Intel

EP4SGX70DF29C4G - Stratix IV GX FPGA, 72.6K LE, 780-FCBGA | Intel

MPN: EP4SGX70DF29C4G βœ“ Active
In Stock Ships in 1-3 business days
780-BBGA, FCBGA Package C4 (commercial) Speed 7,564,880 Memory
From $196.99 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $328.31 $328.31
10 $295.48 $2,954.80
100 $262.65 $26,265.00
500 $229.82 $114,910.00
1,000 $196.99 $196,990.00
ℹ️ All prices are in USD

EP4SGX70DF29C4G Overview

The Intel (Altera) EP4SGX70DF29C4G is a Stratix IV GX family Field Programmable Gate Array (FPGA) fabricated on a 40 nm process node, integrating 72,600 logic elements (LEs), 7,564,880 bits of embedded memory (approximately 7.2 Mbit), 372 user I/O pins, and 8 transceivers operating up to 8.5 Gbps in a 780-ball FCBGA (Flip-Chip Ball Grid Array) package. According to the Verified Web Data, the part is offered in a C4 commercial speed grade and is the latest-generation Intel/Altera Stratix IV part for high-bandwidth transceiver, memory-rich DSP, and ASIC-prototyping designs.

A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that contains an array of configurable logic blocks (CLBs) interconnected through programmable routing fabric, allowing hardware designers to implement arbitrary digital logic, DSP pipelines, or entire microprocessors after silicon manufacturing. Within the broader semiconductor taxonomy, FPGAs sit between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers/MCUs: they deliver ASIC-level performance and parallelism for high-throughput workloads while retaining the reprogrammability and short time-to-market of software-defined development.

Key differentiating features of the EP4SGX70DF29C4G include 8 integrated high-speed transceivers supporting data rates up to 8.5 Gbps, hard memory controllers for DDR/DDR2/DDR3 SDRAM, dedicated DSP blocks with variable-precision multipliers, up to 24 full-duplex CDR-based transceivers for serial connectivity, and a multi-gigabit serial link capability that targets protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and 10 GbE PHY interfaces. The 780-FCBGA package provides a 29 mm Γ— 29 mm body with 1.0 mm pitch, supporting high-density board designs with extensive pin access for memory and high-speed I/O fan-out.

Architecturally, Stratix IV GX combines a sea-of-gates logic fabric with dedicated MLAB (memory logic array block) memory, true dual-port RAM, embedded transceivers with adaptive equalization and pre-emphasis, and a centralized control plane. The 40 nm process enables higher integration at lower dynamic power than prior 65 nm Stratix III families. Designers typically use Quartus Prime (legacy Quartus II) development software with SOPC Builder / Platform Designer for system integration.

Typical applications for this part span high-end communications infrastructure (10/40 GbE MAC+PHY, OTN framer, CPRI baseband for base-station backhaul), high-fidelity broadcast video processing, ASIC prototyping, radar signal processing, test & measurement instrumentation, and military/aerospace signal processing where high transceiver count and large logic density are needed simultaneously. The wide memory capacity also makes it suitable for data-path buffering in packet processors and image pre-processing pipelines.

When designing with the EP4SGX70DF29C4G, careful PCB layout is essential for the high-speed serial channels: matched-length differential pairs, controlled impedance (100 Ξ© differential) routing, and proper ground-return stitching are required. The transceiver channels must be AC-coupled to external connectors or backplanes to avoid DC bias conflicts. Use the Quartus IBIS-AMI models and the Stratix IV GX Transceiver User Guide for link-budget validation, and ensure sufficient decoupling near the multi-rail power distribution network (PDN).

This page consolidates distributor inventory and pricing (DigiKey, Mouser, LCSC, Element14, Jotrin, Vyrian, FPGAkey), same-brand Stratix IV drop-in alternatives, and design resources that go beyond the manufacturer datasheet summary. Pricing reflects current market data as of 2026-09-10.

Drop-in alternatives for EP4SGX70DF29C4G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4SGX70DF29C4G (same form factor and footprint) β€” differing in Package, Speed Grade, Transceivers, Mounting Type, Operating Temperature.

Intel
Package: 780-FCBGA (29 mm)
Compare with EP4SGX70DF29C4G β†’
Intel
Mounting Type: Surface Mount (Flip-Chip BGA)
Operating Temperature: Commercial (0C to +85C) - per C3 grade suffix
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-ball FCBGA (DF29)
Speed Grade: C4
Transceivers: Up to 8.5 Gbps (GX)
Compare with EP4SGX70DF29C4G β†’
Altera
Operating Temperature: -40C to +100C (Industrial)
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-FBGA (29x29 mm)
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-ball FC-FBGA (DF29)
Speed Grade: C2 (lower-power commercial/industrial variant)
Transceivers: Up to 24 channels at 8.5 Gbps
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-BBGA, FCBGA (FineLine BGA)
Transceivers: Up to 16 channels, 600 Mbps - 8.5 Gbps
Mounting Type: Surface Mount (BGA)
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-ball FC-FBGA (29 x 29 mm)
Speed Grade: C4
Transceivers: 8 channels (GX)
Compare with EP4SGX70DF29C4G β†’
Intel
Speed Grade: -3
Mounting Type: Surface Mount (BGA)
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Intel
Package: 780-BBGA, FCBGA (29x29 mm)
Speed Grade: I4
Transceivers: Up to 8 multi-gigabit channels (per family)
Compare with EP4SGX70DF29C4G β†’
Intel
Package: 780-BBGA, FC-FBGA (DF29), 29 x 29 mm
Speed Grade: I4
Operating Temperature: -40C to +100C (industrial)
Compare with EP4SGX70DF29C4G β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4SGX70DF29C3G

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· Stratix IV GX Β· Intel (formerly Altera) Β· 72,600 Β· 7,564,880 Β· 372 Β· 0.9 V Β· 780-BBGA, FCBGA (FineLine BGA)

βœ“ In Stock

$1425 / Unit

View Datasheet β†’

EP4SGX70DF29C2XN

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· 72,600 Β· 2,904 Β· 7,564,880 bits Β· 372 Β· Up to 24 channels at 8.5 Gbps Β· 0.9 V Β· 40 nm

βœ“ In Stock

$2450 / Unit

View Datasheet β†’

EP4SGX70DF29C2XG

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· 72,600 Β· 7,564,880 bits Β· 372 Β· 40 nm Β· 0.9 V Β· 780-FBGA (29x29 mm) Β· Surface Mount

βœ“ In Stock

$1295 / Unit

View Datasheet β†’

EP4SGX110DF29C4G

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· 105,600 Β· 4,224 Β· 9,793,536 Β· 372 Β· 0.87 V to 0.93 V Β· 40 nm Β· 780-ball FCBGA (DF29)

βœ“ In Stock

$1495 / Unit

View Datasheet β†’

EP4SGX110DF29C3G

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· Stratix IV GX Β· 105,600 Β· 4,224 LABs Β· 9,793,536 Β· 372 Β· 780-BBGA, FCBGA (Flip-Chip) Β· 780

βœ“ In Stock

$2610.5 / Unit

View Datasheet β†’

EP4SGX110DF29C2XG

βœ… Drop-In
Intel
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· Intel (formerly Altera) Β· 40 nm Β· 105,600 Β· 9,793,536 Β· 372 Β· 780-FCBGA (29 mm) Β· Surface Mount

βœ“ In Stock

$1265 / Unit

View Datasheet β†’

EP4SGX110DF29I4G

βœ… Drop-In
Altera
πŸ“¦ 780-FCBGA (DF29)
Stratix IV GX Β· Intel (formerly Altera) Β· 105,600 Β· 42,240 Β· 4,224 Β· 9,793,536 (9.79 Mbit) Β· 372 Β· 0.95 V

βœ“ In Stock

$1085 / Unit

View Datasheet β†’

EP4SGX70DF29C4G Maximum Ratings & Electrical Characteristics

Series Stratix IV GX
Family Stratix IV
Logic Elements (LE) 72,600
Total Memory Bits 7,564,880
User I/O Count 372
Number of Transceivers 8
Transceiver Data Rate (max) 8.5 Gbps
Package Type 780-BBGA, FCBGA
Package Code BGA
Package Body Size 29 mm Γ— 29 mm
Ball Pitch 1.0 mm
Process Node 40 nm
Speed Grade C4 (commercial)
Mounting Type Surface Mount
RoHS Status Compliant

EP4SGX70DF29C4G 29 mm Γ— 29 mm Pin Configuration Guide

Pin configuration for EP4SGX70DF29C4G (29 mm Γ— 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

29 mm Γ— 29 mm package pinout diagram for EP4SGX70DF29C4G

No detailed pinout data available for EP4SGX70DF29C4G.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4SGX70DF29C4G is suitable for 7 applications: 10/40 Gigabit Ethernet Network Interface Cards, Wireless Base Station CPRI Baseband Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Image Manipulation, Radar and Military Signal Processing, Test and Measurement Instrumentation, High-Performance Computing (HPC) Acceleration Cards.

🌐

10/40 Gigabit Ethernet Network Interface Cards

The EP4SGX70DF29C4G's 8 integrated transceivers up to 8.5 Gbps and 72.6K logic elements make it well-suited for 10 GbE and 40 GbE MAC+PHY line-card designs, where 4 lanes at 10.3125 Gbps can drive a QSFP+ 40 GbE interface. The hard PCIe Gen2 endpoint and 7.56 Mbit embedded block memory enable packet buffering and QoS scheduling without external memory for short bursts. Designers typically instantiate the Altera 10GbE MAC IP with XAUI/CAUI-4 PMA variants, leveraging the 780-FCBGA DF29's 372 user I/Os for direct-attached memory and board interconnect. Compared to ASIC implementations, the FPGA provides rapid PMA reconfiguration for protocol experimentation (10GBASE-KR, KR4, CR4) and faster time-to-market for emerging Ethernet standards.

πŸ“±

Wireless Base Station CPRI Baseband Processing

The 8 transceivers at 8.5 Gbps align directly with CPRI Line Bit Rate Option 6 (6.144 Gbps) and 7 (9.830 Gbps) for LTE/WCDMA base-station backhaul between the radio equipment (RE) and the radio equipment controller (REC). The Stratix IV GX 72.6K LEs accommodate forward-error-correction (Turbo/LDPC) codecs, IQ sample buffering, and the digital up/down-conversion (DUC/DDC) pipelines required by 4G/LTE remote-radio-heads. Hard DDR3 controllers support high-bandwidth sample storage, while 372 user I/Os allow direct interface to ADC/DAC pairs (e.g., TI DAC5682Z, Analog Devices AD9125). Industrial-temperature variants exist in the same DF29 family for outdoor radio unit installations.

πŸ–₯️

ASIC Prototyping and Emulation

With 72,600 logic elements, 7.56 Mbit embedded memory, and 8 high-speed serial links, the EP4SGX70DF29C4G is well-positioned as a building block in multi-FPGA ASIC prototyping platforms where designs of 1-3 million ASIC gates are partitioned across multiple FPGAs. Designers use the 8 transceivers for chip-to-chip partitioning interconnect at 8.5 Gbps, often with Altera's SoftTouch or custom time-division-multiplexing protocols to bridge high-fanout ASIC nets. The 780-FCBGA package's 29 mm Γ— 29 mm body supports high-density socketed daughter cards, and the mature Quartus II design flow with synthesis from Verilog/VHDL/SystemVerilog enables rapid compile-and-test cycles. Compared to ASIC fabrication, FPGA prototyping cuts validation time from months to days.

πŸ“Ί

Broadcast Video Processing and Image Manipulation

The 7.56 Mbit embedded block memory and variable-precision DSP blocks of the EP4SGX70DF29C4G enable real-time SD/HD/3G-SDI video processing pipelines, including color-space conversion, deinterlacing, scaling, and frame-rate conversion. The 8 high-speed transceivers at 8.5 Gbps support HDMI 1.4/2.0 receivers, DisplayPort 1.2, and 12G-SDI standards through external reclockers. Designers build video overlay and PIP (picture-in-picture) systems with the on-chip RAM storing multiple frame buffers and the high-speed I/Os streaming pixel data into external DDR3 SDRAM. The 780-FCBGA DF29 footprint supports full 4K/8K-ready broadcast reference designs with multiple banks of DDR3.

✈️

Radar and Military Signal Processing

The combination of high DSP block density, large embedded memory, and 8 multi-gigabit transceivers in the EP4SGX70DF29C4G makes it ideal for radar front-end preprocessing such as digital beamforming, pulse compression, and CFAR detection. Industrial-temperature variants in the same DF29 family are used in military and aerospace applications including EW (electronic warfare), SIGINT, and phased-array radar systems. Designers implement FFT engines for synthetic-aperture radar (SAR) and moving-target-indication (MTI) processing, leveraging the Stratix IV's variable-precision DSP blocks for 18Γ—18 and 36Γ—36 multiplier modes. The transceivers interface to high-speed ADCs (e.g., TI ADC12D1800, Analog Devices AD9680) with JESD204B subclass-1 support on similar Stratix V families.

πŸ”§

Test and Measurement Instrumentation

The 8 high-speed transceivers of the EP4SGX70DF29C4G at 8.5 Gbps allow designers to build protocol-aware test equipment such as PCIe Gen2 analyzer cards, Serial RapidIO exercisers, and OTU2 optical-link BERT testers. The 7.56 Mbit embedded memory provides real-time pattern buffering for protocol-aware pattern generators and error counters without external memory. Designers instantiate the Altera Native PHY IP for adaptive equalization and link training with display via integrated JTAG or external USB-Blaster, all under Quartus Prime control. The DF29 780-FCBGA allows compact PXI/PXIe form-factor cards for production-line automated test equipment (ATE) with deterministic latency.

🏭

High-Performance Computing (HPC) Acceleration Cards

The PCIe Gen2 hard IP block of the EP4SGX70DF29C4G, combined with 72.6K LEs and DDR3 controllers, makes it a drop-in compute accelerator for HPC and machine-learning inference workloads in PCIe form-factor cards. Designers use OpenCL SDK for FPGA to compile kernel code to custom datapaths, accelerating Monte Carlo simulations, option pricing, and low-power CNN inference at the edge. The 8 transceivers support both PCIe Γ—4 host links and Aurora or 10 GbE side-channels for clustered HPC racks. Compared with GPU accelerators, the Stratix IV GX offers per-watt efficiency advantages for low-precision (INT8) inference at modest batch sizes.

What is the EP4SGX70DF29C4G and what series does it belong to?
The EP4SGX70DF29C4G is a Stratix IV GX Field Programmable Gate Array (FPGA) from Intel (formerly Altera), fabricated on a 40 nm process. It integrates 72,600 logic elements, 7,564,880 bits of embedded memory, 372 user I/Os, and 8 high-speed transceivers capable of up to 8.5 Gbps, all housed in a 780-ball FCBGA package. Per the Verified Web Data, it is offered in a commercial C4 speed grade for general-purpose and high-performance designs.
Where can I buy the EP4SGX70DF29C4G online at the best price?
According to the Verified Web Data (2026-09-10), the EP4SGX70DF29C4G is in stock and ships same-day at authorized distributors including DigiKey, Mouser, LCSC Electronics, Element14, Jotrin, Vyrian, FPGAkey, Digiode, Xilinx-Components, and LoveChip. LCSC lists the qty-1 unit price at $328.31 as of 2026-09-10. Always request a current quote for volumes above 100 pieces, as FPGA pricing is highly volume-sensitive.
What is the lead time for the EP4SGX70DF29C4G?
The Verified Web Data shows the EP4SGX70DF29C4G ships same-day (today) from DigiKey with active stock and immediate availability across major distributors as of 2026-09-10. Mouser and LCSC also list inventory in stock, while specialty distributors such as Jotrin and Vyrian provide quote-based pricing. Lead time is typically 4-8 weeks for direct factory orders through Intel's FPGA fulfillment channel for larger volumes.
What is the difference between the EP4SGX70DF29C4G and the EP4SGX70DF29C3G?
The EP4SGX70DF29C4G is the C4 commercial speed grade and the EP4SGX70DF29C3G is the C3 commercial speed grade of the same 72.6K-LE Stratix IV GX die in the identical 780-FCBGA DF29 package. The C3 speed grade is faster (lower logic delay) and targets timing-critical designs, while C4 is slower and slightly less expensive. Both parts are pin-compatible drop-in alternatives; only the speed grade suffix differs.
Is the EP4SGX70DF29C4G pin-compatible with the EP4SGX70DF29C2XN or EP4SGX70DF29C2XG?
Yes - the EP4SGX70DF29C2XN and EP4SGX70DF29C2XG are C2 speed-grade variants of the same Stratix IV GX 72.6K-LE die, sharing the identical 780-FCBGA DF29 footprint and pinout as the EP4SGX70DF29C4G. C2 is the slowest commercial grade and is typically used in cost-sensitive, non-timing-critical designs. All four variants (C2, C2N, C2X, C3, C4) are drop-in compatible on the same PCB.
When should I choose the EP4SGX70DF29C4G over the EP4SGX70DF29C3G?
Choose the EP4SGX70DF29C4G when your design meets timing closure at the C4 speed grade and you want the lower-cost option for a given volume commitment. Choose the EP4SGX70DF29C3G when your critical paths need the faster timing model or you want extra timing margin for safety. Both share the 780-FCBGA package and pinout, so PCB design and BOM are interchangeable.
What is the best drop-in replacement for the EP4SGX70DF29C4G?
The best drop-in replacement for the EP4SGX70DF29C4G is the EP4SGX70DF29C3G - the same 72.6K-LE Stratix IV GX die in the same 780-FCBGA DF29 package, but in the C3 commercial speed grade. It is bit-stream-compatible at the logic level with the same configuration bitstream, and only the speed grade timing model differs. Other pin-compatible variants include EP4SGX70DF29C2XN and EP4SGX70DF29C2XG (slower speed grades).
Where can I download the EP4SGX70DF29C4G datasheet PDF?
The official Intel/Altera datasheet, user guides, and pinout files for the EP4SGX70DF29C4G can be downloaded from the Intel FPGA documentation portal at https://www.altera.com/documentation/hco1356443928074.html. You can also access the Stratix IV GX Device Handbook and the pin-out (.pin) file for the DF29 780-FCBGA package from the same portal, or request a copy from authorized distributors.
Where can I find the pinout for the EP4SGX70DF29C4G?
The EP4SGX70DF29C4G pinout for the 780-ball FCBGA DF29 package is available in the Stratix IV GX Device Handbook pin-out tables and the DF29 .pin file in the Quartus Prime pin assignment tool. The package is a 29 mm Γ— 29 mm BGA with 1.0 mm ball pitch arranged in a grid; the official Intel/Altera documentation portal provides the .pin file along with signal name assignments and ball map images for the DF29 device variant.
Is the EP4SGX70DF29C4G the same as the EP4SGX110DF29C4G?
No - the EP4SGX70DF29C4G (72.6K LEs, 7.56 Mbit memory) and EP4SGX110DF29C4G (110K LEs, larger memory) are different Stratix IV GX family members in the same DF29 780-FCBGA package family but with different logic/memory densities and different bitstreams. They are not drop-in compatible at the bitstream level but share the same PCB footprint within the Stratix IV GX DF29 device family. Use the EP4SGX110 variant only when your design requires the larger logic capacity.
What is the maximum transceiver speed of the EP4SGX70DF29C4G?
The EP4SGX70DF29C4G integrates 8 high-speed transceivers rated for up to 8.5 Gbps operation, supporting common serial protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, CPRI for wireless backhaul, and OTU1/OTU2 optical transport. The transceivers include adaptive equalization, pre-emphasis, and CDR capabilities documented in the Stratix IV GX Transceiver User Guide. Per Verified Web Data, the maximum channel count is 8 transceivers.
Does the EP4SGX70DF29C4G support DDR3 SDRAM interfaces?
Yes, the EP4SGX70DF29C4G includes hard memory controllers that support external DDR, DDR2, and DDR3 SDRAM interfaces through its I/O subsystems, along with QDR II/II+ SRAM and RLDRAM II/III support. The 372 user I/Os and dedicated DQS (data strobe) pins enable multi-bank memory subsystems. Use the Quartus Prime MegaWizard Plug-In Manager to configure the external memory interface IP and validate timing with the board timing models.
What is the operating temperature of the EP4SGX70DF29C4G?
The operating temperature range for the EP4SGX70DF29C4G is not explicitly stated in the Verified Web Data and is marked as [DATA_NEEDED] in the specs. The 'C' in the speed-grade suffix indicates a commercial temperature grade (typically 0Β°C to +85Β°C junction temperature) for the Stratix IV family; industrial (-40Β°C to +100Β°C) variants carry an 'I' suffix and a different ordering code. Refer to the Stratix IV GX datasheet for the exact junction temperature limits and thermal resistance values for the 780-FCBGA package.
Is the EP4SGX70DF29C4G still in production or obsolete?
The EP4SGX70DF29C4G is currently listed as active and in stock across multiple authorized distributors (DigiKey, Mouser, LCSC, Element14, Jotrin) as of 2026-09-10 per the Verified Web Data. The Stratix IV family is a mature product line, so while it remains in production for existing designs, Intel recommends the newer Stratix V and Stratix 10 families for new high-performance FPGA designs. Existing designs with Stratix IV can continue to be sourced through authorized channels.
What development tools support the EP4SGX70DF29C4G?
The EP4SGX70DF29C4G is supported by Intel Quartus Prime design tools (legacy Quartus II), including Qsys/Platform Designer for system integration, MegaWizard Plug-In Manager for IP instantiation, the TimeQuest Timing Analyzer for static timing analysis, and the SignalTap II Logic Analyzer for on-chip debug. Per Verified Web Data, the part uses Altera (now Intel) design flow with .sof/.pof configuration bitstreams generated by Quartus. The Stratix IV device support is available in Quartus Prime Pro/Standard 16.0 and earlier versions.

Engineering reference data for EP4SGX70DF29C4G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4SGX70DF29C4G when your design needs 72.6K LEs with 8 transceivers at up to 8.5 Gbps in a 780-FCBGA DF29 package, and your timing paths close at the C4 commercial speed grade. Choose the EP4SGX70DF29C3G if you need extra timing margin for the same density. Choose the EP4SGX70DF29C2XN/C2XG if your design meets timing at C2 and you want the lowest-cost option. Choose the EP4SGX110DF29C4G/C3G when you need 110K LEs instead of 72.6K for more logic/memory headroom. Choose the EP4SGX110DF29I4G for industrial-temperature deployments. All variants share the same DF29 780-FCBGA footprint, so PCB layout and BOM are reusable across the family.

Comparison with Alternatives

Parameter This Product EP4SGX70DF29C3G EP4SGX70DF29C2XN EP4SGX70DF29C2XG EP4SGX110DF29C4G EP4SGX110DF29C3G EP4SGX110DF29C2XG EP4SGX110DF29I4G
Package 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same DF29 family 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same DF29 family 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same DF29 family 780-FCBGA (DF29), 29 mm Γ— 29 mm, 1.0 mm pitch - same DF29 family
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements (LE) 72,600 72,600 - same 72,600 - same 72,600 - same 110,000 110,000 110,000 110,000
Speed Grade C4 (commercial) C3 (faster) C2 (slower, N = lead-free) C2 (slower) C4 (commercial) C3 (faster) C2 (slower) I4 (industrial temp)
Number of Transceivers 8 8 - same 8 - same 8 - same 8 - same (some SKUs may differ) 8 - same 8 - same 8 - same
Max Transceiver Data Rate 8.5 Gbps 8.5 Gbps - same 8.5 Gbps - same 8.5 Gbps - same 8.5 Gbps - same 8.5 Gbps - same 8.5 Gbps - same 8.5 Gbps - same
User I/O Count 372 372 - same 372 - same 372 - same 372 - same 372 - same 372 - same 372 - same
Process Node 40 nm 40 nm - same 40 nm - same 40 nm - same 40 nm - same 40 nm - same 40 nm - same 40 nm - same

Key Differentiators

  • C4 speed grade offers timing-margin headroom over C2/C3 at lower price (vs EP4SGX70DF29C3G)
  • Higher LE density within the same DF29 PCB footprint (vs EP4SGX110DF29C4G)
  • Commercial temperature grade vs industrial variants (vs EP4SGX110DF29I4G)

Design Notes

The 780-FCBGA DF29 package has 1.0 mm ball pitch and requires high-density PCB layout: 8 transceiver channels at up to 8.5 Gbps demand 100 Ξ© differential impedance-controlled pairs with matched length to within Β±5 mil for a single channel. Use 12+ layer stack-up (microstrip or stripline) with continuous reference planes over each differential pair. Place AC-coupling capacitors (0.1 Β΅F 0402 X7R) within 200 mil of the FPGA TX/RX balls; missing capacitors cause link failures even with correct channel tuning.

Stratix IV GX devices require a multi-rail power distribution network: core voltage VCC (typically 0.9 V), VCCD_PLL (1.0 V), VCCPT (1.5 V), VCCAUX (2.5 V), VCCIO (1.2-3.0 V bank-dependent), and the transceiver VCCEHT_GXB (1.4 V). Use a sequencing controller such as the LM3880 or LTC2934 to enforce proper rail turn-on order (core before I/O before transceivers) - improper sequencing can damage the device. Decoupling must include 220 Β΅F bulk caps per rail and a high-density array of 0.1 Β΅F/0.01 Β΅F ceramic caps near the BGA balls.

The 8 transceivers require IBIS-AMI simulations for the channel and connector to validate the 8.5 Gbps link budget. Apply Stratix IV GX pre-emphasis settings (typically 4-tap) and adaptive equalization in the receiver. Pre-layout planning should target -8 dB channel loss at 4.25 GHz Nyquist frequency with under-3 dB return loss for the connector pair. Use the Altera Transceiver Toolkit (in Quartus II) for real-time link tuning once hardware is available. Crosstalk from adjacent high-speed signals can severely degrade margin - maintain 3W spacing between differential pairs in the breakout region.

Do not hot-swap the configuration JTAG chain while the device is in user mode - reset the FPGA before re-attaching an external programmer. Avoid using the EPCS or EPCQ flash devices for configuration if the design requires 100 ms startup time; use an EPCQ with appropriate compression mode instead. When porting designs from Stratix III to Stratix IV, verify PLL reference clock ranges and I/O standard compatibility - some legacy I/O standards (LVDS 2.5 V) require voltage-referenced termination that differs from Stratix IV recommendations. Configuration bitstream security should be enabled with AES-128 (256-bit optional) for production to protect IP.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGA family, automotive is not the primary target market). Lead-free packaging is standard for all 'G' and 'N' suffix variants. Halogen-free status and full conflict-minerals documentation should be requested from Intel's product compliance portal.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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