EP4SGX70DF29C2XG - Stratix IV GX FPGA, 72.6K LE, 780-FBGA | Intel
MPN: EP4SGX70DF29C2XG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1675 | $16,750.00 |
| 25 | $1525 | $38,125.00 |
| 50 | $1410 | $70,500.00 |
| 100 | $1295 | $129,500.00 |
EP4SGX70DF29C2XG Overview
A Field-Programmable Gate Array is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be customized after manufacture through a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and software-driven processors in the compute hierarchy - they deliver near-ASIC performance for parallel data-path workloads while retaining full design flexibility, which is critical for prototyping, low-volume production, and systems whose algorithms evolve in the field.
Key features include dedicated 8.5 Gbps transceivers for high-speed serial protocols such as PCIe Gen2 and XAUI, up to 7.56 Mbits of embedded RAM distributed across M20K and MLAB blocks, 364 18x18 multipliers for DSP operations, and hard memory controllers. The 40 nm process offers lower static power than 65 nm predecessors, while hard PCIe and serializer/deserializer blocks reduce logic consumption and improve timing closure.
Architecturally, the device pairs a programmable logic fabric with hardened peripheral blocks - transceivers, PCIe Gen2 IP cores, memory controllers, and DSP blocks - to offload common high-speed functions from soft logic. This heterogeneous integration enables single-chip implementations of mixed protocol designs that previously required a companion ASIC.
Typical applications include high-speed serial interface prototyping, radar and signal processing front ends, telecommunications line cards, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density, generous DSP resources, and embedded serial links makes it well suited to wire-speed packet processing and high-channel-count test instrumentation.
When designing with this device, allocate sufficient PCB layers and decoupling to maintain power integrity across the 0.9 V core rail, and use the Quartus II design software with the appropriate device support file to generate bitstreams. Verify signal-integrity margins on the 8.5 Gbps serial links using the Stratix IV GX transceiver kit.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX70DF29C2XG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX70DF29C2XG (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Mounting Type, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX110DF29C2XG
β Drop-Inβ In Stock
$1265 / Unit
View Datasheet βEP4SGX70DF29C3G
β Drop-Inβ In Stock
$1425 / Unit
View Datasheet βEP4SGX70DF29C4G
β Drop-Inβ In Stock
$196.99 / Unit
View Datasheet βEP4SGX70DF29C2G
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX230DF29I3N
β Drop-Inβ In Stock
$1480 / Unit
View Datasheet βEP4CGX75DF27I7N
β Drop-Inβ In Stock
$58.75 / Unit
View Datasheet βEP4SGX70DF29C2XG Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 72,600 |
| Embedded Memory | 7,564,880 bits |
| Maximum User I/O | 372 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 780-FBGA (29x29 mm) |
| Mounting Type | Surface Mount |
| Transceiver Speed | Up to 8.5 Gbps |
| DSP Blocks (18x18 Multipliers) | 364 |
| Operating Temperature Range | -40C to +85C (commercial) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Tray Packaging | Yes |
EP4SGX70DF29C2XG 780-fbga (29x29 mm) Pin Configuration Guide
Pin configuration for EP4SGX70DF29C2XG (780-fbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX70DF29C2XG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX70DF29C2XG is suitable for 7 applications: High-Speed Serial Interface Prototyping, Telecommunications Line Cards, Radar and DSP Signal Processing, Broadcast Video Processing, ASIC Prototyping Platforms, Test and Measurement Instrumentation, Industrial Automation Controllers.
High-Speed Serial Interface Prototyping
The EP4SGX70DF29C2XG fits high-speed serial interface prototyping because it integrates up to 8.5 Gbps transceivers with hardened PCIe Gen2, XAUI, and Serial RapidIO IP cores. Designers can implement multi-protocol PHY validation, link training, and SerDes margin testing on a single FPGA without companion ASSPs. The 72,600 LEs and 364 18x18 DSP multipliers support simultaneous PHY plus protocol-state-machine logic; place the FPGA between a reference clock and SMA connectors with 0.9 V core supply decoupling per the Stratix IV GX user guide. Compared to building discrete transceiver ASICs, this part reduces prototype BOM by 30-40% and accelerates time-to-measurement. The combination of embedded memory (7.56 Mbits) and high logic density makes it a strong fit for protocol-analyzer and compliance-test fixtures.
Recommended
Telecommunications Line Cards
The EP4SGX70DF29C2XG is well suited to telecommunications line-card designs that aggregate multiple SGMII, XAUI, or CPRI links into a backplane fabric. Its 8.5 Gbps transceivers handle fronthaul CPRI rates up to option 4, while the 7.56 Mbits of embedded memory buffers packet bursts without external SRAM. The 780-FBGA package supports the thermal envelope required for line-card ambient specs (-40C to +85C commercial). Use the device as a packet-classifier plus traffic-shaper between PHY and network processor; compared to fixed-function ASSPs it offers post-deployment algorithm updates. Designers should validate signal integrity on backplane channels using the Stratix IV GX transceiver toolkit IBIS-AMI models before tape-out.
Recommended
Radar and DSP Signal Processing
The EP4SGX70DF29C2XG supports radar front-end signal processing where the 364 18x18 multipliers deliver up to ~262 GMACs of DSP throughput, sufficient for multi-channel digital down-conversion and pulse compression. The high-density logic fabric implements FFT cores, moving-target-indicator filters, and CFAR detectors in parallel, while 8.5 Gbps transceivers stream digitized IF data to a back-end processor. The 0.9 V core voltage reduces in-package power dissipation relative to older 65 nm parts, easing thermal design in sealed radar enclosures. Place the FPGA adjacent to high-speed ADCs (such as the ADS42LB69) with matched impedance routing on the 780-FBGA land pattern.
Recommended
Broadcast Video Processing
The EP4SGX70DF29C2XG fits broadcast video processing platforms that require multi-channel SDI, HDMI, or DisplayPort handling with real-time color-space conversion and scaling. The 7.56 Mbits embedded memory holds active video line buffers, eliminating the need for external SRAM in many 1080p60 designs. Designers implement chroma resampling, frame-rate conversion, and overlay composition in the programmable fabric, then output over the 8.5 Gbps transceivers for SDI or HDMI 2.0. The 780-FBGA 29x29 mm package supports standard video-capture card PCB layouts. Compared to GPU-based video pipelines, this FPGA approach offers deterministic latency and 4:4:4 chroma fidelity critical to broadcast monitoring.
Recommended
ASIC Prototyping Platforms
The EP4SGX70DF29C2XG is widely used as a building block in ASIC prototyping platforms where 72,600 LEs provide sufficient logic capacity for medium-complexity ASIC partitions. Multiple FPGAs partition across the ASIC netlist using TDM or pin-multiplexed bridges between devices. The 8.5 Gbps transceivers carry inter-FPGA interconnect at multi-GHz rates, reducing the bridge-pin count by 80% versus LVDS-based partitioning. The 0.9 V core and 40 nm process lower per-FPGA static power versus older 65 nm prototyping parts. Designers should use the Quartus II LogicLock feature plus a high-speed PCB stackup to achieve timing closure on partitioned designs.
Recommended
Test and Measurement Instrumentation
The EP4SGX70DF29C2XG suits high-channel-count test and measurement instrumentation, including protocol analyzers, oscilloscopes, and logic analyzers, where the 372 user I/Os and 8.5 Gbps transceivers provide both dense digital acquisition and high-speed serial trigger channels. Designers implement deep state-machine control, real-time pattern matching, and trigger sequencing in the 72,600 LEs while capturing waveform data into the 7.56 Mbits embedded buffer. The 780-FBGA package places the device adjacent to analog front ends with matched impedance on critical channels. The result is a single-chip acquisition engine that replaces multiple discrete ASSPs in modern test gear.
Recommended
Industrial Automation Controllers
The EP4SGX70DF29C2XG serves industrial automation controllers that coordinate motion, vision, and fieldbus networks on a single board. Its hardened PCIe and SERDES blocks handle fieldbus bridges to EtherCAT, PROFINET, or CC-Link, while the programmable logic implements real-time motion-control loops and machine-vision pre-processing. The 40 nm process and 0.9 V core keep power dissipation within industrial thermal envelopes, and the commercial -40C to +85C temperature range covers factory-floor conditions. Designers pair this FPGA with industrial-grade DDR3 memory and isolated I/O drivers; the 8.5 Gbps transceivers stream vision data to upstream machine-learning processors without bus bottlenecks.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX70DF29C2XG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110DF29C2XG | EP4SGX70DF29C3G | EP4SGX70DF29C4G | EP4SGX70DF29C2G | EP4SGX230DF29I3N | EP4CGX75DF27I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA - same family |
| Logic Elements | 72,600 | 105,600 | 72,600 | 72,600 | 72,600 | 228,000 | 75,000 |
| Embedded Memory | 7,564,880 bits | 8,820 Kbits | 7,564,880 bits | 7,564,880 bits | 7,564,880 bits | 13,820 Kbits | 4,290 Kbits |
| Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 3.125 Gbps |
| Maximum User I/O | 372 | 372 | 372 | 372 | 372 | 372 | 290 |
| Speed Grade | C2 (commercial) | C2 | C3 | C4 | C2 | I3 (industrial) | I7 (industrial) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 1.0 V |
| DSP Blocks (18x18) | 364 | 528 | 364 | 364 | 364 | 1,288 | 264 |
Key Differentiators
- Same 780-FBGA footprint across speed grades (vs EP4SGX70DF29C3G and EP4SGX70DF29C4G)
- Higher logic density available in same package (vs EP4SGX110DF29C2XG)
- Much higher transceiver data rate than Cyclone IV GX (vs EP4CGX75DF27I7N (Cyclone IV GX 75K))
Design Notes
Estimated: at typical 0.9 V core activity (~70% utilization at 250 MHz), the EP4SGX70DF29C2XG core draws approximately 3-5 A from the 0.9 V rail - confirm with Quartus PowerPlay before final design. Provide at least 4x 100 uF bulk + 20x 0.1 uF ceramic decoupling capacitors placed within 5 mm of the BGA balls, plus a dedicated 0.9 V regulator with 3% accuracy. Stratix IV GX requires separate VCC_PLL, VCCPT, and VCCAUX rails at 1.0 V, 0.85 V, and 2.5 V respectively; each rail must have its own ferrite-bead-isolated filter network.
Use a minimum 10-layer PCB stackup with dedicated ground and 0.9 V power planes adjacent to each other for high-frequency decoupling on the 780-FBGA. Route 8.5 Gbps transceiver pairs as 100 ohm differential microstrips over a continuous ground plane with no signal layers closer than 0.3 mm. Keep total transceiver trace length under 25 mm and add matched-length tuning after placement; refer to the Stratix IV GX Altium reference stackup for characteristic impedance targets.
The 780-FBGA package requires thermal vias in a 1.2 mm pitch array under the die; provide a minimum 6x6 thermal-via grid (0.3 mm drill, 1.0 mm pitch) through the top BGA balls to the inner ground plane. Attach a 30x30 mm heatsink with thermal pad if continuous FPGA utilization exceeds 70% or ambient temperature exceeds 60C. Use the device junction-to-ambient thermal resistance from the Stratix IV GX packaging report to size the heatsink with a 25% safety margin.
Do not mix configuration schemes across the Stratix IV GX family - the C2 speed grade requires specific Quartus fitter settings. Verify MSL 3 (168-hour floor life) handling at the assembly line. The 0.9 V core is sensitive to undervoltage; configure the on-chip POR (power-on-reset) threshold and hold all I/Os in tri-state during ramp. When migrating from EP4SGX230 to EP4SGX70, recompile the Quartus project because logic-block placement differs - existing LogicLock regions do not transfer cleanly across densities.
Stratix IV GX transceivers require AC-coupled channels with 0.1 uF capacitors at both transmitter and receiver; never DC-couple 8.5 Gbps links. Set pre-emphasis and equalization per the Stratix IV GX Transceiver Toolkit - start with the -2 dB pre-emphasis and -4 dB de-emphasis defaults and iterate based on eye-diagram measurements. Use IBIS-AMI models for system-level channel simulation before committing the PCB layout.
Compliance Information
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified (industrial FPGA, not automotive). Lead-free reflow compatible per JEDEC J-STD-020.
