EP4CE75F23C6 - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
MPN: EP4CE75F23C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118.5 | $11,850.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP4CE75F23C6 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. Within the broader programmable logic taxonomy, an FPGA sits between a CPLD (smaller, non-volatile, low-density) and an ASIC (higher NRE, fixed function). The Cyclone IV E family specifically targets low-power, low-cost designs, positioning FPGAs as a viable alternative to microcontrollers and ASSPs for parallel, real-time processing tasks.
Key Cyclone IV E features include up to 4 PLLs per device, 8 input clock pins, dedicated DDR/DDR2/QDRII memory controllers (data rates up to 200 MHz), and transceivers-less general-purpose I/O supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 4,713 CLBs and 4 M9K RAM blocks (36 Kb each) plus 1 MLAB block (640 bits) deliver approximately 4.7 Mb of embedded memory. Configuration is supported via JTAG, Active Serial (AS), or Passive Serial (PS) modes, and the device family is supported by Intel Quartus® Prime design software.
Typical applications include industrial machine vision, motor control and robotics, video processing pipelines, software-defined radio front-ends, LED video walls, low-cost ASIC prototyping, and bridge/aggregation logic between processors and peripherals such as DRAM, sensors, and high-speed serial links. Designers use the Cyclone IV E family when the target calls for parallel DSP throughput, deterministic latency, and reconfigurability at low BOM cost.
When designing with this device, plan I/O bank partitioning carefully: the 484-FBGA package exposes 8 I/O banks whose VCCIO levels must be matched to the connected memory or peripheral I/O standard. Place decoupling capacitors (0.1 µF + bulk) adjacent to every VCCINT, VCCIO, and VCCA pin, and follow Intel's recommended PCB stack-up for the 1.0 mm-pitch FBGA to maintain signal integrity on LVDS and DDR interfaces.
Drop-in alternatives for EP4CE75F23C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C6 (same form factor and footprint) — differing in Package, Embedded 18x18 Multipliers, Speed Grade, Configuration Modes, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F23C7N
✅ Drop-In✓ In Stock
$136.85 / Unit
View Datasheet →EP4CE75F23C8N
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP4CE75F23I7N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP4CE75F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE55F23C6
✅ Drop-In✓ In Stock
$36.75 / Unit
View Datasheet →EP4CE115F23C8N
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP4CE75F23C6 Maximum Ratings & Electrical Characteristics
| Series | Cyclone® IV E |
| Family | Cyclone IV E (EP4CE75) |
| Logic Elements | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Total RAM Bits | 2,810,880 (~274 Kb) |
| Embedded Multipliers (18x18) | 274 |
| PLLs | 4 |
| Maximum User I/Os | 292 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 484-FBGA (F23), 23x23 mm, 1.0 mm pitch |
| Pin Count | 484 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Mode | JTAG, Active Serial, Passive Serial |
| RoHS Status | Compliant |
EP4CE75F23C6 484-fbga (f23), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE75F23C6 (484-fbga (f23), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23C6 is suitable for 7 applications: Industrial Motor Control and Field-Oriented Control (FOC), Machine Vision and Industrial Camera Processing, Video Processing and Display Walls, Software-Defined Radio (SDR) Front-End and DSP, ASIC Prototyping and Pre-Silicon Validation, Industrial Networking Bridges and Protocol Converters, LED Lighting Control and Architectural Pixel Mapping.
Industrial Motor Control and Field-Oriented Control (FOC)
The EP4CE75F23C6 is well-suited to industrial motor drives using field-oriented control because its 274 embedded 18x18 multipliers and 75,408 logic elements deliver the DSP throughput required for Park/Clarke transforms, PI current loops, and SVPWM generation in real time. The 60 nm low-power process keeps dissipation low enough for fan-less drives, and the 4 PLLs synthesize the multiple clocks needed for ADC sampling, PWM switching, and encoder interfaces. Compared with a microcontroller-based scheme, the FPGA parallelizes the current loop, shrinking loop period below 5 µs and raising torque-bandwidth. The 484-FBGA F23 footprint exposes 8 I/O banks, allowing direct connection to LVDS encoders, isolated gate drivers, and 3.3 V Hall sensors without external level shifters.
Recommended
Machine Vision and Industrial Camera Processing
In machine-vision pipelines, the EP4CE75F23C6 handles line-scan or area-sensor image preprocessing, including Bayer demosaicing, gamma correction, and histogram calculation. Its 2,810,880 embedded RAM bits and M9K block-RAM primitives enable line buffering for typical 2K line-scan sensors at 40 MHz pixel rate without external SRAM. The 4 PLLs derive the sensor pixel clock, LVDS link clock, and processor interface clock from a common reference, simplifying PCB clock-tree design. Compared to a DSP or GPU solution, the FPGA delivers deterministic, low-latency per-pixel processing suitable for inline quality control at production-line speeds.
Recommended
Video Processing and Display Walls
The EP4CE75F23C6 drives LED video walls and multi-panel LCD video walls because its 292 user I/Os and 8 I/O banks fan out to dozens of LVDS or TTL display panels simultaneously. Each LAB can implement a per-pixel color-correction or gamma curve in parallel, and the 274 18x18 multipliers accelerate image scaling and edge-enhancement filters. The 60 nm low-power process enables passive cooling, important for tight video-wall enclosures. The on-chip DDR2 controller interfaces directly to external SDRAM at 200 MHz, storing frame buffers without external memory controllers.
Recommended
Software-Defined Radio (SDR) Front-End and DSP
The EP4CE75F23C6 implements SDR baseband processing - DDC/DUC, channelization filters, and demodulation - because its 274 18x18 multipliers compute FIR filters at high sample rates while the 75,408 logic elements handle control state machines and protocol stacks. The 4 PLLs derive LO and sample clocks from a single TCXO reference, while LVDS I/Os connect directly to ADC and DAC front-ends such as the AD9238 or AD9122. Versus a generic-purpose DSP, the FPGA's parallel architecture achieves lower latency and can be reconfigured for new waveforms without hardware change.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Designers use the EP4CE75F23C6 as a pre-silicon prototype platform for mid-complexity ASICs because its 75K logic elements and 4.7 Mb embedded memory approximate a sizeable gate-array prototype. Quartus Prime provides ASIC-equivalent synthesis and gate-mapping flows so RTL-coded designs port seamlessly to a downstream ASIC vendor. The 484-FBGA F23 package exposes enough I/Os to model real-world ASIC pad-out for boundary-scan validation. Compared to a software simulation environment, real-time FPGA prototyping catches race conditions and clock-domain issues years before tape-out.
Recommended
Industrial Networking Bridges and Protocol Converters
The EP4CE75F23C6 functions as a multi-protocol industrial bridge (EtherCAT, PROFINET, Modbus TCP, CAN, RS-485) by using its 4 PLLs to clock independent network domains and 292 user I/Os to fan out to multiple transceivers. The 75K logic elements hold multiple soft-IP protocol stacks concurrently, while the embedded RAM buffers packets between mismatched network rates. Its 60 nm process tolerates industrial temperature grades (industrial -40 to +100C variants available as EP4CE75F23I7N). Compared to a microcontroller, the FPGA bridges several protocols in parallel with deterministic latency, ideal for industrial gateway aggregation points.
Recommended
LED Lighting Control and Architectural Pixel Mapping
The EP4CE75F23C6 drives large architectural LED arrays where each pixel needs individual PWM dimming and color mixing. The 274 18x18 multipliers compute per-pixel color-correction curves, and the 292 I/Os fan out to dozens of LED-driver chains (such as WS2812-compatible or SPI-driven APA102 strips). The 4 PLLs synthesize the PWM carrier and data-line clocks. Compared to a microcontroller, the FPGA refreshes thousands of pixels at frame rates exceeding 1 kHz with deterministic phase alignment, enabling smooth slow-motion effects on stadium or facade installations.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23C7N | EP4CE75F23C8N | EP4CE75F23I7N | EP4CE75F29C7N | EP4CE55F23C6 | EP4CE115F23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23), 23x23 mm, 1.0 mm pitch | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F29) - same ball pattern, different PCB land | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 39,600 | 114,480 |
| Embedded RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,340,480 | 3,981,312 |
| 18x18 Multipliers | 274 | 274 | 274 | 274 | 274 | 156 | 266 |
| Speed Grade | -6 (C6) | -7 (faster) | -8 (fastest) | -7 industrial | -7 | -6 | -8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Maximum User I/Os | 292 | 292 | 292 | 292 | 292 | 290 | 284 |
Key Differentiators
- 75K logic elements with 274 multipliers in a 484-FBGA package (vs EP4CE55F23C6)
- Industrial temperature option in the same footprint (vs EP4CE75F23C6 vs EP4CE75F23I7N)
- Speed grade scalability within the same die and footprint (vs EP4CE75F23C6 vs EP4CE75F23C8N)
- 60 nm low-power process reduces dynamic dissipation (vs Cyclone III (older 65 nm node, predecessor))
Design Notes
The EP4CE75F23C6 requires three separate power rails: VCCINT (1.2 V core, up to ~1.5 A in worst-case dynamic conditions), VCCIO (per-bank 1.2/1.5/1.8/2.5/3.3 V matching the connected I/O standard), and VCCA (2.5 V analog PLL supply). Decouple every VCCINT/VCCIO/VCCA pin with a 0.1 µF MLCC placed within 50 mils of the package ball, and add four bulk capacitors (220 µF tantalum or 470 µF aluminum-polymer) distributed around the BGA perimeter. Estimated: at 100% logic utilization and 200 MHz toggle rate, total VCCINT current approaches 1.5 A; budget 2 A headroom.
The 484-FBGA F23 package uses 1.0 mm ball pitch and 23x23 mm body - design the PCB stack-up to Intel's Cyclone IV guidelines: microvia-in-pad recommended, 4 to 8 routing layers with dedicated ground and power planes, and matched impedance (50 Ω single-ended, 100 Ω differential) for LVDS and DDR traces. BGA break-out uses dog-bone fan-out or via-in-pad depending on PCB house capability. Maintain 4 mm of continuous ground plane under the BGA for thermal spreading and decoupling return paths.
Do not mix VCCIO standards across banks without sequencing: a 2.5 V LVDS bank adjacent to a 3.3 V CMOS bank can back-drive during power-up. Use the Cyclone IV device family's bank-internal VREF pins when implementing SSTL/HSTL memory interfaces; each bank provides one VREF that must be driven by a precision resistor divider. Also note that JTAG and Active Serial configuration modes share TCK/TMS/TDI/TDO pins but require different MSEL[3..0] strap settings - verify the configuration scheme before PCB layout because a wrong strap causes unconfigured silicon at first power-up.
Place clock buffers (PLL outputs) such that matched-length traces reach all synchronous loads; for DDR2 interfaces use 50 Ω single-ended with 100 Ω differential across the byte group, and enforce length-matching to within ±25 ps per byte. Route all LVDS pairs with 100 Ω differential impedance, keep pairs on the same layer, and avoid 90° bends - use 45° or rounded curves to minimize impedance discontinuities. Place the configuration EPCS or EPCQ flash within 2 cm of the FPGA to keep AS configuration traces short.
Estimated: at 1.2 V VCCINT and ~1.5 A worst-case dynamic current, the EP4CE75F23C6 dissipates up to ~1.8 W during continuous operation. With a theta-JA of ~12 C/W (484-FBGA with adequate ground-plane spreading), this yields a junction temperature rise of ~22 C above ambient. For commercial-grade 0-85 C operation, ensure ambient remains below 63 C; for industrial deployment, select the EP4CE75F23I7N variant which is rated -40 to +100 C.
Compliance Information
RoHS compliance per Intel/Altera product page (https://www.altera.com/products/fpga/cyclone/iv/e/ep4ce75-f23/EP4CE75F23C6). AEC-Q100 not applicable for FPGAs in this family; industrial-temperature grade variants (I7N/I8N) are available separately for harsh environments.
