EP4CGX30CF19C6N - Cyclone IV GX FPGA, 29K LE, 150 I/O, 324-FBGA | Intel / Altera
MPN: EP4CGX30CF19C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $120.89 | $120.89 |
| 10 | $115 | $1,150.00 |
| 100 | $105 | $10,500.00 |
| 500 | $95 | $47,500.00 |
| 1,000 | $85 | $85,000.00 |
EP4CGX30CF19C6N Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device in the programmable logic family, sitting hierarchically between application-specific integrated circuits (ASICs) and general-purpose processors in terms of flexibility, performance per watt, and unit cost. FPGAs are widely used for digital signal processing, hardware acceleration, custom peripheral interfacing, and rapid prototyping of parallel compute pipelines. The Cyclone IV GX family specifically combines the low static and dynamic power of the Cyclone IV architecture with integrated high-speed transceivers, a combination not previously available in low-cost FPGA families.
Key features of the EP4CGX30CF19C6N include 29,440 logic elements (LEs), 66 embedded 18 x 18 multipliers for DSP, 1,105,920 bits (135 Kb) of on-chip RAM configured as M9K blocks, four general-purpose PLLs, and 150 single-ended or 75 differential-pair user I/Os. The device supports LVDS, SSTL, HSTL, and LVPECL I/O standards, and the integrated transceivers operate from 600 Mbps to 3.125 Gbps across protocols including PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The configuration scheme supports both passive serial (AS) and JTAG programming.
The Cyclone IV GX architecture combines a logic fabric of LABs (logic array blocks) with embedded memory, multipliers, and transceivers on a single die. Designers compile HDL or schematic designs into a bitstream using Quartus II software and load the bitstream into SRAM-based configuration cells. The device supports hot-socketing and partial reconfiguration in select modes, enabling dynamic hardware updates in deployed systems.
Typical applications include industrial video and image processing, motor control and drive subsystems, low-cost protocol bridging (PCIe, GbE, CPRI), portable and battery-powered test equipment, and machine-vision camera interfaces. Its balance of logic density, transceiver count, and static power makes it particularly attractive for cost-sensitive designs that nonetheless need multi-gigabit serial links.
Design considerations include careful PCB layout of the 324-ball FBGA, decoupling of the 1.2 V core and 2.5 V/3.3 V auxiliary rails, and routing of the high-speed transceiver channels with controlled-impedance differential pairs (typically 100 ohm). Quartus II software handles synthesis, place-and-route, and timing closure. For cost-down variants, the Cyclone IV E family (no transceivers) and Cyclone V (next-generation) families are alternative architecture families within the Altera / Intel portfolio.
This page consolidates distributor pricing as of 2026-09-10, drop-in alternative MPNs, and engineering design notes that go beyond the bare manufacturer datasheet, providing practical guidance for hardware engineers evaluating the EP4CGX30CF19C6N for new designs.
Drop-in alternatives for EP4CGX30CF19C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF19C6N (same form factor and footprint) — differing in Package, Transceivers, Operating Temperature, Process Technology, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX30CF19C7N
✅ Drop-In✓ In Stock
$68.95 / Unit
View Datasheet →EP4CGX30CF19I6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP4CGX30CF19I7N
✅ Drop-In✓ In Stock
$76.4 / Unit
View Datasheet →EP4CGX30CF19C8N
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →EP4CGX22CF19C6N
✅ Drop-In✓ In Stock
$31.95 / Unit
View Datasheet →EP4CGX30CF19C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements (LE) | 29,440 |
| Embedded Memory Bits | 1,105,920 (135 Kb) |
| Embedded Multipliers | 66 (18 x 18) |
| User I/O Pins | 150 |
| Number of I/O Banks | 8 |
| PLLs | 4 |
| Transceivers | Up to 8 (3.125 Gbps) |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package | 324-pin FBGA (F19) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Configuration Mode | Active Serial (AS) / JTAG |
| RoHS Status | Compliant |
EP4CGX30CF19C6N 324-pin fbga (f19) Pin Configuration Guide
Pin configuration for EP4CGX30CF19C6N (324-pin fbga (f19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX30CF19C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX30CF19C6N is suitable for 7 applications: Industrial Video Processing, PCI Express Endpoint Cards, Industrial Motor Control Drives, Gigabit Ethernet Protocol Bridging, Portable Test and Measurement Equipment, Machine Vision Camera Interfaces, Wireless Baseband Signal Processing.
Industrial Video Processing
The EP4CGX30CF19C6N is well-suited for industrial video processing because its 29,440 logic elements and 66 embedded 18 x 18 multipliers provide ample DSP throughput for real-time pixel pipelines (Sobel, Canny, color-space conversion). The 1,105,920 bits of embedded M9K memory buffer line-store image data without off-chip SRAM. Placed on a 4-lane MIPI-CSI2 or LVDS camera-input board, the device ingests raw video, performs histogram equalization, and outputs HDMI. The integrated transceivers are not used for video in this role — the LVDS I/Os at 150 pins handle parallel pixel data at up to 875 Mbps per pair.
Recommended
PCI Express Endpoint Cards
The EP4CGX30CF19C6N integrates a hardened PCI Express Gen1 (2.5 Gbps) Physical Layer, data-link, and transaction-layer block, making it ideal for low-cost PCIe x1 and x2 endpoint cards (data-acquisition, protocol analyzers, industrial I/O expansion). Its 29,440 LEs handle user-application logic while the PCIe hard IP manages bus protocol autonomously, freeing fabric for DMA engines and register interfaces. Deployed on a PCIe card with the device's 8 transceivers, the design achieves <1 W typical power. The 324-FBGA package provides sufficient I/O for multiple GPIO plus the x2 PCIe link.
Recommended
Industrial Motor Control Drives
The EP4CGX30CF19C6N is a strong fit for multi-axis industrial motor control because its 66 embedded 18 x 18 multipliers implement Park/Clark transforms, SVPWM modulators, and PID controllers in a single fabric. The 4 PLLs generate independent PWM and encoder sampling clocks, and the 150 user I/Os interface to multi-axis resolver/encoder feedback plus gate-driver enable signals. Industrial applications typically substitute EP4CGX30CF19I6N for -40 °C to 100 °C support. The 1.2 V core and integrated transceivers (used here for CAN-FD or RS-485 isolated links) keep the BOM small.
Recommended
Gigabit Ethernet Protocol Bridging
The EP4CGX30CF19C6N provides integrated tri-speed Ethernet MAC IP and 1.25 Gbps SGMII-capable transceivers, making it ideal for protocol-bridging applications (EtherCAT to SPI, GbE to parallel bus). Placed between an industrial Ethernet PHY and a host MCU, the device performs frame filtering, timestamp insertion, and protocol conversion. Its 29,440 LEs support multiple parallel slave interfaces plus a soft RISC-V or Nios II control core for management plane. The 324-FBGA package allows PCB routing of the SGMII differential pair directly to the PHY with controlled 100 ohm impedance.
Recommended
Portable Test and Measurement Equipment
The EP4CGX30CF19C6N is used in portable test equipment (logic analyzers, protocol exercisers) because its combination of high-speed LVDS I/Os (up to 875 Mbps per pair), 150 user I/Os, and integrated transceivers supports multi-channel waveform capture in a single chip. The 1.2 V core supply and Cyclone IV GX low-power architecture keep battery-pack size manageable for handheld form factors. The device's embedded M9K memory buffers captured samples before DMA to host, and 4 PLLs provide per-channel sampling clock synthesis. Commercial 0-85 °C temperature grade is sufficient for indoor lab use.
Recommended
Machine Vision Camera Interfaces
The EP4CGX30CF19C6N supports machine-vision camera interface standards including Camera Link, CoaXPress, and GigE Vision because of its integrated transceivers (3.125 Gbps for CoaXPress up-link), 150 LVDS-capable user I/Os (for Camera Link base/medium/full configurations), and embedded multipliers for image pre-processing. Placed at the frame-grabber side, the device converts camera-specific protocols to a host interface (PCIe or USB 3.0 via transceiver). The 1.2 V core and low-power Cyclone IV GX architecture suit dense multi-camera inspection systems where heat dissipation is constrained.
Recommended
Wireless Baseband Signal Processing
The EP4CGX30CF19C6N serves small-cell and pico-cell wireless baseband processing because of its 66 embedded 18 x 18 multipliers, which implement channelization, FFT/iFFT, and crest-factor-reduction blocks without external DSP chips. The integrated transceivers interface directly to RF front-end ADCs/DACs via CPRI or OBSAI at up to 3.072 Gbps, eliminating external PHY ICs. The 150 user I/Os route to external memory (DDR2/DDR3 controller in soft IP) and backhaul Ethernet. For temperature-hardened outdoor deployments, the industrial -40 °C to 100 °C variant EP4CGX30CF19I7N is preferred.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF19C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF19C7N | EP4CGX30CF19I6N | EP4CGX30CF19I7N | EP4CGX30CF19C8N | EP4CGX22CF19C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (F19) | 324-FBGA (F19) — same | 324-FBGA (F19) — same | 324-FBGA (F19) — same | 324-FBGA (F19) — same | 324-FBGA (F19) — same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 | 21,640 (-26%) |
| Embedded Memory | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 783,360 bits (-29%) |
| User I/O | 150 | 150 | 150 | 150 | 150 | 150 |
| Embedded Multipliers | 66 (18x18) | 66 | 66 | 66 | 66 | 44 (-33%) |
| Speed Grade | C6 | C7 (faster) | I6 (industrial) | I7 (faster + industrial) | C8 (fastest) | C6 (same) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Industrial (-40 to 100 °C) | Industrial | Commercial | Commercial |
Key Differentiators
- Highest-density 30K-LE variant of Cyclone IV GX with 8 integrated transceivers (vs EP4CGX22CF19C6N)
- Lowerest price tier among speed-grade variants in the same F19 footprint (vs EP4CGX30CF19C8N)
- Commercial-temperature variant — ideal for indoor / lab / non-rugged use (vs EP4CGX30CF19I6N)
Design Notes
The 324-ball FBGA (F19) package uses a 1.0 mm ball pitch, requiring a minimum 4-layer PCB with microvia (HDI) stack-up. Use ENIG surface finish for fine-pitch BGA reliability, and allocate at least 4 ground vias under the package thermal balls for thermal dissipation. Power and ground planes should be solid copper beneath the device to provide low-impedance return paths for the high-speed transceivers; never route signal traces across plane splits beneath the FPGA.
The EP4CGX30CF19C6N requires a 1.2 V core supply (VCCINT), a 2.5 V or 3.0 V analog supply (VCCA) for PLLs and transceivers, and a 2.5 V or 3.3 V I/O supply (VCCIO) per bank. Decoupling must include 0.1 µF ceramic caps within 50 mil of every supply pin and bulk 47 µF tantalum or polymer caps on each rail. Power sequencing per the Cyclone IV GX device handbook is mandatory: VCCINT must precede VCCIO to avoid I/O driver latch-up. Estimated quiescent current at 0 °C with no logic activity is approximately 250 mA; add 0.5 W per active transceiver channel.
High-speed transceiver channels must be routed as 100 ohm differential pairs with intra-pair skew under 5 mil and total length matched within 25 mil. Use a 4-layer stack-up with continuous reference ground plane beneath the transceiver traces; never cross plane splits. LVDS user I/O pairs should follow the same 100 ohm differential rule, with maximum data rate of 875 Mbps per pair. At PCIe Gen1 (2.5 Gbps), the AC-coupling capacitors (75 nF to 200 nF) must be placed within 250 mil of the transmitter ball. Estimated transmitter pre-emphasis and de-emphasis settings are configured in the Quartus II transceiver toolkit, not hard-coded in the schematic.
A frequent design mistake is omitting the JTAG download chain termination — even unused JTAG pins (TCK, TMS, TDI, TDO) must be pulled to defined logic levels (TCK pulled low, TMS and TDI pulled high via 10 kohm) to prevent floating-state spurious configuration. Another common pitfall is configuring the AS (active serial) flash with the wrong compression mode, causing the bitstream to fail CRC check on power-up. Always generate the .pof file using Quartus II's Convert Programming Files tool, and verify it against the JTAG .jic file before sending to manufacturing. Finally, do not enable the transceiver calibration sequence before the 1.2 V rail reaches its stable threshold — the Cyclone IV GX device handbook specifies a 100 µs minimum VCCINT ramp time.
Compliance Information
RoHS compliant per Altera / Intel product page. Lead-free finish indicated by 'N' designator in part number. Halogen-free status not specified in available web data. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-qualified part.
