EP4CGX22BF14C8 - Cyclone IV GX FPGA 21,280 LEs 169-LBGA | Intel
MPN: EP4CGX22BF14C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.5 | $13,750.00 |
| 1,000 | $24.2 | $24,200.00 |
EP4CGX22BF14C8 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic via a hardware description language such as Verilog or VHDL. Cyclone IV GX FPGAs sit in the hierarchy of: FPGA -> programmable logic -> digital IC -> semiconductor, and are positioned as a low-power, transceiver-equipped alternative to higher-end Stratix families. The 'GX' suffix denotes integrated high-speed serial transceivers, while 'IV' refers to the 60 nm node.
Key features of the EP4CGX22BF14C8 include 21,280 logic elements (LEs), 774,144 memory bits (RAM), 72 maximum user I/Os, and a 169-ball LBGA fine-pitch BGA package. The 'C8' speed grade indicates a mid-range Fmax of approximately 402 MHz for internal logic, while 'BF14' identifies the package and pinout. The device also supports up to two high-speed transceivers capable of multi-gigabit data rates, suitable for PCIe, GigE, or custom serial protocols.
Cyclone IV GX architecture uses 4-input look-up tables (LUTs), embedded M9K memory blocks, and dedicated 18x18 hardware multipliers for DSP. The integrated transceivers support multiple protocols, reducing bill-of-materials cost versus discrete SERDES solutions. The 60 nm process offers a favorable balance of static power, dynamic performance, and unit cost.
Typical applications include industrial control and HMI, low-cost PCIe endpoints, video processing and display bridges, motor drive interfaces, and communications line cards. Designers choose Cyclone IV GX when they need a few transceivers plus moderate logic density at the lowest unit cost in the Altera/Intel low-end FPGA portfolio.
Designers should note that the EP4CGX22BF14C8 is a commercial-temperature variant - the industrial-grade equivalent is EP4CGX22BF14I8. A version without integrated transceivers (Cyclone IV E) may be more cost-effective if SERDES is not required. A version without integrated transceivers (Cyclone IV E) may be more cost-effective if SERDES is not required.
This page synthesizes distributor pricing, drop-in equivalents, and practical design guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX22BF14C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX22BF14C8 (same form factor and footprint) — differing in Package, Transceivers, Process Technology, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX22BF14C7
✅ Drop-In✓ In Stock
$23.6 / Unit
View Datasheet →EP4CGX22BF14C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP4CGX22BF14I8
✅ Drop-In✓ In Stock
$41.3 / Unit
View Datasheet →EP4CGX22BF14C7N
✅ Drop-In✓ In Stock
$39.48 / Unit
View Datasheet →EP4CGX22BF14C6N
✅ Drop-In✓ In Stock
$42.14 / Unit
View Datasheet →EP4CGX22BF14C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 21,280 |
| Adaptive Logic Modules (ALMs) | 21280 |
| Embedded Memory | 756 kbit |
| Total RAM Bits | 774,144 |
| Number of I/Os | 72 |
| Supply Voltage (Core) | 1.2 V |
| Process Technology | 60 nm |
| Package | 169-LBGA (F14) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +70C (Commercial) |
| Speed Grade | C8 |
| Transceivers | Integrated (GX family) |
| RoHS Status | Compliant |
| Logic Cells / Logic Blocks | 47 |
EP4CGX22BF14C8 169-lbga (f14) Pin Configuration Guide
Pin configuration for EP4CGX22BF14C8 (169-lbga (f14) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX22BF14C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX22BF14C8 is suitable for 6 applications: Industrial Control & HMI, Low-Cost PCIe Endpoint, Video Processing & Display Bridge, Communications Line Card, Motor Drive Interface, Test & Measurement Equipment.
Industrial Control & HMI
The EP4CGX22BF14C8's combination of 21,280 logic elements and integrated transceivers fits industrial control boards that need deterministic parallel I/O plus serial backhaul. The 72 user I/Os support multi-channel encoder inputs, PWM outputs for motor drive interfaces, and HMI display signals. The commercial 0C to +70C range covers most factory-floor enclosures; use the EP4CGX22BF14I8 for outdoor cabinets. The integrated transceivers enable fieldbus gateways (PROFINET, EtherCAT) without external SERDES, reducing BOM cost.
Recommended
Low-Cost PCIe Endpoint
The EP4CGX22BF14C8 integrates PCIe hard IP and multi-gigabit transceivers in a 169-LBGA package, enabling cost-optimized PCIe Gen1/Gen2 endpoint designs for video capture cards, industrial I/O, and storage controllers. The 21k LEs handle protocol state machines, DMA engines, and user application logic. Designers save PCB area versus two-chip solutions (FPGA + external SERDES). The C8 speed grade delivers adequate throughput for Gen1 x1/x4 endpoints where latency is less critical than BOM cost.
Recommended
Video Processing & Display Bridge
With 756 kbits embedded RAM and 72 I/Os, the EP4CGX22BF14C8 serves as a video format converter or display bridge chip. It can accept parallel RGB/HDMI-style input, perform scaling/color-space conversion, and drive LVDS or DisplayPort outputs via its transceivers. The 60 nm process keeps dynamic power manageable for always-on retail signage and medical imaging panels. Designers use the embedded M9K memory blocks for line buffers, eliminating external SRAM.
Recommended
Communications Line Card
The integrated transceivers of the EP4CGX22BF14C8 support CPRI, OBSAI, and custom serial links for small-cell base stations, microwave backhaul, and fiber-optic line cards. The 21k LEs handle PHY-layer glue logic, framer/mapper functions, and control-plane soft cores (Nios II). The 169-LBGA package fits small form-factor line cards where PCB area is at a premium. Power consumption remains under 1.5 W typical, suitable for thermally constrained sealed enclosures.
Recommended
Motor Drive Interface
The EP4CGX22BF14C8 supports encoder feedback (QEP, SSI, EnDat), PWM generation for multi-axis drives, and fieldbus connectivity (EtherCAT, CAN, RS-485) through its transceivers and 72 I/Os. Designers implement torque/speed control loops and safety state machines in the 21k LEs. The commercial temperature range covers most industrial enclosures; the EP4CGX22BF14I8 industrial variant supports outdoor drive cabinets. Embedded hardware multipliers accelerate Park/Clarke transforms for vector control.
Recommended
Test & Measurement Equipment
The EP4CGX22BF14C8's mix of transceivers, parallel I/O, and moderate logic density suits bench-top instruments: logic analyzers, protocol testers, and data-acquisition front-ends. Engineers implement custom trigger logic, pattern generation, and statistics counters in the 21k LEs. The integrated SERDES handles USB 3.0 PHY bridging or 10G Ethernet test ports. JTAG-based debugging via Quartus Prime simplifies bring-up of prototype instruments. Embedded RAM serves as deep sample memory.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX22BF14C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX22BF14C7 | EP4CGX22BF14C8N | EP4CGX22BF14I8 | EP4CGX22BF14C7N | EP4CGX22BF14C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LBGA (F14) | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 |
| Embedded Memory | 756 kbit | 756 kbit | 756 kbit | 756 kbit | 756 kbit | 756 kbit |
| Speed Grade | C8 | C7 (faster) | C8 (same) | I8 (industrial) | C7 (faster) | C6 (slower) |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | -40C to +85C (Industrial) | 0C to +70C | 0C to +70C |
| Lead-Free / RoHS | Standard (non-N) | Standard | Lead-free (N suffix) | Standard | Lead-free (N suffix) | Lead-free (N suffix) |
| Unit Price (1-piece) | $38.50 | $42.00 (faster grade) | $39.50 | $48.00 (industrial) | $43.50 | $36.00 (slower grade) |
Key Differentiators
- C8 speed grade offers balanced performance-cost (vs EP4CGX22BF14C7)
- Commercial temperature range fits indoor enclosures (vs EP4CGX22BF14I8)
- Integrated transceivers eliminate external SERDES (vs EP4CE40F23C8N (Cyclone IV E))
Design Notes
Estimated: The Cyclone IV GX EP4CGX22BF14C8 draws approximately 1.0-1.5 W typical core power at 100 MHz with moderate toggle rates. Add 0.3-0.5 W per active transceiver channel. Designers should budget a 2 A regulator for VCCINT (1.2 V) and 1.5 A for VCCAUX (2.5 V) plus per-bank VCCIO rails. Decoupling follows Intel's reference design: 0.1 uF X7R per power pin plus 10 uF bulk caps every 4-6 pins.
The 169-ball LBGA F14 package uses 1.0 mm ball pitch with full-array BGA layout. Per Intel Cyclone IV GX layout guidelines, route all signals on inner layers with microvia-in-pad for breakout. Maintain 50 ohm controlled impedance for high-speed transceiver traces and clock inputs. Provide at least 4 ground vias per signal via for the breakout region to maintain reference plane continuity.
The integrated transceivers require AC-coupling capacitors on each TX/RX serial pin (typically 100 nF X7R). Match differential pair lengths to within 150 mil for PCIe Gen1, 75 mil for Gen2. Use Intel's Quartus Prime transceiver toolkit to characterize eye diagrams and tune pre-emphasis/equalization. Reference the Cyclone IV GX Transceiver User Guide for PCB stackup recommendations (typically 6-8 layer with stripline for longest routes).
Common pitfalls include: (1) forgetting MSL3/4 handling for the LBGA package - bake at 125C for 24 hours before assembly if exposed to ambient >30% RH for >8 hours; (2) confusing the 'C' temperature prefix (commercial 0C to +70C) with the 'I' industrial prefix; (3) not populating all VCC pins - Intel requires all VCCINT and VCCAUX pins be connected even if unused internally. Always run full pinout verification against the F14 package symbol in Quartus.
Compliance Information
Standard EP4CGX22BF14C8 is RoHS compliant per Intel product page. Lead-free / halogen-free variants available with N suffix (e.g. EP4CGX22BF14C8N). AEC-Q100 not applicable - FPGAs not typically qualified for automotive unless explicitly listed.
