EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera
MPN: EP4CE6E22C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.96 | $18.96 |
| 10 | $17.25 | $172.50 |
| 100 | $14.5 | $1,450.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $11.2 | $11,200.00 |
EP4CE6E22C6N Overview
A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.
Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.
Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.
When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.
This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.
Drop-in alternatives for EP4CE6E22C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6E22C6N (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE6E22C8N
β Drop-Inβ In Stock
$10.5 / Unit
View Datasheet βEP4CE6E22C7N
β Drop-Inβ In Stock
$18.5 / Unit
View Datasheet βEP4CE6E22I7N
β Drop-Inβ In Stock
$10.5 / Unit
View Datasheet βEP4CE6E22A7N
β Drop-Inβ In Stock
$17.4 / Unit
View Datasheet βEP4CE10E22C8N
β Drop-Inβ In Stock
$11.1 / Unit
View Datasheet βEP4CE15E22C8N
β Drop-Inβ In Stock
$15.95 / Unit
View Datasheet βEP4CE6E22C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device | EP4CE6 |
| Logic Elements (LEs) | 6,272 |
| Embedded Memory (Bits) | 270 Kbits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Maximum User I/Os | 91 |
| I/O Banks | 4 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| Package | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C (industrial, C6 speed grade) |
| RoHS Status | Lead-Free / Compliant |
| Lead-Free | Yes |
EP4CE6E22C6N Pin Configuration
| Pin 1 | I/O β User I/O (bank 1) |
| Pin 2 | I/O β User I/O (bank 1) |
| Pin 3 | I/O β User I/O (bank 1) |
| Pin 4 | VCCIO1 β I/O supply for bank 1 |
| Pin 5 | I/O β User I/O (bank 1) |
| Pin 6 | I/O β User I/O (bank 1) |
| Pin 7 | I/O β User I/O (bank 1) |
| Pin 8 | I/O β User I/O (bank 1) |
| Pin 9 | I/O β User I/O (bank 2) |
| Pin 10 | I/O β User I/O (bank 2) |
| Pin 11 | I/O β User I/O (bank 2) |
| Pin 12 | GND β Ground |
| Pin 13 | I/O β User I/O (bank 2) |
| Pin 14 | I/O β User I/O (bank 2) |
| Pin 15 | I/O β User I/O (bank 2) |
| Pin 16 | VCCIO2 β I/O supply for bank 2 |
| Pin 17 | I/O β User I/O (bank 2) |
| Pin 18 | I/O β User I/O (bank 2) |
| Pin 19 | I/O β User I/O (bank 2) |
| Pin 20 | I/O β User I/O (bank 2) |
| Pin 21 | I/O β User I/O (bank 2) |
| Pin 22 | GND β Ground |
| Pin 23 | I/O β User I/O (bank 2) |
| Pin 24 | I/O β User I/O (bank 2) |
| Pin 25 | I/O β User I/O (bank 2) |
| Pin 26 | I/O β User I/O (bank 2) |
| Pin 27 | I/O β User I/O (bank 2) |
| Pin 28 | I/O β User I/O (bank 2) |
| Pin 29 | GND β Ground |
| Pin 30 | I/O β User I/O (bank 3) |
| Pin 31 | I/O β User I/O (bank 3) |
| Pin 32 | VCCIO3 β I/O supply for bank 3 |
| Pin 33 | I/O β User I/O (bank 3) |
| Pin 34 | I/O β User I/O (bank 3) |
| Pin 35 | I/O β User I/O (bank 3) |
| Pin 36 | GND β Ground |
| Pin 37 | I/O β User I/O (bank 3) |
| Pin 38 | I/O β User I/O (bank 3) |
| Pin 39 | I/O β User I/O (bank 3) |
| Pin 40 | I/O β User I/O (bank 3) |
| Pin 41 | I/O β User I/O (bank 3) |
| Pin 42 | VCCIO3 β I/O supply for bank 3 |
| Pin 43 | I/O β User I/O (bank 3) |
| Pin 44 | I/O β User I/O (bank 3) |
| Pin 45 | I/O β User I/O (bank 3) |
| Pin 46 | I/O β User I/O (bank 3) |
| Pin 47 | I/O β User I/O (bank 3) |
| Pin 48 | I/O β User I/O (bank 3) |
| Pin 49 | GND β Ground |
| Pin 50 | I/O β User I/O (bank 3) |
| Pin 51 | I/O β User I/O (bank 3) |
| Pin 52 | I/O β User I/O (bank 4) |
| Pin 53 | I/O β User I/O (bank 4) |
| Pin 54 | I/O β User I/O (bank 4) |
| Pin 55 | I/O β User I/O (bank 4) |
| Pin 56 | VCCIO4 β I/O supply for bank 4 |
| Pin 57 | I/O β User I/O (bank 4) |
| Pin 58 | I/O β User I/O (bank 4) |
| Pin 59 | I/O β User I/O (bank 4) |
| Pin 60 | I/O β User I/O (bank 4) |
| Pin 61 | I/O β User I/O (bank 4) |
| Pin 62 | GND β Ground |
| Pin 63 | I/O β User I/O (bank 4) |
| Pin 64 | I/O β User I/O (bank 4) |
| Pin 65 | I/O β User I/O (bank 4) |
| Pin 66 | I/O β User I/O (bank 4) |
| Pin 67 | I/O β User I/O (bank 4) |
| Pin 68 | I/O β User I/O (bank 4) |
| Pin 69 | GND β Ground |
| Pin 70 | I/O β User I/O (bank 4) |
| Pin 71 | I/O β User I/O (bank 4) |
| Pin 72 | I/O β User I/O (bank 5) |
| Pin 73 | I/O β User I/O (bank 5) |
| Pin 74 | I/O β User I/O (bank 5) |
| Pin 75 | I/O β User I/O (bank 5) |
| Pin 76 | VCCIO5 β I/O supply for bank 5 |
| Pin 77 | I/O β User I/O (bank 5) |
| Pin 78 | I/O β User I/O (bank 5) |
| Pin 79 | I/O β User I/O (bank 5) |
| Pin 80 | I/O β User I/O (bank 5) |
| Pin 81 | I/O β User I/O (bank 5) |
| Pin 82 | GND β Ground |
| Pin 83 | I/O β User I/O (bank 5) |
| Pin 84 | I/O β User I/O (bank 5) |
| Pin 85 | I/O β User I/O (bank 5) |
| Pin 86 | I/O β User I/O (bank 5) |
| Pin 87 | I/O β User I/O (bank 5) |
| Pin 88 | I/O β User I/O (bank 5) |
| Pin 89 | GND β Ground |
| Pin 90 | I/O β User I/O (bank 5) |
| Pin 91 | I/O β User I/O (bank 5) |
| Pin 92 | I/O β User I/O (bank 6) |
| Pin 93 | I/O β User I/O (bank 6) |
| Pin 94 | I/O β User I/O (bank 6) |
| Pin 95 | I/O β User I/O (bank 6) |
| Pin 96 | VCCIO6 β I/O supply for bank 6 |
| Pin 97 | I/O β User I/O (bank 6) |
| Pin 98 | I/O β User I/O (bank 6) |
| Pin 99 | I/O β User I/O (bank 6) |
| Pin 100 | I/O β User I/O (bank 6) |
| Pin 101 | I/O β User I/O (bank 6) |
| Pin 102 | GND β Ground |
| Pin 103 | I/O β User I/O (bank 6) |
| Pin 104 | I/O β User I/O (bank 6) |
| Pin 105 | I/O β User I/O (bank 6) |
| Pin 106 | I/O β User I/O (bank 6) |
| Pin 107 | I/O β User I/O (bank 6) |
| Pin 108 | I/O β User I/O (bank 6) |
| Pin 109 | GND β Ground |
| Pin 110 | I/O β User I/O (bank 6) |
| Pin 111 | I/O β User I/O (bank 6) |
| Pin 112 | I/O β User I/O (bank 7) |
| Pin 113 | I/O β User I/O (bank 7) |
| Pin 114 | I/O β User I/O (bank 7) |
| Pin 115 | I/O β User I/O (bank 7) |
| Pin 116 | VCCIO7 β I/O supply for bank 7 |
| Pin 117 | I/O β User I/O (bank 7) |
| Pin 118 | I/O β User I/O (bank 7) |
| Pin 119 | I/O β User I/O (bank 7) |
| Pin 120 | I/O β User I/O (bank 7) |
| Pin 121 | I/O β User I/O (bank 7) |
| Pin 122 | GND β Ground |
| Pin 123 | I/O β User I/O (bank 7) |
| Pin 124 | I/O β User I/O (bank 7) |
| Pin 125 | I/O β User I/O (bank 7) |
| Pin 126 | I/O β User I/O (bank 7) |
| Pin 127 | I/O β User I/O (bank 7) |
| Pin 128 | I/O β User I/O (bank 7) |
| Pin 129 | GND β Ground |
| Pin 130 | I/O β User I/O (bank 7) |
| Pin 131 | I/O β User I/O (bank 7) |
| Pin 132 | I/O β User I/O (bank 8) |
| Pin 133 | I/O β User I/O (bank 8) |
| Pin 134 | I/O β User I/O (bank 8) |
| Pin 135 | I/O β User I/O (bank 8) |
| Pin 136 | VCCIO8 β I/O supply for bank 8 |
| Pin 137 | I/O β User I/O (bank 8) |
| Pin 138 | I/O β User I/O (bank 8) |
| Pin 139 | I/O β User I/O (bank 8) |
| Pin 140 | I/O β User I/O (bank 8) |
| Pin 141 | I/O β User I/O (bank 8) |
| Pin 142 | VCCINT β Core supply (1.2 V) |
| Pin 143 | VCCINT β Core supply (1.2 V) |
| Pin 144 | EPAD β Exposed thermal pad (must be soldered to PCB GND land) |
Typical Applications
EP4CE6E22C6N is suitable for 6 applications: Industrial Motor Control, LED Display and Lighting Controllers, USB/Ethernet Bridging and Protocol Conversion, Consumer Video Processing and LCD/LED Controllers, Automotive Infotainment Sub-Modules, Education and Hobbyist Development Boards.
Industrial Motor Control
The EP4CE6E22C6N is well-suited to industrial motor control applications where its 91 user I/Os handle multiple encoder inputs, Hall-effect sensors, and PWM outputs while its 15 embedded 18x18 multipliers support field-oriented control (FOC) and Clarke/Park transforms. Operating from a 1.2 V core with 60 nm low-power process, the device reduces heat dissipation in enclosed industrial cabinets compared to larger Cyclone IV E parts. Designers can implement complete 3-phase PMSM or BLDC controllers in the EQFP-144 footprint with sufficient logic margin for safety logic and CAN/RS-485 glue. The 4 I/O banks support mixed-voltage encoder interfaces (3.3 V logic, 5 V tolerant) without external level shifters.
Recommended
LED Display and Lighting Controllers
LED video walls and architectural lighting require wide parallel data buses with tight refresh timing. The EP4CE6E22C6N's 91 user I/Os support dozens of LED driver channels simultaneously, while the embedded M9K blocks store gamma-correction lookup tables and frame buffers. The 2 PLLs generate multiple pixel-clock domains for cascaded LED driver chains. Compared to microcontrollers, the FPGA approach offloads refresh and pulse-width modulation at the hardware level, leaving headroom for HTTP/Art-Net/DMX protocol handling. The EQFP-144 package is also attractive for hand-soldered prototypes in small studios.
Recommended
USB/Ethernet Bridging and Protocol Conversion
Industrial gateways often bridge USB, Ethernet, and legacy serial buses. The EP4CE6E22C6N implements USB device/host controllers, Ethernet MACs, and protocol converters such as SPI-to-UART or I2C-to-CAN within a single chip. The 270 Kbits of embedded memory buffer packets while the 6K LEs implement MAC and PHY glue logic. Quartus Prime provides IP cores (USB 2.0 device, 10/100 Ethernet MAC) that compile directly to this device. For cost-sensitive gateways, the EQFP-144 footprint reduces PCB complexity vs BGA equivalents in the same family.
Recommended
Consumer Video Processing and LCD/LED Controllers
Low-cost video pipelines (deinterlacing, scaling, OSD overlay, image rotation) fit comfortably in the EP4CE6E22C6N's fabric. Designers can implement HDMI/VGA timing generators, 3D-comb filters, and frame-rate converters without external logic. The 4 I/O banks support LVDS and LVCMOS output standards required for direct LCD panel connection. Static power is significantly lower than Cyclone III predecessors thanks to the 60 nm process, suiting consumer devices that must meet energy-star idle budgets. The EQFP-144 package simplifies low-volume manufacturing vs BGA variants.
Recommended
Automotive Infotainment Sub-Modules
Auxiliary automotive subsystems (display backlight controllers, HVAC control panels, mirror adjustment modules) can leverage the EP4CE6E22A7N variant of this same silicon for -40 C to +125 C operation. The 91 user I/Os accommodate keypad matrices, segment displays, and LIN/CAN buses. Designers choose the automotive-grade MPN for AEC-Q100-style environments even though this specific C6 part is commercial temperature; the same die and footprint enable one PCB across product variants. Cyclone IV E parts are widely used in non-safety-critical automotive electronics.
Recommended
Education and Hobbyist Development Boards
Tertiary curricula and DIY communities have standardized on Cyclone IV E EP4CE6 devices thanks to the open-source Altera/Intel toolchain and the hand-solderable EQFP-144 package. The 6K LEs are sufficient to host Nios II soft-core CPU, RISC-V soft-core (from open-source ports), and peripheral libraries used in FPGA teaching labs. Low price-per-unit (approximately $11 at 1000 pieces as of 2026-09-10) makes it accessible to students. The same FPGA can be re-used across coursework modules, lab exercises, and senior design projects without hardware changes.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6E22C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22I7N | EP4CE6E22A7N | EP4CE10E22C8N | EP4CE15E22C8N |
|---|---|---|---|---|---|---|---|
| Package | EQFP-144 (E22) | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 (+64%) | 15,408 (+145%) |
| Speed Grade | C6 | C8 (faster) | C7 | I7 (industrial) | A7 (automotive) | C8 | C8 |
| Temperature Grade | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Automotive -40 C to +125 C | Commercial | Commercial |
| Embedded Memory | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 414 Kbits | 504 Kbits |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 15 | 15 | 23 | 56 |
| Maximum User I/Os | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
Key Differentiators
- Lowest-density Cyclone IV E in hand-solderable EQFP-144 footprint (vs EP4CE10E22C8N)
- Hand-solderable EQFP-144 package (no BGA required) (vs Lattice ECP5 LFE5U-12 in TQFP-144)
- Multi-temperature variants in the same EQFP-144 footprint (vs Cyclone III EP3C5E22 (single temperature option))
Design Notes
The EP4CE6E22C6N requires separate VCCINT (1.2 V core) and VCCIOx (per-bank I/O) supplies. Per Intel's Cyclone IV Device Handbook, each VCCIO bank may be independently set to 1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V but mixing voltages within one bank is not allowed. Decouple each VCCINT pin with one 0.1 uF X7R ceramic plus one 10 uF bulk per supply plane; decouple each VCCIO bank with one 0.1 uF ceramic. Total quiescent current scales with logic utilization - estimate 200-400 mA typical at 6K LEs fully routed.
The exposed thermal pad (EPAD, pin 144) must be soldered to a PCB land pattern of at least the same area as the package EPAD, with thermal vias to the inner GND plane for heat dissipation. Although the EP4CE6 is low-power, neglecting the EPAD solder connection degrades thermal performance and increases junction temperature during sustained logic activity. Per IPC-7351 land pattern guidelines, place 0.5 mm-pitch QFP leads on 0.3 mm-wide pads with 0.2 mm solder mask expansion for reliable paste deposition.
Route configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) carefully - they are sensitive to noise and stub lengths. Keep configuration trace lengths under 50 mm and avoid running them parallel to high-speed switching signals. JTAG signals (TCK, TMS, TDI, TDO) require a 10 kohm pull-up on TCK as specified by IEEE 1149.1 - the EP4CE6E22C6N does not include internal TCK pull-up on all variants.
Do not migrate directly from Cyclone III EP3C5/EP3C16 EQFP-144 to Cyclone IV E EP4CE6E22 - the pinouts differ even though packages look identical. Use the Cyclone III to Cyclone IV E migration guide from Intel to remap pins. Also note that the EP4CE6E22C6N does not include hard PCIe or SERDES; if your design requires transceivers, choose Cyclone IV GX or Cyclone V instead. Do not exceed the absolute maximum junction temperature of 125 C - derate by 10 C in enclosed industrial enclosures.
Compliance Information
Lead-free per Cyclone IV E product page. The C6 part is commercial temperature and not AEC-Q100 qualified; choose EP4CE6E22A7N for AEC-Q100-grade automotive applications. RoHS and REACH compliance confirmed via Heisener and DigiKey product listings.
