EP4CGX75DF27I7N - Cyclone IV GX FPGA 73.9K LE | Intel
MPN: EP4CGX75DF27I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $86.5 | $86.50 |
| 10 | $78.2 | $782.00 |
| 100 | $71.45 | $7,145.00 |
| 500 | $64.1 | $32,050.00 |
| 1,000 | $58.75 | $58,750.00 |
EP4CGX75DF27I7N Overview
An FPGA (field-programmable gate array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined by user-loaded configuration bitstreams rather than at the factory. Within the digital IC hierarchy, FPGAs sit between general-purpose microcontrollers and full custom ASICs, offering higher performance and parallelism than MCUs while avoiding the non-recurring engineering cost of ASICs. The Cyclone IV family further subdivides into the GX (transceiver-equipped) and E (logic-only) variants, with the EP4CGX75 targeting designs that need multi-gigabit serial links without paying for higher-tier Stratix-class devices.
Key features include 73,920 logic elements, 4,257,792 bits of embedded RAM organized as M9K memory blocks, up to 310 user I/O pins spanning eight I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, SSTL, HSTL), and 3.125 Gbps transceiver channels. The device also integrates a hard PCI Express (PIPE) Gen1 x1/x2/x4 endpoint block, dedicated PLL clocking resources, and DSP-style multipliers arranged in variable-precision DSP blocks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes.
The Cyclone IV GX architecture pairs a 60 nm logic fabric with embedded transceivers and hard IP blocks to minimize both static and dynamic power. The core voltage is typically 1.2 V with separate VCCPD and VCCIO rails per bank, and the transceiver blocks run from dedicated analog supplies. Compared with the Cyclone III LS predecessor, Cyclone IV GX adds transceiver capability at similar density points while keeping total power budget under 1.5 W in many typical designs. Reference designs and Quartus II / Intel Quartus Prime design flows are supported across the family.
Typical applications include industrial video processing and broadcast bridging, low-cost PCIe endpoint cards, motor control and factory automation backplanes, point-to-point and backplane serial link aggregation. The combination of transceiver channels and abundant logic resources makes EP4CGX75DF27I7N a strong fit when designs need multi-gigabit serial I/O without moving to a more expensive, larger-density FPGA.
When designing with EP4CGX75DF27I7N, pay close attention to bank I/O voltage assignment: each of the eight I/O banks requires its own VCCIO rail, and mixing SSTL and LVCMOS in the same bank is not allowed. Plan decoupling with at least 4-6 low-ESL ceramic capacitors per supply rail near the BGA balls, and follow Intel's recommended PCB layer stack-up for the 27 mm x 27 mm FBGA-672 footprint to maintain signal-integrity on the transceiver channels.
This page consolidates distributor pricing, FBGA-672 pin-compatible alternatives from the Site MPN list, and practical Quartus Prime design guidance that is not assembled in any single location in the Intel Cyclone IV Device Handbook.
Drop-in alternatives for EP4CGX75DF27I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27I7N (same form factor and footprint) β differing in Package, Operating Temperature, Process Technology, Embedded Memory, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX75DF27I7
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View Datasheet βEP4CGX75DF27I6N
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View Datasheet βEP4CGX75DF27C8N
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View Datasheet βEP4CGX110DF27I7N
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View Datasheet βEP4CGX75DF27I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Device Model | EP4CGX75 |
| Logic Elements (LE) | 73,920 |
| Embedded Memory | 4,257,792 bits (M9K blocks) |
| User I/O Count | 310 |
| Package | FBGA-672 (27 mm) |
| Supply Voltage - Core | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial, I7) |
| Process Technology | 60 nm |
| Number of Transceivers | 8 channels |
| Transceiver Data Rate | 3.125 Gbps |
| Hard PCIe Block | Gen1 x1/x2/x4 (PIPE) |
| Number of PLLs | 8 |
| Number of I/O Banks | 8 |
| Configuration Modes | JTAG, AS, AP, PS |
| RoHS Status | Compliant |
EP4CGX75DF27I7N fbga-672 (27 mm) Pin Configuration Guide
Pin configuration for EP4CGX75DF27I7N (fbga-672 (27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27I7N is suitable for 6 applications: Industrial Video Bridging, PCIe Endpoint Cards, Motor Control & Factory Automation, Point-to-Point Serial Link Aggregation, Test & Measurement Instrumentation, Broadcast Video Switchers.
Industrial Video Bridging
The EP4CGX75DF27I7N's 73,920 logic elements and 3.125 Gbps transceivers make it well-suited for industrial video bridging between SDI, HDMI, DisplayPort, and Ethernet. With 4.06 Mbits of embedded M9K memory and 8 high-speed serial channels, the FPGA can convert SDI streams into uncompressed Ethernet packets at line rates up to 3 Gbps while maintaining sub-frame latency. The I7 industrial temperature grade (-40C to +100C) allows deployment in uncooled factory-floor enclosures where commercial-grade parts would fail. According to Intel Cyclone IV GX reference designs, PCI Express Gen1 hard IP enables low-latency host-side ingest for broadcast switchers and video-wall controllers.
Recommended
PCIe Endpoint Cards
The EP4CGX75DF27I7N integrates a hard PCI Express Gen1 x1/x2/x4 endpoint block with PIPE interface, eliminating soft PCIe IP license fees and simplifying timing closure. With 73,920 logic elements and 4 Mbits of block RAM, designers can implement protocol bridges (PCIe-to-Local Bus, PCIe-to-Gigabit Ethernet, PCIe-to-RapidIO) plus scatter-gather DMA controllers on a single chip. Per Intel's Cyclone IV GX datasheet, the hard PCIe block supports 2.5 Gbps Gen1 line rates and integrated transceivers handle the SERDES, removing the need for external PHY chips. The FBGA-672 F27 package supports industrial-grade PCIe cards for factory automation and test equipment.
Recommended
Motor Control & Factory Automation
The EP4CGX75DF27I7N's high logic density and transceiver channels suit multi-axis motor control and fieldbus bridging in factory automation systems. Designers can implement EtherCAT, PROFINET, SERCOS III, and Modbus TCP fieldbus stacks simultaneously while driving PWM controllers for up to 8 axes from the FPGA fabric. The industrial I7 temperature grade ensures reliable operation in sealed control cabinets where ambient temperatures exceed 70C. According to Intel's Cyclone IV GX industrial reference designs, the integrated transceivers enable 100 Mbit/s Ethernet PHYs without external SERDES chips, reducing BOM cost in volume production.
Recommended
Point-to-Point Serial Link Aggregation
The EP4CGX75DF27I7N's 8 high-speed transceivers at 3.125 Gbps are ideal for aggregating multiple point-to-point serial links in telecom and industrial backplane applications. With 73,920 logic elements, designers can implement CPRI, OBSAI, Serial RapidIO, and proprietary backplane protocols while running protocol-aware aggregation logic on the same device. The 4 Mbits of M9K memory is sufficient for elastic buffers and protocol headers. According to Intel Cyclone IV GX datasheets, the device supports multi-lane aggregation up to 25 Gbps aggregate throughput, suitable for small-cell baseband and remote-radio-head applications.
Recommended
Test & Measurement Instrumentation
The EP4CGX75DF27I7N's 8 transceivers and 73,920 logic elements make it well-suited for protocol-aware test instruments, logic analyzers, and bit-error-rate testers (BERT) targeting serial standards up to 3.125 Gbps. Designers can build custom pattern generators, error counters, and protocol decoders on the same FPGA fabric. Per the Cyclone IV GX datasheet, the integrated PLLs (8 total) provide flexible reference clocking for multiple test rates, while 4 Mbits of block RAM enables deep pattern storage and trace buffering for protocol analysis. Industrial temperature grade suits bench-top and field-deployed test equipment.
Recommended
Broadcast Video Switchers
The EP4CGX75DF27I7N's mix of transceivers, logic density, and block RAM suits mid-range broadcast video switchers and routing matrices. With 4.06 Mbits of M9K memory, the FPGA can buffer uncompressed SDI streams, perform frame synchronization, and route multiple 3G-SDI inputs to multiple 3G-SDI outputs simultaneously. The 8 high-speed transceivers handle SDI serialization/deserialization at 2.97 Gbps, eliminating external SDI serializer chips. According to Intel Cyclone IV GX broadcast reference designs, the I7 industrial temperature grade supports fan-less chassis operation common in broadcast control rooms and OB vans.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27I7 | EP4CGX75DF27I6N | EP4CGX75DF27C8N | EP4CGX75DF27C7N | EP4CGX75DF27C6N | EP4CGX110DF27I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-672 (F27) | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same |
| Logic Elements | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 109,424 |
| Embedded Memory | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 5,382,144 bits |
| Speed Grade | I7 (fastest industrial) | I7 | I6 (slower) | C8 (commercial, slower) | C7 (commercial, slower) | C6 (commercial, slowest) | I7 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Transceivers | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps | 8 channels at 3.125 Gbps |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Integrated 3.125 Gbps transceivers with hard PCIe Gen1 endpoint (vs EP4CE75F23I7N (Cyclone IV E))
- Mid-range density with same F27 package as larger family members (vs EP4CGX110DF27I7N (higher-density variant))
- Industrial temperature grade I7 for harsh environments (vs EP4CGX75DF27C8N (commercial grade))
Design Notes
The FBGA-672 (F27) package at 27 mm body size requires a 1.0 mm ball pitch PCB footprint with microvia stack-ups (typically 8-12 layers). Per Intel's Cyclone IV GX hardware reference design, dedicate the top 4 layers to high-speed signals and transceiver routing, with continuous ground planes beneath the transceiver balls. Use a 4-6 layer stack-up minimum and follow JEDEC JESD51 PCB thermal guidelines for BGA packages.
The EP4CGX75DF27I7N requires separate supply rails for VCCINT (1.2 V core), VCCPD (1.2/2.5/3.0/3.3 V pre-driver), VCCIO (1.2/1.5/1.8/2.5/3.3 V per bank), and dedicated analog transceiver supplies VCCA, VCCP, and VCCHIP. Per the Cyclone IV Device Handbook, isolate VCCA/VCCP with ferrite beads from the digital core and place 10uF + 0.1uF decoupling within 5 mm of each supply ball. Inadequate decoupling causes increased jitter on transceiver outputs and PCIe Gen1 link failures.
For 3.125 Gbps transceiver channels, controlled-impedance differential routing (100 ohm differential, 85 ohm common-mode for the PCIe-capable TX buffers) is required. Per Intel's Cyclone IV GX Transceiver Layout Guidelines, route transceiver pairs on the top or bottom layers with length matching within 150 mils between P and N. Avoid layer transitions when possible and use ground-via stitching every 200 mils along the route.
Do not mix SSTL and LVCMOS I/O standards within the same I/O bank - each bank must use a single VCCIO voltage. The hard PCIe Gen1 endpoint requires a 100 MHz reference clock with +/- 50 ppm accuracy routed through a dedicated PLL. JTAG chain configuration errors (TDI/TDO ordering) are common during initial board bring-up; verify with the Quartus Prime Programmer before assuming silicon failure.
Compliance Information
RoHS and REACH compliance verified per Intel product page. Pb-free and halogen-free per Cyclone IV Device Handbook. AEC-Q100 is not applicable for FPGAs of this density - this is a commercial/industrial-grade part, not an automotive-qualified device.
