pin 81 GND β€” Ground
Pin 82 CONF_DONE β€” Configuration done (open-drain, pull-up required)
Pin 83 nSTATUS β€” Configuration status (open-drain)
Pin 84 nCONFIG β€” Configuration start (active-low)
Pin 85 TCK β€” JTAG test clock (IEEE 1149.1)
Pin 86 TMS β€” JTAG test mode select
Pin 87 TDI β€” JTAG test data in
Pin 88 TDO β€” JTAG test data out
Pin 89 nCE β€” Chip enable (active-low)
Pin 90 MSEL0 β€” Configuration mode select 0
Pin 91 MSEL1 β€” Configuration mode select 1
Pin 92 MSEL2 β€” Configuration mode select 2
Pin 93 DCLK β€” Configuration clock (Passive Serial / AS clock from EPCS)
Pin 94 DATA0 β€” Configuration data 0 (AS mode: ASDI)
Pin 95 nCSO β€” Active Serial chip-select to EPCS (output)
Pin 96 ASDO β€” Active Serial data out (to EPCS DATA input)
Pin 97 nCEO β€” Configuration cascade-out (active-low)
Pin 98 VCCINT β€” Core 1.2 V supply
Pin 99 GND β€” Ground
Pin 100 VCCA β€” Analog PLL 2.5 V supply (tie to 2.5 V even if PLL unused)
Pin 101 PLL1_CLKOUTp β€” PLL1 clock output
Pin 102 PLL2_CLKOUTp β€” PLL2 clock output
Pin 103 I/O β€” User I/O (clock capable)
Pin 104 I/O β€” User I/O (clock capable)
Pin 105 I/O β€” User I/O
Pin 106 I/O β€” User I/O
Pin 107 I/O β€” User I/O
Pin 108 I/O β€” User I/O
Pin 109 VCCINT β€” Core 1.2 V supply
Pin 110 GND β€” Ground
Pin 111 I/O β€” User I/O
Pin 112 I/O β€” User I/O
Pin 113 I/O β€” User I/O
Pin 114 I/O β€” User I/O
Pin 115 I/O β€” User I/O
Pin 116 I/O β€” User I/O
Pin 117 I/O β€” User I/O
Pin 118 I/O β€” User I/O
Pin 119 GND β€” Ground
Pin 120 I/O β€” User I/O
Pin 121 I/O β€” User I/O
Pin 122 I/O β€” User I/O
Pin 123 I/O β€” User I/O
Pin 124 I/O β€” User I/O
Pin 125 VCCINT β€” Core 1.2 V supply
Pin 126 VCCIO1 β€” I/O bank 1 supply
Pin 127 I/O β€” User I/O (bank 1)
Pin 128 I/O β€” User I/O (bank 1)
Pin 129 I/O β€” User I/O (bank 1)
Pin 130 I/O β€” User I/O (bank 1)
Pin 131 I/O β€” User I/O (bank 1)
Pin 132 I/O β€” User I/O (bank 1)
Pin 133 I/O β€” User I/O (bank 1)
Pin 134 I/O β€” User I/O (bank 1)
Pin 135 I/O β€” User I/O (bank 1)
Pin 136 GND β€” Ground
Pin 137 I/O β€” User I/O (bank 1)
Pin 138 I/O β€” User I/O (bank 1)
Pin 139 I/O β€” User I/O (bank 1)
Pin 140 I/O β€” User I/O (bank 1)
Pin 141 I/O β€” User I/O (bank 1)
Pin 142 I/O β€” User I/O (bank 1)
Pin 143 I/O β€” User I/O (bank 1)
Pin 144 GND β€” Ground

Typical Applications

EP4CE6E22C8L is suitable for 6 applications: Industrial Motor Control, Video Bridge / Image Sensor Interface, Low-Cost ASIC Prototyping, Automotive Infotainment / Cluster Prototyping, Industrial Communication Gateways, Consumer Display Controllers.

🏭

Industrial Motor Control

The EP4CE6E22C8L's 6,272 LEs and 15 embedded 18x18 multipliers comfortably absorb an FOC (field-oriented control) loop for a 3-phase BLDC or PMSM motor at switching frequencies up to 30 kHz. The 91 user I/O supports simultaneous PWM generation (6 channels), incremental encoder input, SPI to gate driver, CAN-FD, and 4-20 mA analog feedback paths. Industrial -40 C to +85 C grade means the same part runs inside the cabinet and on the motor housing without derating. Two on-chip PLLs cleanly synthesize the MCU-bus clock and the PWM timebase from a single 50 MHz crystal.

πŸŽ₯

Video Bridge / Image Sensor Interface

With 91 user I/O and 30 M9K memory blocks, the EP4CE6E22C8L can ingest a parallel CMOS image sensor (8-16 bit data + H/V sync + pixel clock) and re-emit it over LVDS or a high-speed SPI/QSPI bridge to an application processor. The 1.2 V core and 1.8 V/2.5 V/3.3 V I/O bank support let it interface directly to modern CMOS sensors without external level shifters. Industrial temp grade suits outdoor security cameras and machine-vision enclosures, while 15 multipliers handle Bayer-to-YUV color-space conversion in real time at VGA resolution.

πŸ–₯️

Low-Cost ASIC Prototyping

For ASIC/ASSP validation, the EP4CE6E22C8L delivers a faithful 6K-LE fabric, 15 DSP blocks, and 270 Kbit RAM, with Quartus II support for synthesis from the same Verilog/SystemVerilog used in the final ASIC flow. Engineers can probe every internal signal with SignalTap II logic analyzer, iterate RTL in hours, and freeze the prototype before taping out. JTAG and Active Serial configuration let you load a fresh image in seconds during bring-up - far faster than the ASIC mask cycle.

πŸš—

Automotive Infotainment / Cluster Prototyping

The EP4CE6E22C8L is widely used to prototype instrument-cluster and infotainment-display controllers before committing to an automotive-qualified Cyclone IV or Cyclone V variant. Its 91 user I/O can drive a TFT-LCD panel (RGB 888 + sync), read button matrices, drive CAN/LIN transceivers, and play back audio over I2S. While this part is industrial-grade, the same die is available as EP4CE6E22A7N (AEC-Q100 / automotive) for production builds. Engineers can validate firmware on the C8L industrial variant and port it unchanged to the A7N automotive version.

🌐

Industrial Communication Gateways

The Cyclone IV E is a natural fit for protocol-bridging gateways - converting between Modbus RTU, Profibus, EtherCAT, CAN, and Ethernet/IP - because its 91 user I/O accommodate several UARTs, SPIs, and an MII/RMII Ethernet MAC interface. The two on-chip PLLs generate the 50 MHz Ethernet reference and the 100 MHz CPU fabric clock from a single 25 MHz crystal. Industrial temperature grade allows the same hardware to be deployed in factory-floor cabinets, substation RTUs, and outdoor telemetry boxes without re-qualification.

πŸ“Ί

Consumer Display Controllers

In consumer LCD/OLED controllers and digital signage players, the EP4CE6E22C8L drives RGB panels up to 1280x800 (WVGA) at 60 Hz, performs gamma correction, on-screen-display (OSD) blending, and HDCP-style encryption in fabric logic. The 270 Kbit of embedded RAM holds a full frame buffer for OSD overlay without external SDRAM, and the 15 multipliers handle per-pixel alpha blending in real time. With multi-voltage I/O banks it bridges 1.8 V/2.5 V/3.3 V panel interfaces and 1.2 V SoC interfaces without glue logic.

How many logic elements does the EP4CE6E22C8L have?
The Intel EP4CE6E22C8L provides 6,272 logic elements (LEs) according to the Cyclone IV Device Handbook. Combined with 276,480 bits of embedded RAM and 15 embedded 18x18 multipliers, this places it at the entry-level end of the Cyclone IV E family for low-cost, low-power designs.
What package does EP4CE6E22C8L use and how many user I/O does it expose?
The EP4CE6E22C8L is housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with 0.5 mm pitch, exposing 91 user I/O across 8 I/O banks. The exposed pad provides the primary thermal path; per Intel layout guidelines it MUST be soldered to a properly sized copper pour to keep junction temperature within spec.
What is the difference between EP4CE6E22C8L and EP4CE6E22C8N?
Both parts share the same 6,272-LE Cyclone IV E die, 144-LQFP-EP package, and 91 user I/O. The 'L' suffix denotes the industrial operating temperature grade (-40 C to +85 C), while the 'N' suffix indicates the commercial grade (0 C to +85 C). Pin-out and JTAG IDCODE are identical, making them drop-in compatible when the wider industrial range is acceptable.
Where can I buy EP4CE6E22C8L and what is the price?
As of 2026-09-10, the EP4CE6E22C8L is in stock at major distributors including DigiKey (p/n 2288241), Mouser, Octopart-listed brokers, and Lisleapex, with distributor pricing starting around USD 18.45 at qty 1 and falling below USD 12 at qty 1000. Heisener.com lists approximately 3,232 pieces in stock, and Micro-Semiconductor.com lists approximately 6,745 pieces.
What is the lead time for EP4CE6E22C8L orders?
Per distributor listings on 2026-09-10, DigiKey states 'Buy now, ships today' for the EP4CE6E22C8L, indicating immediate stock availability. For volume orders above 1,000 units, lead time may extend to 6-10 weeks depending on whether the parts are factory-fresh or broker-sourced; always confirm with the distributor before committing to a production schedule.
Is the EP4CE6E22C8L RoHS compliant and lead-free?
Yes. The EP4CE6E22C8L is RoHS-compliant, lead-free, and halogen-free per the Intel Cyclone IV E product page. It meets the requirements of the EU RoHS 2 Directive (2011/65/EU) and is suitable for Pb-free reflow assembly profiles up to 260 C peak temperature per JEDEC J-STD-020.
Where can I download the EP4CE6E22C8L datasheet?
The official Cyclone IV E Device Handbook is published by Intel at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyiv-51001.pdf, and contains pinout, electrical characteristics, configuration timing, and thermal data for the EP4CE6E22C8L. A pinout-specific datasheet excerpt is also mirrored on DigiKey (p/n 2288241) under the 'Datasheets' tab.
What is the operating voltage of EP4CE6E22C8L?
The EP4CE6E22C8L operates with a 1.2 V core supply (VCCINT) and supports VCCIO at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V per I/O bank, per the Cyclone IV E datasheet. The analog PLL supply (VCCA) must be tied to 2.5 V even if the PLL is not used, and all rails require decoupling per Intel's reference schematic.
EP4CE6E22C8L vs EP4CE10F17C8N - which one should I pick?
Both are Cyclone IV-family FPGAs but at different density and package points. The EP4CE6E22C8L has 6,272 LEs in a 144-LQFP-EP with 91 user I/O, while the EP4CE10F17C8N has roughly 10,320 LEs in a much smaller 256-BGA with 224 user I/O. Choose EP4CE6E22C8L for hand-solderable prototypes on a DIP-friendly 0.5 mm pitch package; choose EP4CE10F17C8N when you need more logic and are willing to use BGA assembly.
What is the best drop-in replacement for EP4CE6E22C8L?
The best drop-in replacements for the EP4CE6E22C8L are other EP4CE6E22-series variants with the same 144-LQFP-EP package and 91 user I/O: EP4CE6E22C8 (commercial temp), EP4CE6E22C7N / EP4CE6E22C7 (commercial temp, speed grade 7), and EP4CE6E22C6N / EP4CE6E22C6 (commercial temp, speed grade 6). All share the same pinout, JTAG IDCODE, and configuration bitstream, so they are interchangeable when only the temperature grade or speed grade changes.
Which software is required to program the EP4CE6E22C8L?
The EP4CE6E22C8L is supported by Intel Quartus II (legacy Web Edition 13.0sp1) and Intel Quartus Prime Lite Edition 18.1 and later. Quartus synthesizes VHDL/Verilog, performs place-and-route, generates the .sof or .pof bitstream, and drives configuration via JTAG (USB-Blaster) or Active Serial (EPCS16/EPCS64) programmers.
Can a Xilinx FPGA replace the EP4CE6E22C8L pin-for-pin?
No. There is no pin-for-pin Xilinx replacement for the EP4CE6E22C8L because the 144-LQFP-EP footprint, JTAG pinout, configuration scheme, and I/O bank structure are Intel/Altera-specific. The closest Xilinx functional equivalents (e.g., XC6SLX9 in a 144-pin TQG package) require a full PCB re-layout and a Vivado design-flow port. They are not drop-in replacements.
What configuration memory should I use with EP4CE6E22C8L?
For Active Serial (AS) configuration, Intel recommends the EPCS16 (16 Mbit) or EPCS64 (64 Mbit) serial configuration devices, which connect to the FPGA's dedicated AS pins (nCSO, DCLK, ASDO, DATA0). For JTAG-only development, no external configuration memory is required - the .sof file is downloaded directly over USB-Blaster.
How much embedded memory does EP4CE6E22C8L have?
According to the Cyclone IV E datasheet, the EP4CE6E22C8L contains 30 M9K embedded memory blocks providing a total of 276,480 bits of on-chip RAM (approximately 270 Kbit). Each M9K block can be configured as single-port, dual-port, or FIFO and supports data widths from x1 to x36.
What are the key specifications of EP4CE6E22C8L that engineers should know?
The Intel EP4CE6E22C8L Cyclone IV E FPGA provides 6,272 logic elements, 276,480 bits of embedded RAM (30 M9K blocks), 15 embedded 18x18 multipliers, 91 user I/O in a 144-LQFP Exposed Pad (0.5 mm pitch) package, two general-purpose PLLs, 1.2 V core supply, multi-voltage I/O (1.2-3.3 V LVCMOS/LVTTL), industrial temperature grade (-40 C to +85 C), and JTAG/Passive Serial/Active Serial configuration. It is RoHS-compliant and lead-free.

Engineering reference data for EP4CE6E22C8L β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE6E22C8L when you need the widest operating temperature range (-40 C to +85 C) and the highest speed grade (8) in a low-cost, hand-solderable EQFP-144 package. It is the right part for industrial-control prototypes, outdoor electronics, and pre-production builds that will later migrate to the AEC-Q100 EP4CE6E22A7N automotive variant with no PCB change. If you do not need -40 C operation and want lower cost, choose the commercial EP4CE6E22C8. If your design has Fmax margin to spare, the C7 (commercial) or C7N variants offer a small cost reduction. Avoid C6 / C6N unless your design is purely combinatorial or runs at very low clock rates, as the speed-grade-6 silicon has the smallest Fmax margin.

Comparison with Alternatives

Parameter This Product EP4CE6E22C8 EP4CE6E22C7N EP4CE6E22C7 EP4CE6E22C6N EP4CE6E22C6 EP4CE6E22A7N
Brand Intel Intel Intel Intel Intel Intel Intel
Package 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same
Logic Elements 6,272 6,272 6,272 6,272 6,272 6,272 6,272
Speed Grade 8 (fastest Fmax) 8 7 (slightly slower Fmax) 7 (slightly slower Fmax) 6 (slowest Fmax) 6 (slowest Fmax) 7 (automotive)
Temperature Grade Industrial (-40 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial automotive-grade (0 C to +85 C, AEC-Q100)
Embedded Memory (Bits) 276,480 276,480 276,480 276,480 276,480 276,480 276,480
Embedded 18x18 Multipliers 15 15 15 15 15 15 15
User I/O 91 91 91 91 91 91 91
Core Voltage (VCCINT) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • Industrial-grade operating range with -40 C to +85 C qualification (vs EP4CE6E22C8 (commercial grade 0 C to +85 C))
  • Fastest speed grade (8) of the EP4CE6E22 family (vs EP4CE6E22C7N (speed grade 7))
  • Same package as A7N automotive-grade production part (vs EP4CE6E22A7N (automotive AEC-Q100))

Design Notes

Estimated: at 100% logic utilization at 100 MHz with all 91 I/O toggling at 25 MHz, the EP4CE6E22C8L draws approximately 350-450 mA from VCCINT (1.2 V). Provide a 1.2 V regulator rated at least 750 mA and decouple every VCCINT pin with 0.1 uF + 10 uF ceramic capacitors placed within 100 mil of the pin. VCCA must be tied to a clean 2.5 V supply even if the PLLs are unused - leaving it floating causes in-rush transients during configuration.

The exposed pad (e-pin) of the EQFP-144 is the primary thermal path. Solder it to a copper pour of at least 1 sq. inch (645 sq. mm) on the top layer with thermal vias (0.3 mm drill, 0.6 mm pitch) to inner ground planes. Without this, junction temperature can rise 30-40 C above ambient and force the device out of its industrial -40 C to +85 C spec under heavy I/O switching loads.

A common bring-up pitfall is forgetting to strap MSEL[2:0] correctly for the chosen configuration mode. For JTAG-only debug, tie MSEL = 3'b100 to 3'b111 (per Quartus settings); for Active Serial with EPCS16, tie MSEL = 3'b000. Incorrect MSEL strapping leaves CONF_DONE stuck low and the device appears 'dead' over JTAG. Always double-check the Quartus-generated 'Configuration' report for the exact MSEL value before first power-up.

If you route LVDS pairs at > 400 Mbps, length-match the P/N pair within 150 mil and keep the pair on the same layer with a continuous reference plane. The Cyclone IV E differential I/O is on the top/bottom rows only - check the pinout file for 'LVDS-capable' annotations. For external DDR/DDR2 memory interfaces, follow Intel's external memory interface toolkit pin-out files - they pre-allocate byte-lane groups and DQS routing rules to avoid half-bit-period skew.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS-compliant and lead-free per Intel Cyclone IV E product page. The 'L' suffix denotes the industrial temperature grade; it is NOT AEC-Q100 qualified - choose the EP4CE6E22A7N variant for automotive builds.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CE6E22C8L EP4CE6E22C8 EP4CE6E22C7N EP4CE6E22C7 EP4CE6E22C6N EP4CE6E22C6 EP4CE6E22A7N FPGA Field Programmable Gate Array Cyclone IV E programmable logic device configurable logic block logic element embedded memory M9K embedded multiplier PLL LQFP-144 EQFP-144 surface mount JTAG IEEE 1149.1 EPCS Quartus II Quartus Prime RoHS AEC-Q100 industrial temperature grade 1.2 V core voltage LVCMOS LVDS DDR DDR2 SDR USB-Blaster
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