EP4CGX30CF19C8 - Cyclone IV GX FPGA 29K LE 324-FBGA | Intel
MPN: EP4CGX30CF19C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.1 | $29,050.00 |
| 1,000 | $52.4 | $52,400.00 |
EP4CGX30CF19C8 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows hardware engineers to implement arbitrary digital logic, signal processing, and interconnect via a hardware description language. FPGAs sit in the semiconductor hierarchy above ASICs in flexibility and below microcontrollers in unit cost, and they belong to the broader category of integrated circuits (ICs). Cyclone IV GX specifically targets low-power, high-volume applications where traditional FPGA solutions were too expensive or power-hungry.
Key features include 66 embedded 18x18 multipliers for DSP acceleration, four general-purpose PLLs, and embedded memory blocks totaling 108 Kbits (M9K) plus 483 Kbits of MLAB. The GX variant provides integrated 3.125 Gbps transceivers, supporting protocols such as PCIe Gen1, GigE, Serial RapidIO, and CPRI - rare for a Cyclone-class low-cost family. Cyclone IV GX delivers up to 30% lower static power than Cyclone III LS for the same logic density.
Typical applications include industrial machine vision, broadcast video processing, low-cost wireless backhaul, USB 3.0 / PCIe Gen1 bridge cards, and motor control. The 324-FBGA package (F19 designation, 19 mm body) supports industrial -40°C to +100°C junction temperature operation with proper thermal management.
When designing with this part, follow Intel's pin connection guidelines for unused pins, provide ample decoupling on every VCCINT/VCCIO rail, and use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Reference the Cyclone IV GX Device Handbook (volume 1: device overview; volume 2: transceiver architecture) for protocol-specific implementation guidance.
Drop-in alternatives for EP4CGX30CF19C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF19C8 (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX30CF19C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$82 / Unit
View Datasheet →EP4CGX30CF19C7N
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$68.95 / Unit
View Datasheet →EP4CGX30CF19C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$85 / Unit
View Datasheet →EP4CGX30CF19C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.75 / Unit
View Datasheet →EP4CGX22CF19C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$26.75 / Unit
View Datasheet →EP4CGX22CF19C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$32.45 / Unit
View Datasheet →EP4CGX30CF19C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Family | Cyclone IV GX |
| Logic Elements (LE) | 29,440 |
| Embedded Memory | 1,105,920 bits |
| Embedded Multipliers (18x18) | 66 |
| User I/O Pins | 150 |
| Transceivers | Up to 8 channels @ 3.125 Gbps |
| PLLs | 4 (general-purpose) |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (LVCMOS/LVDS) |
| Speed Grade | 8 (commercial) |
| Operating Temperature | -40C to +100C (TJ) |
| Package | 324-FBGA (FineLine BGA), 19 mm body |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Programming Tool | Intel Quartus Prime (legacy: Quartus II) |
| Configuration Mode | AS / PS / JTAG |
EP4CGX30CF19C8 324-fbga (fineline bga), 19 mm body Pin Configuration Guide
Pin configuration for EP4CGX30CF19C8 (324-fbga (fineline bga), 19 mm body package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX30CF19C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX30CF19C8 is suitable for 6 applications: Industrial Machine Vision, Broadcast Video Processing, PCIe Gen1 Bridge Cards, Motor Control and Industrial Drives, Low-Cost Wireless Backhaul, Test and Measurement Instrumentation.
Industrial Machine Vision
The EP4CGX30CF19C8 fits industrial machine vision because its 29,440 logic elements and 66 embedded 18x18 multipliers provide enough DSP bandwidth for real-time Bayer demosaicing, edge filtering, and basic object detection on Camera Link or GigE Vision inputs. With 150 user I/Os and 8 transceiver channels at 3.125 Gbps, the device can directly interface GigE Vision cameras without external PHY, simplifying BOM. Its 1.2 V core and low static power suit fanless factory enclosures.
Recommended
Broadcast Video Processing
The EP4CGX30CF19C8 is well-suited to broadcast video processing because its integrated transceivers support SDI (SMPTE 259M/292M/424M) and DVB-ASI at typical 270 Mbps / 1.485 Gbps / 2.97 Gbps rates without external serializer ICs. The 1,105,920 bits of embedded memory buffer active video lines, while 150 I/Os accommodate parallel BT.656 / BT.1120 buses plus GPIO for front-panel control. Cyclone IV GX static power is 30% lower than Cyclone III for the same logic density.
Recommended
PCIe Gen1 Bridge Cards
The EP4CGX30CF19C8 supports PCIe Gen1 x1/x2/x4 endpoints via its integrated transceivers and hard PCIe IP, eliminating external PHY cost on low-cost adapter cards. With 29,440 logic elements and 66 multipliers, the device implements DMA engines, scatter-gather controllers, and protocol translation layers between PCIe and peripheral buses (USB 3.0, SATA, GbE). The F19 324-FBGA package fits standard PCIe x1 half-height form factors.
Recommended
Motor Control and Industrial Drives
The EP4CGX30CF19C8 fits industrial motor drives because its 66 18x18 multipliers accelerate field-oriented control (FOC) loops, SVPWM generation, and current/voltage decoupling math at 20-50 kHz switching rates. The 150 user I/Os interface multiple encoder channels (QEP, SinCos, EnDat), PWM outputs, and isolated SPI to gate drivers. Industrial -40C to +100C junction rating and 60 nm process tolerance match factory-floor thermal environments.
Recommended
Low-Cost Wireless Backhaul
The EP4CGX30CF19C8 fits small-cell wireless backhaul because its 3.125 Gbps transceivers support CPRI up to option 4 (2.4576 Gbps) for LTE radio-over-fiber links and short-haul GbE aggregation. The 1,105,920 bits of embedded memory buffer Ethernet frames between CPRI and GbE interfaces, while logic elements implement framer/deframer, MAC, and timing-distribution logic. Low static power suits outdoor PoE-powered installations.
Recommended
Test and Measurement Instrumentation
The EP4CGX30CF19C8 fits bench-top test instruments because its high user I/O count (150) and 3.125 Gbps transceivers support high-speed ADC/DAC interfacing, pattern generation, and protocol-aware BERT (bit-error-rate testing). The 1,105,920 bits of embedded memory store captured waveform segments, while 66 multipliers enable real-time FFT and DSP for spectrum analysis. The 324-FBGA package supports standard 0.1 inch pitch fanout on 4-layer PCBs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF19C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF19C7 | EP4CGX30CF19C7N | EP4CGX30CF19C6N | EP4CGX30CF19C6 | EP4CGX22CF19C8 | EP4CGX22CF19C8N |
|---|---|---|---|---|---|---|---|
| Package | 324-FBGA (F19) | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same | 324-FBGA (F19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 - same | 29,440 - same | 29,440 - same | 29,440 - same | 21,600 (-27%) | 21,600 (-27%) |
| Speed Grade | 8 (commercial) | 7 (faster) | 7 (faster) | 6 (fastest) | 6 (fastest) | 8 - same | 8 - same |
| Lead-Free (N suffix) | No (leaded finish) | No | Yes | Yes | No | No | Yes |
| Embedded Memory | 1,105,920 bits | 1,105,920 bits - same | 1,105,920 bits - same | 1,105,920 bits - same | 1,105,920 bits - same | 783,360 bits (-29%) | 783,360 bits (-29%) |
| Embedded Multipliers (18x18) | 66 | 66 - same | 66 - same | 66 - same | 66 - same | 40 (-39%) | 40 (-39%) |
| User I/O Pins | 150 | 150 - same | 150 - same | 150 - same | 150 - same | 150 - same | 150 - same |
| Transceivers (max) | 8 @ 3.125 Gbps | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same |
Key Differentiators
- Higher logic density than EP4CGX22CF19C8 with same footprint (vs EP4CGX22CF19C8)
- Cost-optimized commercial speed grade 8 (vs EP4CGX30CF19C7)
- Drop-in compatible with lead-free N variants for RoHS compliance (vs EP4CGX30CF19C8N)
Design Notes
Decouple every VCCINT and VCCIO rail with 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls, plus bulk 10-22 uF tantalum or polymer caps. The 1.2 V core rail typically draws 200-500 mA at full logic utilization; use a switching regulator followed by an LDO for transceiver PLLs (2.5 V VCCHIP and 1.2 V VCCR/L rails each require separate filtering). Cyclone IV GX power estimator in Quartus Prime yields design-specific rail currents before layout.
At 100% logic utilization with 8 active transceivers at 3.125 Gbps, total power can reach 2-3 W on EP4CGX30CF19C8. The 324-FBGA package requires thermal vias beneath the central ball grid (per Intel AN 315) to extract heat to inner PCB copper planes. For enclosed industrial enclosures, reduce ambient temperature by 10-15°C below datasheet maximum (100°C junction) to maintain margin over transceiver-induced self-heating.
Route the 8 transceiver differential pairs (each Rx and Tx) with 100 ohm differential impedance and matched lengths within 150 mils. Maintain 3W spacing between transceiver pairs and other high-speed signals to minimize crosstalk. Use AC-coupled capacitors (0.1 uF) on each serial link; reference Intel Cyclone IV GX handbook chapter 4 for protocol-specific coupling networks. Ground reference planes must be continuous under transceiver channels.
Do not connect unused GPIO to GND if the Quartus Prime pin assignment marks them as 'Reserve' - leave them floating per Intel pin connection guidelines, or signal integrity issues arise on adjacent signals. Ensure the MSEL[2..0] bootstrap pins are correctly pulled for the desired AS/PS/JTAG mode. Configuration errors from incorrect MSEL settings are the most common first-time bring-up failure on Cyclone IV GX designs.
Compliance Information
RoHS compliant per Altera/Intel product page. C8 suffix indicates standard lead finish (not Pb-free); for lead-free RoHS-compliant manufacturing use EP4CGX30CF19C8N variant. Not AEC-Q100 qualified - automotive designs should consult Intel automotive-grade FPGA offerings.
