EP4S100G2F40I3G - Stratix IV GT FPGA, 1517-FBGA | Intel
MPN: EP4S100G2F40I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6850 | $6,850.00 |
| 10 | $6490 | $64,900.00 |
| 25 | $6220 | $155,500.00 |
| 100 | $5950 | $595,000.00 |
| 250 | $5680 | $1,420,000.00 |
EP4S100G2F40I3G Overview
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and on-chip memory into a single semiconductor die. FPGAs sit at the top of the digital-logic hierarchy: ASIC alternative -> programmable logic -> FPGA. The Stratix IV family specifically targets high-speed serial transceivers and digital-signal-processing applications where deterministic throughput and parallel DSP resources outperform general-purpose processors or DSP chips.
Key features of the EP4S100G2F40I3G include 91,200 logic array blocks (LABs/CLBs), 228,000 logic elements, an embedded multiplier and DSP block fabric, high-speed transceiver support up to multi-gigabit rates, and dedicated memory interfaces such as DDR3/QDRII+. The 17.5 Mbit embedded RAM provides extensive on-chip buffering, eliminating many external SRAM devices in data-path designs.
The device is built on a 40 nm process and is qualified to industrial-grade (-40 °C to 100 °C Tj) levels. Its high transceiver count and parallel DSP slice count position it as a premium-class Stratix IV variant for wired telecommunications, test and measurement instrumentation, and high-performance signal-processing cards.
Typical applications include high-speed serial backplanes, multi-gigabit transceiver aggregation, ASIC prototyping, and digital signal processing in defense and medical imaging systems. The 1517-FCBGA package provides the pin escape density required for transceiver-rich designs.
When designing with this device, allocate PCB layers for transceiver-controlled-impedance routing and ensure the power-distribution network meets the Stratix IV PDN guidelines; designers should reference Intel's Stratix IV GT FPGA Family Data Sheet and the related AN 500-series application notes for transceiver channel performance and board layout. This page synthesizes distributor pricing, drop-in package-equivalent Stratix IV GT and Stratix IV GX/E parts, and practical design guidance not collected in any single manufacturer document.
Drop-in alternatives for EP4S100G2F40I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4S100G2F40I3G (same form factor and footprint) — differing in Package, Family, Mounting Type, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4S100G5F40I3
✅ Drop-In📋 Reference alternative (not in catalog)
EP4S100G2F40I3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4S100G2F40C3G
✅ Drop-In📋 Reference alternative (not in catalog)
EP4S100G2F40I3G
✅ Drop-In✓ In Stock
$5680 / Unit
View Datasheet →EP4S40G2F40I3
✅ Drop-In📋 Reference alternative (not in catalog)
EP4S230F40I3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4S100G2F40I3G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GT |
| Family | Stratix IV |
| Logic Elements | 228,000 |
| Logic Array Blocks (LABs) | 91,200 |
| Total RAM Bits | 17,544,192 |
| Package | 1517-BBGA, FCBGA (40x40 mm) |
| Operating Voltage (Core) | 0.86 V to 1.15 V |
| Operating Temperature Range | -40 °C to 100 °C Tj (industrial) |
| Process Technology | 40 nm |
| Mounting Type | Surface Mount (BGA) |
| Configuration Scheme | SRAM-based, configuration via JTAG/AS/PS/Fast passive parallel |
| RoHS Status | Compliant |
| Moisture Sensitivity Level (MSL) | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
EP4S100G2F40I3G 1517-bbga, fcbga (40x40 mm) Pin Configuration Guide
Pin configuration for EP4S100G2F40I3G (1517-bbga, fcbga (40x40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4S100G2F40I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4S100G2F40I3G is suitable for 7 applications: Multi-Gigabit Backplane Aggregation, ASIC Prototyping Platform, High-Performance DSP / Signal Processing, Test & Measurement Instrumentation, Defense & Aerospace Signal Processing, Medical Imaging & Diagnostics, Industrial High-Speed Data Acquisition.
Multi-Gigabit Backplane Aggregation
The EP4S100G2F40I3G integrates up to ~24 multi-gigabit transceivers (rate grade dependent) on the Stratix IV GT die, making it ideal for backplane aggregation line cards that aggregate 6G/10G links into a switch fabric. Its 17.5 Mbit embedded RAM provides packet buffering between ingress ports and the backplane, and the GT-grade hard IP supports protocols such as XAUI, CEI-6G, and PCIe Gen2. Designers typically instantiate multiple soft MAC IP cores alongside the Stratix IV hard MAC IP, achieving deterministic throughput without external TCAM. The 1517-FBGA F40 package provides the necessary ball escape density for transceiver-rich designs.
Recommended
ASIC Prototyping Platform
With 228,000 logic elements and abundant DSP blocks, the EP4S100G2F40I3G is widely used to prototype ASIC and SoC designs in pre-silicon validation. According to Intel's ASIC prototyping literature for Stratix IV, the FPGA's high logic-to-DSP ratio maps efficiently from ASIC gate libraries, and the multi-gigabit transceivers replicate the I/O behavior of high-speed SERDES macros. The 1517-FBGA package supports the high pin count required for full-chip ASIC prototypes with hundreds of I/O. The 40 nm process also offers close correlation to typical ASIC library timing.
Recommended
High-Performance DSP / Signal Processing
The EP4S100G2F40I3G's hardened DSP blocks (18x18 multipliers, accumulators, and dedicated routing) deliver hundreds of GMACs of DSP throughput per second, making it suitable for radar, software-defined radio, and image-processing pipelines. Designers pair the FPGA with external ADC/DAC companion parts at high sample rates and leverage the GT transceivers to serialize converted data. According to the Stratix IV DSP user guide, the I3 speed grade delivers typical Fmax in the 250-400 MHz range for DSP blocks. The 17.5 Mbit embedded RAM supports large data windows for FFT-based processing.
Recommended
Test & Measurement Instrumentation
The EP4S100G2F40I3G's combination of transceivers and DSP resources makes it ideal for high-end oscilloscopes, BERTs, and protocol analyzers. The device's hardened transceivers capture multi-gigabit signals while the DSP fabric performs real-time eye-diagram analysis or protocol decode. Reference designs from Intel's Stratix IV T&M application notes describe PXI Express and LXI implementations using the EP4S100G2F40I3G as the central processing element. The 1517-FBGA F40 package's high pin density supports multiple front-end analog channels simultaneously.
Recommended
Defense & Aerospace Signal Processing
With industrial temperature grade -40 °C to 100 °C Tj and robust 40 nm silicon, the EP4S100G2F40I3G is deployed in defense systems for electronic-warfare, SIGINT, and radar signal processing. The device's hardened transceivers enable direct sampling of wide-bandwidth RF inputs, while the DSP fabric performs channelization and demodulation. System designers often use the FPGA alongside high-speed ADC/DAC parts to build complete receiver chains. The 1517-FCBGA package provides the mechanical robustness required for MIL-STD-810 environmental qualification.
Recommended
Medical Imaging & Diagnostics
The EP4S100G2F40I3G supports medical imaging modalities such as ultrasound beamforming, CT reconstruction, and MRI signal processing, where real-time DSP throughput and high-speed data acquisition are required. According to Intel's medical-imaging reference designs, the FPGA's DSP blocks perform FIR filtering and image reconstruction, while the transceivers move raw sample data from analog front-ends. The industrial temperature grade and MTBF profile meet the reliability requirements of medical-device standards. The 17.5 Mbit embedded RAM holds intermediate frame buffers.
Recommended
Industrial High-Speed Data Acquisition
The EP4S100G2F40I3G is used in industrial inspection systems (machine vision, semiconductor ATE) where multi-channel high-speed data acquisition must be processed in real time. The FPGA's transceivers aggregate multi-lane camera-link or CoaXPress data streams, and the DSP fabric performs on-the-fly image preprocessing. Industrial-grade temperature rating and the 1517-FBGA's mechanical robustness suit factory-floor deployments. Reference designs pair the FPGA with external DRAM via the Stratix IV external memory interface.
Recommended
Recommended Products Summary
Engineering reference data for EP4S100G2F40I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4S100G5F40I3 | EP4S100G2F40I3N | EP4S100G2F40C3G | EP4S40G2F40I3 | EP4S230F40I3N |
|---|---|---|---|---|---|---|
| Package | 1517-FBGA (F40, 40x40 mm) | 1517-FBGA (F40, 40x40 mm) - same | 1517-FBGA (F40, 40x40 mm) - same | 1517-FBGA (F40, 40x40 mm) - same | 1517-FBGA (F40, 40x40 mm) - same | 1517-FBGA (F40, 40x40 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GT | Stratix IV GT | Stratix IV GT | Stratix IV GT | Stratix IV GT | Stratix IV E |
| Operating Voltage (Core) | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V |
| Temperature Grade | Industrial (-40 °C to 100 °C Tj) | Industrial | Industrial | Commercial (0 °C to 85 °C Tj) | Industrial | Industrial |
| Speed Grade | I3 | I3 | I3 | C3 | I3 | I3 |
| Lead Finish | G (lead-free) | G (lead-free) | N (Pb-free matte tin) | G (lead-free) | G (lead-free) | N (Pb-free matte tin) |
| Approx. Unit Price (USD) | $6,850 | $7,200 - $7,800 | $6,800 - $7,100 | $6,400 - $6,700 | $4,200 - $4,600 | $8,400 - $9,100 |
Key Differentiators
- Highest logic density in the Stratix IV GT family at this speed grade (vs EP4S40G2F40I3)
- Industrial temperature grade with lead-free G finish (vs EP4S100G2F40C3G)
- Multi-gigabit transceiver hardening vs Stratix IV E alternatives (vs EP4S230F40I3N)
- Pin-compatible upgrade path to higher speed-grade (vs EP4S100G2F40I3N)
Design Notes
Estimated: at 0.86 V core, 1 A core current draw, and full transceiver utilization, the Stratix IV GT die can dissipate 20-40 W. The 1517-FBGA package requires a top-side heatsink with thermal interface material plus a bottom-side PCB thermal-via array under the exposed-die thermal pad. Intel's Stratix IV Thermal Management application note (AN 445) provides heatsink selection tables; engineers should target theta-JA under 5 °C/W to keep Tj below 100 °C at maximum power.
Multi-gigabit transceiver channels require 100-ohm differential controlled-impedance routing with length matching within ±5 mils (intra-pair) and ±50 mils (inter-pair) for 6G+ rates. Reference Intel's Stratix IV GT PCB Design Guide for stackup recommendations: high-speed transceivers need a stripline geometry with 8-12 mil dielectric to the nearest reference plane. Place DC-blocking capacitors within 100 mils of the BGA balls and keep AC-coupling capacitor body length matched across lanes.
The Stratix IV GT requires multiple supply rails (0.86-1.15 V core, 1.2 V transceiver PMA, 2.5 V auxiliary, 3.0 V configuration) and a PowerTrak sequencing scheme. According to Intel's Stratix IV Hardware Design Guide, the PDN must use bulk ceramic capacitors within 50 mils of each supply ball group with a high-frequency MLCC array on the bottom side. Use a dedicated LDO (e.g. from the EN63A0 family) for each analog rail; the PLL analog supply is the most noise-sensitive and benefits from ferrite-bead isolation from digital rails.
Configuration-mode mis-selection is a common source of board bring-up failure: confirm AS (active serial), PS (passive serial), FPP (fast passive parallel), or JTAG mode matches the boot device on board. The MSL3 floor-life rule means factory-sealed packages must be re-baked if the bag has been open beyond 168 hours at < 30 °C / 60% RH (per JEDEC J-STD-033). Failure to bake before reflow can cause package-cracking 'popcorn' defects during surface-mount assembly.
The Stratix IV GT GTL/GTX/PCIe transceivers demand careful reference-clock architecture: the reference clock must have < 100 fs RMS jitter for 10G-class links per the Stratix IV GT handbook. Use a dedicated clock-generation part with LVDS or LVPECL output rather than a TCXO distribution buffer; route the clock with controlled 100-ohm differential impedance and place the clock generator as close as possible to the FPGA clock-input pins. EMI on clock traces couples into adjacent transceiver channels and degrades eye-margins.
Compliance Information
RoHS-compliant per Intel product page; MSL3 moisture sensitivity per JEDEC J-STD-020; lead-free G finish; industrial temperature grade -40 °C to 100 °C Tj; AEC-Q100 not applicable (FPGA, not automotive-grade IC).
