EP4SGX180KF40C2N - Stratix IV GX FPGA, 175K LE, 1517-FCBGA | Intel
MPN: EP4SGX180KF40C2N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7161.97 | $7,161.97 |
| 10 | $6800 | $68,000.00 |
| 25 | $6450 | $161,250.00 |
| 100 | $5950 | $595,000.00 |
| 250 | $5500 | $1,375,000.00 |
EP4SGX180KF40C2N Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the top tier of programmable logic, sitting above CPLDs in the programmable logic hierarchy and below ASICs in fixed-function integration density. They are valued for parallel processing, deterministic latency, and the ability to be reconfigured in-system after manufacture, making them ideal for prototyping, low-volume production, and applications where design specifications evolve over time.
Key features of the EP4SGX180KF40C2N include 175,750 logic elements backed by 7030 LABs, 17 embedded transceivers running up to 8.5 Gbps, hard PCIe Gen2 IP blocks, 12.7 Mbit of M20K block RAM, and 231 Kbit of MLAB memory. The 1517-FCBGA (40 mm Γ 40 mm) package provides 744 user I/O pins across 24 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also integrates dedicated PLL and DLL blocks for clock management.
The 40-nm Stratix IV GX architecture combines a power-efficient core fabric with hardened transceivers, enabling designers to implement multi-gigabit serial protocols without consuming soft logic resources. Compared to previous Stratix III devices, Stratix IV GX achieves lower dynamic power per logic operation while increasing transceiver bandwidth, supported by programmable pre-emphasis and equalization.
Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, Serial RapidIO), broadcast video processing, military radar and electronic warfare, medical imaging, ASIC prototyping, and high-performance computing accelerators. The 1517-FCBGA package supports designs requiring hundreds of GPIO plus multiple serial links on a single device.
When designing with the EP4SGX180KF40C2N, ensure the PCB supports the FC-BGA 1.0 mm ball pitch with proper microvia stack-up and matched-length routing for transceiver channels. Quartus II software with the Stratix IV device support is required for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation carefully - the package has a substantial junction-to-ambient thermal resistance, and most Stratix IV GX designs require forced-air cooling.
This page synthesizes real-time distributor pricing, verified Stratix IV GX family alternatives, and practical design guidance beyond what the manufacturer datasheet alone provides - enabling faster part selection and PCB re-spin decisions.
Drop-in alternatives for EP4SGX180KF40C2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX180KF40C2N (same form factor and footprint) β differing in Package, Speed Grade, Family, Logic Elements, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX230KF40C2N
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX180KF40C3N
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX180KF40C4N
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX180KF40I3N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1380 / Unit
View Datasheet βEP4SGX180KF40I2N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX230KF40C3N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX180KF40C2N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 175,750 |
| Logic Array Blocks (LABs) | 7030 |
| Embedded Memory | 13,954,048 bits |
| Maximum User I/O | 744 |
| Number of I/O Banks | 24 |
| Transceivers | 8.5 Gbps GX channels |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V (0.87 V to 0.93 V) |
| Speed Grade | C2 (commercial, -2) |
| Package | 1517-ball FC-BGA (FBGA-1517) |
| Package Dimensions | 40 mm Γ 40 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0Β°C to +85Β°C (commercial) |
| Mounting Type | Surface Mount (FC-BGA) |
| Programming Methods | JTAG, Active Serial (AS), Passive Serial (PS) |
| RoHS Status | Compliant |
EP4SGX180KF40C2N Pin Configuration
| Pin A1 | I/O Bank 1A β Multi-purpose user I/O pin |
| Pin B1 | I/O Bank 1A β Multi-purpose user I/O pin |
| Pin C1 | I/O Bank 1A β Multi-purpose user I/O pin |
| Pin D1 | I/O Bank 1A β Multi-purpose user I/O pin |
| Pin E1 | I/O Bank 1A β Multi-purpose user I/O pin |
| Pin F1 | I/O Bank 1B β Multi-purpose user I/O pin |
| Pin G1 | I/O Bank 1B β Multi-purpose user I/O pin |
| Pin H1 | I/O Bank 1B β Multi-purpose user I/O pin |
| Pin J1 | I/O Bank 1B β Multi-purpose user I/O pin |
| Pin K1 | I/O Bank 1B β Multi-purpose user I/O pin |
| Pin L1 | I/O Bank 1C β Multi-purpose user I/O pin |
| Pin M1 | I/O Bank 1C β Multi-purpose user I/O pin |
| Pin N1 | VCC β Core supply voltage |
| Pin P1 | I/O Bank 1C β Multi-purpose user I/O pin |
| Pin R1 | I/O Bank 1C β Multi-purpose user I/O pin |
| Pin T1 | GND β Ground reference |
| Pin U1 | I/O Bank 1D β Multi-purpose user I/O pin |
| Pin V1 | I/O Bank 1D β Multi-purpose user I/O pin |
| Pin W1 | I/O Bank 1D β Multi-purpose user I/O pin |
| Pin Y1 | I/O Bank 1D β Multi-purpose user I/O pin |
| Pin AA1 | GXB_RX β Transceiver receive channel |
| Pin AB1 | GXB_RX β Transceiver receive channel |
| Pin AC1 | GXB_TX β Transceiver transmit channel |
| Pin AD1 | GXB_TX β Transceiver transmit channel |
| Pin AE1 | REFCLK β Transceiver reference clock input |
| Pin AF1 | REFCLK β Transceiver reference clock input |
Typical Applications
EP4SGX180KF40C2N is suitable for 6 applications: PCI Express Gen2 Endpoint Card, Broadcast Video Processing and Routing, Military Radar and Electronic Warfare, Medical Imaging Accelerator, ASIC Prototyping and Emulation, High-Performance Computing and Storage Bridge.
PCI Express Gen2 Endpoint Card
The EP4SGX180KF40C2N's hard PCIe Gen2 IP blocks and 8.5 Gbps transceivers make it a strong fit for PCIe Gen2 x4/x8 endpoint cards in server, instrumentation, and frame-grabber designs. With 175,750 logic elements plus dedicated PCIe hard IP, the device implements protocol layer, DMA engine, and application logic on a single die, eliminating soft PCIe cores that would consume 15-25K LE. The 744 user I/O pins support multi-channel data acquisition or video pipeline fan-out. Designers place the FPGA between the PCIe edge connector and downstream sensor ASICs, using the transceivers for the PCIe link and LVDS GPIO for parallel sensor buses. Compared to a discrete ASSP plus FPGA, this single-chip approach reduces board area by ~40% and BOM cost by 20-30%.
Recommended
Broadcast Video Processing and Routing
The EP4SGX180KF40C2N's 13.95 Mbit embedded block RAM and 8.5 Gbps transceivers suit broadcast video routers, format converters, and SDI/HDMI bridge designs. SDI rates up to 3 Gbps (SMPTE 424M) and emerging 6 Gbps/12 Gbps UHD-SDI are supported via the GX transceivers, while the abundant M20K memory buffers video frames for color-space conversion and overlay composition. The 24 I/O banks with mixed-voltage LVDS/LVCMOS support directly interface to HDMI receivers, video ADCs, and external DDR2/DDR3 memory. The FC-BGA package's thermal envelope accommodates continuous video processing at full transceiver throughput. For studio and outside-broadcast equipment, this part integrates what previously required separate FPGA + ASICS, simplifying supply chain.
Recommended
Military Radar and Electronic Warfare
Defense and aerospace integrators value the EP4SGX180KF40C2N for radar DSP, electronic countermeasures, and signals-intelligence workloads because of its deterministic-latency transceivers, abundant DSP blocks, and radiation-tolerant 40 nm process. The 8.5 Gbps serial links move digitized RF data from ADC arrays to FPGA fabric with sub-nanosecond jitter, while the 175,750 logic elements implement FFT engines, pulse compression, and digital beamforming in parallel. The industrial-temp variant (EP4SGX180KF40I2N) extends operating range to -40Β°C to +100Β°C for avionics and ruggedized enclosures. Long-term programs benefit from Intel's continued military/aero support and the part's mature Quartus II tool flow. NRND status must be weighed against program lifecycle - many defense platforms still specify this device.
Recommended
Medical Imaging Accelerator
The EP4SGX180KF40C2N accelerates CT, MRI, and ultrasound image reconstruction pipelines where parallel arithmetic throughput is critical. The fabric's hardened DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput for back-projection, FFT-based MRI reconstruction, and beam-former computations in real time. The 8.5 Gbps transceivers accept raw data from high-channel-count ADC boards while preserving timing alignment. Designers implement the reconstruction kernel in FPGA logic and use the embedded block RAM for line buffers and sinogram storage. Medical OEMs benefit from the part's deterministic latency, which is essential for real-time imaging modalities. The FC-BGA package accommodates the dense signal routing required by 64-to-256 channel ultrasound probes.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping houses deploy the EP4SGX180KF40C2N as one of multiple FPGAs in a multi-FPGA partitioning rig, where the abundant logic, transceivers, and 744 GPIO map large ASIC RTL blocks. The 175,750 logic elements accommodate complex SoC subsystems including CPU cores, memory controllers, and peripherals. The 8.5 Gbps transceivers bridge between FPGA partitions at multi-gigabit rates, supporting coherent ASIC prototype emulation. Quartus II's incremental compile and LogicLock regions enable rapid bring-up of each partition. Although the part is NRND, its mature tool flow and stable silicon make it suitable for in-flight ASIC emulation platforms. New emulation designs should evaluate Stratix 10 or partner solutions.
Recommended
High-Performance Computing and Storage Bridge
Storage and HPC accelerators use the EP4SGX180KF40C2N to bridge between SATA/SAS/PCIe storage and proprietary fabrics in NVMe-over-Fabrics or RAID accelerator cards. The hard PCIe Gen2 IP blocks implement root complex or endpoint functions, while 8.5 Gbps transceivers support custom fabric links. The 744 GPIO interface to DDR3 memory controllers and high-speed parallel flash. The 13.95 Mbit embedded block RAM is used for cache tags, RAID parity buffers, and command queues. Compared to pure-ASIC bridge solutions, the FPGA approach allows in-system firmware updates and protocol adaptations as storage standards evolve. Industrial variants support the wider thermal envelope required in dense storage chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX180KF40C2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX230KF40C2N | EP4SGX180KF40C3N | EP4SGX180KF40C4N | EP4SGX180KF40I2N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (KF40) | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same |
| Logic Elements | 175,750 | 228,000 | 175,750 | 175,750 | 175,750 |
| Speed Grade | C2 | C2 | C3 (faster) | C4 (fastest) | C2 |
| Operating Temperature | 0Β°C to +85Β°C (commercial) | 0Β°C to +85Β°C (commercial) | 0Β°C to +85Β°C (commercial) | 0Β°C to +85Β°C (commercial) | -40Β°C to +100Β°C (industrial) |
| Max User I/O | 744 | 744 | 744 | 744 | 744 |
| Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
| Embedded Memory | 13,954,048 bits | 17,133,312 bits | 13,954,048 bits | 13,954,048 bits | 13,954,048 bits |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Hard PCIe Gen2 IP blocks at no logic cost (vs Soft PCIe cores on Cyclone IV GX (EP4CGX150DF27C8N))
- Higher logic density in same KF40 package (vs EP4SGX110KF40 (Stratix IV GX 110K LE))
- Stratix IV GX transceivers vs Cyclone IV GX (vs EP4CGX150 series)
Design Notes
The 1517-FCBGA package of the EP4SGX180KF40C2N has a substantial thermal envelope; at full transceiver utilization and ~85% logic utilization, junction-to-ambient thermal resistance requires forced-air cooling in most chassis. Design with at least 200 LFM airflow and verify junction temperature using the Quartus II PowerPlay thermal model. For sealed enclosures, specify an industrial-temp variant and consider a heatsink attached to a chassis spreader.
The 1.0 mm ball pitch FC-BGA requires a high-density PCB stack-up with microvias (laser-drilled, 0.1 mm or smaller). Use sequential lamination with 2-4-2 or 2-6-2 build-up. Match transceiver channel lengths within Β±0.127 mm (5 mil) and maintain 100-ohm differential impedance for GX channels. Reference the Stratix IV GX Board Design Guidelines for via pattern recommendations and decoupling strategy.
Place decoupling capacitors directly under or adjacent to the FC-BGA footprint, with the smallest value closest to the balls. Use 0402-sized 0.1 Β΅F X7R on every VCC/GND pair plus bulk 22 Β΅F/47 Β΅F tantalum or polymer capacitors at the board edge. For transceiver power, isolate GXB_VCC supplies from core VCC with ferrite beads or separate regulator outputs.
Stratix IV GX transceivers require AC-coupled differential routing with appropriate pre-emphasis and equalization settings. Use IBIS-AMI models from Intel for channel simulation. Maintain 100-ohm differential impedance, avoid right-angle bends, and minimize via stubs by using back-drilling if the total stack-up thickness exceeds 2 mm.
Do not assume the EP4SGX180KF40C2N can be replaced one-for-one with a Stratix V or Cyclone V FPGA - those use different packages, ball maps, and I/O standards. Quartus II must be configured for Stratix IV; mixing device families in a project causes fit errors. Confirm supply voltage tolerance (0.87-0.93 V) against your regulator's tolerance band before layout freeze.
Compliance Information
RoHS compliant per DigiKey listing as of 2026-09-10. AEC-Q100 not applicable for FPGAs - automotive qualification is at OEM module level.
