EP4CGX30CF19C6 - Cyclone IV GX FPGA, 29K LE, 150 I/O | Intel
MPN: EP4CGX30CF19C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.85 | $298.50 |
| 100 | $26.4 | $2,640.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $20.75 | $20,750.00 |
EP4CGX30CF19C6 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor that engineers configure after manufacture to implement custom digital logic, parallel processing pipelines, and high-speed serial interfaces. FPGAs sit in the programmable-logic tier of the broader semiconductor taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC). The Cyclone IV GX family specifically targets low-power, transceiver-rich applications such as industrial video bridging, motor control, and wireless backhaul, balancing unit cost against the higher-density Stratix and lower-cost Cyclone IV E variants.
Key features include 1,840 LABs/CLBs, 66 embedded 18x18 multipliers, 4 transceivers at up to 3.125 Gbps, support for PCI Express Gen1 (x1/x2) hard IP blocks, and 4 PLLs. The device family offers flexible configuration via JTAG, Active Serial, or Passive Parallel modes, and supports 1.05 Mbit of dedicated configuration-related internal memory.
Architecture-wise the device combines an LUT-based fabric with distributed M9K memory blocks (108 in total), dedicated DSP blocks, and hard IP for PCIe and transceivers that offload common I/O tasks from the fabric. This mix lets designers hit aggressive power and cost targets without sacrificing serial bandwidth, and the same silicon scales across the EP4CGX30/50/75/110/150 family members by simply changing interconnect density and package.
Typical applications include industrial machine vision, broadcast video processing, low-cost PCIe endpoint cards, motor control drives, and wireless baseband pre-processing. The Cyclone IV GX family is well suited to designs that need a few fast serial lanes without paying for full transceiver-heavy Stratix silicon.
When designing, allocate at least one transceiver reference clock per quad, follow Intel's PCB layout guidelines for the F19 BGA (matched-length differential routing, controlled-impedance vias), and verify Quartus Prime support for the chosen speed grade. Power estimation should start with the PowerPlay Early Power Estimator before PCB commitment.
This page synthesizes distributor stock, drop-in Cyclone IV GX and Cyclone V alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX30CF19C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF19C6 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, PLLs, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX30CF19C7N
✅ Drop-In✓ In Stock
$68.95 / Unit
View Datasheet →EP4CGX30CF19C7
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →EP4CGX30CF19C8
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →EP4CGX30CF19I6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CGX30CF19C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.6 / Unit
View Datasheet →EP4CGX30CF19C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 29,440 LE |
| LABs/CLBs | 1,840 |
| Total RAM Bits | 1,105,920 bits |
| Number of I/Os | 150 |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| Operating Supply Voltage (Core) | 1.2 V |
| Process Technology | 60 nm |
| Package / Case | 324-LBGA (F19, 19 mm) |
| Mounting Style | SMD/SMT |
| Operating Temperature | 0 C to +70 C (Commercial) |
| Speed Grade | C6 |
EP4CGX30CF19C6 Pin Configuration
| Pin A1 | I/O — Bank 8 general purpose I/O |
| Pin A2 | I/O — Bank 8 general purpose I/O |
| Pin A3 | I/O — Bank 8 general purpose I/O |
| Pin A4 | I/O — Bank 8 general purpose I/O |
| Pin A5 | I/O — Bank 8 general purpose I/O |
| Pin A6 | I/O — Bank 8 general purpose I/O |
| Pin A7 | I/O — Bank 8 general purpose I/O |
| Pin A8 | I/O — Bank 8 general purpose I/O |
| Pin A9 | I/O — Bank 8 general purpose I/O |
| Pin A10 | I/O — Bank 8 general purpose I/O |
| Pin A11 | I/O — Bank 8 general purpose I/O |
| Pin A12 | VCCIO8 — Bank 8 I/O supply |
| Pin B1 | I/O — Bank 8 general purpose I/O |
| Pin B2 | I/O — Bank 8 general purpose I/O |
| Pin B3 | I/O — Bank 8 general purpose I/O |
| Pin B4 | I/O — Bank 8 general purpose I/O |
| Pin B5 | I/O — Bank 8 general purpose I/O |
| Pin B6 | I/O — Bank 8 general purpose I/O |
| Pin B7 | I/O — Bank 8 general purpose I/O |
| Pin B8 | I/O — Bank 8 general purpose I/O |
| Pin B9 | I/O — Bank 8 general purpose I/O |
| Pin B10 | I/O — Bank 8 general purpose I/O |
| Pin B11 | VCCINT — Core supply 1.2 V |
| Pin B12 | GND — Ground |
Typical Applications
EP4CGX30CF19C6 is suitable for 6 applications: Industrial Machine Vision, PCIe Endpoint Card, Motor Control and Industrial Drive, Broadcast Video Processing, Wireless Baseband Pre-Processing, Test & Measurement Instrumentation.
Industrial Machine Vision
The EP4CGX30CF19C6 fits industrial machine vision because its 29,440 logic elements can host Camera Link, CoaXPress, or GigE Vision image processing pipelines while the 4 transceivers feed raw data into the fabric at line rate. Designers place external SDRAM next to the FPGA for frame buffering, then implement Bayer demosaicing, defect detection, and compression in the DSP blocks. The 1.2 V core plus dedicated PLL support lets the part run the image sensor at fixed pixel clocks while a second PLL drives an Ethernet PHY. Compared with discrete ASSP vision processors, the FPGA offers deterministic latency critical for inline quality inspection. Ensure the PCB keeps 100 ohm differential pairs matched for the transceiver channels.
Recommended
PCIe Endpoint Card
The EP4CGX30CF19C6 includes a hard PCIe Gen1 x1/x2 endpoint block, so designers can build a low-cost PCIe add-in card without consuming soft logic for the PHY. With 29,440 logic elements available, the FPGA can implement a custom DMA engine plus driver-side protocol logic on the fabric, while 4 transceivers reserve lanes for PCIe plus an upstream high-speed link. Commercial temperature grade suits desktop and server PCIe slots. A typical layout places the PCIe edge connector traces within 250 mil of the FPGA transceiver pins per Intel's PCIe design guide. The 1105920-bit embedded RAM supports packet buffers without external SSRAM.
Recommended
Motor Control and Industrial Drive
Motor control drives benefit from the EP4CGX30CF19C6 because the FPGA fabric handles high-rate field-oriented control (FOC) loops while the dedicated PLLs generate synchronized PWM clocks. With 66 embedded 18x18 multipliers, the design can implement space-vector modulation, SVPWM, and observer algorithms in hardware for sub-microsecond loop times. The 4 transceivers feed encoder protocols like EnDat 2.2 or BiSS C over LVDS, and 150 I/Os drive gate-driver signals and over-current protection. Industrial-grade variants (EP4CGX30CF19I6) extend temperature to +100 C for cabinet-side mounting.
Recommended
Broadcast Video Processing
Broadcast video routers and SDI gateways run on the EP4CGX30CF19C6 because the integrated transceivers support SDI rates up to 3 Gbps (SMPTE 424M) without external serializers. The 29K LEs are enough for cross-point switching, frame sync, and audio embedding for up to four SDI streams, with 108 M9K memory blocks buffering line-rate data. Designers pair the FPGA with external DDR2 SDRAM for full-frame store-and-forward. Quartus Prime supports SDI reference designs from Intel that drop into the F19 footprint. The commercial temperature grade is adequate for studio and headend installations.
Recommended
Wireless Baseband Pre-Processing
In wireless backhaul and small-cell designs, the EP4CGX30CF19C6 acts as a baseband front-end with the 4 transceivers handling CPRI or OBSAI links to the radio unit. The 66 multipliers implement channel estimation, FFT/iFFT, and digital up/down conversion in the DSP blocks, while 1.1 Mbit of embedded RAM buffers symbol streams. With low static power from the 60 nm process, the FPGA fits thermally constrained PoE-powered enclosures. Designers should budget 4 watts typical for full-speed operation and provide at least 4 layers of 1 oz copper for heat spreading.
Recommended
Test & Measurement Instrumentation
Test equipment vendors use the EP4CGX30CF19C6 for protocol analyzers, logic analyzers, and protocol-aware BERT systems. The high I/O count (150) connects to physical-layer probes, and the transceivers feed the analyzer with up to 3.125 Gbps signals from serial protocols. The 1105920 bits of embedded RAM allow deep capture windows at full speed, while the 66 multipliers accelerate protocol decoding in real time. Commercial 0 to +70 C temperature works for lab equipment, and the F19 package simplifies integration into PXIe or USB-based instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF19C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF19C7N | EP4CGX30CF19C7 | EP4CGX30CF19C8 | EP4CGX30CF19I6 | EP4CGX30CF19C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-LBGA (F19, 19 mm) | 324-LBGA (F19, 19 mm) - same | 324-LBGA (F19, 19 mm) - same | 324-LBGA (F19, 19 mm) - same | 324-LBGA (F19, 19 mm) - same | 324-LBGA (F19, 19 mm) - same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Speed Grade | C6 | C7 (faster Fmax) | C7 | C8 (fastest) | C6 industrial | C8 lead-free |
| Total RAM Bits | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 | 66 |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | -40 C to +100 C (Industrial) | 0 C to +70 C |
Key Differentiators
- Faster speed grade available in identical F19 package (vs EP4CGX30CF19C7)
- Industrial temperature option in identical F19 package (vs EP4CGX30CF19I6)
- Lead-free RoHS option available (vs EP4CGX30CF19C6N)
Design Notes
The 324-ball F19 FineLine BGA demands controlled-impedance 100 ohm differential routing for all four transceiver channels. Match intra-pair length to within 5 mils and pair-to-pair within 50 mils per Intel's Cyclone IV GX PCB layout guidelines. Use 4 or more PCB layers with a continuous ground plane under the device for return path integrity. BGA vias should be 12 mil drill with 24 mil pad for 1 oz copper process.
Estimated: core current for the EP4CGX30CF19C6 at 100% logic utilization with all 4 transceivers running at 3.125 Gbps draws approximately 1.3 A from the 1.2 V VCCINT rail, so designers should budget a 4 A capable switching regulator with at least 1.5x headroom. Add 100 uF bulk decoupling plus 0.1 uF and 0.01 uF ceramic decoupling per VCCINT ball group. Use the PowerPlay Early Power Estimator (EPE) spreadsheet for accurate design-specific numbers.
Reference clocks for the transceiver blocks (REFCLK0n/p, REFCLK1n/p) must be driven by a low-jitter clock source such as a dedicated SiLabs Si5338 or equivalent, with jitter under 100 fs RMS for 3.125 Gbps operation. Route these clocks with 100 ohm differential impedance and keep them isolated from noisy digital signals. AC-couple the clock inputs as required by the device handbook, and avoid sharing power rails between the clock generator and noisy switching circuitry.
Do not omit configuration mode strapping pins (MSEL0/1/2). The EP4CGX30CF19C6 defaults depend on these strapping values, and incorrect settings will prevent JTAG or Active Serial configuration from working. Always place a 4-pin JTAG header (TCK, TMS, TDI, TDO) on every board for debug access, and include a separate AS configuration flash footprint. Verify the AS flash size against your SOF bitstream using the Quartus Prime programmer tool before tape-out.
Compliance Information
Compliance fields marked unknown because the verified web data does not state explicit RoHS, REACH, or lead-free status. The N-suffix variants (e.g., EP4CGX30CF19C6N) are RoHS-compliant lead-free per Intel ordering information, but the C6 (no N suffix) variant finish is not explicitly stated in the provided data.
