EP4CGX22CF19C6N - Cyclone IV GX FPGA, 22K LEs, 324-FBGA | Intel
MPN: EP4CGX22CF19C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $44.2 | $442.00 |
| 100 | $39.8 | $3,980.00 |
| 500 | $35.4 | $17,700.00 |
| 1,000 | $31.95 | $31,950.00 |
EP4CGX22CF19C6N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC (semiconductor) that allows designers to implement arbitrary digital logic, memory, and DSP functions through a configuration bitstream. FPGAs sit hierarchically above standard logic ICs and below ASICs in the digital design hierarchy, offering rapid prototyping, in-field reprogrammability, and parallel processing capabilities. The Cyclone IV GX family in particular adds integrated transceivers, bridging the gap between pure-logic FPGAs and high-end transceiver-equipped families used in communications, industrial, and test equipment.
Key features of the EP4CGX22CF19C6N include up to 150 user I/O pins, up to 66 (9x6) 18x18 multipliers, embedded memory blocks totaling 774 Kbits, configuration via JTAG or serial/parallel flash, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The integrated transceivers support CPRI, OBSAI, PCIe Gen1, Serial RapidIO, and Gigabit Ethernet protocols, enabling protocol-bridged backplane and line-card designs.
Technically, the device uses a 4-input lookup table (LUT) architecture combined with dedicated routing, with embedded RAM blocks configurable as single-port RAM, dual-port RAM, FIFO, or ROM. Hard IP blocks include PLLs for clock synthesis, DLLs for precise timing, and the transceiver physical layer. The Quartus II (and current Quartus Prime) tool chain provides synthesis, place-and-route, timing analysis, and simulation support, with extensive IP libraries for DDR memory controllers, Ethernet MACs, and DSP blocks.
Typical applications include industrial motor control, video surveillance with on-chip image preprocessing, low-cost wireless backhaul baseband, test and measurement equipment, PCIe endpoint cards, and serial RapidIO bridges. The combination of integrated transceivers and 22K logic elements strikes a useful balance between logic density and cost for embedded designs.
When designing with this device, plan I/O bank assignment carefully, as each bank shares a VCCIO supply and supports a defined I/O standard set. Use the Quartus PowerPlay power analyzer for accurate thermal estimation, and follow the F19 package layout guidelines for escape routing and decoupling. The exposed die pad (ePAD) must be soldered to a grounded thermal pad for proper operation.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX22CF19C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX22CF19C6N (same form factor and footprint) — differing in Package, Transceivers, Operating Temperature, Process Technology, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP4CGX22CF19C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 21,280 |
| Logic Array Blocks (LABs) | 1,330 |
| Embedded Memory (M9K blocks) | 774 Kbits |
| Embedded Multipliers (18x18) | Up to 66 |
| User I/O Pins | 150 |
| Transceivers | Integrated 3.125 Gbps transceivers |
| PLLs | Up to 4 |
| Process Technology | 60 nm low-power |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Package | 324-ball FBGA (F19), 19x19 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (C6 suffix) |
| Configuration Method | JTAG / Serial / Parallel flash |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-Free / Compliant |
EP4CGX22CF19C6N 324-ball fbga (f19), 19x19 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX22CF19C6N (324-ball fbga (f19), 19x19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX22CF19C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX22CF19C6N is suitable for 6 applications: Industrial Motor Control, PCIe Endpoint Card / Industrial PC, Video Surveillance and Image Preprocessing, Wireless Backhaul Baseband, Test and Measurement Equipment, Serial RapidIO Bridge / Embedded Backplane.
Industrial Motor Control
The EP4CGX22CF19C6N suits industrial motor control designs where its 21,280 logic elements and 66 embedded 18x18 multipliers handle field-oriented control (FOC) algorithms, PWM generation, and encoder feedback processing. The integrated 3.125 Gbps transceivers allow the drive to communicate with networked controllers via SERCOS III, EtherCAT-over-fiber, or proprietary serial protocols. With 774 Kbits of M9K memory it stores sine/cosine tables and current-loop coefficients on-chip, while the four PLLs synthesize motor PWM frequencies from a single low-frequency crystal. The 324-FBGA package gives sufficient I/O for multi-axis drives with parallel encoder inputs.
Recommended
PCIe Endpoint Card / Industrial PC
The EP4CGX22CF19C6N implements a PCIe Gen1 x1 endpoint with integrated hard IP, eliminating external PHY components and reducing BOM cost. The 22K logic elements fit lightweight protocol bridges between PCIe and local buses (SPI, I2C, parallel GPIOs) common in industrial I/O cards. With 150 user I/Os the device exposes enough LVDS/CMOS pins for expansion headers, and the 774 Kbits of M9K memory buffers PCIe transactions locally. Quartus Prime provides the PCIe hard IP block reference design that fits comfortably within 22K LEs and the four PLLs derive reference clocks from the 100 MHz PCIe clock.
Recommended
Video Surveillance and Image Preprocessing
In video surveillance systems, the EP4CGX22CF19C6N handles on-sensor preprocessing (noise reduction, edge detection, motion detection) before passing compressed frames to a host SoC. Its 66 multipliers perform 8-bit convolution kernels at video rates, while the 150 user I/Os interface to MIPI-CSI, BT.656, or LVDS image sensors. Embedded M9K blocks store line buffers for temporal noise reduction, and the four PLLs generate pixel clocks from a single 27 MHz reference. The integrated transceivers stream processed video to a host SoC over GigE Vision or to multiple cameras via CPRI at 3.072 Gbps.
Recommended
Wireless Backhaul Baseband
For wireless backhaul baseband processing, the EP4CGX22CF19C6N's integrated transceivers carry digitized IF signals to/from RF front-ends, while 22K logic elements implement channel filtering, equalization, and FEC coding. The four PLLs derive multiple sample clocks from a single OCXO reference, and 774 Kbits of M9K memory buffer IQ sample streams. Its commercial temperature grade suits indoor/outdoor sealed enclosures with thermal management, and the 324-FBGA package allows compact board layouts that fit in standard outdoor-radio housings.
Recommended
Test and Measurement Equipment
Test and measurement instruments leverage the EP4CGX22CF19C6N's combination of DSP-rich logic (66 multipliers), ample I/O (150 pins), and serial connectivity (3.125 Gbps transceivers). Logic analyzer pods, protocol exercisers, and arbitrary waveform generators use the 22K logic elements for sample storage addressing, while multipliers implement real-time DSP like FFTs or filters. Embedded M9K blocks hold waveform lookup tables and trigger buffers, and transceivers interface to high-speed serial buses like PCIe, USB 3.0, or Aurora for host links. The 1.2 V low-power process keeps total board power budget reasonable for portable instruments.
Recommended
Serial RapidIO Bridge / Embedded Backplane
In embedded backplane designs using Serial RapidIO, the EP4CGX22CF19C6N bridges between the backplane serial links and local parallel buses. The integrated transceivers implement SRIO physical layer at 3.125 Gbps per lane, and the 22K logic elements handle transport-layer logic, message routing, and protocol conversion. With 150 user I/Os it connects to multiple local microcontrollers, DSPs, or FPGAs, and 774 Kbits of M9K memory buffers packet payloads. The 324-FBGA package supports the dense board layouts required for VPX or ATCA backplane cards.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX22CF19C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX22CF19C7N | EP4CGX22CF19C8N | EP4CGX22BF14C8N | EP4CGX22BF14C7N |
|---|---|---|---|---|---|
| Package | 324-FBGA (F19), 19x19 mm, 1.0 mm pitch | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 |
| Embedded Memory | 774 Kbits (M9K) | 774 Kbits | 774 Kbits | 774 Kbits | 774 Kbits |
| Transceivers | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps, B variant) | Yes (3.125 Gbps, B variant) |
| User I/O | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | C6 (commercial) | C7 (faster) | C8 (slower) | C8 | C7 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Mid-density Cyclone IV GX with integrated 3.125 Gbps transceivers (vs EP4CE22F17C6N (Cyclone IV E, no transceivers))
- C6 speed grade balances performance and yield cost (vs EP4CGX22CF19C7N (C7 speed grade))
- F19 324-FBGA package balances I/O count and PCB complexity (vs EP4CGX22BF14 series (also F19 324-FBGA))
Design Notes
Estimated: At typical industrial toggle rate (12.5%) and 50 MHz core clock, EP4CGX22CF19C6N consumes 1.0-2.5 W total. Use Quartus PowerPlay for project-specific figures. Each VCCINT/VCCIO/VCCA/VCCD_PLL rail must have a 0.1 uF decoupling cap within 100 mil of every ball, plus bulk caps on each supply island. PCIe transceiver channels, when active at 3.125 Gbps, can add 200-300 mW per lane.
The F19 FBGA package has a thermal resistance (theta-JA) of approximately 12-14 C/W with a properly soldered exposed pad. Estimated: At 2 W total power dissipation, junction-to-ambient temperature rise is 24-28 C, so adequate airflow or a heatsink is required for designs approaching commercial temperature limit (70 C ambient). Use thermal vias under the ePAD and avoid covering the package with insulator.
Escape routing from the F19 324-FBGA with 1.0 mm pitch requires 0.15 mm trace width and 0.20 mm via pad diameter on the top layer. Use laser-drilled micro vias (0.1 mm) for inner-layer fan-out. Maintain at least 4 ground-reference vias near the ePAD for thermal and signal integrity. Follow Altera Cyclone IV GX F19 package design guidelines for high-speed transceiver channel routing (100 ohm differential, 5 W spacing).
Do not assume the F19 FBGA package is pin-compatible with the F256 or F484 FBGA variants of the Cyclone IV GX family - ball maps differ. Configuration mode pins (MSEL) must be tied correctly to select JTAG/AS/PS/AP modes - wrong values cause configuration failures. The RREF pins for transceiver calibration must use 2 kohm 1% resistors to analog ground - leaving these floating disables transceiver channels.
Compliance Information
Lead-free F19 FBGA package per Altera product page. Commercial temperature grade (C6 suffix); industrial-grade variants use I7 suffix. Not AEC-Q100 qualified - choose EP4CGX22IF19I7N for automotive applications.
