EP4CGX150DF31I7NAD - Cyclone IV GX FPGA 149K LEs | Altera | 896-BGA
MPN: EP4CGX150DF31I7NAD ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460.75 | $4,607.50 |
| 100 | $421.5 | $42,150.00 |
| 250 | $398.2 | $99,550.00 |
| 500 | $372.4 | $186,200.00 |
EP4CGX150DF31I7NAD Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), routing interconnect, embedded memory, and dedicated silicon IP such as transceivers and PLLs that can be reconfigured after PCB assembly. Cyclone IV GX belongs to the low-power Cyclone IV sub-family (which also includes Cyclone IV E without transceivers); FPGAs sit at the top of the programmable logic hierarchy below ASICs in NRE cost but above discrete CPLDs in density. The EP4CGX150 variant is the highest-density member of the Cyclone IV GX family, with 9,360 CLBs distributed across 16 logic array blocks.
Key features of the EP4CGX150DF31I7NAD include the 8 transceiver channels supporting CPRI, OBSAI, PCIe Gen1, GigE, SDI, and Serial RapidIO protocols; two hard PCI Express Gen1 controllers (x1, x2, or x4); dedicated PLL and 36x36 DSP blocks for high-throughput arithmetic; and Cyclone IV's signature low-power architecture that consumes less than 1.5 W in typical configuration. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with built-in AES-256 bitstream encryption for IP protection. The 896-ball FineLine BGA with 1.0 mm pitch requires high-density PCB fabrication but enables the highest I/O count in the Cyclone IV GX family.
The transceiver-rich architecture makes the EP4CGX150DF31I7NAD particularly well-suited to wireless baseband processing, industrial video transmission, and low-cost PCIe endpoint designs. Designers migrating from Cyclone III designs benefit from drop-in software compatibility through Quartus II and the modern Quartus Prime toolchain, while pin-compatible footprint options within the F31 package family allow density upgrades between EP4CGX110 and EP4CGX150 variants.
For power supply design, the EP4CGX150 requires separate VCCINT (1.0 V/1.2 V core), VCCA (2.5 V PLL analog), VCCD_PLL (1.0 V/1.2 V PLL digital), and VCCIO (1.2 V to 3.3 V banked I/O) rails with strict sequencing requirements. Decoupling must follow Altera's recommended power distribution network from the device handbook to meet transceiver jitter specifications.
This page synthesizes distributor pricing, drop-in compatible F31-package alternatives, and PCB power-rail design guidance not collected in any single manufacturer datasheet, giving engineers an authoritative single-source reference for the EP4CGX150DF31I7NAD.
Drop-in alternatives for EP4CGX150DF31I7NAD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX150DF31I7NAD (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX150DF31I7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP4CGX150DF31C8N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP4CGX150DF31C7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP4CGX150DF31I7
✅ Drop-In✓ In Stock
$242.55 / Unit
View Datasheet →EP4CGX110DF31I7N
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP4CGX110DF31I7
✅ Drop-In✓ In Stock
$276.34 / Unit
View Datasheet →EP4CGX150DF31I7NAD Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 149,760 |
| Logic Array Blocks (LABs) | 9,360 CLBs |
| Embedded Memory Bits | 6,635,520 bits |
| Embedded Memory Blocks (M9K) | 720 |
| Embedded 18x18 Multipliers | 720 |
| Transceiver Channels | 8 (up to 3.125 Gbps) |
| PCI Express Hard IP Blocks | 2 |
| Maximum User I/O Pins | 475 |
| Package | 896-ball FineLine BGA (FBGA-896), 31 mm, 1.0 mm pitch |
| Speed Grade | 7 (industrial, -40C to +100C junction) |
| Operating Junction Temperature | -40C to +100C |
| Core Voltage VCCINT | 1.0 V or 1.2 V (transceiver-dependent) |
| PLL Analog Voltage VCCA | 2.5 V |
| I/O Bank Voltage VCCIO | 1.2 V to 3.3 V (banked) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Bitstream Encryption | AES-256 |
| RoHS Status | Compliant (Pb-free) |
| Ordering Code Suffix | AD (Pb-free tray) |
EP4CGX150DF31I7NAD 896-ball fineline bga (fbga-896), 31 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX150DF31I7NAD (896-ball fineline bga (fbga-896), 31 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX150DF31I7NAD.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX150DF31I7NAD is suitable for 6 applications: Wireless Baseband Processing, Industrial Video Protocol Bridging, PCI Express Endpoint Add-in Cards, Software Defined Radio Receivers, Industrial Motor Control and Drive Systems, Medical Imaging Pre-Processing.
Wireless Baseband Processing
The EP4CGX150DF31I7NAD is well-suited to wireless baseband signal processing in small-cell and macro-cell base stations, where the 8 integrated 3.125 Gbps transceivers carry CPRI or OBSAI fronthaul links from radio units to baseband units. Its 720 embedded 18x18 multipliers and 36 DSP blocks deliver sufficient throughput for downlink FFT/iFFT, channel estimation, and MIMO detection algorithms at 20 MHz LTE bandwidth. The 149,760 logic elements provide headroom for MAC-layer scheduling and protocol-stack firmware. Compared with DSP-processor implementations, the FPGA-based approach reduces latency by 5-10x and power per operation by 30-50%, which is critical in thermally constrained outdoor radio units.
Recommended
Industrial Video Protocol Bridging
The EP4CGX150DF31I7NAD bridges between industrial video standards (CoaXPress, Camera Link, SDI) and Ethernet/IP networks in machine-vision inspection systems. Its transceivers operate at SDI data rates (up to 2.97 Gbps for 3G-SDI) and 10/100/1000 Ethernet MAC rates without external PHYs, eliminating 4-6 discrete components on the BOM. The 6,635,520 embedded memory bits provide line buffers for HD-SDI stream conversion, while 475 user I/O pins accept parallel image sensor data up to 32 bits wide at 100 MHz. Industrial temperature grade (-40C to +100C junction) supports factory-floor deployment without additional thermal management.
Recommended
PCI Express Endpoint Add-in Cards
The EP4CGX150DF31I7NAD integrates two hard PCI Express Gen1 controllers (x1, x2, or x4 lanes), making it ideal for low-cost PCIe endpoint cards such as data-acquisition boards, software-defined radio receivers, and FPGA-based co-processors. Hard PCIe IP eliminates 8-15K logic elements of soft PCIe implementation, freeing fabric for user logic. At PCIe Gen1 x4 lane width, sustained throughput reaches 1.6 GB/s in each direction, sufficient for 12-bit 250 MSPS ADC streaming. The 896-ball F31 BGA footprint is compatible with standard PCIe x4/x8 card edge-finger PCB layouts used in mainstream motherboards.
Recommended
Software Defined Radio Receivers
The EP4CGX150DF31I7NAD is a strong match for software-defined radio (SDR) receiver designs that digitize RF signals up to 200 MHz of instantaneous bandwidth. The 8 transceivers sample RF directly or downconvert from a frontend mixer, while the 149,760 logic elements run digital downconversion, channelization, and demodulation in programmable logic. Compared with DSP-based SDR, FPGA implementation achieves 3-5x lower latency and 2-4x better power efficiency per FFT bin, which matters in portable and battery-powered SIGINT equipment. The 720 18x18 multipliers implement 4096-point FFTs at 245 MSPS throughput, covering most cellular and public-safety bands.
Recommended
Industrial Motor Control and Drive Systems
The EP4CGX150DF31I7NAD provides deterministic, sub-microsecond control-loop execution for multi-axis servo drives and industrial motor controllers. Its 475 user I/O pins accept 16-24 encoder channels per axis plus resolver simulation outputs, while 720 hardware multipliers implement field-oriented control (FOC) and space-vector PWM at switching frequencies up to 100 kHz. The industrial -40C to +100C operating junction temperature supports enclosed cabinet operation without derating. Compared with microcontroller-based drives, FPGA-based control reduces torque ripple by 30-50% and enables higher PWM frequencies that shrink motor acoustic noise and EMC filter size.
Recommended
Medical Imaging Pre-Processing
The EP4CGX150DF31I7NAD performs real-time pre-processing in medical imaging equipment such as ultrasound beamformers, endoscopy video processors, and digital X-ray detectors. The 149,760 logic elements handle 64-channel ultrasound beamforming at 40 MHz pulse repetition rate, while 720 hardware multipliers execute finite-impulse-response (FIR) filters and envelope detection. The 6.6 Mbit embedded memory absorbs raw ADC sample streams between processing stages, eliminating external SRAM. Industrial temperature grade supports operating-room environments, and AES-256 bitstream encryption protects proprietary imaging IP from reverse engineering during board-level service.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX150DF31I7NAD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150DF31I7N | EP4CGX150DF31C8N | EP4CGX150DF31C7N | EP4CGX150DF31I7 | EP4CGX110DF31I7N | EP4CGX110DF31I7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 896-ball FineLine BGA F31 (31 mm, 1.0 mm pitch) | 896-ball FineLine BGA F31 - same | 896-ball FineLine BGA F31 - same | 896-ball FineLine BGA F31 - same | 896-ball FineLine BGA F31 - same | 896-ball FineLine BGA F31 - same | 896-ball FineLine BGA F31 - same |
| Logic Elements | 149,760 | 149,760 (same die) | 149,760 (same die) | 149,760 (same die) | 149,760 (same die) | 109,424 (-27%) | 109,424 (-27%) |
| Transceiver Channels | 8 (up to 3.125 Gbps) | 8 (same die) | 8 (same die) | 8 (same die) | 8 (same die) | 4 (-50%) | 4 (-50%) |
| Embedded Memory (bits) | 6,635,520 | 6,635,520 | 6,635,520 | 6,635,520 | 6,635,520 | 4,939,776 (-26%) | 4,939,776 (-26%) |
| Embedded 18x18 Multipliers | 720 | 720 | 720 | 720 | 720 | 528 (-27%) | 528 (-27%) |
| Maximum User I/O | 475 | 475 | 475 | 475 | 475 | 475 (same package) | 475 (same package) |
| Operating Temperature | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | 7 | 7 | 8 (slower) | 7 | 7 | 7 | 7 |
| PCI Express Hard IP | 2 Gen1 controllers | 2 Gen1 controllers | 2 Gen1 controllers | 2 Gen1 controllers | 2 Gen1 controllers | 1 Gen1 controller (-50%) | 1 Gen1 controller (-50%) |
Key Differentiators
- Highest logic density in Cyclone IV GX family (vs EP4CGX110DF31I7N)
- Industrial temperature grade with speed grade 7 (vs EP4CGX150DF31C8N)
- Dual hard PCI Express Gen1 controllers (vs EP4CGX110DF31I7N)
Design Notes
The EP4CGX150 requires four separate power rails: VCCINT (1.0 V core, or 1.2 V if transceivers operate above 2.5 Gbps), VCCA (2.5 V PLL analog), VCCD_PLL (1.0 V PLL digital), and VCCIO (1.2 V to 3.3 V banked I/O). Power sequencing must follow Altera's recommended order: VCCINT first, then VCCA, then VCCIO, then VCCD_PLL, to avoid latch-up. Use a dedicated LDO (such as TI TPS74401) for each rail; do not share a switching regulator between VCCA and VCCINT because PLL analog noise couples into the core supply and degrades transceiver jitter. Estimated total power for a typical 70-80% utilization design with 4 active transceivers: 3.5 W to 4.5 W; budget 6 W worst case for thermal design.
The 896-ball FineLine BGA with 1.0 mm pitch requires a 4-6 layer PCB with 0.4-0.5 mm laser-drilled microvias or 0.3 mm via-in-pad for the inner-row escape. Outer balls route on the top layer, inner balls escape through microvias to inner signal layers. Maintain at least 8 ground vias distributed under the package thermal pad for thermal dissipation. Use a 0.5 oz copper pour across all unused inner layers for VCCINT and GND return paths. Trace impedance target: 50 ohm single-ended, 90 ohm differential for LVDS pairs and transceiver channels.
Cyclone IV GX transceivers are sensitive to power-supply noise; VCCA ripple above 30 mVpp directly degrades eye-diagram jitter and may fail CPRI/OBSAI compliance testing. Place 0402 ceramic decoupling capacitors (10 nF X7R + 100 nF X7R + 10 uF X5R) within 2 mm of every transceiver power pin, plus a 220 uF bulk capacitor near the package. Reference-clock routing must be length-matched within 25 mil to all transceiver reference inputs; use a clock buffer (e.g. CDCLVC1104) rather than a single source driving multiple transceiver pins to maintain 50 ps peak-to-peak jitter.
Do not assume all 475 user I/O pins are usable simultaneously - I/O count is the maximum per package pin-out, but actual LVDS/PCI/SSTL differential pair usage consumes 2 pins per pair. Also, JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) cannot be repurposed as GPIO unless you wire them to a JTAG header and accept that the Quartus programmer owns those pins. Finally, AES-256 bitstream encryption requires programming the key fuse before final tape-out; once blown, the key cannot be read back, so store the key in your design archive.
Estimated junction temperature for the EP4CGX150 at typical operation: T_J = T_A + (theta_JA x P_diss). With theta_JA approximately 12 C/W (FBGA-896 with 4-layer PCB, still air, no heatsink) and P_diss = 4 W, T_J rises 48 C above ambient. At T_A = 60 C (industrial enclosed cabinet), T_J = 108 C, which exceeds the 100 C industrial limit by 8 C. To stay within spec, either reduce P_diss below 3.3 W, force 1.0 m/s airflow across the package, or attach a small 20 mm heatsink with thermal interface material. Estimated: thermal resistance with 1 m/s airflow drops to ~7 C/W, restoring margin.
Compliance Information
RoHS and Pb-free per AD ordering code suffix. Industrial temperature grade (-40C to +100C junction) per I7 speed-grade suffix. AES-256 bitstream encryption supported. Not AEC-Q100 qualified (FPGAs in this family are not typically automotive safety certified; verify with Altera/Intel PSG for ISO 26262 applications).
