EP4CGX30CF19C7N - Cyclone IV GX FPGA 29.4K LE | Intel
MPN: EP4CGX30CF19C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $101.48 | $101.48 |
| 10 | $92.45 | $924.50 |
| 100 | $82.18 | $8,218.00 |
| 500 | $74.6 | $37,300.00 |
| 1,000 | $68.95 | $68,950.00 |
EP4CGX30CF19C7N Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader programmable logic device (PLD) hierarchy alongside complex PLDs (CPLDs) and structured ASICs. The Cyclone IV GX family specifically targets applications requiring integrated transceivers for serial connectivity at modest cost and power budgets.
Key specifications include 29,440 logic elements, 66 embedded 18x18 multipliers, 4 transceivers supporting up to 3.125 Gbps data rates, 66 embedded memory blocks (M9K) totaling 1,105,920 bits, 150 maximum user I/Os, and 8 phase-locked loops (PLLs). The device supports 1.0V, 1.2V, 2.5V, 3.3V, and differential I/O standards, making it suitable for bridging between legacy parallel buses and modern serial protocols. Industrial temperature grade parts are designated with an "I" suffix in the ordering code.
The EP4CGX30CF19C7N uses a 60nm low-power process technology with 1.2V core voltage, achieving substantially lower static power than the prior Cyclone III generation. Integrated transceivers eliminate the need for external PHY chips in designs using PCI Express, Gigabit Ethernet, or Serial RapidIO, reducing both BOM cost and PCB complexity. The 324-ball FBGA package provides high pin density required for the 150 user I/Os and transceiver channels.
Typical applications include industrial motor control, video surveillance and image processing, automotive driver assistance systems, wireless base station baseband processing, PCI Express endpoint cards, and protocol bridging between serial and parallel interfaces. The combination of logic density, embedded memory, and transceivers makes the device particularly suited for mid-volume applications that require hardware acceleration without the cost of ASIC NRE.
When designing with the EP4CGX30CF19C7N, attention to transceiver channel placement is critical: the four transceiver channels occupy dedicated pins (GXB_TX/RX) on the package periphery and must be routed with controlled impedance differential pairs and AC coupling capacitors per Intel reference designs. Power sequencing between the 1.2V core, 2.5V/3.3V I/O, and transceiver analog supplies must follow the datasheet-specified order to prevent latch-up.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not consolidated in the manufacturer datasheet, helping procurement and design engineers evaluate EP4CGX30CF19C7N for cost-sensitive FPGA-based designs.
Drop-in alternatives for EP4CGX30CF19C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF19C7N (same form factor and footprint) β differing in Package, Operating Temperature, Transceivers, Speed Grade, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX30CF19C7
β Drop-Inβ In Stock
$82 / Unit
View Datasheet βEP4CGX30CF19C6N
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$85 / Unit
View Datasheet βEP4CGX30CF19C6
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$20.75 / Unit
View Datasheet βEP4CGX50CF19C7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX22CF19C7N
β Drop-Inβ In Stock
$53.1 / Unit
View Datasheet βEP4CGX30CF19I7N
β Drop-Inβ In Stock
$76.4 / Unit
View Datasheet βEP4CGX30CF19C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Embedded Memory (bits) | 1,105,920 |
| Embedded Memory Blocks (M9K) | 66 |
| Embedded 18x18 Multipliers | 66 |
| Maximum User I/Os | 150 |
| Transceivers | 4 channels, up to 3.125 Gbps |
| PLLs | 8 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power |
| Package | 324-ball FBGA (F19) |
| Operating Temperature | 0 C to +85 C (commercial) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP4CGX30CF19C7N 324-ball fbga (f19) Pin Configuration Guide
Pin configuration for EP4CGX30CF19C7N (324-ball fbga (f19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX30CF19C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX30CF19C7N is suitable for 6 applications: Industrial Motor Control and Factory Automation, PCI Express Endpoint Card Design, Video Surveillance and Image Processing, Wireless Base Station Baseband Processing, Automotive Driver Assistance Systems, Protocol Bridging and Industrial Networking.
Industrial Motor Control and Factory Automation
The EP4CGX30CF19C7N's 29,440 logic elements, 66 dedicated 18x18 multipliers, and 4 integrated transceivers make it well-suited for industrial motor control and factory automation. The multipliers implement field-oriented control (FOC) and space-vector PWM (SVPWM) loops in hardware, achieving sub-microsecond current-loop latency for servo drives and three-phase inverters. The transceiver channels connect directly to RS-485, PROFIBUS, or EtherCAT PHYs at multi-megabit rates, while the 150 user I/Os drive gate-driver signals and read back resolver/encoder feedback. Estimated: at 100 MHz system clock, a single EP4CGX30 instance can handle two independent FOC axes with current loop bandwidths above 10 kHz.
Recommended
PCI Express Endpoint Card Design
The 4 integrated transceiver channels of the EP4CGX30CF19C7N support PCI Express Gen1 x1 and x2 endpoint applications without external PHY cost. With 29,440 logic elements and 66 hardware multipliers, the FPGA can implement the PCIe IP core plus application-layer data processing such as DMA engines, protocol accelerators, or signal-conditioning front-ends. According to the Cyclone IV GX handbook, the soft PCIe IP occupies roughly 4K-6K logic elements, leaving 20K+ LE for application code. The 324-ball FBGA provides sufficient I/O for 4-lane PCIe edge connector plus side-band signals and user LEDs/buttons.
Recommended
Video Surveillance and Image Processing
The EP4CGX30CF19C7N handles HD video processing pipelines including image resizing, color-space conversion, edge detection, and JPEG/H.264 pre-processing for video surveillance systems. Its 1,105,920 bits of embedded RAM (66 M9K blocks) buffer multiple video frames in on-chip memory, eliminating the need for external SDRAM in entry-level designs. The 66 multipliers accelerate convolutional filters and motion-detection kernels in real time at 1080p60 resolution. The 4 transceivers can serialize camera sensor data from MIPI-CSI through external bridge chips or stream processed video over Gigabit Ethernet to a backhaul recorder.
Recommended
Wireless Base Station Baseband Processing
Small-cell and picocell base stations use the EP4CGX30CF19C7N to implement CPRI/OBSAI baseband processing, digital upconversion (DUC), and digital downconversion (DDC) functions for LTE and small-cell radio units. The 4 transceivers handle CPRI links up to 3.072 Gbps carrying IQ samples between baseband and radio units, while the 29K logic elements and 66 multipliers run crest-factor reduction (CFR) and digital pre-distortion (DPD) algorithms to improve PA linearity. The wide industrial temperature-grade option (I7N) is available on the same F19 footprint for outdoor radio unit deployments.
Recommended
Automotive Driver Assistance Systems
The EP4CGX30CF19C7N supports ADAS applications such as front-view camera processing, surround-view stitching, and radar pre-processing. The FPGA aggregates data from multiple CSI-2 camera sensors via deserializer ICs, performs lane-departure warning and object-detection pre-processing using the 66 hardware multipliers, and outputs results over CAN-FD or Automotive Ethernet PHYs. The industrial temperature variant (-40C to +100C) ensures operation under automotive environmental conditions. The 4 integrated transceivers can drive two Automotive Ethernet channels or a single Radar sensor link at multi-gigabit rate.
Recommended
Protocol Bridging and Industrial Networking
Industrial gateways leverage the EP4CGX30CF19C7N to bridge between legacy fieldbus protocols (PROFIBUS, Modbus RTU, CAN) and modern Ethernet-based protocols (PROFINET, EtherCAT, EtherNet/IP). The 150 user I/Os handle multiple parallel fieldbus channels with hardware-accelerated protocol stacks, while the 4 transceivers provide dual Gigabit Ethernet ports with IEEE 1588 timing. The FPGA's deterministic latency and on-chip memory enable precise protocol conversion at sub-100-microsecond update rates required by motion-control networks. The wide operating temperature and integrated transceivers eliminate the need for external industrial-PHY silicon.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF19C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF19C7 | EP4CGX30CF19C6N | EP4CGX50CF19C7N | EP4CGX22CF19C7N | EP4CGX30CF19I7N |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (F19) | 324-ball FBGA (F19) - same | 324-ball FBGA (F19) - same | 324-ball FBGA (F19) - same | 324-ball FBGA (F19) - same | 324-ball FBGA (F19) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 49,888 | 21,680 | 29,440 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 2,162,688 | 783,360 | 1,105,920 |
| 18x18 Multipliers | 66 | 66 | 66 | 125 | 40 | 66 |
| Transceivers (3.125 Gbps) | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 150 | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | C7 | C7 - same | C6 (~15% lower Fmax) | C7 - same | C7 - same | C7 - same |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
Key Differentiators
- Integrated 3.125 Gbps transceivers eliminate external PHY cost (vs EP4CE55F29C8N (Cyclone IV E, no transceivers))
- Lowest unit cost in Cyclone IV GX family with 4 transceivers (vs EP4CGX50CF19C7N (same family, higher density))
- Pin-compatible scalability within F19 package family (vs EP4CGX110CF23C7N (F23 package, different ball map))
Design Notes
The EP4CGX30CF19C7N requires at least three independent supply rails: 1.2V VCCINT (core), 2.5V VCCAUX (PLL/auxiliary), and 3.3V or 2.5V VCCIO (per bank). The transceiver analog supplies VCCA_GXB (2.5V) and VCCH_GXB (3.3V) must be low-noise LDOs with sub-100 mV pk-pk ripple to meet the 3.125 Gbps eye-mask specifications per the Cyclone IV GX handbook. Power sequencing: VCCINT must rise before or simultaneously with VCCAUX, and VCCAUX must rise before or simultaneously with VCCIO to prevent I/O latch-up. Bulk decoupling needs at least 4x 47 uF tantalum plus 22x 0.1 uF X7R ceramic capacitors placed close to the package balls.
The 324-ball FBGA F19 package uses a 1.0 mm ball pitch on a 19 mm body, requiring microvia (laser-drilled) PCB stack-up on at least 4-2-4 layers to escape the inner balls without dog-bone fanout violations. Each transceiver channel requires matched-length (within 150 mil differential pair length matching) AC-coupled differential pairs routed with 85-ohm differential impedance and 4+ ground vias per via transition. Per the Cyclone IV GX PCB layout guidelines, place the 0.1 uF AC coupling capacitors within 250 mil of the GXB transmitter pins and add a continuous ground reference plane under all transceiver traces to control impedance and reduce crosstalk.
Do not confuse the EP4CGX30CF19C7N with the EP4CGX30BF14C7N: the F19 suffix designates the 324-ball FBGA package with 150 user I/Os, while BF14 designates the smaller 169-ball FBGA with only 81 user I/Os and reduced transceiver count. The two packages have completely different pin assignments and ball maps - designs cannot be migrated between them without PCB re-layout. Also confirm the configuration mode (AS, PS, JTAG, or Fast Passive Parallel) matches your system boot requirements before PCB fabrication, since CONF_DONE, nSTATUS, and MSEL pins must be strapped correctly for the chosen mode.
Estimated: At 100% logic utilization with 4 active transceivers at 3.125 Gbps and 150 MHz LVCMOS I/O switching, the EP4CGX30CF19C7N dissipates approximately 2.5-3.5 W in a typical design. The 324-ball FBGA has a theta_JA of approximately 18 C/W with 4 thermal balls connected to the inner ground/power planes (forced-air 200 LFM airflow). Without forced airflow and with only 4 thermal vias, theta_JA rises to ~32 C/W and junction temperature can reach 110C in a 70C ambient environment. For continuous full-load industrial operation, attach a small heatsink or thermal pad to the top of the package per the Cyclone IV GX thermal design guide.
Compliance Information
RoHS compliance confirmed by Altera/Intel product page. AEC-Q100 not qualified - select AEC-Q100 qualified parts for safety-critical automotive applications. Halogen-free status not explicitly stated in verified data.
