Intel

EP4CGX22CF19C8 - Cyclone IV GX FPGA, 21K LEs, 324-FBGA | Intel

MPN: EP4CGX22CF19C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 324-ball FBGA, 1.0 mm pitch Package C8 (commercial) Speed 774,144 Memory
From $26.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $42.5 $42.50
10 $39.1 $391.00
100 $34.85 $3,485.00
500 $30.2 $15,100.00
1,000 $26.75 $26,750.00
ℹ️ All prices are in USD

EP4CGX22CF19C8 Overview

The Intel (formerly Altera) EP4CGX22CF19C8 is a Cyclone IV GX field-programmable gate array (FPGA) with 21,280 logic elements, 774,144 bits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 324-ball FineLine BGA package at the commercial 0°C to 85°C temperature grade. Built on a low-power 60 nm process, this FPGA targets cost-sensitive applications that still require high-speed serial I/O and moderate logic density.

A Cyclone IV GX FPGA is a reprogrammable logic device belonging to the programmable-logic family, sitting hierarchically below ASICs and above fixed-function ASSPs in the design flexibility spectrum. The GX sub-series adds dedicated multi-gigabit transceivers that differentiate it from the standard Cyclone IV E family, allowing direct interfacing with PCIe Gen1, Gigabit Ethernet, Serial RapidIO, CPRI, and other high-speed serial protocols without external PHY devices. This combination of programmable fabric, embedded memory blocks, DSP blocks, and integrated transceivers in a single low-power chip makes Cyclone IV GX a common choice for bridging, protocol conversion, and I/O expansion designs.

Key features include 21,280 logic elements (LEs), 774 Kbits of embedded RAM (M9K blocks), 80 embedded 18x18 multipliers for DSP operations, two PLL blocks per quadrant for clock management, and a maximum of 150 general-purpose user I/O pins. The device also integrates PCI Express hard IP blocks and up to eight full-duplex transceiver channels supporting data rates from 600 Mbps up to 3.125 Gbps. Configuration is supported via JTAG, active serial (AS), passive serial (PS), and fast passive parallel (FPP) modes through dedicated configuration pins.

The 324-ball FBGA package uses a 1.0 mm ball pitch, providing a compact footprint for space-constrained boards while supporting up to 150 user I/Os. The -C8 speed grade denotes a commercial temperature range with the 8-corner speed bin, balanced for medium-speed designs. Quartus II design software (or the maintained Intel Quartus Prime Lite edition) is used for synthesis, place-and-route, and bitstream generation.

Typical applications include PCI Express endpoint cards, industrial video bridges, low-cost serial protocol converters, motor control pre-processing, and base-station fronthaul interfaces where the integrated transceivers eliminate the need for a separate PHY chip.

Designers should pay attention to transceiver reference-clock routing and power-rail sequencing for the analog supply (VCCA), because jitter on the reference clock directly limits transceiver eye-diagram performance at 3.125 Gbps.

This page synthesizes distributor stock, drop-in alternatives from the same Cyclone IV GX family, and practical design notes that are not duplicated on the manufacturer product page.

Drop-in alternatives for EP4CGX22CF19C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX22CF19C8 (same form factor and footprint) — differing in Package, Transceivers, Operating Temperature, PLLs, Process Technology.

Altera
Package: 169-ball FBGA (FineLine BGA, F19)
Operating Temperature: Commercial (0C to +85C) - C6 speed grade
Process Technology: 60 nm low-power CMOS
Compare with EP4CGX22CF19C8 →
Intel
Package: 324-ball FBGA (F19), 19x19 mm, 1.0 mm pitch
Transceivers: Integrated 3.125 Gbps transceivers
PLLs: Up to 4
Compare with EP4CGX22CF19C8 →
Intel
Package: FBGA-324 (F19) 19 x 19 mm, 1.0 mm pitch
Transceivers: 2 x 3.125 Gbps
Operating Temperature: Commercial (0C to +85C)
Compare with EP4CGX22CF19C8 →
Altera
Package: 324-LBGA (F19) 19x19 mm, 1.0 mm pitch
Operating Temperature: 0C to +85C (commercial 'C8' speed grade)
PLLs: 4
Compare with EP4CGX22CF19C8 →
Intel
Package: 324-FBGA (FineLine BGA)
Transceivers: Up to 2 channels at 3.125 Gbps
PLLs: 4 general-purpose PLLs
Compare with EP4CGX22CF19C8 →
Intel
Transceivers: Yes, 3.125 Gbps multi-gigabit transceivers
Process Technology: 60 nm low-power CMOS
Compare with EP4CGX22CF19C8 →
Intel
Package: 324-FBGA (FineLine BGA), 19 mm body
Transceivers: Up to 8 channels @ 3.125 Gbps
Operating Temperature: -40C to +100C (TJ)
Compare with EP4CGX22CF19C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX22CF19C8N

✅ Drop-In
Altera
📦 324-ball FBGA (F19, 1.0mm pitch)
Cyclone IV GX · 21,280 · 1,330 · 774,144 bits · M9K blocks, 36 total · 36 · 150 · Up to 4 (600 Mbps to 2.5 Gbps)

✓ In Stock

$32.45 / Unit

View Datasheet →

EP4CGX22CF19C7N

✅ Drop-In
Intel
📦 324-ball FBGA (F19, 1.0mm pitch)
Cyclone IV GX · 21,280 · 1,330 · 774,144 bits · 66 · 150 · 4 · 2 x 3.125 Gbps

✓ In Stock

$53.1 / Unit

View Datasheet →

EP4CGX22IF19C8N

✅ Drop-In
📦 324-ball FBGA (F19, 1.0mm pitch)
identical die and F19 package, industrial temperature grade (-40C to 100C junction) instead of commercial 0C to 85C

📋 Reference alternative (not in catalog)

EP4CGX22CF19C6N

✅ Drop-In
Intel
📦 324-ball FBGA (F19, 1.0mm pitch)
Cyclone IV GX · 21,280 · 1,330 · 774 Kbits · Up to 66 · 150 · Integrated 3.125 Gbps transceivers · Up to 4

✓ In Stock

$31.95 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP4CGX22CF19C8 Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Logic Elements 21,280
Embedded Memory (bits) 774,144
Number of M9K Memory Blocks 66
Embedded 18x18 Multipliers 80
General-Purpose PLLs 2
Maximum User I/O Pins 150
Transceiver Channels Up to 4 full-duplex (varies by package)
Maximum Transceiver Data Rate 3.125 Gbps
Process Technology 60 nm low-power
Core Supply Voltage 1.2 V
Package 324-ball FBGA, 1.0 mm pitch
Speed Grade C8 (commercial)
Operating Temperature (junction) 0°C to 85°C (commercial)
Configuration Modes JTAG, AS, PS, FPP
RoHS Status Compliant

EP4CGX22CF19C8 324-ball fbga, 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP4CGX22CF19C8 (324-ball fbga, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

324-ball fbga, 1.0 mm pitch package pinout diagram for EP4CGX22CF19C8

No detailed pinout data available for EP4CGX22CF19C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX22CF19C8 is suitable for 6 applications: PCI Express Endpoint Cards, Gigabit Ethernet Bridging, Industrial Video Format Conversion, Motor Control Pre-Processing (FOC), Serial Protocol Converters / CPRI Fronthaul, Low-Cost ASIC Prototyping / I/O Expansion.

🖥️

PCI Express Endpoint Cards

The EP4CGX22CF19C8's integrated PCI Express hard IP block supports x1 Gen1 endpoint operation at 2.5 Gbps per lane, eliminating the need for an external PHY. With 21,280 logic elements, 774 Kbits of embedded RAM, and 80 DSP multipliers, the device comfortably fits protocol state machines, scatter-gather DMA engines, and application logic for low-cost PCIe add-in cards used in industrial PCs, test instruments, and data-acquisition boards. Designers typically pair it with a small external clock buffer for the 100 MHz PCIe reference and place the FBGA close to the board edge connector to minimize lane length.

🌐

Gigabit Ethernet Bridging

The EP4CGX22CF19C8 supports 1000BASE-X Gigabit Ethernet over its 3.125 Gbps transceivers using SGMII or 1000BASE-X PCS implementations in fabric logic. With 150 user I/Os the FPGA can expose multiple GMII/RGMII/SGMII interfaces plus management-plane I2C and MDIO, acting as a multi-port Ethernet bridge in industrial gateways and small-cell backhaul. Designers typically instantiate a soft Tri-Mode Ethernet MAC core from Intel and pair the device with an external 125 MHz reference clock for the PHY-side interface.

🎥

Industrial Video Format Conversion

The EP4CGX22CF19C8's 80 DSP multipliers handle real-time chroma resampling, scaling, and color-space conversion between Camera Link, DVI/HDMI, and SDI video formats. Embedded M9K memory buffers line-store data for horizontal scaling, while the abundant user I/Os interface to external video ADCs/DACs and LVDS serializers. The commercial temperature grade suits indoor industrial cameras and video walls; for outdoor broadcast equipment, designers move to the industrial-grade 'I' variant of the same die.

🏭

Motor Control Pre-Processing (FOC)

Field-oriented control of three-phase motors requires Park/Clarke transforms, PI controllers, and space-vector PWM generation, all of which fit within 21,280 logic elements. The EP4CGX22CF19C8's 80 18x18 multipliers accelerate Park/Clarke math and current-loop PI computation at switching frequencies up to 100 kHz. The 774 Kbits of embedded RAM store sinusoidal lookup tables and per-axis calibration constants. Designers pair the FPGA with external gate drivers and ADCs, using the FPGA's high-speed LVDS I/Os to sample current shunts at sub-microsecond resolution.

✈️

Serial Protocol Converters / CPRI Fronthaul

The integrated transceivers make the EP4CGX22CF19C8 a natural fit for CPRI, OBSAI, or Serial RapidIO base-station fronthaul interfaces operating at 614.4 Mbps to 3.072 Gbps. Logic resources handle the MAC-layer framing, scrambling/descrambling, and timing adjustments. The 324-ball F19 package allows up to four full-duplex transceiver channels plus 150 LVCMOS/LVDS user I/Os for backplane connections. Designers typically run the analog supply (VCCA) and PLL supply from low-noise LDO regulators to minimize jitter on the recovered clock.

🔧

Low-Cost ASIC Prototyping / I/O Expansion

Designers using the EP4CGX22CF19C8 as an ASIC prototype benefit from the 21,280 logic elements, which approximate small-to-medium ASIC gate counts, and from the embedded transceivers that map directly to common ASIC SerDes macros. The device is also widely deployed as a general-purpose I/O expander and level shifter on legacy industrial backplanes, using its 150 user I/Os to bridge 3.3 V logic to 1.8 V or 5 V domains. Quartus II's incremental compilation allows fast iterative debug during prototype bring-up.

What is the logic element count and embedded memory of EP4CGX22CF19C8?
The EP4CGX22CF19C8 contains 21,280 logic elements (LEs) and 774,144 bits (774 Kbits) of embedded SRAM organized into 66 M9K blocks. According to the Cyclone IV GX device family datasheet, this places the EP4CGX22 in the lower-density tier of the family, suitable for I/O expansion, protocol bridging, and cost-sensitive applications that do not require the largest Cyclone IV GX devices.
What transceiver data rates does EP4CGX22CF19C8 support?
The EP4CGX22CF19C8 supports multi-gigabit transceiver (MGT) data rates from 600 Mbps up to 3.125 Gbps per channel, depending on package variant and protocol. This covers PCI Express Gen1 (2.5 Gbps), Gigabit Ethernet (1.25 Gbps), Serial RapidIO, CPRI, and other common serial standards without requiring an external PHY chip.
What is the operating temperature range of EP4CGX22CF19C8?
The EP4CGX22CF19C8 uses the commercial temperature grade, with junction temperature rated from 0°C to 85°C. For industrial (–40°C to 100°C junction) operation, the same die is offered with an 'I' prefix such as EP4CGX22IF19C8; this part should not be substituted into industrial designs without re-qualifying the temperature range.
How many user I/O pins does EP4CGX22CF19C8 provide?
The EP4CGX22CF19C8 provides a maximum of 150 general-purpose user I/O pins in its 324-ball FBGA package. The exact number depends on how many balls are reserved for power, ground, configuration, and transceiver channels; the Quartus II pin planner reports the user-usable I/O count for a chosen configuration scheme.
What package and ball pitch does EP4CGX22CF19C8 use?
The EP4CGX22CF19C8 ships in a 324-ball FineLine BGA (FBGA) package with a 1.0 mm ball pitch and approximately 19 mm body size (F19 designation). This package balances user I/O count with board-routing density and is widely supported by low-cost multilayer PCB fabrication houses.
Where can I buy EP4CGX22CF19C8 and what is the typical price?
The EP4CGX22CF19C8 is stocked in small quantities at major distributors including DigiKey, Mouser, and Octopart-listed resellers. As of 2026-09-10, the unit price at qty 1 is approximately $42.50, dropping to around $26.75 at qty 1000. Lead time is typically 8-12 weeks from the factory for production volumes, with distributor shelf stock available for prototype builds.
Is EP4CGX22CF19C8 in stock at major distributors?
Stock at major distributors for the EP4CGX22CF19C8 is limited and varies week to week; DigiKey historically lists small reel/tray quantities, while Mouser typically shows quote-based availability. As of 2026-09-10, XAIPART lists this part as back-order, with confirmed lead time of 10-14 weeks from Intel for production orders.
What is the lead time for EP4CGX22CF19C8 orders?
As of 2026-09-10, distributor shelf-stock lead time for EP4CGX22CF19C8 is 3-7 business days when available, while factory-direct production orders from Intel quote 10-14 weeks. Long-term supply is supported by Intel's product longevity program for Cyclone IV devices, but designers should plan for periodic distributor stock-outs.
EP4CGX22CF19C8 vs EP4CGX22BF14C8N - which should I choose?
The EP4CGX22CF19C8 uses the 324-ball FBGA (F19) package and supports 3.125 Gbps transceivers, while the EP4CGX22BF14C8N uses the smaller 169-ball FBGA (F14) package with fewer transceiver channels and a smaller I/O count. Choose CF19C8 when you need the maximum I/O and full transceiver count; choose BF14C8N when your design fits within 100 I/Os and you want a smaller board footprint.
EP4CGX22CF19C8 vs EP4CE22F19C8 - which is better for protocol bridging?
The EP4CGX22CF19C8 includes integrated 3.125 Gbps transceivers, whereas the EP4CE22F19C8 (Cyclone IV E) has no transceivers and relies on external PHYs for any high-speed serial work. For PCIe, Gigabit Ethernet, or Serial RapidIO bridging, the GX variant is the correct choice because the E variant would require additional PHY chips, increasing BOM cost and PCB area.
When should I choose EP4CGX22CF19C8 over the larger EP4CGX50 or EP4CGX75?
Choose EP4CGX22CF19C8 when your logic utilization stays below approximately 18,000 LEs and your memory and DSP requirements fit within 21,280 LEs / 774 Kbits / 80 multipliers. Step up to EP4CGX50CF23C8 or EP4CGX75CF23C8 only if Quartus II fitter reports routing congestion or if you need the additional transceivers, PLLs, and I/O that larger package variants provide.
Is EP4CGX22CF19C8 suitable for industrial motor control?
Yes, the EP4CGX22CF19C8 is widely used in industrial motor control pre-processing and encoder-interface designs. The 80 embedded 18x18 multipliers handle field-oriented control (FOC) math, while 774 Kbits of embedded RAM buffers current and position samples. Note however that this part is commercial temperature grade (0°C to 85°C); for industrial cabinets with extended thermal range, choose the 'I' grade variant.
What is the best drop-in replacement for EP4CGX22CF19C8?
The best drop-in replacement for EP4CGX22CF19C8 in the same 324-ball F19 package is EP4CGX22CF19C8N (lead-free reflow-compatible variant of the same die). For higher speed, EP4CGX22CF19C7N offers a faster speed grade (C7) in the identical footprint; for industrial temperature, EP4CGX22IF19C8N is the same die and package rated for –40°C to 100°C junction.
Where can I download the EP4CGX22CF19C8 datasheet PDF?
The EP4CGX22CF19C8 datasheet is part of the Cyclone IV GX Device Handbook (document c4gx_51008) published by Intel (formerly Altera). The official PDF can be downloaded from the Altera/Intel website at the Cyclone IV GX documentation page; the XAIPART product page also provides a direct datasheet link and the per-pin pinout CSV extracted from Quartus II pin planner files.
Where do I find the EP4CGX22CF19C8 pinout?
The pinout for EP4CGX22CF19C8 is documented in the Cyclone IV GX Device Handbook, Chapter 9 (Pin Connection Guidelines) and in the per-package pin-out tables (F19 variant). The Intel Quartus II pin-planner CSV file generated for the F19 package is the most engineer-friendly source, listing each ball's function (user I/O bank, transceiver channel, power, ground, or configuration).
What are the key specifications of EP4CGX22CF19C8 that engineers should know?
Key specs of EP4CGX22CF19C8 are: 21,280 logic elements, 774,144 bits of embedded RAM, 80 18x18 multipliers, 2 PLLs per quadrant, 150 maximum user I/Os, 324-ball FBGA package, 1.2 V core supply, 3.125 Gbps transceivers, 0°C to 85°C commercial junction temperature, and C8 speed grade. The combination of moderate logic density with integrated transceivers distinguishes this FPGA from non-transceiver Cyclone IV E devices.

Engineering reference data for EP4CGX22CF19C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CGX22CF19C8 when your design needs 3.125 Gbps transceivers (PCIe Gen1, GbE, Serial RapidIO, CPRI) plus moderate logic density in the 18K-20K LE range, and your target environment is a commercial-temperature indoor product. Drop in EP4CGX22CF19C8N if you need Pb-free reflow compatibility but otherwise identical specs. Upgrade to EP4CGX22CF19C7N if Quartus II timing closure fails on critical paths - the C7 speed grade gives ~10% extra timing margin at no extra cost. Switch to EP4CGX22IF19C8N if the board will see industrial or outdoor temperatures (cabinet, automotive, base station). Avoid EP4CGX22BF14C8N unless your design genuinely fits within 100 I/Os - that variant shares the same logic count but uses the smaller 169-ball F14 package with fewer transceivers, requiring PCB redesign.

Comparison with Alternatives

Parameter This Product EP4CGX22CF19C8N EP4CGX22CF19C7N EP4CGX22IF19C8N EP4CGX22CF19C6N EP4CGX22BF14C8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 324-ball FBGA (F19, 1.0mm) 324-ball FBGA (F19, 1.0mm) 324-ball FBGA (F19, 1.0mm) 324-ball FBGA (F19, 1.0mm) 324-ball FBGA (F19, 1.0mm) 169-ball FBGA (F14, 1.0mm)
Logic Elements 21,280 21,280 21,280 21,280 21,280 21,280
Embedded Memory (bits) 774,144 774,144 774,144 774,144 774,144 774,144
Embedded 18x18 Multipliers 80 80 80 80 80 80
Maximum User I/Os 150 150 150 150 150 Up to 72 (F14 package)
Transceiver Data Rate (max) 3.125 Gbps 3.125 Gbps 3.125 Gbps 3.125 Gbps 3.125 Gbps 3.125 Gbps (fewer channels)
Speed Grade C8 C8 C7 (faster) C8 C6 (slower) C8
Temperature Grade Commercial (0C to 85C) Commercial (0C to 85C) Commercial (0C to 85C) Industrial (-40C to 100C) Commercial (0C to 85C) Commercial (0C to 85C)

Key Differentiators

  • Integrated 3.125 Gbps transceivers at low LE count (vs EP4CE22F19C8N (Cyclone IV E))
  • Faster speed grade available in same package (vs EP4CGX22CF19C8N (same C8 speed grade, Pb-free variant))
  • Industrial temperature option with identical pinout (vs EP4CGX22CF19C8N (commercial 0C to 85C))

Design Notes

Estimated: the EP4CGX22CF19C8 requires at least three separate supply rails - core VCCINT (1.2 V), I/O VCCIO (1.2 V to 3.3 V depending on bank), analog VCCA (2.5 V) for the transceiver PLLs, and VCCD_PLL (1.2 V) for the digital PLL blocks. Designers must sequence VCCINT before VCCIO per the Cyclone IV GX device handbook power-on sequencing guidelines; failure to sequence correctly can trigger high inrush current and latch-up. Use a dedicated LDO such as an LT3080 for VCCA to minimize jitter on the recovered transceiver clock.

Transceiver channels must be routed as 100 ohm differential pairs with length matching better than 150 mils within a channel and better than 1500 mils between channels for the F19 package. The reference clock pair has even tighter matching tolerance. The FBGA escape routing requires microvia or via-in-pad technology on the top layer; the 1.0 mm ball pitch is at the practical limit of standard 4-mil trace-and-space outer-layer PCB fabrication.

A common mistake is choosing the Cyclone IV E (EP4CE22) instead of Cyclone IV GX (EP4CGX22) because the logic-element counts look identical on paper. The E variant has no multi-gigabit transceivers; designs that require PCIe, Gigabit Ethernet, Serial RapidIO, or any 600 Mbps+ serial protocol will not work without adding an external PHY chip. Always confirm the GX designation when transceivers are required.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance per Intel product declaration for Cyclone IV GX family. AEC-Q100 not applicable (this is commercial grade, not automotive qualified). Lead-free (Pb-free) reflow-compatible per JEDEC J-STD-020 MSL3 profile at 260C peak.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CGX22CF19C8 EP4CGX22CF19C8N EP4CGX22CF19C7N EP4CGX22IF19C8N Cyclone IV GX FPGA field-programmable gate array logic element M9K memory block 18x18 multiplier PLL PCI Express Gen1 Gigabit Ethernet Serial RapidIO CPRI FBGA BGA 1.0 mm ball pitch 3.125 Gbps transceiver 60 nm process Quartus II RoHS J-STD-020 MSL3 JTAG
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