EP4CE75F23C7N - 75K LE Cyclone IV E FPGA, 484-FBGA | Intel
MPN: EP4CE75F23C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $228.09 | $228.09 |
| 10 | $205.28 | $2,052.80 |
| 100 | $182.47 | $18,247.00 |
| 500 | $159.66 | $79,830.00 |
| 1,000 | $136.85 | $136,850.00 |
EP4CE75F23C7N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are programmed by the end user after manufacture. The Cyclone IV E family belongs to the broader taxonomy of programmable logic devices (PLD) -> FPGA -> low-cost SRAM-based FPGA -> Intel/Altera low-power Cyclone family. FPGAs sit alongside ASICs, microcontrollers, and ASSPs in digital design, offering hardware-level parallelism and the flexibility to implement custom peripherals, memory controllers, or signal-processing pipelines that fixed-function silicon cannot match.
Key features of the EP4CE75F23C7N include up to 4 PLLs for clock synthesis, 266 embedded 18x18 multipliers (approximately 1,062 GMAC/s of DSP throughput), dedicated hardware for LVDS at up to 875 Mbps, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Configuration is typically loaded through JTAG or active/passive serial flash, and the device is supported by Intel Quartus Prime (the unified replacement for the legacy Altera Quartus II toolchain).
Typical applications span industrial motor control and factory automation, video surveillance and image processing, automotive infotainment prototypes, software-defined radio baseband, portable test and measurement, and bridge/aggregation logic on telecom backplanes. The 484-FBGA footprint supports high-density board layouts where hundreds of I/O signals and multiple high-speed transceivers (when paired with external PHY devices) must fan out to memory and connectors.
When designing with this part, allocate sufficient PCB area for the 484-ball BGA escape routing (typically 1.0 mm pitch), provide multiple decoupling capacitors near each power pin pair, and follow Intel's PCB layout guidelines for FPGA power rails. Use Intel Quartus Prime for synthesis, place-and-route, timing analysis, and power estimation; the free Quartus Prime Lite edition supports Cyclone IV E devices without a license fee.
This page synthesizes distributor inventory, drop-in alternatives from the Cyclone IV E family, and practical design notes not consolidated in any single manufacturer datasheet. Specifications below are sourced from DigiKey, Mouser, Octopart, and the official Intel Cyclone IV Device Handbook as of 2026-09-10.
Drop-in alternatives for EP4CE75F23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C7N (same form factor and footprint) — differing in Package, Embedded 18x18 Multipliers, Configuration Modes, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F23C8N
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP4CE75F23C6N
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View Datasheet →EP4CE115F23C8N
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$145 / Unit
View Datasheet →EP4CE75F23C7
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$148 / Unit
View Datasheet →EP4CE75F23C6
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$92 / Unit
View Datasheet →EP4CE55F23C7N
✅ Drop-In✓ In Stock
$56.4 / Unit
View Datasheet →EP4CE75F23C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Embedded Memory Bits | 2,810,880 |
| Embedded 18x18 Multipliers | 266 |
| User I/Os | 292 |
| PLLs | 4 |
| Global Clocks | 20 |
| Logic Array Blocks (LABs) | 4,713 |
| Package | 484-BGA (FBGA-484) |
| Pin/Pitch | 484 / 1.0 mm |
| Supply Voltage (Core) | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C7 |
| Process Technology | 60 nm low-power CMOS |
| Configuration Interface | JTAG, Active Serial, Passive Serial |
| RoHS Status | Compliant |
EP4CE75F23C7N Pin Configuration
| Pin A1 | I/O — User I/O ball (per Cyclone IV handbook ball map) |
| Pin B1 | I/O — User I/O ball |
| Pin AB1 | I/O — User I/O ball |
| Pin AB24 | I/O — User I/O ball |
| Pin GND | GND — Ground (multiple balls) |
| Pin VCC | VCCINT — Core supply 1.2 V (multiple balls) |
| Pin VCCIO | VCCIO — I/O supply 1.2-3.3 V (multiple banks) |
Typical Applications
EP4CE75F23C7N is suitable for 7 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Software-Defined Radio Baseband Processing, Automotive Infotainment Prototyping, Portable Test and Measurement Instrumentation, Telecom Bridge and Aggregation Logic, LED Display and Lighting Controllers.
Industrial Motor Control and Factory Automation
The EP4CE75F23C7N fits industrial motor control applications because its 75,408 logic elements and 266 embedded 18x18 multipliers provide ample resources for implementing field-oriented control (FOC), space-vector PWM, and encoder decoding algorithms in parallel hardware. With 292 user I/Os in the 484-FBGA package, the FPGA can interface directly to multiple quadrature encoders, resolver-to-digital converters, and gate-driver ICs such as the IR2110 or UCC27211. The 4 on-chip PLLs allow precise synthesis of high-frequency switching clocks (up to 100+ MHz PWM) from a single crystal, while 2.81 Mbit of embedded memory absorbs current-loop sample buffers without external SRAM. Unlike a microcontroller, the FPGA executes the entire current loop in deterministic hardware latency, an essential property for high-bandwidth servo loops.
Recommended
Video Surveillance and Image Processing
The EP4CE75F23C7N is well suited for video surveillance pipelines because the 266 hardware 18x18 multipliers enable real-time convolution, edge detection, and motion-vector estimation at HD video rates. Its 2.81 Mbit of embedded memory serves as line buffers and frame buffers for progressive-scan video at 720p/1080p, while the 292 I/Os allow direct connection to MIPI-CSI bridges, HDMI transmitters, and DDR2 frame stores. The Cyclone IV E fabric supports LVDS signaling up to 875 Mbps, accommodating uncompressed digital video links to image sensors. Compared with a DSP or GPU, the FPGA delivers deterministic per-frame latency critical for synchronized multi-camera security installations, and its low 1.2 V core reduces power in always-on surveillance installations.
Recommended
Software-Defined Radio Baseband Processing
The EP4CE75F23C7N handles SDR baseband workloads because the 75,408 logic elements and 266 hardware multipliers deliver the throughput required for digital down-conversion, FIR filtering, and FFT processing on IF samples up to 50-100 MSPS. Its 2.81 Mbit embedded SRAM acts as a fast sample buffer between decimation stages and the host interface, while the 4 PLLs synthesize the multiple clock domains needed by ADCs, DACs, and digital up-conversion paths. The 484-FBGA's 292 I/Os accommodate LVDS pairs from high-speed ADCs such as the AD9643 or AD9122, supporting both receive and transmit chains. Engineers choose Cyclone IV E over a DSP for SDR prototyping when deterministic latency and rapid iteration outweigh peak FLOPS.
Recommended
Automotive Infotainment Prototyping
The EP4CE75F23C7N suits automotive infotainment prototype development because its Cyclone IV E architecture provides sufficient logic (75K LEs) and memory (2.81 Mbit) to prototype display controllers, MOST or LVDS video links, and audio DSP pipelines, all within a single programmable device. The 292 I/Os in the 484-FBGA package map cleanly to multi-display clusters, touchscreen controllers, and CAN/LIN transceivers. Designers benefit from the FPGA's ability to iterate on infotainment feature sets without respinning an ASIC, while the industrial 0C to 85C operating range covers most cabin environments. For production automotive designs, the part is typically re-targeted to an AEC-Q100-qualified Cyclone IV GX or MAX 10 device, but the EP4CE75F23C7N is widely used for engineering prototypes and pre-production validation.
Recommended
Portable Test and Measurement Instrumentation
The EP4CE75F23C7N is a strong fit for portable test and measurement instruments because its low 1.2 V core voltage keeps total power consumption modest, supporting battery-powered or handheld form factors. The 75,408 LEs and 266 multipliers enable integration of arbitrary waveform generators, digital pattern generators, and real-time DSP filters, while 2.81 Mbit of embedded memory captures transient waveforms without external buffering. With 292 I/Os available in the 484-FBGA, the FPGA can drive color TFT displays, ADCs, DACs, and USB/Ethernet bridges. The deterministic fabric makes the device ideal for protocol-aware logic analyzers and protocol-aware scopes that require sample-accurate triggering.
Recommended
Telecom Bridge and Aggregation Logic
The EP4CE75F23C7N serves telecom backplane bridge applications because the 292 I/Os in the 484-FBGA can aggregate multiple lower-speed serial links (LVDS, SPI, I2C, parallel buses) into higher-speed uplinks. Its 4 on-chip PLLs synthesize the independent clock domains required when bridging between Ethernet PHYs, E1/T1 framers, and CPRI links to baseband units. The 2.81 Mbit embedded memory functions as elastic storage for rate adaptation between asynchronous domains, while the 75K logic elements implement HDLC, PCS, and GFP framing in hardware. Cyclone IV E devices are widely deployed in legacy telecom infrastructure where a small, deterministic, low-power aggregation device is preferable to a large processor or an ASIC.
Recommended
LED Display and Lighting Controllers
The EP4CE75F23C7N is well suited to large-scale LED video wall and architectural lighting controllers because the 75,408 logic elements and 266 multipliers can drive hundreds of PWM channels for color-mixing and brightness correction. The 292 user I/Os in the 484-FBGA map easily to multiple LED driver chains, with LVDS outputs supporting long-distance cabling between the controller and remote driver panels. The 4 PLLs generate the precise high-frequency clocks required for hub75-style multiplexed LED matrices, and the 2.81 Mbit of embedded memory acts as a frame buffer for layered content. Compared with a microcontroller, the FPGA's parallel PWM architecture avoids interrupt jitter, ensuring flicker-free video playback on large LED walls.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23C8N | EP4CE75F23C6N | EP4CE115F23C8N | EP4CE75F23C7 | EP4CE55F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 114,480 | 75,408 | 55,296 |
| Speed Grade | C7 | C8 | C6 | C8 | C7 | C7 |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 3,981,312 bits | 2,810,880 bits | 2,340,480 bits |
| User I/Os | 292 | 292 | 292 | 292 | 292 | 292 |
| 18x18 Multipliers | 266 | 266 | 266 | 266 | 266 | 156 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Mid-range Cyclone IV E capacity with full 292 I/O count (vs EP4CE55F23C7N)
- Pin-compatible with the larger EP4CE115 for design migration (vs EP4CE115F23C8N)
- Faster speed grade than the C8 variant at same price tier (vs EP4CE75F23C8N)
Design Notes
Estimated: the 484-FBGA uses a 1.0 mm ball pitch. Escape routing requires microvia (HDI) PCB technology on at least 4 layers, with all signal vias fanned out to inner layers before break-out. Follow Intel Cyclone IV handbook Chapter 8 for the official PCB layout and decoupling guidelines: place one 0.1 uF + one 10 uF capacitor pair within 100 mils of each VCCINT/VCCIO ball pair. Estimated 4-layer stackup cost roughly 30% more than 2-layer but is required for BGA fan-out.
Estimated: configure the EP4CE75F23C7N with VCCINT = 1.2 V and VCCIO bank supplies between 1.2 V and 3.3 V depending on connected logic. Use Intel's PowerPlay early power estimator within Quartus Prime to predict total current before committing to the PCB power tree; Cyclone IV E devices at full utilization can require 1.5-2.5 A on VCCINT. Per-bank VCCIO supplies must be sequenced after VCCINT; in-rush from simultaneous ramp can trigger POR events.
DDR/DDR2 external memory interfaces require matched trace lengths and 50 ohm controlled-impedance routing; refer to the Cyclone IV External Memory Interface Handbook for byte-lane deskewing tolerances. LVDS pairs must be routed as length-matched 100 ohm differential lines and kept clear of noisy switching signals. JTAG and configuration pins (TCK, TMS, TDI, TDO, MSEL, nCE, nCONFIG, nSTATUS) should be accessible for board-level programming and boundary-scan test.
Do not confuse Cyclone IV E with Cyclone IV GX - the latter adds 3 Gbps transceivers and uses a different pinout despite similar package codes. Verify MSEL[3:0] strapping matches your configuration scheme (AS x1, AS x4, PS, JTAG) or the device will fail to configure silently. The EP4CE75F23C7N is industrial-grade (0C to 85C junction); for full industrial (-40C to 100C) or automotive temperature grades, look at the 'I' suffix variants.
Compliance Information
RoHS compliant per distributor product listings. The C7 commercial-grade part is not AEC-Q100 qualified; for automotive applications choose qualified Cyclone IV or MAX 10 variants.
