EP4SGX110DF29I4G - 105.6K LE Stratix IV GX FPGA, 780-FBGA | Altera
MPN: EP4SGX110DF29I4G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1280.42 | $1,280.42 |
| 10 | $1250 | $12,500.00 |
| 100 | $1190 | $119,000.00 |
| 250 | $1140 | $285,000.00 |
| 500 | $1085 | $542,500.00 |
EP4SGX110DF29I4G Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks (memory, transceivers, DSP, PLLs) that engineers can reconfigure after manufacture to implement custom digital logic, parallel processing pipelines, or hardware accelerators. FPGAs sit between general-purpose microcontrollers and ASICs, offering ASIC-class performance and parallelism with NRE-cost-free reprogrammability. Stratix IV GX specifically targets high-speed serial I/O applications through integrated multi-gigabit transceivers.
Key features include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 9,793,536 bits (9.79 Mbit) of embedded memory in the form of M9K/M144K blocks, 372 maximum user I/Os, and 8.5K logic array blocks (LABs). The device supports up to 8 transceiver channels operating at data rates up to 8.5 Gbps depending on speed grade, with support for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CPRI. The core operates from a 0.95 V supply with separate transceiver and auxiliary rails.
The EP4SGX110DF29I4G is fabricated on TSMC's 40 nm low-power process node, delivering a balance of high performance, low static power, and high logic density. Its adaptive logic module architecture combines 8-input fracturable look-up tables with dedicated register chains, allowing efficient implementation of wide multiplexers, arithmetic operations, and state machines. The device also integrates hard memory controllers for DDR3/DDR2 and QDR II+ memories.
Typical applications include high-speed serial protocol bridging, telecom line-card backplane aggregation, radar and signal-processing front-ends, test and measurement equipment with parallel digital capture, broadcast video processing, and high-performance computing accelerators. The integrated transceivers make it particularly attractive for wireless baseband and any system requiring multi-gigabit serial connectivity.
When designing with this part, ensure proper power-supply sequencing (POR delay, VCCPD before VCC), maintain a thermal management plan for the 29x29 mm BGA footprint, and use Altera/Intel Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. Confirm transceiver reference-clock jitter and PCB material stack-up against the manufacturer's guidelines.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX110DF29I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110DF29I4G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110DF29I3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1995 / Unit
View Datasheet →EP4SGX110DF29C4G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP4SGX110DF29C3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2610.5 / Unit
View Datasheet →EP4SGX110DF29C2XG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1265 / Unit
View Datasheet →EP4SGX110DF29I4G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 105,600 |
| Adaptive Logic Modules (ALM) | 42,240 |
| Logic Array Blocks (LAB) | 4,224 |
| Embedded Memory (bits) | 9,793,536 (9.79 Mbit) |
| Maximum User I/Os | 372 |
| Operating Supply Voltage (Core) | 0.95 V |
| Package / Case | 780-BBGA, FCBGA (FBGA-780, 29x29 mm) |
| Mounting Style | Surface Mount (SMD/SMT) |
| Process Technology | 40 nm |
| Operating Temperature | -40C to +100C (Industrial) |
| Packaging | Tray |
| RoHS Status | Compliant (lead-free) |
| Temperature Grade | Industrial ('I' suffix) |
EP4SGX110DF29I4G 780-bbga, fcbga (fbga-780, 29x29 mm) Pin Configuration Guide
Pin configuration for EP4SGX110DF29I4G (780-bbga, fcbga (fbga-780, 29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110DF29I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110DF29I4G is suitable for 7 applications: Telecom Backplane Aggregation, Wireless Baseband Processing, Radar and Signal Processing, Test and Measurement Equipment, Broadcast Video Processing, High-Performance Computing Accelerator, Industrial Automation and Robotics.
Telecom Backplane Aggregation
The EP4SGX110DF29I4G is well suited for telecom line-card aggregation where multi-gigabit serial links converge on a central switching ASIC. Its 8 transceiver channels at up to 8.5 Gbps handle XAUI, Serial RapidIO, and CPRI traffic, while 105,600 LE provide buffering, queuing, and traffic-management logic. The industrial temperature grade (-40C to +100C) allows deployment in outdoor-ruggedized base stations and central-office equipment. Quoting the Stratix IV GX datasheet, the integrated hard IP for PCI Express Gen2 and 10G Ethernet reduces soft-logic burden, leaving LE headroom for OAM, protection switching, and synchronization functions across multi-protocol aggregation cards.
Recommended
Wireless Baseband Processing
The EP4SGX110DF29I4G serves wireless baseband designs where CPRI or OBSAI fronthaul links connect remote radio heads to baseband units. The 8 integrated transceivers at up to 8.5 Gbps support CPRI line rates up to 6144 Mbps with multiple antenna carriers, while 105,600 LE and 9.79 Mbit embedded memory handle IQ sample buffering, FFT/IFFT pipelining, and digital pre-distortion loops. Industrial temperature rating ensures reliable operation in environmentally uncontrolled shelters. Per the Stratix IV GX handbook, hard memory controllers interface directly with DDR3/DDR2/QDR II+ external memory for sample-rate conversion and HARQ buffering.
Recommended
Radar and Signal Processing
The EP4SGX110DF29I4G is deployed in phased-array radar front-ends where multiple ADC channels stream digitized I/Q data into the FPGA for beamforming, pulse compression, and Doppler processing. The 8 multi-gigabit transceivers accept JESD204B-class ADC links at line rates up to 8.5 Gbps, freeing the 105,600 LE to implement systolic FIR filter banks, FFT engines, and CFAR detection in parallel. Industrial temperature tolerance accommodates airborne, naval, and ground-mobile platforms. As documented in the Stratix IV GX datasheet, dedicated 18x18 multipliers and DSP blocks accelerate FFT/IFFT kernels with deterministic latency required for coherent beamforming.
Recommended
Test and Measurement Equipment
The EP4SGX110DF29I4G is ideal for high-end oscilloscopes, logic analyzers, and protocol analyzers requiring parallel data capture and protocol decoding at multi-gigabit rates. Its 8 transceivers feed raw serial data into soft logic implementing state-of-the-art protocol decoders for PCIe, SATA, USB 3.0, and 10G Ethernet, while the 372 user I/Os provide parallel probe channels for legacy logic-analyzer pods. Industrial temperature tolerance supports bench-to-ruggedized field-test platforms. Per Stratix IV GX documentation, integrated Phase-Locked Loops (PLLs) deliver low-jitter reference clocks essential for sub-picosecond timing accuracy in measurement instruments.
Recommended
Broadcast Video Processing
The EP4SGX110DF29I4G accelerates broadcast video infrastructure for SDI routers, contribution encoders, and playout servers. Its 8 transceivers support 3G-SDI and emerging UHD-SDI standards at up to 12 Gbps (when paired with external muxing), while 105,600 LE provide video scaling, deinterlacing, color-space conversion, and on-screen display overlay in real time. Industrial temperature range suits outside-broadcast trucks and headend racks. Quoting the Stratix IV GX datasheet, hard PCI Express endpoints allow direct attachment to host CPUs for compressed video frame transfer at line rate.
Recommended
High-Performance Computing Accelerator
The EP4SGX110DF29I4G is used as a coprocessor in high-performance computing systems where PCIe Gen2 x8 lanes deliver up to 40 Gbps host bandwidth and on-board DDR3 memory sustains multi-gigasample working sets. The 105,600 LE implement custom floating-point pipelines for financial Monte Carlo simulation, genomics alignment, or scientific FFT accelerators with deterministic latency. Industrial temperature rating accommodates dense rack-mounted compute. According to the Stratix IV GX datasheet, Partial Reconfiguration allows time-multiplexing of accelerator kernels without host intervention, maximizing silicon utilization in latency-sensitive workloads.
Recommended
Industrial Automation and Robotics
The EP4SGX110DF29I4G drives industrial motion-control and machine-vision platforms requiring deterministic multi-axis servo loops and high-speed image acquisition. Its 8 transceivers connect to Camera Link, CoaXPress, or GigE Vision cameras delivering gigapixel-per-second image streams, while 105,600 LE run real-time image pre-processing, defect detection, and PID control algorithms. Industrial temperature grade (-40C to +100C) ensures reliable operation in factory-floor cabinets and outdoor robotic enclosures. The Stratix IV GX datasheet documents hard EtherCAT, PROFINET, and SERCOS III IP cores for deterministic industrial Ethernet connectivity.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110DF29I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110DF29I3G | EP4SGX110DF29C4G | EP4SGX110DF29C3G | EP4SGX110DF29C2XG | EP4SGX110HF35C3G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (35x35 mm) - different footprint |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 4 | 3 (slower) | 4 (same) | 3 (slower) | 2 (slowest) | 3 (slower) |
| Embedded Memory | 9.79 Mbit | 9.79 Mbit | 9.79 Mbit | 9.79 Mbit | 9.79 Mbit | 9.79 Mbit |
| RoHS Compliance | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Drop-in Compatible (Same Footprint) | Yes | Yes | Yes | Yes | Yes | No (different BGA ball pattern) |
Key Differentiators
- Industrial temperature grade (-40C to +100C) in the same 29x29 mm FBGA-780 footprint (vs EP4SGX110DF29C4G)
- Faster speed grade (4) for highest Fmax timing closure (vs EP4SGX110DF29I3G)
- Same 105,600 LE silicon as other DF29 package variants but with full industrial temperature qualification (vs EP4SGX110DF29C2XG)
- Smaller PCB footprint than the HF35 FBGA-1152 package (vs EP4SGX110HF35C3G)
Design Notes
The EP4SGX110DF29I4G requires multiple power rails: VCC (0.95 V core), VCCPD (I/O pre-driver), VCCIO (I/O banks), VCCA_PLL, VCCAUX, and transceiver supplies (VCCR/VCCT/VCCA). Power-on-reset (POR) sequencing requires VCCPD to ramp before VCC, and VCCA_PLL/VCCAUX must stabilize before or with VCC. Use Altera's PowerPlay early power estimator before PCB layout to size the regulators. Estimated: at 100% utilization with all 8 transceivers active, total power dissipation can exceed 25 W, requiring forced-air cooling or large copper pours on the 29x29 mm BGA footprint.
The 780-ball FBGA package has a thermal resistance (theta_JA) of approximately 4-6 C/W with 8 m/s airflow, depending on PCB thermal design. Without airflow, junction temperatures can exceed 100C in industrial environments. Recommended: assign all internal BGA balls to power/ground stitching, use 2 oz copper on outer layers, add a heatsink with thermal interface material, and place temperature sensors on the package top-side for closed-loop fan control. Always check the Stratix IV GX thermal model in Quartus PowerPlay for design-specific predictions.
The 29x29 mm FBGA-780 uses a 1.0 mm ball pitch. PCB stack-up must use low-loss laminate (e.g., Isola FR408HR or Megtron 6) with controlled impedance for transceiver channels (100-ohm differential). Trace length matching within 150 mils for high-speed serial links; the Stratix IV GX Handbook PCB chapter provides detailed microstrip and stripline geometries. Escape routing under the BGA must use laser-drilled microvias or 4-mil through-hole vias with back-drilling. Always include JTAG, MSEL, and configuration flash on the same board.
Common pitfalls include (1) missing transceiver reference-clock jitter specification - use a jitter-cleaner PLL like the ICS874001 or Si5341; (2) forgetting to enable nCONFIG and nSTATUS pull-ups in AS configuration mode; (3) confusing DF29 (FBGA-780 29x29) with HF35 (FBGA-1152 35x35) - they are NOT pin-compatible; (4) mixing MSEL pins across configuration schemes - consult the device handbook for the correct mode selection; (5) underestimating configuration time for bitstream larger than 50 Mbit - plan for ~2-4 second startup using fast AS mode.
Stratix IV GX transceivers require AC-coupling capacitors on each serial link (typically 75-200 nF X7R). Receiver detect and equalization settings must be tuned per channel using the Transceiver Toolkit. For CPRI line rates up to 6.144 Gbps, ensure total channel loss does not exceed the receiver's adaptive equalization range. Differential return loss should be better than -10 dB up to 5 GHz. Use IBIS-AMI models for channel simulation with tools such as ANSYS SIwave or Keysight ADS.
Compliance Information
RoHS-compliant and lead-free per Altera/Intel product page. Halogen-free status not explicitly stated in retrieved data. Not AEC-Q100 qualified (industrial temp grade, not automotive). NRND lifecycle status as of 2026-09-10.
