EP4CE75F23C8 - Cyclone IV E FPGA 75K LE 484-FBGA | Intel
MPN: EP4CE75F23C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $207.13 | $207.13 |
| 10 | $195.5 | $1,955.00 |
| 100 | $178.2 | $17,820.00 |
| 250 | $168.75 | $42,187.50 |
| 500 | $159.4 | $79,700.00 |
EP4CE75F23C8 Overview
A Cyclone IV E FPGA is a programmable logic device (PLD) belonging to the broader category of SRAM-based FPGAs, which sit within the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are commonly deployed as glue logic, co-processors, or standalone controllers in embedded designs. Compared with the older Cyclone III family, Cyclone IV E focuses on lower static and dynamic power, while preserving the proven Quartus II design-flow ecosystem. The 'E' suffix denotes the logic-and-memory-optimized sub-family, distinct from the 'GX' sub-family that adds transceivers.
Key features include 75,408 logic elements arranged in 4,713 logic array blocks (LABs), 274 embedded 18 x 18 multipliers for DSP, 4 general-purpose PLLs, and 4.5 Mb of embedded SRAM distributed across M9K blocks. The device supports common I/O standards (LVDS, LVCMOS, SSTL, HSTL) up to 3.3 V and offers 292 maximum user I/Os through 8 I/O banks, enabling flexible mixed-voltage interfacing to DDR2/DDR3, parallel buses, and high-speed sensor links. Configuration is supported via passive serial, active serial, fast passive parallel, and JTAG modes.
Architecturally, the Cyclone IV E family leverages a 60 nm TSMC process, an 8-input adaptive logic module (ALM) for fine-grained packing efficiency, and dedicated per-LAB clock and control networks. The result is deterministic timing closure with the Quartus II TimeQuest analyzer, plus tight power estimation via the PowerPlay toolchain.
Typical applications include industrial motor control and PLCs, video surveillance and image-processing front ends, low-cost software-defined radio baseband, PCIe endpoint bridging, and LED video-wall scan controllers. Designers also use the EP4CE75F23C8 as a system integration hub in factory automation and portable test equipment.
A key design consideration is signal integrity on the 1.0 mm-pitch BGA: a 4- to 6-layer PCB with matched-length impedance routing for DDR2 and LVDS pairs is recommended, along with solid power-plane stitching for VCCINT and VCCA. Thermal management at sustained high toggle rates should be evaluated against the FBGA-484 thermal resistance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CE75F23C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C8 (same form factor and footprint) — differing in Package, Embedded 18x18 Multipliers, Family, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F23C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$42.3 / Unit
View Datasheet →EP4CE75F23C7N
✅ Drop-In✓ In Stock
$136.85 / Unit
View Datasheet →EP4CE75F23C7
✅ Drop-In✓ In Stock
$148 / Unit
View Datasheet →EP4CE75F23C6N
✅ Drop-In✓ In Stock
$189.5 / Unit
View Datasheet →EP4CE75F23C6
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP4CE115F23C8N
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP4CE55F23C8
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP4CE75F23C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 (4.5 Mbit) |
| Embedded Memory Type | M9K blocks |
| Embedded 18x18 Multipliers | 274 |
| General-Purpose PLLs | 4 |
| Maximum User I/O | 292 |
| I/O Banks | 8 |
| Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | Passive Serial, Active Serial, Fast Passive Parallel, JTAG |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | 8 |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
EP4CE75F23C8 484-fbga (23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE75F23C8 (484-fbga (23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23C8 is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Baseband, LED Video Wall Scan Controller, PCIe Endpoint Bridge, Portable Test and Measurement.
Industrial Motor Control
The EP4CE75F23C8 is well suited to industrial motor-control and PLC designs because its 274 embedded 18 x 18 multipliers and 4 PLLs easily implement Field-Oriented Control (FOC) loops, encoder feedback capture, and PWM generation in a single device. At 75,408 logic elements it can host the state machine, safety logic, and a Modbus or EtherCAT slave MAC simultaneously. Its 292 user I/Os in the 484-FBGA accommodate multiple encoder channels, gate-driver signals, and isolation barriers. Industrial designers prefer the Cyclone IV E for its long-term availability and proven Quartus II toolchain, even though newer Cyclone V parts are more power-efficient.
Recommended
Video Surveillance and Image Processing
The EP4CE75F23C8 drives mid-resolution video surveillance and machine-vision front ends with 75,408 logic elements sufficient for Sobel/Canny edge detection, color-space conversion, and MJPEG compression. The 4.5 Mbit of M9K memory acts as line buffers for 720p processing at 60 fps, while the 274 multipliers accelerate convolution kernels. Its LVDS I/O bank supports direct connection to CMOS image sensors over sub-LVDS or HiSPi links. Compared with a DSP-only approach, this single-FPGA implementation reduces BOM cost and PCB area, while keeping flexibility for algorithmic updates via on-chip soft processors.
Recommended
Software-Defined Radio Baseband
In software-defined radio baseband designs, the EP4CE75F23C8 implements digital down-conversion (DDC), channelization, and MAC-layer processing for narrow-band protocols below 30 MHz of instantaneous bandwidth. The 4 dedicated PLLs generate coherent sample clocks for dual ADC inputs, and the 274 multipliers handle polyphase FIR filterbanks in real time. The 484-FBGA provides enough LVDS pairs for parallel ADC interfaces such as the ADS62Pxx family from Texas Instruments. Designers favor the Cyclone IV E for SDR prototypes because the Quartus II DSP Builder accelerates MATLAB-to-FPGA workflows.
Recommended
LED Video Wall Scan Controller
Large-format LED video walls require a scan controller that can drive dozens of high-speed LVDS outputs with deterministic latency. The EP4CE75F23C8 delivers up to 292 user I/Os, of which many can be configured as LVDS pairs, allowing 30+ redundant scan channels per device. The 4 PLLs supply phase-shifted pixel clocks from 5 MHz to 312.5 MHz, covering standard LED driver IC inputs. On-chip M9K memory buffers one full frame at 1920 x 1080 x 16 bits, eliminating external SDRAM in mid-size configurations. Commercial speed-grade operation (0C to +85C) suits most indoor installations.
Recommended
PCIe Endpoint Bridge
The Cyclone IV E EP4CE75F23C8 implements a low-cost PCIe Gen1 x1/x4 endpoint through its soft MegaWizard IP, eliminating the need for a discrete bridge chip in industrial and embedded designs. The 484-FBGA provides the 8 dedicated high-speed transceiver-less SERDES lanes implemented in LVDS pairs plus sufficient general-purpose I/O for side-band signals. With 75,408 LEs and 4.5 Mbit memory, the device can also host custom application logic alongside the PCIe endpoint. This is a popular architecture for low-cost FPGA accelerators and data-acquisition cards.
Recommended
Portable Test and Measurement
Portable oscilloscopes, logic analyzers, and protocol testers use the EP4CE75F23C8 to consolidate display driving, data compression, USB bridging, and on-screen DSP into one device. The 60 nm process keeps idle power low, important for battery-powered instruments, while 75,408 LEs provide ample room for protocol decoding stacks (CAN, LIN, SPI, I2C, UART). The 4 PLLs allow simultaneous generation of the ADC sample clock, USB reference clock, and LCD pixel clock. Designers appreciate the F23 package's thermal dissipation for fan-less enclosures, and the long-term Intel product-life commitment for instrument platforms with 7-10 year lifecycles.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23C8N | EP4CE75F23C7N | EP4CE75F23C7 | EP4CE75F23C6N | EP4CE75F23C6 | EP4CE115F23C8 | EP4CE55F23C8 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23, 23x23 mm) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 114,480 | 55,488 |
| Embedded 18x18 Multipliers | 274 | 274 | 274 | 274 | 274 | 274 | 532 | 154 |
| Embedded Memory (M9K) | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 5.0 Mbit | 2.5 Mbit |
| General-Purpose PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/O | 292 | 292 | 292 | 292 | 292 | 292 | 292 | 292 |
| Speed Grade | 8 (commercial) | 8 | 7 | 7 | 6 | 6 | 8 | 8 |
Key Differentiators
- Higher multiplier density than smaller-density sibling (vs EP4CE55F23C8)
- Lower cost than larger-density sibling (vs EP4CE115F23C8)
- RoHS lead-free option available in same package (vs EP4CE75F23C8N)
- Speed-grade scaling for cost optimization (vs EP4CE75F23C7 / EP4CE75F23C6)
Design Notes
The EP4CE75F23C8 is housed in a 1.0 mm-pitch 484-FBGA package, which requires a 4- to 6-layer PCB with stacked microvia or laser-drilled vias for breakout routing. Use a minimum of 2 GND and 2 VCC planes with stitching vias spaced at <=lambda/20 of the highest harmonic in your design. Maintain 50 ohm +/-10% characteristic impedance on single-ended and 100 ohm differential for LVDS. Use via-in-pad or filled-and-capped vias to maximize BGA breakout density; a 0.8 mm pad with 0.4 mm via is the practical minimum for cost-effective HDI fabrication.
VCCINT (1.2 V core) requires a +/-30 mV tolerance per Cyclone IV Device Handbook, and design margin of 3% is recommended. Decouple every VCCINT pin with a 0.1 uF X7R plus a 10 uF bulk cap placed within 50 mil of each ball row. VCCA (analog PLL supply) must be cleanly isolated from VCCD_PLL with a ferrite bead and dedicated regulator. VCCIO must be planned per bank: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V. Use the Quartus II Early Power Estimator to size the regulator and bulk capacitance before layout finalization.
Three common pitfalls when designing with the EP4CE75F23C8: (1) leaving MSEL[3:0] floating - they must be tied to VCCPD or GND through 4.7 kohm resistors to select the configuration mode; (2) missing the nCONFIG or nSTATUS pull-up resistors, which causes intermittent configuration failure at power-up; (3) using a JTAG header without the 4.7 kohm TCK TMS TDI TDO pull-down/pull-ups, leading to boundary-scan errors. Always include the 1.0 uF ceramic on VCCPD and 2.2 uF on VCCPGM near the device. Reference the Cyclone IV Configuration, Design Security, and Remote System Upgrades chapter for complete details.
Estimated: at 85C ambient, 100% logic utilization, and 100 MHz toggle rate, the EP4CE75F23C8 dissipates approximately 2.5-3.5 W typical. The 484-FBGA has theta_JA of approximately 13 C/W with a JEDEC JESD51-9 test board, so junction temperature rises by 33-46 C, leaving ~5C margin to the 125C limit. For continuous high toggle rates or sealed enclosures, place a 25 x 25 x 5 mm heat spreader (e.g., Fischer Elektronik FK 222 SA) directly on the FBGA top with a 0.1 mm thermal interface pad. JTAG boundary-scan can be used to verify worst-case junction temperature during stress characterization.
For DDR2/DDR3 memory interfaces above 200 MHz, place matched-length groups within 50 mil of each byte lane, and route DQS pairs with 100 ohm differential impedance. Use IBIS simulation in HyperLynx or Mentor to validate DDR2 eye margins; the Cyclone IV IO Timing Analyzer in Quartus II 13.0sp1 reports per-pin setup/hold margins. For LVDS inputs, keep stubs to less than 100 mil and add 100 ohm differential termination within 250 mil of the FPGA ball. Pre-emphasis and slew-rate settings can be tuned in the Quartus II Assignment Editor for extended cable or backplane lengths.
Compliance Information
RoHS compliance and lead-free finish confirmed by Intel Cyclone IV E product family documentation. AEC-Q100 not applicable as the EP4CE75F23C8 is a commercial-grade FPGA without automotive qualification. For halogen-free or specific automotive needs, contact Intel.
