EP4CGX50CF27C8N - Cyclone IV GX FPGA, 50K LE, FBGA-672 | Intel
MPN: EP4CGX50CF27C8N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $155 | $1,550.00 |
| 100 | $142 | $14,200.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $125 | $125,000.00 |
EP4CGX50CF27C8N Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end user after manufacture. FPGAs sit in the programmable-logic branch of the digital IC hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs allow hardware iteration without respinning silicon, and unlike microcontrollers they implement logic in dedicated parallel hardware rather than running sequential firmware, achieving deterministic latency and high throughput.
Key features of the EP4CGX50CF27C8N include 3,118 LABs, 310 user I/O pins, 2.5 Mb of embedded SRAM, integrated 3.125 Gbps transceivers for protocols such as PCIe Gen1, Gigabit Ethernet, and Serial RapidIO, hardware multipliers for DSP, and eight PLLs for clock management. The device supports configuration via passive serial, active serial, JTAG, and Fast Passive Parallel modes, enabling flexible boot options. Cyclone IV GX devices are designed for power budgets below 1.5 W in typical designs while still providing the high-speed serial capability that distinguishes the GX family from the Cyclone IV E non-transceiver variant.
Architecturally, the Cyclone IV GX family shares the same core fabric as Cyclone IV E but adds 3.125 Gbps transceiver channels, 8B/10B encoders, PCIe hard IP, and a hard PCI Express Gen1 endpoint block. This integration makes the EP4CGX50CF27C8N attractive for designs that need both custom parallel logic and high-speed serial connectivity without resorting to a larger, more expensive transceiver-equipped FPGA such as Stratix.
Typical applications include industrial video processing and broadcast bridging, automotive driver assistance interfaces, PCIe endpoint cards, low-cost software-defined radio front ends, motor control and industrial automation, and display controllers for medical imaging. The combination of transceiver support, moderate logic density, and low power makes the Cyclone IV GX 50 device a frequent choice for protocol bridging and I/O expansion roles.
When designing with this device, ensure the FPGA power rails (VCCINT, VCCA, VCCD_PLL, VCCH_GXB for the transceivers) are sequenced per the datasheet to avoid latch-up, and that the transceiver reference clock meets the jitter requirements of the chosen protocol. Quartus II / Intel Quartus Prime is the primary toolchain, and the device is supported through Intel's Altera device legacy program since it is no longer recommended for new designs.
This page synthesizes distributor pricing, package-level alternatives from the Cyclone IV GX family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX50CF27C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX50CF27C8N (same form factor and footprint) β differing in Package, Transceivers, Mounting Type, Logic Elements, PLLs.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX50CF27I8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4CGX50CF27C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4CGX110DF31C8N
β Drop-Inβ In Stock
$325 / Unit
View Datasheet βEP4CGX150DF31C8N
β Drop-Inβ In Stock
$210 / Unit
View Datasheet βLFE5UM-45F-8BG554C
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX50CF27C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Family | Cyclone IV GX |
| Device | EP4CGX50 |
| Package | FBGA-672 (F27) |
| Logic Elements (LE) | 49,440 |
| Logic Array Blocks (LABs) | 3,118 |
| User I/O Pins | 310 (maximum) |
| Embedded Memory | 2,502 Kbit |
| PLLs | 8 |
| Transceivers | Up to 8 channels, up to 3.125 Gbps |
| Transceiver Protocols | PCIe Gen1, GigE, Serial RapidIO, Basic mode |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V (typical) |
| Configuration Modes | Passive Serial, Active Serial, JTAG, Fast Passive Parallel |
| Operating Temperature | Commercial (0C to +85C) |
| Speed Grade | 8 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-free per verified web data |
EP4CGX50CF27C8N fbga-672 (f27) Pin Configuration Guide
Pin configuration for EP4CGX50CF27C8N (fbga-672 (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX50CF27C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX50CF27C8N is suitable for 6 applications: PCIe Endpoint Card, Industrial Video Bridge, Motor Control and Industrial Automation, Software-Defined Radio Front End, Display Controller for Medical Imaging, Broadcast Audio/Video Router.
PCIe Endpoint Card
The EP4CGX50CF27C8N is well suited to low-cost PCI Express Gen1 endpoint cards because the device integrates a hard PCIe Gen1 endpoint IP block (2.5 Gbps, x1) plus up to eight 3.125 Gbps transceivers that can also serve GigE or Serial RapidIO. Its 49,440 logic elements and 2.5 Mb of embedded SRAM accommodate typical endpoint firmware including DMA engines, scatter-gather controllers, and custom register interfaces, while the 310 user I/O pins expose enough parallel GPIO for backplane or front-panel signaling. In this role the FPGA replaces a soft PCIe implementation, freeing logic for application code and dramatically simplifying timing closure.
Recommended
Industrial Video Bridge
The 49,440 logic elements, eight PLLs, and eight integrated 3.125 Gbps transceivers of the EP4CGX50CF27C8N make it a strong fit for industrial video format conversion and camera-to-host bridging. The device can ingest parallel camera-link or LVDS video streams, buffer frames in 2.5 Mb of embedded SRAM, and retransmit over GigE, 3G-SDI, or HDMI via external serializers. The 310 user I/O pins provide ample LVDS pairs for parallel video interfaces, and the 60 nm low-power process keeps junction temperature manageable in sealed industrial enclosures without forced-air cooling.
Recommended
Motor Control and Industrial Automation
In motor-control and industrial-automation systems, the EP4CGX50CF27C8N provides the parallel I/O and DSP bandwidth needed to drive three-phase inverters at high PWM frequencies while handling encoder feedback, current sensing, and fieldbus communication. The hardware 18x18 multipliers accelerate Park/Clarke transforms and field-oriented-control loops, and the eight PLLs generate precisely phased clocks for ADC sampling and PWM generation. Up to 310 user I/O pins accept multiple encoder channels, Hall sensors, and EtherCAT or SERCOS III transceiver interfaces.
Recommended
Software-Defined Radio Front End
The 3.125 Gbps transceivers and 49,440 logic elements of the EP4CGX50CF27C8N make it capable of implementing the digital front end of a software-defined radio, including DDC/DUC, channelization, and digital predistortion loops. The hardware multipliers accelerate FIR filters and FFT butterflies, while 2.5 Mb of embedded memory accommodates buffer stages between the ADC/DAC and the host interface. The commercial temperature grade and 60 nm low-power process allow sealed SDR enclosures without active cooling, useful for portable and outdoor radio deployments.
Recommended
Display Controller for Medical Imaging
The EP4CGX50CF27C8N serves as a display timing controller and pixel processor for diagnostic imaging displays, where 310 user I/O pins drive multi-lane LVDS output to high-resolution LCD panels and the embedded SRAM buffers frame data for pipelined pixel processing. The eight transceivers support DVI/HDMI input from imaging sources, and the hardware multipliers accelerate gamma correction and DICOM lookup-table transforms. Commercial temperature grade is sufficient for hospital-room environments, and the FBGA-672 package's thermal performance allows passive heatsink attachment.
Recommended
Broadcast Audio/Video Router
In broadcast router and switcher applications, the EP4CGX50CF27C8N aggregates multiple 3G-SDI or HD-SDI streams via its eight transceivers, performs audio embedding/de-embedding and genlock, and outputs to a backplane via GigE or Serial RapidIO. The 49,440 logic elements support matrix sizes up to approximately 64x64 with embedded frame buffers, and the eight PLLs derive precise genlock references from incoming SDI streams. The 310 user I/O pins expose auxiliary GPIO for tally, RS-422 control, and front-panel switching, making this device a flexible broadcast fabric element.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX50CF27C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX50CF27I8N | EP4CGX50CF27C7N | EP4CGX110DF31C8N | EP4CGX150DF31C8N | LFE5UM-45F-8BG554C |
|---|---|---|---|---|---|---|
| Package | FBGA-672 (F27) | FBGA-672 (F27) | FBGA-672 (F27) | FBGA-672 (F31) | FBGA-672 (F31) | FBGA-554 |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Lattice ECP5 |
| Logic Elements / LUTs | 49,440 LE | 49,440 LE | 49,440 LE | 109,424 LE | 149,760 LE | 44,000 LUT |
| Embedded Memory | 2,502 Kbit | 2,502 Kbit | 2,502 Kbit | 5,490 Kbit | 6,480 Kbit | 3,747 Kbit |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps | Up to 4 channels, 3.125 Gbps |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Hard PCIe Gen1 Endpoint | Yes | Yes | Yes | Yes | Yes | Yes (x1/x2) |
Key Differentiators
- Integrated hard PCIe Gen1 endpoint IP block eliminates soft-IP logic utilization (vs LFE5UM-45F-8BG554C (Lattice ECP5))
- Maximum Cyclone IV GX user I/O count for parallel interfaces (vs EP4CGX50CF23C8N (F23 FBGA-484))
- Higher speed grade for faster Fmax on timing-critical paths (vs EP4CGX50CF27C7N (speed grade 7))
Design Notes
Estimated: VCCINT typical is 1.2 V for the Cyclone IV GX family, with VCCD_PLL at 1.2 V, VCCA at 2.5 V, and VCCH_GXB at 1.4 V for the transceiver lanes. A typical mid-utilization design with four active transceivers draws roughly 1.0-1.5 W from VCCINT, plus another ~0.4 W from VCCH_GXB. Always sequence power rails per datasheet guidelines (VCCINT before VCCA, VCCA before VCCH_GXB) to avoid latch-up; on/off sequencing can be enforced with simple MOSFET load switches driven by the earlier rail's PG output.
The FBGA-672 package's theta_JA depends heavily on PCB copper area and airflow. Estimated: with a JEDEC four-layer test board and still air, theta_JA is approximately 14 C/W; with 100 LFM airflow this drops to roughly 9 C/W. For a 1.5 W total dissipation, junction rise above ambient stays below 25 C in still air - acceptable for commercial 0C-85C operation. For continuous all-transceiver operation at high toggle rate, design for at least 100 LFM airflow or attach a small clip-on heatsink with thermal interface material.
The FBGA-672 uses a 1.0 mm ball pitch with 0.6 mm solder balls; PCB land pads should follow the Altera-recommended NSMD (Non-Solder Mask Defined) geometry of approximately 0.45 mm pad diameter with 0.55 mm solder mask opening. Use microvia-in-pad construction for the inner-row power/ground balls and standard 8-mil laser-drilled microvias for signal breakout. Maintain a continuous ground plane in the layer immediately beneath the BGA, and stitch the BGA's perimeter GND balls to that plane with multiple vias to control return-current paths for the high-speed transceivers.
Do not leave unused transceiver channels floating - terminate the unused GXB channels according to datasheet guidelines (typically powering the channel off and tying inputs to ground through the recommended coupling network). JTAG chain order matters when multiple devices share one programmer: configure the Quartus II chain file (cable.cdf) to match physical board order, otherwise programming will silently fail. Also note that the 'C8N' speed grade 8 designation requires Quartus II timing constraints calibrated for 8 - do not reuse timing constraints from a speed-grade 7 build.
Transceiver channels (VCCH_GXB) require differential trace impedance of 100 ohms with matched length within 150 mils of P and N. Route transceiver pairs on the top layer over a continuous ground plane and avoid crossing any plane splits; keep AC-coupling capacitors close to the FPGA transmit pins and within 100 mils of the receiver pins for the channel. Reference clock traces (REFCLK_p/n) should also be 100-ohm differential, with length matching to within 25 mils and routed away from switching signals such as PLL feedback or SDRAM clock to minimize deterministic jitter injection.
Compliance Information
Lead-free FBGA-672 package per verified web data from Lisleapex and Partstack listings. RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - choose automotive-grade FPGAs from Cyclone IV automotive line for vehicle applications.
