Intel

EP4CGX50DF27I8N - Cyclone IV GX FPGA, 49,888 LEs, 672-FBGA | Intel

MPN: EP4CGX50DF27I8N ✓ Active

In Stock Ships in 1-3 business days

1.2 V Vdss 672-ball FineLine BGA (F27) Package 20 Speed 2,562,048 Memory

From $58.9 USD / Unit

MOQ: 1 |

Price updated: 2026-09-10

Volume Pricing

Qty	Unit Price	Extended
1	$87.5	$87.50
10	$79.2	$792.00
100	$71.8	$7,180.00
500	$64.4	$32,200.00
1,000	$58.9	$58,900.00

ℹ️ All prices are in USD

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EP4CGX50DF27I8N Overview

The Intel EP4CGX50DF27I8N is a Cyclone IV GX field-programmable gate array (FPGA) delivering 49,888 logic elements, 2,562,048 bits of embedded memory, and integrated 3.125 Gbps transceivers, fabricated on a low-power 60 nm process and housed in a 672-ball FineLine BGA package. The device is built around a 1.2 V core supply with 1.0 V / 2.5 V / 3.3 V I/O bank support and provides 310 user I/O pins, making it suitable for high-density, transceiver-based digital systems.

An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be configured by the end user after manufacture. The Cyclone IV GX family sits in the low-power, transceiver-enabled segment of Intel's programmable-logic portfolio, combining programmable logic, embedded multiplier/DSP blocks, embedded M9K memory blocks, hard PCI Express Gen1 controllers, and multi-gigabit transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs and older SPLD architectures; they are used when deterministic parallel processing, custom I/O protocols, or hardware acceleration are required.

Key features include 3.125 Gbps transceiver channels, 200 embedded 18 x 18 multipliers, 2,562,048 bits of user-accessible RAM distributed across 250 M9K blocks, 4 PLLs, and 20 global clock networks. The device supports PCI Express Gen1 x1/x2/x4 hard IP, external memory interfaces up to DDR2 SDRAM at 200 MHz, and hot-socketing capability. The I8 speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment designs.

From an architectural perspective, the EP4CGX50DF27I8N uses an SRAM-based LUT fabric with 8-input fracturable look-up tables, dedicated routing channels, and hard IP blocks for memory controllers and transceivers. The 60 nm process delivers static power low enough for fan-less embedded platforms, while the transceiver PHY provides 8b/10b encoding, word alignment, and rate-matching logic.

Typical applications include industrial video broadcast and image processing, telecom line cards with backplane SERDES, low-cost PCIe endpoint cards, motor control, and protocol-bridging mezzanines. The wide temperature range also suits outdoor industrial enclosures and test-and-measurement equipment.

When designing with this FPGA, careful power-rail sequencing is required because the 1.2 V core and 2.5 V/3.3 V auxiliary supplies must ramp in a defined order to avoid in-rush latch-up. The transceiver reference clocks demand jitter-cleaner PLLs and well-decoupled analog supplies; isolate the analog and digital ground returns with a single tie-point under the BGA.

This page synthesizes distributor pricing, drop-in same-package alternatives from the same Cyclone IV GX family, and practical board-level design notes that go beyond the manufacturer datasheet itself.

Drop-in alternatives for EP4CGX50DF27I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX50DF27I8N (same form factor and footprint) — differing in Package, Embedded Memory, Operating Temperature, PLLs, Process Technology.

EP4CGX110DF27I7N

Intel

Package: 672-ball FBGA, 1.0 mm pitch

Operating Temperature: -40C to +100C (Industrial)