EP4CE6E22C9L - Cyclone IV E FPGA, 6.3K LE, 144-LQFP | Intel
MPN: EP4CE6E22C9L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.09 | $14.09 |
| 10 | $12.85 | $128.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.75 | $8,750.00 |
EP4CE6E22C9L Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O pads that can be reconfigured by the designer after manufacturing. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility for glue logic, digital signal processing, and custom interface bridging.
Key features of the EP4CE6E22C9L include 15 embedded 18x18 multipliers (up to 266 MHz), up to 270 Kbits of distributed RAM, configuration via standard serial/parallel modes, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V interfacing. The device family integrates PLL-based clock management and supports LVDS, SSTL, and LVTTL I/O standards.
The Cyclone IV E architecture uses a 60 nm process and emphasizes low static and dynamic power consumption, making it well-suited for battery-powered and thermally constrained embedded designs. The 144-LQFP exposed-pad package improves thermal dissipation and allows hand-solderable assembly for prototypes and low-volume builds.
Typical applications include industrial control and motor drives, video processing pipelines, software-defined radio front ends, portable test and measurement equipment, and LED display controllers. The combination of 6,272 logic elements and 91 user I/O provides headroom for medium-complexity glue logic, custom peripherals, and parallel DSP functions.
When designing with this device, ensure adequate decoupling on each VCCINT and VCCA rail and follow Intel's pin connection guidelines for the EP4CE6 family. The exposed pad must be soldered to a properly sized copper pour for thermal and electrical performance, especially when running the multipliers near their maximum frequency.
This page synthesizes drop-in alternatives, distributor pricing, and practical design considerations not consolidated in the manufacturer datasheet, helping engineers shorten evaluation cycles and avoid common PCB layout pitfalls.
Drop-in alternatives for EP4CE6E22C9L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6E22C9L (same form factor and footprint) — differing in Package, Speed Grade, PLLs, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE6E22C8N
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →EP4CE6E22C7N
✅ Drop-In✓ In Stock
$18.5 / Unit
View Datasheet →EP4CE6E22C6N
✅ Drop-In✓ In Stock
$11.2 / Unit
View Datasheet →EP4CE10E22C8N
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EP4CE15E22C8N
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →EP4CE6E22A7N
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →EP4CE6E22C9L Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Total RAM Bits | 276,480 bits |
| Embedded Multipliers (18x18) | 15 |
| Maximum User I/O | 91 |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| Mounting Type | Surface Mount |
| Process Node | 60 nm |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C9 |
| RoHS Status | Compliant |
EP4CE6E22C9L Pin Configuration
| Pin 1 | I/O — User I/O pin (bank-specific voltage) |
| Pin 2 | I/O — User I/O pin (bank-specific voltage) |
| Pin 3 | I/O — User I/O pin (bank-specific voltage) |
| Pin 4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 5 | I/O — User I/O pin (bank-specific voltage) |
| Pin 6 | I/O — User I/O pin (bank-specific voltage) |
| Pin 7 | I/O — User I/O pin (bank-specific voltage) |
| Pin 8 | GND — Ground |
| Pin 9 | I/O — User I/O pin (bank-specific voltage) |
| Pin 10 | I/O — User I/O pin (bank-specific voltage) |
| Pin 11 | I/O — User I/O pin (bank-specific voltage) |
| Pin 12 | VCCINT — Core supply voltage (1.2 V) |
| Pin 13 | I/O — User I/O pin (bank-specific voltage) |
| Pin 14 | I/O — User I/O pin (bank-specific voltage) |
| Pin 15 | I/O — User I/O pin (bank-specific voltage) |
| Pin 16 | GND — Ground |
| Pin 17 | I/O — User I/O pin (bank-specific voltage) |
| Pin 18 | I/O — User I/O pin (bank-specific voltage) |
| Pin 19 | I/O — User I/O pin (bank-specific voltage) |
| Pin 20 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 21 | I/O — User I/O pin (bank-specific voltage) |
| Pin 22 | I/O — User I/O pin (bank-specific voltage) |
| Pin 23 | I/O — User I/O pin (bank-specific voltage) |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O pin (bank-specific voltage) |
| Pin 26 | I/O — User I/O pin (bank-specific voltage) |
| Pin 27 | I/O — User I/O pin (bank-specific voltage) |
| Pin 28 | VCCINT — Core supply voltage (1.2 V) |
| Pin 29 | I/O — User I/O pin (bank-specific voltage) |
| Pin 30 | I/O — User I/O pin (bank-specific voltage) |
| Pin 31 | I/O — User I/O pin (bank-specific voltage) |
| Pin 32 | GND — Ground |
| Pin 33 | I/O — User I/O pin (bank-specific voltage) |
| Pin 34 | I/O — User I/O pin (bank-specific voltage) |
| Pin 35 | I/O — User I/O pin (bank-specific voltage) |
| Pin 36 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 37 | I/O — User I/O pin (bank-specific voltage) |
| Pin 38 | I/O — User I/O pin (bank-specific voltage) |
| Pin 39 | I/O — User I/O pin (bank-specific voltage) |
| Pin 40 | GND — Ground |
| Pin 41 | I/O — User I/O pin (bank-specific voltage) |
| Pin 42 | I/O — User I/O pin (bank-specific voltage) |
| Pin 43 | I/O — User I/O pin (bank-specific voltage) |
| Pin 44 | VCCINT — Core supply voltage (1.2 V) |
| Pin 45 | I/O — User I/O pin (bank-specific voltage) |
| Pin 46 | I/O — User I/O pin (bank-specific voltage) |
| Pin 47 | I/O — User I/O pin (bank-specific voltage) |
| Pin 48 | GND — Ground |
| Pin 49 | I/O — User I/O pin (bank-specific voltage) |
| Pin 50 | I/O — User I/O pin (bank-specific voltage) |
| Pin 51 | I/O — User I/O pin (bank-specific voltage) |
| Pin 52 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 53 | I/O — User I/O pin (bank-specific voltage) |
| Pin 54 | I/O — User I/O pin (bank-specific voltage) |
| Pin 55 | I/O — User I/O pin (bank-specific voltage) |
| Pin 56 | GND — Ground |
| Pin 57 | I/O — User I/O pin (bank-specific voltage) |
| Pin 58 | I/O — User I/O pin (bank-specific voltage) |
| Pin 59 | I/O — User I/O pin (bank-specific voltage) |
| Pin 60 | VCCINT — Core supply voltage (1.2 V) |
| Pin 61 | I/O — User I/O pin (bank-specific voltage) |
| Pin 62 | I/O — User I/O pin (bank-specific voltage) |
| Pin 63 | I/O — User I/O pin (bank-specific voltage) |
| Pin 64 | GND — Ground |
| Pin 65 | I/O — User I/O pin (bank-specific voltage) |
| Pin 66 | I/O — User I/O pin (bank-specific voltage) |
| Pin 67 | I/O — User I/O pin (bank-specific voltage) |
| Pin 68 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 69 | I/O — User I/O pin (bank-specific voltage) |
| Pin 70 | I/O — User I/O pin (bank-specific voltage) |
| Pin 71 | I/O — User I/O pin (bank-specific voltage) |
| Pin 72 | GND — Ground |
| Pin 73 | I/O — User I/O pin (bank-specific voltage) |
| Pin 74 | I/O — User I/O pin (bank-specific voltage) |
| Pin 75 | I/O — User I/O pin (bank-specific voltage) |
| Pin 76 | VCCINT — Core supply voltage (1.2 V) |
| Pin 77 | I/O — User I/O pin (bank-specific voltage) |
| Pin 78 | I/O — User I/O pin (bank-specific voltage) |
| Pin 79 | I/O — User I/O pin (bank-specific voltage) |
| Pin 80 | GND — Ground |
| Pin 81 | I/O — User I/O pin (bank-specific voltage) |
| Pin 82 | I/O — User I/O pin (bank-specific voltage) |
| Pin 83 | I/O — User I/O pin (bank-specific voltage) |
| Pin 84 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 85 | I/O — User I/O pin (bank-specific voltage) |
| Pin 86 | I/O — User I/O pin (bank-specific voltage) |
| Pin 87 | I/O — User I/O pin (bank-specific voltage) |
| Pin 88 | GND — Ground |
| Pin 89 | I/O — User I/O pin (bank-specific voltage) |
| Pin 90 | I/O — User I/O pin (bank-specific voltage) |
| Pin 91 | I/O — User I/O pin (bank-specific voltage) |
| Pin 92 | VCCINT — Core supply voltage (1.2 V) |
| Pin 93 | I/O — User I/O pin (bank-specific voltage) |
| Pin 94 | I/O — User I/O pin (bank-specific voltage) |
| Pin 95 | I/O — User I/O pin (bank-specific voltage) |
| Pin 96 | GND — Ground |
| Pin 97 | I/O — User I/O pin (bank-specific voltage) |
| Pin 98 | I/O — User I/O pin (bank-specific voltage) |
| Pin 99 | I/O — User I/O pin (bank-specific voltage) |
| Pin 100 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 101 | I/O — User I/O pin (bank-specific voltage) |
| Pin 102 | I/O — User I/O pin (bank-specific voltage) |
| Pin 103 | I/O — User I/O pin (bank-specific voltage) |
| Pin 104 | GND — Ground |
| Pin 105 | I/O — User I/O pin (bank-specific voltage) |
| Pin 106 | I/O — User I/O pin (bank-specific voltage) |
| Pin 107 | I/O — User I/O pin (bank-specific voltage) |
| Pin 108 | VCCINT — Core supply voltage (1.2 V) |
| Pin 109 | I/O — User I/O pin (bank-specific voltage) |
| Pin 110 | I/O — User I/O pin (bank-specific voltage) |
| Pin 111 | I/O — User I/O pin (bank-specific voltage) |
| Pin 112 | GND — Ground |
| Pin 113 | I/O — User I/O pin (bank-specific voltage) |
| Pin 114 | I/O — User I/O pin (bank-specific voltage) |
| Pin 115 | I/O — User I/O pin (bank-specific voltage) |
| Pin 116 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 117 | I/O — User I/O pin (bank-specific voltage) |
| Pin 118 | I/O — User I/O pin (bank-specific voltage) |
| Pin 119 | I/O — User I/O pin (bank-specific voltage) |
| Pin 120 | GND — Ground |
| Pin 121 | I/O — User I/O pin (bank-specific voltage) |
| Pin 122 | I/O — User I/O pin (bank-specific voltage) |
| Pin 123 | I/O — User I/O pin (bank-specific voltage) |
| Pin 124 | VCCINT — Core supply voltage (1.2 V) |
| Pin 125 | I/O — User I/O pin (bank-specific voltage) |
| Pin 126 | I/O — User I/O pin (bank-specific voltage) |
| Pin 127 | I/O — User I/O pin (bank-specific voltage) |
| Pin 128 | GND — Ground |
| Pin 129 | I/O — User I/O pin (bank-specific voltage) |
| Pin 130 | I/O — User I/O pin (bank-specific voltage) |
| Pin 131 | I/O — User I/O pin (bank-specific voltage) |
| Pin 132 | VCCA_PLL — PLL analog supply voltage |
| Pin 133 | I/O — User I/O pin (bank-specific voltage) |
| Pin 134 | I/O — User I/O pin (bank-specific voltage) |
| Pin 135 | I/O — User I/O pin (bank-specific voltage) |
| Pin 136 | GND — Ground |
| Pin 137 | nCONFIG — Configuration control (active-low) |
| Pin 138 | nSTATUS — Configuration status (active-low) |
| Pin 139 | CONFIG_DONE — Configuration done signal |
| Pin 140 | TCK — JTAG test clock |
| Pin 141 | TMS — JTAG test mode select |
| Pin 142 | TDI — JTAG test data in |
| Pin 143 | TDO — JTAG test data out |
| Pin 144 | EPAD — Exposed thermal pad (tie to GND) |
Typical Applications
EP4CE6E22C9L is suitable for 6 applications: Industrial Motor Control (FOC / Servo Drive), LED Video Wall Display Controller, Software Defined Radio (SDR) Front End, Portable Test and Measurement Equipment, Automotive Infotainment / CAN Gateway, Educational FPGA Development Boards.
Industrial Motor Control (FOC / Servo Drive)
The EP4CE6E22C9L fits industrial motor control drives because its 15 embedded 18x18 multipliers and 91 user I/O pins support field-oriented control (FOC) algorithms, space-vector PWM generation, encoder quadrature decoding, and multi-axis timing. The 6,272 logic elements handle state machines for commutation, current-loop PI controllers, and safety interlocks. The 0C to +85C commercial temperature range suits sealed drive enclosures, while the 1.2 V core supply keeps dissipation low in always-on factory automation systems. The exposed-pad 144-LQFP package enables a compact, hand-solderable PCB layout suitable for low-volume industrial SKUs.
Recommended
LED Video Wall Display Controller
The EP4CE6E22C9L is well-matched to LED video wall controllers, where its 91 user I/O drive parallel data and clock lines to hundreds of LED driver ICs while its 6,272 logic elements handle scan-line multiplexing, gamma correction, and refresh-rate conversion. The 276,480 bits of embedded RAM serve as line buffers for color-space conversion (RGB to LED PWM duty cycles). Compared with a microcontroller, the FPGA's parallel fabric supports higher refresh rates without taxing a single CPU core, eliminating visible flicker on large panels. The LQFP-144 footprint eases prototype builds in custom display enclosures.
Recommended
Software Defined Radio (SDR) Front End
For SDR baseband processing, the EP4CE6E22C9L provides sufficient logic density to implement digital down-conversion (DDC), finite impulse response (FIR) filters, and quadrature demodulation. Its 15 hardware 18x18 multipliers accelerate complex-mix multiply-accumulate operations required for tuner I/Q channelization. The 276 Kbits of block RAM hold FIR coefficients and small FFT windows without needing external memory. Combined with an external ADC and DAC pair, the EP4CE6E22C9L can implement a single-channel HF or VHF SDR receiver. The 144-LQFP exposed-pad package fits a credit-card-sized PCB for portable SDR kits.
Recommended
Portable Test and Measurement Equipment
Battery-powered oscilloscopes, logic analyzers, and protocol testers benefit from the EP4CE6E22C9L's low dynamic power and 91 flexible user I/O. Logic analyzers use the FPGA for sampling-channel multiplexing and trigger-pattern matching, while arbitrary waveform generators use the embedded multipliers for DDS (direct digital synthesis) phase accumulators. The 1.2 V core supply combined with multi-voltage I/O banks (1.2 V to 3.3 V) lets the same board interface legacy 5 V-tolerant signals via external level shifters. The LQFP-144 exposed pad supports hand assembly for prototype instruments.
Recommended
Automotive Infotainment / CAN Gateway
Inside vehicle infotainment head units and CAN-to-Ethernet gateways, the EP4CE6E22C9L bridges multiple automotive buses (CAN, LIN, FlexRay) and routes audio/video streams to display controllers. Its 91 user I/O support several CAN controllers, audio I2S buses, and LVDS display links. The 6,272 logic elements accommodate protocol state machines and audio sample-rate conversion. Designers should pair this part with the industrial-temperature EP4CE6E22A7N variant for AEC-Q100-grade thermal profiles, since the EP4CE6E22C9L itself is commercial-grade. The exposed-pad package aids thermal dissipation behind dashboard enclosures.
Recommended
Educational FPGA Development Boards
University digital logic courses and FPGA training kits favor the EP4CE6E22C9L because it pairs the Intel Quartus Prime toolchain with a hand-solderable 144-LQFP exposed-pad package, eliminating BGA rework equipment for student labs. Its 6,272 logic elements are sufficient for full RISC-V soft-core implementations, VGA controllers, and UART peripherals commonly assigned in coursework. The exposed pad also simplifies thermal benchmarking and oscilloscope probing. Combined with low unit pricing, this makes the EP4CE6E22C9L a cost-effective platform for instructors building lab kits in volume.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6E22C9L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22C6N | EP4CE10E22C8N | EP4CE15E22C8N | EP4CE6E22A7N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) | 6,272 (same) | 10,320 (+64%) | 15,408 (+145%) | 6,272 (same) |
| Speed Grade | C9 | C8 (slower) | C7 (slower) | C6 (slowest) | C8 | C8 | A7 (industrial) |
| Embedded RAM (bits) | 276,480 | 276,480 (same) | 276,480 (same) | 276,480 (same) | 423,936 (+53%) | 516,096 (+87%) | 276,480 (same) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 23 (+53%) | 56 (+273%) | 15 (same) |
| Maximum User I/O | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Key Differentiators
- Fastest Cyclone IV E speed grade in the 144-LQFP package (vs EP4CE6E22C8N)
- 6,272 logic elements - lowest density in Cyclone IV E 144-LQFP family (vs EP4CE15E22C8N)
- Commercial 0C to +85C temperature range (vs EP4CE6E22A7N)
Design Notes
Decouple every VCCINT pin (1.2 V core) with a 0.1 uF X7R ceramic capacitor placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor near the FPGA. Each VCCIO bank (1.2 V to 3.3 V) requires its own 0.1 uF bypass cap. Failure to decouple each pin individually is a common cause of JTAG communication failures and intermittent configuration errors on Cyclone IV E devices.
The exposed pad (pin 144 / EPAD) on the 144-LQFP package MUST be soldered to a copper pour of at least 100 mm^2 on the top or bottom PCB layer, with thermal vias (0.3 mm drill, 0.5 mm pitch grid) connecting to internal ground planes. For designs running the 15 embedded multipliers near 266 MHz, the junction temperature can exceed 100C without adequate thermal copper, leading to timing failures or device damage.
Follow Intel's Pin Connection Guidelines for the Cyclone IV E family - unused I/O pins should be left floating or driven to a defined logic level per Quartus Prime device settings. Do not tie unused I/O to ground without checking the unused-pin report, as some I/O cells feed internal configuration logic that expects a default high state during power-up. Always run the Quartus Prime fitter with all pin assignments finalized before PCB layout freeze.
A frequent mistake is selecting the wrong speed grade for timing closure. The C9 grade in EP4CE6E22C9L is the fastest Cyclone IV E speed; substituting a C8 or C7 pin-compatible part can fail hold-time analysis in pipelines clocked above 200 MHz. Estimated: at 200 MHz fMAX, a C8 part provides roughly 10-15% less timing margin than C9. Always re-run timing analysis after substituting any speed grade variant.
Place the JTAG header (TCK, TMS, TDI, TDO) within 50 mm of the FPGA with 33 ohm series termination resistors on each JTAG signal to suppress ringing during programming. Route JTAG traces away from switching power supply nodes and high-speed differential pairs. For multi-FPGA JTAG chains, add a 1k pull-up on TCK and TMS to keep the chain in a benign state during board power-up.
Compliance Information
RoHS and lead-free compliant per Cyclone IV E product page. Commercial temperature grade - not AEC-Q100 qualified. Choose EP4CE6E22A7N for industrial-grade thermal profiles.
