EP4CE40F23C6 - Cyclone IV E FPGA 39.6K LE | Intel
MPN: EP4CE40F23C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $124.43 | $124.43 |
| 10 | $112 | $1,120.00 |
| 100 | $96.5 | $9,650.00 |
| 250 | $87.2 | $21,800.00 |
| 500 | $79.85 | $39,925.00 |
| 1,000 | $71.4 | $71,400.00 |
EP4CE40F23C6 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic is configured by the customer after manufacturing, sitting at the top of the programmable logic hierarchy: programmable logic device (PLD) -> CPLD (complex PLD) -> FPGA. Compared with CPLDs, FPGAs offer far higher logic density, embedded block RAM, dedicated multipliers, and high-speed serial transceivers. The Cyclone IV E series from Intel targets cost- and power-sensitive applications where the higher-speed GX transceiver variants are unnecessary.
Key features of the EP4CE40F23C6 include 4 PLLs for clock management, 20 global clock networks, 1134 Kbits of embedded RAM (distributed + block), 4 configuration schemes (AS, AP, FPP, JTAG), and support for external memory interfaces including DDR2/DDR3. The Cyclone IV E family is the lowest-power FPGA family in its class, with typical static power below 100 mW at 1.2 V core, enabling fanless designs.
Typical applications include industrial motor control, video processing pipelines, LED display controllers, low-cost ASIC prototyping, software-defined radio baseband, machine vision interfaces, and consumer-electronics glue logic. The 328 user I/Os support wide external buses and multiple parallel sensor interfaces in a single chip.
When designing with the EP4CE40F23C6, ensure the Quartus Prime design tool supports the device (versions 13.0+ through current), provide proper decoupling on all VCCINT/VCCIO rails, and configure unused I/O pins per Intel's guidelines to minimize EMI. JTAG programming via a 10-pin header is recommended for development.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design considerations not found in the manufacturer datasheet, providing a single reference for sourcing and second-source decisions on the Cyclone IV E EP4CE40F23C6.
Drop-in alternatives for EP4CE40F23C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23C6 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F23C6N
✅ Drop-In✓ In Stock
$76.8 / Unit
View Datasheet →EP4CE40F23C7N
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EP4CE40F23A7N
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP4CE40F23I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52.75 / Unit
View Datasheet →EP4CE55F23C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$74 / Unit
View Datasheet →EP4CE30F23C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE40F23C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits (1134 Kbits) |
| Embedded Multipliers (18x18) | 116 |
| User I/O Pins | 328 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Configuration Schemes | AS, AP, FPP, JTAG |
| Process Technology | 60 nm low-power |
| Core Voltage (VCCINT) | 1.2 V |
| Package | FBGA-484 (23 x 23 mm, 1.0 mm pitch) |
| Package Code | F23 |
| Speed Grade | C6 (commercial, mid-tier) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4CE40F23C6 f23 Pin Configuration Guide
Pin configuration for EP4CE40F23C6 (f23 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F23C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F23C6 is suitable for 7 applications: Industrial Motor Control, Video Processing & Display Controllers, ASIC Prototyping & Emulation, LED Display & Signage Controllers, Software-Defined Radio Baseband, Machine Vision & Camera Interfaces, Automotive Infotainment & Telematics.
Industrial Motor Control
The EP4CE40F23C6 fits industrial motor-control applications where multi-axis field-oriented control (FOC) demands parallel DSP throughput. With 116 18x18 hardware multipliers and 39.6K LEs, it can execute Park/Clarke transforms, space-vector PWM, and encoder-decoding in a single fabric. The 328 user I/Os accept quadrature-encoder inputs from multiple axes plus PWM outputs to gate drivers. Industrial-grade variants (I7) extend the operating temperature to -40C to +100C. The 60 nm low-power process keeps junction temperature rise manageable in sealed IP65 enclosures. Quartus Prime DSP Builder accelerates Simulink-to-FPGA flow for control-loop synthesis.
Recommended
Video Processing & Display Controllers
EP4CE40F23C6's 1.16 Mbit embedded RAM and dedicated DDR2/DDR3 PHY enable real-time HD video pipeline designs including deinterlacing, scaling, chroma conversion, and on-screen-display composition. The 328 user I/Os accept 24-bit parallel RGB plus HDMI/DVI input-side TMDS decoded to parallel. Internal block RAM tiles serve as line buffers for up to 1920x1080@60Hz at 148.5 MHz pixel clock. Its 60 nm low-power process keeps the controller board cooler than competing 65 nm FPGAs. Quartus Prime Video and Image Processing Suite provides IP for deinterlacer, scaler, and color-space converter cores.
Recommended
ASIC Prototyping & Emulation
Engineers use EP4CE40F23C6 as a sub-fabric for ASIC prototyping where multiple lower-density Cyclone IV E chips are stitched to emulate larger SoCs. The 39.6K LEs comfortably host ARM Cortex-M-class debug plus peripheral subsystems for pre-silicon firmware bring-up. JTAG and Active Serial configuration modes support fast compile-download-test cycles. The 4 PLLs provide multiple clock-domain synthesis across prototype partitions. Commercial C6 speed grade offers Fmax of around 200 MHz on logic-intensive paths, sufficient for most MCU-class emulation.
Recommended
LED Display & Signage Controllers
EP4CE40F23C6's high GPIO count (328) drives hundreds of RGB LED channels for large-format video walls, scoreboards, and architectural lighting. Its embedded memory holds multiple full-frame buffers for cross-fade and pixel-mapping operations. The 116 18x18 multipliers enable real-time gamma correction and color-temperature conversion across millions of pixels. Industrial-temp grade variants (I7) suit outdoor signage down to -40C. 60 nm low-power process minimizes thermal budget in enclosed LED cabinets where heat dissipation is constrained.
Recommended
Software-Defined Radio Baseband
EP4CE40F23C6 fits the digital baseband processing section of software-defined radio (SDR) receivers below the ADC. Its 116 18x18 multipliers implement DDC (digital down-conversion), FIR filtering, and demodulation for narrowband signals. The 1.16 Mbit block RAM holds FFT windows and channelization buffers. While Cyclone IV E lacks the high-speed transceivers of Cyclone IV GX, it pairs with external ADC and DAC chips via LVDS parallel interfaces. Low power consumption suits portable SDR equipment and battery-powered spectrum analyzers.
Recommended
Machine Vision & Camera Interfaces
EP4CE40F23C6 bridges parallel LVDS camera sensors to image processors, performing pre-processing tasks like Bayer demosaicing, lens-shading correction, and ROI cropping. The 328 user I/Os accept 8-lane LVDS camera links plus trigger and GPIO channels. Its embedded memory buffers raw sensor frames for downstream MIPI-CSI or USB3 forwarding. The FPGA's deterministic latency is critical for synchronized multi-camera inspection systems in factory automation. Quartus Prime supports the Altera Video and Image Processing IP suite for vision pipelines.
Recommended
Automotive Infotainment & Telematics
EP4CE40F23C6 supports automotive infotainment sub-systems including rear-seat entertainment, head-unit glue logic, and telematics control modules. Its high GPIO count and DDR memory controller interface simplify multi-display and CAN/LIN bus bridging. While the C6 commercial temperature grade suits in-cabin environments, automotive-qualified variants in the Cyclone IV family offer AEC-Q100 screening. The low 60 nm process power enables fanless head-unit designs where acoustic noise is undesirable.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C6N | EP4CE40F23C7N | EP4CE40F23A7N | EP4CE40F23I7N | EP4CE55F23C8N | EP4CE30F23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (F23, 23x23 mm, 1.0 mm pitch) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 55,856 | 28,848 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 2,396,160 | 608,256 |
| 18x18 Multipliers | 116 | 116 | 116 | 116 | 116 | 156 | 66 |
| User I/Os | 328 | 328 | 328 | 328 | 328 | 374 | 328 |
| Speed Grade | C6 (commercial, mid) | C6 | C7 (faster) | A7 (slower) | I7 (industrial) | C8 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| RoHS / Lead-Free | Non-RoHS (SnPb balls) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) |
| Price Tier (qty-1, USD) | $124.43 | approx. $128 | approx. $138 | approx. $115 | approx. $165 | approx. $215 | approx. $98 |
Key Differentiators
- Pin-compatible density migration within Cyclone IV E family (vs EP4CE30F23C8N and EP4CE55F23C8N)
- Cyclone IV E is the lowest-power FPGA family in its class (vs Cyclone IV GX (EP4CGX series))
- Industrial temperature variant available in identical footprint (vs EP4CE40F23I7N)
- Dual-package pin compatibility enables head-unit and industrial re-use (vs EP4CE40F29C6 (F29 780-ball))
Design Notes
EP4CE40F23C6 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V per I/O bank), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Decoupling per Intel's Cyclone IV Device Handbook requires 0.1 uF + 1 uF ceramic caps within 5 mm of each VCC pin, plus bulk 22-100 uF polymer tantalum on each rail. Estimated: 39.6K-LE design with 60% utilization draws approximately 350 mA core current at typical toggle rates; add 20-30% margin for IO-bank power when many LVDS pairs toggle. Power sequencing: VCCINT, VCCA, VCCIO should ramp within 100 ms of each other to avoid latch-up.
FBGA-484 package thermal resistance (theta_JA) for EP4CE40F23C6 is approximately 16 C/W with 4-layer JEDEC JESD51 test board; thermal resistance to case (theta_JC) is around 1.0 C/W. For continuous 350 mA core current with simultaneous IO toggling, a moderate 50% utilization design dissipates approximately 1.0-1.5 W. Without forced airflow or thermal vias to inner copper planes, junction temperature rise above ambient is about 16-24 C - well within the 125 C Tj max for commercial grade. Industrial I7 variants require derating for the +100 C upper limit; consider heatsink attachment above 2 W dissipation.
FBGA-484 with 1.0 mm pitch requires ENIG or OSP surface finish, microvia or laser-drilled stacked-via PCB process. Per Intel Cyclone IV pin connection guidelines, route all 8 I/O banks on the top layer with via-in-pad to inner signal layers; use a 4-layer stackup with two dedicated ground planes for return-path continuity. Place configuration pins (nCONFIG, MSEL[3:0], nCE, nCEO) within 50 mm of the FPGA and pull TMS/TCK high via 10 kohm resistor for JTAG. Decoupling caps within 5 mm of VCC pins. Match all LVDS pairs within 50 mil of length, 100 mil of differential skew.
For production configuration, use Active Serial (AS) mode with EPCQ16 or EPCQ32 flash storing bitstream; this enables fast field updates and remote reconfiguration via JTAG. For development, JTAG-only configuration simplifies debug cycles. Set MSEL[3:0] pins correctly for the chosen mode per datasheet Table 11-1. Cyclone IV E supports in-system programming (ISP) via JTAG without disrupting IO bank operation. Ensure nCONFIG has a 10 kohm pull-up to VCCIO bank and nSTATUS has 10 kohm pull-up to VCCIO bank for proper boot sequencing.
Common pitfalls: (1) Exceeding LVDS input voltage range (>2.625 V at LVDS receiver) when bridging 3.3 V LVCMOS signals to LVDS bank - use external termination or level shifter. (2) Failing to set unused pins per Intel guidelines (drive to known state via Quartus assignment) causes EMI failures - use 'as input tri-stated with pull-up' or assign them as outputs driving low. (3) DDR2/DDR3 DQS phase shift circuitry must be enabled via Quartus IO assignment; missing it causes intermittent read failures. (4) MSEL pins must match the actual configuration mode; mismatched MSEL state silently prevents boot.
Compliance Information
EP4CE40F23C6 base part uses SnPb solder balls - non-RoHS. For RoHS-compliant assembly use the EP4CE40F23C6N lead-free variant. Halogen-free per Intel product disclosure. Not AEC-Q100 qualified - automotive designs should consider AEC-Q100-qualified Cyclone IV or newer Cyclone V parts.
