EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel
MPN: EP4SGX110DF29C2XG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1575.89 | $1,575.89 |
| 10 | $1489.5 | $14,895.00 |
| 100 | $1395 | $139,500.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1265 | $1,265,000.00 |
EP4SGX110DF29C2XG Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA.
Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels.
Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups.
When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.
Drop-in alternatives for EP4SGX110DF29C2XG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110DF29C2XG (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Mounting Type, Adaptive Logic Modules (ALM).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX230DF29C2X
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX290DF29C2X
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX110DF29C2XG Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 40 nm |
| Logic Elements (LEs) | 105,600 |
| Total Memory Bits | 9,793,536 |
| User I/O Count | 372 |
| Package | 780-FCBGA (29 mm) |
| Mounting Type | Surface Mount |
| Multi-Gigabit Transceivers | Yes (GX series, hard PCS) |
| Embedded DSP Blocks | Yes (variable-precision) |
| External Memory Interface | DDR/DDR2/DDR3, QDR II/II+, RLDRAM II |
| Hard PCIe IP | Yes (PCIe Gen1/Gen2 hard IP) |
| Configuration Method | FPGA configuration flash / JTAG |
| RoHS Status | Compliant |
EP4SGX110DF29C2XG 780-fcbga (29 mm) Pin Configuration Guide
Pin configuration for EP4SGX110DF29C2XG (780-fcbga (29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110DF29C2XG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110DF29C2XG is suitable for 7 applications: Software-Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridge, ASIC Prototyping and Emulation, High-End Test & Measurement Instrumentation, Radar and Beamforming Signal Processing, Video Broadcast and Image Processing, Industrial High-Speed Control Systems.
Software-Defined Radio (SDR) Baseband
The EP4SGX110DF29C2XG's multi-gigabit transceivers interface directly to JESD204B/C ADCs and DACs used in wideband SDR baseband cards, while its variable-precision DSP blocks execute channelization, decimation, and digital down-conversion (DDC) chains in hardware. The 105,600 LEs and 9.79 Mbits of embedded memory buffer ADC capture across multiple antennas, and the hard PCIe Gen2 IP links the FPGA to a host CPU for higher-layer baseband processing. With 372 user I/Os the device exposes LVDS pairs for backplane synchronization.
Recommended
High-Speed Serial Protocol Bridge
Used as a bridge between PCIe Gen2, Serial RapidIO, 10G Ethernet, and custom backplane protocols, the EP4SGX110DF29C2XG integrates hard PCS channels that close timing at 6.375 Gbps line rates without soft-IP overhead. Its 105,600 LEs handle protocol state machines and DMA, while the 780-FCBGA package preserves signal integrity on multi-gigabit lanes. Engineers use this configuration in telecom base-station line cards and protocol-conversion ASICs.
Recommended
ASIC Prototyping and Emulation
The 105,600 logic elements of the EP4SGX110DF29C2XG combined with 9.79 Mbits of embedded memory make it a viable target for ASIC prototyping of mid-complexity SoCs. Designers partition the ASIC RTL across multiple Stratix IV GX FPGAs using TimeGen or HapsCheck timing closure tools, with the integrated multi-gigabit transceivers modelling chip-to-chip SerDes at near-SoC line rates. The 780-FCBGA package exposes enough user I/Os to bring out ASIC peripherals for real-time verification.
Recommended
High-End Test & Measurement Instrumentation
Test instruments such as protocol analyzers, oscilloscopes, and bit-error-rate testers rely on the EP4SGX110DF29C2XG to capture and generate multi-gigabit serial traffic in real time. Its variable-precision DSP blocks perform on-the-fly decoding, error counting, and pattern matching, while 9.79 Mbits of embedded memory buffer acquisition captures. The 780-FCBGA package supports fine BGA fan-out to high-pin-count probe fixtures and high-speed connector backplanes.
Recommended
Radar and Beamforming Signal Processing
In phased-array and MIMO radar front-ends the EP4SGX110DF29C2XG implements beamforming weight calculation, pulse compression, and CFAR detection directly in its variable-precision DSP blocks. The 9.79 Mbits of embedded memory store range-Doppler maps across multiple PRIs, and the integrated multi-gigabit transceivers distribute digitized sub-array data across the backplane. The 372 user I/Os expose LVDS synchronization lines between array elements.
Recommended
Video Broadcast and Image Processing
Broadcast video routers and image-processing pipelines use the EP4SGX110DF29C2XG for real-time 3G-SDI/HD-SDI switching, color-space conversion, and scaling. Its 105,600 LEs handle multi-stream pixel pipelines, the 9.79 Mbits of embedded memory buffer line-rate frame buffers, and the integrated transceers transport SDI and HDMI streams without external PHYs. The 780-FCBGA package supports the high-pin-count parallel video buses used in broadcast routers.
Recommended
Industrial High-Speed Control Systems
Industrial motion controllers and machine-vision systems use the EP4SGX110DF29C2XG for sub-microsecond servo-loop processing and real-time image preprocessing. Its variable-precision DSP blocks execute multi-axis PID loops in hardware, the 9.79 Mbits of embedded memory buffer camera frames, and the multi-gigabit transceivers link to GigE Vision cameras over the CoaXPress or 10G Ethernet physical layers. The 780-FCBGA package handles dense encoder and GPIO routing.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110DF29C2XG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX230DF29C2X | EP4SGX290DF29C2X | EP4SGX110FF35C2X |
|---|---|---|---|---|
| Package | 780-FCBGA (DF29) | 780-FCBGA (DF29) - same | 780-FCBGA (DF29) - same | 1152-FCBGA (FF35) - different |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 105,600 | 228,000 | 290,000 | 105,600 |
| Embedded Memory | 9,793,536 bits | 17,133,312 bits | 21,041,664 bits | 9,793,536 bits |
| User I/O | 372 | 372 | 372 | 480 |
| Multi-Gigabit Transceivers | Yes (GX) | Yes (GX) | Yes (GX) | Yes (GX) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (C2) | Commercial (C2) | Commercial (C2) |
Key Differentiators
- Optimal price-density point for 100K-LE class designs (vs EP4SGX230DF29C2X)
- Same 780-FCBGA DF29 footprint across the Stratix IV GX family (vs EP4SGX110FF35C2X)
- Integrated multi-gigabit transceivers and hard PCIe IP (vs Cyclone IV GX (EP4CGX110DF27))
Design Notes
The 780-FCBGA package requires a multi-layer PCB stack-up with microvia or stacked-via technology to fan out from the 1.0 mm ball pitch. Use 8+ layers, with dedicated GND and PWR planes beneath the FPGA to control impedance for the multi-gigabit transceiver lanes. Reference the Stratix IV GX pin connection guidelines for recommended decoupling (typically 0.1 uF, 0.01 uF, and bulk caps on each transceiver analog rail).
Multi-gigabit transceiver channels in the Stratix IV GX series require 100-ohm differential routing with controlled length matching of better than 150 mils across P and N pairs. Use IBIS-AMI simulation for channel losses above 5 GHz, and place AC-coupling capacitors close to the FPGA transmitter pins. Verify TX pre-emphasis and RX equalization settings in Quartus II against the actual channel loss profile.
Do not assume the EP4SGX110DF29C2XG and EP4SGX110FF35 are interchangeable - they share the same die but use different packages (780-FCBGA vs 1152-FCBGA) and are NOT pin-compatible. The 'C2' suffix denotes commercial temperature grade (0C to +85C); for industrial (-40C to +100C) operation choose the 'I2' suffix variant. Quartus II software version compatibility must be checked - Stratix IV GX support requires Quartus II v10.0 or later with the Stratix IV device library installed.
Compliance Information
RoHS compliant per Altera (now Intel) part-number convention; 'G' suffix in the MPN denotes lead-free / RoHS-compliant assembly. C2 suffix denotes commercial temperature grade (0C to +85C); for industrial temperature range choose the I2 suffix variant. AEC-Q100 is not applicable to high-density FPGAs in this performance class.
