EP4CGX30CF19C7 - Cyclone IV GX FPGA, 29K Logic Elements, 324-FBGA | Intel
MPN: EP4CGX30CF19C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $144.85 | $144.85 |
| 10 | $130.5 | $1,305.00 |
| 100 | $115 | $11,500.00 |
| 500 | $95.5 | $47,750.00 |
| 1,000 | $82 | $82,000.00 |
EP4CGX30CF19C7 Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader taxonomy, this places the EP4CGX30CF19C7 in the category of programmable logic devices (PLD) > FPGA > low-power FPGA > Cyclone IV GX. The device supports parallel I/O standards including LVDS, LVPECL, SSTL, and HSTL, plus PCI Express Gen1 x1/x2 hard IP for serial interconnect.
Key features include 29,440 logic elements, 66 embedded 18x18 multipliers for DSP workloads, 4 transceiver channels rated up to 3.125 Gbps, and 150 general-purpose user I/O pins. The device also offers 1840 CLBs, an internal performance of approximately 472 MHz, and configuration via JTAG, Active Serial, or Passive Serial modes. The 324-ball FBGA package measures 19 x 19 mm with a 1.0 mm ball pitch.
The Cyclone IV GX architecture integrates transceivers directly on-die, eliminating the need for external PHY chips in designs that previously required two-chip solutions. Combined with on-chip phase-locked loops (PLLs) and 66 9x9 multipliers, the EP4CGX30CF19C7 delivers up to ~198 GMAC of DSP throughput for cost-sensitive signal-processing pipelines.
Typical applications include industrial video and image processing, automotive driver assistance systems, communications protocol bridging, low-cost PCIe endpoint cards, and factory automation controllers. The integrated transceivers make it especially suited for serial backplanes, SFP/SFP+ optical interfaces, and industrial camera link.
When designing with this device, pay close attention to transceiver power-supply filtering and reference-clock routing. Use the Altera/Intel Quartus II design software (version 13.0 or later) for synthesis, place-and-route, and timing closure; legacy Quartus II 13.0 SP1 remains the most stable release for the Cyclone IV family.
This page synthesizes real-time distributor pricing, drop-in alternatives within the Cyclone IV family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP4CGX30CF19C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF19C7 (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX30CF19C8N
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →EP4CGX30CF19C6N
✅ Drop-In✓ In Stock
$85 / Unit
View Datasheet →EP4CGX30CF19I7N
✅ Drop-In✓ In Stock
$76.4 / Unit
View Datasheet →EP4CGX30CF19C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$68.95 / Unit
View Datasheet →EP4CGX30CF19C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.75 / Unit
View Datasheet →EP4CGX30CF19C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Series | EP4CGX30 |
| Device Model | EP4CGX30CF19C7 |
| Logic Elements | 29,440 |
| Configurable Logic Blocks (CLBs) | 1,840 |
| Embedded Memory Bits | 1,105,920 bits |
| Embedded 18x18 Multipliers | 66 |
| User I/O Pins (maximum) | 150 |
| Transceiver Channels | 4 |
| Transceiver Data Rate | up to 3.125 Gbps |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Internal Performance | approximately 472 MHz |
| Package | 324-ball FBGA (F19), 19 x 19 mm, 1.0 mm pitch |
| Supply Voltage | 1.2 V core, 2.5 V/3.3 V I/O |
| Mounting Type | Surface Mount (SMT) |
| RoHS Status | Compliant |
| Process Technology | 60 nm low-k CMOS |
EP4CGX30CF19C7 324-ball fbga (f19), 19 x 19 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX30CF19C7 (324-ball fbga (f19), 19 x 19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX30CF19C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX30CF19C7 is suitable for 6 applications: Industrial PCIe Endpoint Card, Communications Protocol Bridging, Industrial Video / Machine Vision, Automotive Driver Assistance Systems, Factory Automation Controllers, Wireless Baseband / DSP Co-Processing.
Industrial PCIe Endpoint Card
The EP4CGX30CF19C7 is well suited to low-cost PCIe Gen1 x1/x2 endpoint cards because its 29,440 logic elements comfortably host the PCIe hard-IP plus application logic for industrial control, while its 4 integrated transceivers deliver 3.125 Gbps serial channels without an external PHY. Designers can implement data acquisition endpoints, industrial Ethernet-to-PCIe bridges, and machine-vision frame grabbers in a single chip. The FBGA-324 package provides enough I/O (150 pins) for parallel sensor buses alongside the PCIe link, and the commercial 0-85 C temperature grade covers factory-floor deployments.
Recommended
Communications Protocol Bridging
With 4 transceivers and 150 user I/Os, the EP4CGX30CF19C7 is ideal for protocol-bridging applications such as serial backplane switching, gigabit Ethernet-to-SPI bridging, and SFP/SFP+ optical transponder interfaces. Its 1,105,920 bits of embedded memory buffer traffic efficiently between domains, and the integrated PLLs provide multiple independent clock domains for inbound and outbound serial streams. Compared with discrete FPGA-plus-PHY solutions, the on-die transceivers cut BOM cost and PCB area while reducing latency by 5-10 ns per hop.
Recommended
Industrial Video / Machine Vision
The 66 embedded 18x18 multipliers and 472 MHz internal performance of the EP4CGX30CF19C7 deliver enough DSP throughput for image-processing pipelines used in machine-vision cameras, line-scan imaging, and quality-inspection systems. Designers can run real-time filtering, edge detection, and color-space conversion in the fabric while reserving transceivers for Camera Link or CoaXPress output. The FBGA-324 footprint supports high-pin-count parallel sensor interfaces (LVDS, sub-LVDS) needed for high-frame-rate imagers.
Recommended
Automotive Driver Assistance Systems
The EP4CGX30CF19C7 supports rear-view camera processing, sensor-fusion pre-processing, and parking-assist controller functions in automotive applications. Although the commercial temperature grade (0 to +85 C) suits in-cabin electronics, designers should use the EP4CGX30CF19I7N variant for under-hood or near-engine-bay installations that require -40 to +100 C operation. The 4 transceivers support CAN-FD, FlexRay, and automotive Ethernet bridging in a single FPGA fabric.
Recommended
Factory Automation Controllers
For PLC-style controllers and motion-control systems, the EP4CGX30CF19C7's 150 user I/Os accept multi-channel encoder inputs, PWM outputs, and parallel sensor buses, while its logic capacity handles real-time control loops. The integrated transceivers support EtherCAT, PROFINET IRT, and Sercos III industrial Ethernet protocols, eliminating the need for companion ASICs. The commercial temperature range covers most factory-floor cabinets.
Recommended
Wireless Baseband / DSP Co-Processing
With 66 dedicated 18x18 multipliers and approximately 198 GMAC of DSP throughput, the EP4CGX30CF19C7 functions as a co-processor alongside host processors for wireless baseband, software-defined radio (SDR) pre-processing, or signal-conditioning pipelines. The 4 transceivers support CPRI/OBSAI links to baseband cards, while the abundant embedded memory provides the sample buffer depth needed for FFT/iFFT chains. Compared with mid-range DSP ICs, the FPGA gives engineers flexibility to upgrade modulation schemes in firmware.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF19C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF19C8N | EP4CGX30CF19C6N | EP4CGX30CF19I7N | EP4CGX30CF19C7N | EP4CGX30CF19C6 |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (F19) | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 - identical | 29,440 - identical | 29,440 - identical | 29,440 - identical | 29,440 - identical |
| Speed Grade | 7 (commercial) | 8 - faster | 6 - slower / lower cost | 7 - industrial temp | 7 - lead-free | 6 - older lead process |
| Transceivers | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Memory | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits | 1,105,920 bits |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 | 66 |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Non-compliant (older process) |
Key Differentiators
- Speed-grade 7 offers balanced timing margin and cost (vs EP4CGX30CF19C8N)
- Commercial temperature grade for cost-sensitive applications (vs EP4CGX30CF19I7N)
- Same-die drop-in alternatives within the Cyclone IV family (vs EP4CGX22CF19C8N)
Design Notes
The EP4CGX30CF19C7 requires four distinct power rails: VCCINT (1.2 V core), VCCIO (2.5 V or 3.3 V I/O), VCCA (2.5 V PLL/analog), and VCCH_GXB (3.3 V transceiver supply). Each rail must be filtered with a ferrite bead and decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the package. The transceiver supplies are particularly noise-sensitive; do not share their ferrite beads with digital VCCIO rails.
Estimated: For an FBGA-324 device with 1.0 mm pitch, escape routing requires either a 4-layer or 6-layer PCB stackup with 0.4 mm laser-drilled microvias on the BGA pads. Allow at least 8 mm of continuous reference plane beneath the package for high-speed transceiver return-current paths. Use the Intel/Altera Cyclone IV GX Board Design Guidelines for layer stack-up and via-pattern recommendations.
The FBGA-324 package has a theta-JA of approximately 12 C/W with a properly designed thermal via array (5x5 staggered 0.3 mm vias under the die). For designs that fully utilize all 4 transceivers at 3.125 Gbps, total power can reach 2.5-3 W; ensure adequate airflow or attach a small heatsink if operating above 70 C ambient. Use Quartus II's PowerPlay early power estimator to validate thermal headroom before PCB layout.
Transceiver channels operate up to 3.125 Gbps; route each serial channel as a 100 ohm differential pair with intra-pair skew under 1 ps and continuous reference-plane stitching. Use the IBIS-AMI models from the Intel/Altera website for channel simulation, and place AC-coupling capacitors (0.1 uF X7R) within 5 mm of the transmitter output on each serial link.
Do not omit the JTAG pull-up resistor on TCK, TMS, and TDI; the configuration logic will fail to enumerate reliably otherwise. Do not share VCCA between PLLs and transceivers without individual ferrite-bead filtering. Do not exceed the 1.2 V VCCINT tolerance of +/- 5%; even brief over-voltage conditions can permanently damage the device. Use Quartus II 13.0 SP1 or later to ensure bitstream compatibility with Cyclone IV GX silicon revision D and later.
Compliance Information
RoHS compliant per Cyclone IV GX family datasheet. Lead-free (Pb-free) assembly compatible. AEC-Q100 not applicable - FPGAs of this class are typically not automotive-qualified; verify with manufacturer for AEC-Q100 variants if required.
