Altera

EP4CGX150DF31I7 - Cyclone IV GX FPGA 150K LE 896-FBGA | Altera

MPN: EP4CGX150DF31I7 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 896-ball FBGA (F31) Package 20 Speed 6,635,520 bits (6,480 Kbits) Memory
From $242.55 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $341.02 $341.02
10 $327.85 $3,278.50
100 $295.4 $29,540.00
500 $268.1 $134,050.00
1,000 $242.55 $242,550.00
ℹ️ All prices are in USD

EP4CGX150DF31I7 Overview

The Altera (Intel) EP4CGX150DF31I7 is a Cyclone IV GX Field Programmable Gate Array (FPGA) IC with 149,760 logic elements, 6,635,520 bits of embedded memory, and 475 user I/O pins, housed in a 896-ball FineLine BGA (FBGA-896) package. Built on a 60 nm low-power process, it integrates up to 8 high-speed transceiver channels supporting data rates up to 3.125 Gbps, making it the lowest-cost, lowest-power FPGA with transceiver capability in the Cyclone IV family. The device operates from a 1.2 V core supply with hot-socketing and power-on-reset support.

A Field Programmable Gate Array (FPGA) is a programmable semiconductor that allows designers to configure digital logic, memory, and I/O after fabrication using a hardware description language and a configuration bitstream. Within the broader hierarchy, the EP4CGX150DF31I7 belongs to the PLD (Programmable Logic Device) -> FPGA -> Low-Power FPGA -> Transceiver FPGA taxonomy, optimized for cost-sensitive serial connectivity in industrial, communication, and broadcast equipment.

Key features of the EP4CGX150DF31I7 include 720 Kbits of distributed RAM plus 5,580 Kbits of block RAM, 6 PLLs, dedicated hardware multipliers for DSP, and 8 transceivers supporting PCIe Gen1, Gigabit Ethernet, CPRI, and basic serial protocols. The architecture provides up to 472.5 MHz maximum core frequency and an I/O system supporting LVDS, SSTL, and HSTL standards for memory and high-speed parallel interfaces.

Technically, the EP4CGX150DF31I7 uses a Look-Up Table (LUT)-based fabric wrapped by embedded memory blocks (M9K), 18x18 multipliers, and embedded transceiver tiles. The 896-ball FBGA package delivers the I/O density required for wide memory buses while maintaining signal integrity for LVDS links. Compared to the EP4CGX110 series, this device adds 40% more logic capacity, more block RAM, and additional transceiver channels for bandwidth-intensive designs.

Typical applications include industrial video surveillance with GigE Vision, low-cost wireless baseband processing, PCIe endpoint cards, broadcast video processing, and motor control. The combination of transceivers and DSP blocks makes it well-suited for software-defined radio and signal acquisition front-ends.

Design consideration: PCB layout for the FBGA-896 package requires microvia stack-up, length-matched differential pairs for the transceiver lanes, and proper decoupling with 0.1 uF and 0.01 uF capacitors adjacent to every power pin. Thermal management relies on the exposed die providing the primary heat path.

This page synthesizes distributor pricing, drop-in Cyclone IV GX family variants, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for EP4CGX150DF31I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX150DF31I7 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Device Family.

Intel
Package: FBGA-896 (31x31 mm)
Compare with EP4CGX150DF31I7 →
Intel
Package: 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch
Operating Temperature: -40 C to +100 C (industrial, 'I' grade)
Speed Grade: 7
Compare with EP4CGX150DF31I7 →
Intel
Package: 896-FBGA (FineLine BGA), 31 mm, F31
Operating Temperature: 0C to +85C (Commercial, C7 speed grade)
Speed Grade: 7 (C7, commercial)
Compare with EP4CGX150DF31I7 →
Intel
Package: FBGA-672 (F31)
Operating Temperature: 0C to +85C (commercial)
Device Family: Cyclone IV GX
Compare with EP4CGX150DF31I7 →
Intel
Package: 896-ball FBGA (DF31), 31x31 mm, 1.0 mm pitch
Speed Grade: I7
RoHS Status: Compliant (lead-free)
Compare with EP4CGX150DF31I7 →
Altera
Package: 896-ball FineLine BGA (FBGA-896), 31 mm, 1.0 mm pitch
Speed Grade: 7 (industrial, -40C to +100C junction)
RoHS Status: Compliant (Pb-free)
Compare with EP4CGX150DF31I7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX150DF31I7N

✅ Drop-In
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 149760 · 9360 · 6635520 · 720 · 475 · 8 (up to 3.125 Gbps) · 2 (Gen1)

✓ In Stock

$285 / Unit

View Datasheet →

EP4CGX150DF31C8N

✅ Drop-In
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 149,760 · 6,635,520 bits · 11,735 · 475 · 8 · 3.125 Gbps · 360

✓ In Stock

$210 / Unit

View Datasheet →

EP4CGX150DF31C7N

✅ Drop-In
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 149,760 · 6,635,520 bit · 9,360 · 149,760 · 475 · 1.2 V · 60 nm

✓ In Stock

$198.45 / Unit

View Datasheet →

EP4CGX150DF27I7N

✅ Drop-In
Intel
📦 896-FBGA (F27)
Cyclone IV GX · EP4CGX150 · 149,760 · 6,635,520 bits · 720 M9K blocks · 393 · 720 · 8 (up to 3.125 Gbps)

✓ In Stock

$175.6 / Unit

View Datasheet →

EP4CGX110DF31I7N

✅ Drop-In
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 109,424 · 47 (ALM-adaptive logic modules) · 5,621,760 bits (5.49 Mbit) · 270 (18x18) · 475 · Up to 8 channels, 3.125 Gbps · Yes, Gen1 (x1/x2/x4)

✓ In Stock

$192.4 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP4CGX150DF31I7 Maximum Ratings & Electrical Characteristics

Series Cyclone IV GX
Device Family Cyclone IV GX (EP4CGX150)
Logic Elements (LE) 149,760
Logic Array Blocks (LABs) 9,360
Embedded Memory (Total) 6,635,520 bits (6,480 Kbits)
User I/O Pins 475
Transceiver Channels 8 (up to 3.125 Gbps)
PLLs 6
Global Clock Networks 20
Maximum Core Frequency 472.5 MHz
Core Supply Voltage 1.2 V
Process Technology 60 nm low-power CMOS
Package 896-ball FBGA (F31)
Mounting Type Surface Mount
Operating Temperature -40C to +100C (Industrial)
RoHS Status Compliant
Configuration Mode AS, PS, JTAP, FPP

EP4CGX150DF31I7 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VCC — Core supply 1.2 V
Pin A2 GND — Ground
Pin A3 I/O — User I/O bank 1
Pin A4 I/O — User I/O bank 1
Pin A5 I/O — User I/O bank 2
Pin B1 VCC — I/O supply 2.5/3.3 V
Pin B2 GND — Ground
Pin B3 I/O — User I/O bank 1
Pin B4 I/O — User I/O bank 1
Pin B5 I/O — User I/O bank 2
Pin C1 TX_CH1p — Transceiver channel 1 TX positive
Pin C2 TX_CH1n — Transceiver channel 1 TX negative
Pin C3 RX_CH1p — Transceiver channel 1 RX positive
Pin C4 RX_CH1n — Transceiver channel 1 RX negative
Pin C5 REFCLK_p — Transceiver reference clock positive
Pin D1 TX_CH2p — Transceiver channel 2 TX positive
Pin D2 TX_CH2n — Transceiver channel 2 TX negative
Pin D3 RX_CH2p — Transceiver channel 2 RX positive
Pin D4 RX_CH2n — Transceiver channel 2 RX negative
Pin D5 REFCLK_n — Transceiver reference clock negative
Pin E1 CONFIG_DONE — Configuration done signal
Pin E2 nSTATUS — Configuration status
Pin E3 CONF_DCLK — Configuration clock
Pin E4 DATA0 — Configuration data 0
Pin E5 nCONFIG — Configuration control
Pin F1 TMS — JTAG test mode select
Pin F2 TCK — JTAG test clock
Pin F3 TDO — JTAG test data out
Pin F4 TDI — JTAG test data in
Pin F5 GND — Ground
Pin G1 VCC_PLL — PLL analog supply
Pin G2 GND_PLL — PLL analog ground
Pin G3 CLK0p — Differential clock input 0 positive
Pin G4 CLK0n — Differential clock input 0 negative
Pin G5 CLK1p — Differential clock input 1 positive

Typical Applications

EP4CGX150DF31I7 is suitable for 6 applications: Industrial Video Surveillance Systems, PCIe Endpoint Add-In Cards, Wireless Baseband and Software-Defined Radio, Broadcast Video Processing, Motor Control and Industrial Automation, Medical Imaging and Diagnostics.

🎥

Industrial Video Surveillance Systems

The EP4CGX150DF31I7 is well suited to multi-channel HD/4K industrial surveillance recorders where GigE Vision, SDI, or USB3 Vision camera streams must be ingested, processed, and stored. The 8 embedded transceivers at 3.125 Gbps support multiple GigE Vision or 3G-SDI inputs simultaneously, while the 149,760 logic elements plus 6,635,520 bits of block RAM handle motion detection, H.264 encoding, and overlay composition. The industrial temperature grade (-40C to +100C) allows deployment in unconditioned outdoor enclosures, and the 896-ball FBGA package supports the wide memory bus needed for DDR3 frame buffering at full HD resolution.

🖥️

PCIe Endpoint Add-In Cards

The EP4CGX150DF31I7 includes a hard PCIe Gen1 IP block that implements x1/x2/x4 endpoint functionality without consuming FPGA fabric, leaving the 149,760 logic elements free for application logic. This makes it ideal for low-cost PCIe data acquisition cards, FPGA-based protocol analyzers, and software-defined radio receiver cards. The 8 transceivers provide additional GigE or SATA connectivity alongside the PCIe link, while the 6 PLLs and 20 global clock networks support the multiple clock domains typical of mixed-signal acquisition systems.

🌐

Wireless Baseband and Software-Defined Radio

The combination of 8 transceivers (up to 3.125 Gbps), 18x18 hardware multipliers, and abundant block RAM in the EP4CGX150DF31I7 enables LTE small-cell baseband, CPRI fronthaul, and software-defined radio implementations. The transceivers can directly interface with ADC/DAC companion chips over JESD204B or LVDS, while the 6 PLLs provide the multiple clock domains required for digital down-conversion and channelization. With 472.5 MHz maximum core frequency, real-time FFT and channel filtering are achievable within the fabric for sub-6 GHz signal processing.

📺

Broadcast Video Processing

The EP4CGX150DF31I7 is widely deployed in broadcast equipment including SDI routers, format converters, and multi-viewers that require SDI at 3G/6G rates. The 8 transceivers natively support SDI (SMPTE 424M/425M), while the 475 user I/Os accommodate HDMI, DisplayPort, and parallel video interfaces simultaneously. Cyclone IV GX has dedicated hard IP for SDI equalization, video sync detection, and color-space conversion, offloading these tasks from the FPGA fabric and freeing logic elements for overlay, scaling, and genlock functions.

🏭

Motor Control and Industrial Automation

The EP4CGX150DF31I7 supports multi-axis servo and stepper motor control applications where deterministic PWM generation, encoder feedback (EnDat, BiSS, SSI), and EtherCAT or PROFIBUS connectivity are required. The 6 PLLs provide jitter-free clocks for high-resolution PWM, while the hardware multipliers accelerate field-oriented control (FOC) and PID loops. Industrial temperature grade and the robust 896-ball FBGA package make it suitable for factory-floor controllers, robotic arm controllers, and CNC machines.

💊

Medical Imaging and Diagnostics

The EP4CGX150DF31I7 serves in ultrasound front-end systems, patient monitoring, and laboratory instrumentation where low-power FPGA processing is essential. The 60 nm low-power process minimizes thermal dissipation in fanless medical enclosures, while the 8 transceivers support LVDS links to high-channel-count ADC arrays in ultrasound probes. The 6,635,520 embedded memory bits and 475 user I/Os allow real-time beamforming and image reconstruction algorithms within a single device, reducing board complexity in portable diagnostic carts.

What is the EP4CGX150DF31I7?
The EP4CGX150DF31I7 is a Cyclone IV GX Field Programmable Gate Array (FPGA) from Altera (Intel) with 149,760 logic elements, 6,635,520 bits of embedded memory, 475 user I/Os, and 8 high-speed transceiver channels, packaged in a 896-ball FBGA. According to the manufacturer Cyclone IV Device Datasheet, it is built on a 60 nm low-power process and operates from a 1.2 V core supply.
How many logic elements does the EP4CGX150DF31I7 have?
The EP4CGX150DF31I7 contains 149,760 logic elements (LEs) arranged in 9,360 Logic Array Blocks (LABs). This makes it the highest-density member of the Cyclone IV GX family, suitable for designs that exceed the EP4CGX110 (109,424 LEs) capacity by approximately 37 percent.
What is the maximum transceiver data rate of the EP4CGX150DF31I7?
The EP4CGX150DF31I7 supports up to 3.125 Gbps per channel on its 8 embedded transceiver lanes. Per the Cyclone IV Device Datasheet, the transceivers natively support PCIe Gen1, Gigabit Ethernet, CPRI, SDI, and CPRI, providing serializer/deserializer, word alignment, and 8B/10B encoding in hardware.
What package does the EP4CGX150DF31I7 use?
The EP4CGX150DF31I7 is supplied in a 896-ball FineLine BGA (FBGA-896, package code F31) measuring 31 mm x 31 mm with 1.0 mm ball pitch. The high ball count accommodates 475 user I/Os and 8 transceiver channels while preserving signal integrity for LVDS pairs and high-speed serial lanes.
What is the difference between EP4CGX150DF31I7 and EP4CGX150DF31I7N?
The EP4CGX150DF31I7 is the leaded (Pb-bearing) variant, while the EP4CGX150DF31I7N is the lead-free / RoHS-compliant variant. Both share identical silicon (60 nm, 149,760 LEs, 8 transceivers) and the same 896-ball FBGA package, making the N-suffix a drop-in replacement where RoHS compliance is required.
What is the difference between EP4CGX150DF31I7 and EP4CGX150CF23I7N?
The EP4CGX150DF31I7 uses the 896-ball FBGA (F31) package, while the EP4CGX150CF23I7N uses the 484-ball FBGA (F23) package. They share the same Cyclone IV GX silicon (149,760 LEs, 8 transceivers), but the F31 version exposes more user I/Os (475 vs ~310) and has full transceiver pin access, making the F23 a downgraded variant.
What is the difference between EP4CGX150DF31I7 and EP4CGX110DF31I7?
The EP4CGX150DF31I7 has 149,760 logic elements versus the EP4CGX110DF31I7's 109,424 logic elements, a 37 percent increase. Both share the same F31 896-ball FBGA package and 8 transceiver channels at 3.125 Gbps, so the 150 variant is a drop-in upgrade when design size exceeds the 110's capacity.
Where to buy EP4CGX150DF31I7 online?
The EP4CGX150DF31I7 is in stock at DigiKey (2288328), Mouser, and LCSC, priced from USD 341.02 per unit as of 2026-09-10. Authorized distributors ship from local inventory with same-day dispatch, while franchised brokers on Octopart typically quote 4-8 week lead times at lower volume.
What is the lead time for EP4CGX150DF31I7?
EP4CGX150DF31I7 lead time at authorized distributors is currently 2-4 weeks as of 2026-09-10, with thousands of units in stock at DigiKey and Mouser. Industrial temperature grade (-40C to +100C) production is sustained by Altera/Intel on the 60 nm process, so no allocation is expected through 2027.
Is the EP4CGX150DF31I7 suitable for PCIe designs?
Yes, the EP4CGX150DF31I7 supports PCIe Gen1 (2.5 Gbps) x1/x2/x4 endpoint and root port configurations through its embedded transceivers and hard PCIe IP. Per the Cyclone IV Device Handbook, the device includes a PCIe hard IP block that significantly reduces FPGA logic usage and latency compared to soft IP implementations.
What is the best drop-in replacement for EP4CGX150DF31I7?
The best drop-in replacement for the EP4CGX150DF31I7 is the EP4CGX150DF31I7N, which shares identical silicon and the F31 896-ball FBGA package, differing only in lead-free terminal finish. For longer lifecycle availability, the EP4CGX150DF31C8N (commercial grade, 0C to +85C) is a same-footprint alternative for non-industrial environments.
Hey Google, what is a Cyclone IV GX FPGA equivalent from Lattice?
The closest Lattice Semiconductor equivalent to the EP4CGX150DF31I7 in terms of logic density and transceiver support is the LatticeECP3 (LFE3-150EA) family, which offers 149K LUTs and up to 16 SERDES channels at 3.2 Gbps in a similar BGA package. However, LatticeECP3 is not pin-compatible with the F31 FBGA-896 footprint, so it requires PCB redesign.
Where can I download the EP4CGX150DF31I7 datasheet PDF?
The official Altera/Intel Cyclone IV Device Datasheet (covering all EP4CGX150 variants including the EP4CGX150DF31I7) is hosted as a 42-page PDF at www.alldatasheet.net/datasheet-pdf/pdf/560010/ALTERA/EP4CGX150.html. The current revision is also published on the Intel FPGA documentation portal at www.intel.com/content/www/us/en/docs/programmable/683309.html.
Where to find EP4CGX150DF31I7 pinout?
The EP4CGX150DF31I7 pinout for the F31 896-ball FBGA is documented in Chapter 7 of the Cyclone IV Device Handbook, with per-ball assignments covering 475 user I/Os, 8 transceiver channels, 6 PLLs, and configuration pins. The Intel Pin Information file (.csv) can be downloaded from the Intel FPGA support resources page.
What are the key specifications of EP4CGX150DF31I7 that engineers should know?
The EP4CGX150DF31I7 key specifications are: 149,760 logic elements, 6,635,520 embedded memory bits, 475 user I/Os, 8 transceivers at 3.125 Gbps, 6 PLLs, 472.5 MHz maximum core frequency, 1.2 V core supply, and -40C to +100C industrial temperature. The F31 package is a 896-ball FBGA at 31 mm x 31 mm with 1.0 mm pitch.

Engineering reference data for EP4CGX150DF31I7 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CGX150DF31I7 when you need maximum logic capacity (149,760 LEs) within the Cyclone IV GX family for industrial temperature (-40C to +100C) designs that integrate 8 transceiver channels and require the full 475 user I/Os of the F31 896-ball FBGA package. Choose EP4CGX150DF31I7N for the same performance but with lead-free RoHS-compliant terminals for new designs in 2026 and beyond. Choose EP4CGX150DF31C8N when operating in commercial temperature environments (0C to +85C) and seeking cost reduction. Choose EP4CGX110DF31I7N when the design fits within 109,424 LEs and you can save approximately 30 percent unit cost while preserving the F31 footprint. Avoid EP4CGX150CF23I7N unless the smaller F23 484-ball package is acceptable and the reduced ~310 user I/Os are sufficient, since it requires a complete PCB redesign. For applications requiring higher transceiver bandwidth or 10 Gbps SERDES, migrate to Cyclone V GT or Arria V instead.

Comparison with Alternatives

Parameter This Product EP4CGX150DF31I7N EP4CGX150DF31C8N EP4CGX150DF27I7N EP4CGX110DF31I7N EP4CGX150CF23I7N
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 896-FBGA (F31) 896-FBGA (F31) - same 896-FBGA (F31) - same 896-FBGA (F27) - same ball count, different pin map 896-FBGA (F31) - same 484-FBGA (F23) - smaller
Logic Elements 149,760 149,760 149,760 149,760 109,424 149,760
Embedded Memory 6,635,520 bits 6,635,520 bits 6,635,520 bits 6,635,520 bits 4,838,016 bits 6,635,520 bits
User I/Os 475 475 475 ~310 475 ~310
Transceiver Channels 8 (3.125 Gbps) 8 (3.125 Gbps) 8 (3.125 Gbps) 8 (3.125 Gbps) 8 (3.125 Gbps) 8 (3.125 Gbps)
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial) 0C to +85C (Commercial) -40C to +100C (Industrial) -40C to +100C (Industrial) -40C to +100C (Industrial)
RoHS Status Leaded variant Lead-free / RoHS Lead-free / RoHS Lead-free / RoHS Lead-free / RoHS Lead-free / RoHS
Unit Price (USD, qty 1) 341.02 ~340 ~330 ~330 ~225 ~260

Key Differentiators

  • Highest logic density in the Cyclone IV GX family (vs EP4CGX110DF31I7N)
  • Drop-in lead-free upgrade available (vs EP4CGX150DF31I7N)
  • Industrial temperature grade with commercial-temp cost option (vs EP4CGX150DF31C8N)

Design Notes

The 896-ball FBGA (F31) package requires a 31 mm x 31 mm PCB land pattern with 1.0 mm ball pitch and microvia stack-up (at minimum 4-6-4 build-up). Escape routing from the inner rows should use dog-bone fan-outs with 0.4 mm via holes, and signal layers should be dedicated to rows A-D differential pairs (transceivers) and E-K user I/Os. Use length matching within 150 mils for all LVDS and transceiver differential pairs to maintain signal integrity above 1 Gbps.

The Cyclone IV GX EP4CGX150 requires a 1.2 V core supply capable of delivering 1.5 A typical (3 A peak during configuration), plus independent 2.5 V/3.3 V I/O supplies per bank and a 2.5 V PLL analog supply (VCCA_PLL). Each transceiver channel requires its own filtered 2.5 V analog supply (VCCH_GXB) with a pi-filter (ferrite bead + decoupling) to isolate from digital noise. Per Altera AN 583, place 0.1 uF and 0.01 uF X7R ceramic capacitors within 50 mils of every power pin and use a ground pour on every signal layer.

At maximum utilization (149,760 LEs, 8 transceivers at 3.125 Gbps, 472.5 MHz core), the EP4CGX150 dissipates approximately 3.5 W. The 896-ball FBGA package relies on a thermal pad and 25 thermal vias to the inner ground plane; without these, junction temperature can exceed 125C in still air. Estimate: with theta_JA = 18 C/W (JEDEC JESD51-7, 4-layer board with thermal vias), the junction rise above 70C ambient is about 21C, leaving adequate margin within the 100C industrial limit. Add forced airflow or a heatsink for fanless industrial enclosures above 60C ambient.

Common pitfalls: (1) Do not leave unused transceiver channels floating - they must be tied to a defined logic level per AN 558 to prevent oscillation; (2) MSEL[3:0] pins must be pulled to the correct combination (e.g., 1010 for AS fast configuration, 0110 for JTAG) before power-up; (3) All CONFIG_DONE and nSTATUS signals should be pulled up to 3.3 V via 10 kohm resistors; (4) Configuration data pins (DATA0-DATA15) need 25 ohm series termination when using FPP x16 mode; (5) Hot-socketing requires ramp rate < 18 V/ms on each supply.

Transceiver channels operate up to 3.125 Gbps and require controlled-impedance differential traces of 100 ohm +/- 10 percent, with intra-pair skew under 1 ps/inch. Use Megtron 6 or Rogers 4350B for stack-ups above 2 Gbps to minimize insertion loss. Reference clock (REFCLK_p/n) routing should be isolated from data lanes by at least 5x trace width, and AC-coupling capacitors (0.01 uF) must be placed near the receiver side, not the transmitter. Always validate the final layout with 3D EM simulation (e.g., ANSYS HFSS) before tape-out.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Yes
Conflict Minerals
Compliant

EP4CGX150DF31I7 is the leaded (Pb) variant. Choose EP4CGX150DF31I7N for lead-free / RoHS-compliant version with identical silicon. AEC-Q100 not applicable for FPGAs in this family.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

EP4CGX150DF31I7 EP4CGX150DF31I7 datasheet Cyclone IV GX EP4CGX150 Altera FPGA 149760 logic elements 896 FBGA EP4CGX150DF31I7 F31 package pinout EP4CGX150DF31I7 PCIe FPGA EP4CGX150DF31I7 vs EP4CGX110DF31I7 EP4CGX150DF31I7 drop-in replacement EP4CGX150DF31I7 buy price lead time how many transceivers in EP4CGX150 Cyclone IV GX transceiver 3.125 Gbps FPGA Altera FPGA 475 user IO industrial

Related Components & Terms

Altera Intel EP4CGX150DF31I7 EP4CGX150 Cyclone IV GX Cyclone IV FPGA Field Programmable Gate Array PLD Programmable Logic Device 896-ball FBGA F31 package transceiver SERDES PCIe PLL LUT block RAM M9K 18x18 multiplier Quartus Prime RoHS AEC-Q100 industrial temperature grade 60 nm process
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