EP4CGX75DF27C7N - Cyclone IV GX FPGA, 75K LE, 672-FBGA | Intel
MPN: EP4CGX75DF27C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $135.2 | $1,352.00 |
| 100 | $122 | $12,200.00 |
| 500 | $108.5 | $54,250.00 |
| 1,000 | $96.4 | $96,400.00 |
EP4CGX75DF27C7N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP blocks that can be re-programmed to implement arbitrary digital logic. FPGAs occupy a distinct tier in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below microcontrollers in per-unit cost, and equivalent to or below microprocessors in raw computational throughput. The Cyclone IV family targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive, and the GX sub-family specifically addresses designs requiring multi-gigabit serial links.
Key features of the EP4CGX75DF27C7N include up to eight 3.125 Gbps transceiver channels, dedicated hardware multipliers supporting up to 150 MHz 18 x 18 multiplication, embedded M9K memory blocks distributed across the fabric, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports the Cyclone IV architecture's Nios II embedded processor soft-core, enabling a complete system-on-chip (SoC) implementation in a single FPGA. Power consumption is optimized for static and dynamic operation, making it suitable for thermally constrained embedded systems.
The Cyclone IV GX architecture implements a four-input LUT-based logic fabric with columnar and rowar interconnects, dedicated multiplier blocks, and memory blocks that can be configured as RAM, ROM, or FIFO. The integrated transceivers use a hardened Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) supporting PCIe Gen1, Gigabit Ethernet, and Serial RapidIO protocols at line rates up to 3.125 Gbps.
Typical applications include industrial machine vision and video processing (where multi-gigabit transceivers drive Camera Link or CoaXPress cameras), low-cost PCIe endpoint cards, motor control and servo drives with high-speed feedback sampling, telecommunications line cards, and embedded vision systems in industrial automation. The wide logic capacity also makes the EP4CGX75 suitable for protocol bridging and custom interface conversion in test and measurement equipment.
When designing with this device, ensure proper power sequencing on VCCINT, VCCA, and VCCD_PLL rails, as incorrect sequencing can damage the device or cause configuration failure. Use the Quartus II design software (13.0sp1 or later is recommended for Cyclone IV support) for synthesis, place-and-route, and bitstream generation. Thermal management is generally straightforward due to the low-power process, but designs exceeding 5W should use at least 4 thermal vias under the package BGA thermal pad.
This page synthesizes distributor pricing, drop-in same-package alternatives (EP4CGX75DF27C6N, EP4CGX75DF27C8N), and practical design notes not found in the manufacturer datasheet, with current data verified against distributor inventories.
Drop-in alternatives for EP4CGX75DF27C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27C7N (same form factor and footprint) β differing in Package, Process Technology, Logic Elements, Operating Temperature, Speed Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX75DF27C6N
β Drop-Inβ In Stock
$88.9 / Unit
View Datasheet βEP4CGX75DF27C8N
β Drop-Inβ In Stock
$117.11 / Unit
View Datasheet βEP4CGX75DF27I7N
β Drop-Inβ In Stock
$58.75 / Unit
View Datasheet βEP4CGX110DF27C7N
β Drop-Inβ In Stock
$204.2 / Unit
View Datasheet βEP4CGX150DF27C7N
β Drop-Inβ In Stock
$171 / Unit
View Datasheet βEP4CGX75DF27C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Series | Cyclone IV |
| Logic Elements (LE) | 73,920 |
| Number of Logic Blocks / CLBs | 4620 CLBs / 47 logic blocks (reported) |
| Total Memory Bits | 4,257,792 bits |
| Number of I/O | 310 |
| Supply Voltage | 1.2 V (core) |
| Number of Transceivers | Up to 8 (3.125 Gbps) |
| Package | 672-FBGA (27 x 27 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial, C7 suffix) |
| Operating Frequency (max) | 472.5 MHz |
| Lead-Free | Yes |
| RoHS Status | Compliant |
| Process Technology | 60 nm low-power |
| Transceiver Data Rate (max) | 3.125 Gbps |
| Configuration Method | SRAM-based, JTAG / AS / PS modes |
| Design Software | Quartus II (Cyclone IV support) |
EP4CGX75DF27C7N 672-fbga (27 x 27 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CGX75DF27C7N (672-fbga (27 x 27 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27C7N is suitable for 6 applications: Industrial Machine Vision Systems, PCIe Endpoint Cards and Embedded Computing, Motor Control and Servo Drives, Telecommunications Line Cards, Test and Measurement Instrumentation, Embedded Vision and Smart Camera Systems.
Industrial Machine Vision Systems
The EP4CGX75DF27C7N fits industrial machine vision applications because its 73,920 logic elements plus dedicated 18 x 18 multipliers can process multi-megapixel image pipelines at 60-120 fps, while the integrated 3.125 Gbps transceivers directly drive Camera Link or CoaXPress cameras without external bridge chips. Designers typically allocate 30K LE for image preprocessing (LUT-based gamma correction, Bayer demosaicing), 20K LE for the protocol stack, and 20K LE for the user application logic. The 4.2 Mbits of embedded M9K memory serves as line buffers and frame buffers. Trade-off: at 27 x 27 mm the BGA is large for compact PoC cameras but provides margin for high-speed transceiver signal integrity. The -7 speed grade is adequate for 100 MHz pixel clock and 60 fps processing in typical inspection scenarios.
Recommended
PCIe Endpoint Cards and Embedded Computing
The EP4CGX75DF27C7N integrates PCIe Gen1 hard IP in its transceivers, making it suitable for low-cost PCIe endpoint cards (x1/x4 lane widths at 2.5 Gbps) in industrial PCs, test equipment, and data acquisition systems. The 73,920 LE fabric holds the PCIe transaction layer, DMA engine, and user application logic without external PHY or bridge chips. Designers commonly use the 4.2 Mbit embedded memory for descriptor rings and scatter-gather DMA tables. Compared to PCIe soft IP in lower-end FPGAs, the hard IP saves approximately 8K LE and meets PCIe Gen1 electrical compliance more reliably. The 672-FBGA package provides sufficient pins for PCIe edge connector plus multiple GPIO banks for rear-panel I/O.
Recommended
Motor Control and Servo Drives
The EP4CGX75DF27C7N is well suited for multi-axis servo drive controllers where 73,920 LE supports several PID control loops, SVPWM generators, and EtherCAT or SERCOS III protocol stacks simultaneously. The integrated transceivers directly interface to industrial Ethernet PHYs at 100 Mbps, replacing external protocol ASICs. Designers typically use 10K LE per axis for current/torque loop, plus 5K LE for the fieldbus master stack. The 4.2 Mbit embedded memory holds reference tables and trajectory buffers. Industrial-grade variants (EP4CGX75DF27I7N) extend operating range to -40C to +100C for cabinet-free mounting. The -7 speed grade provides sufficient timing margin for 16 kHz current loop sampling on 3-axis drives.
Recommended
Telecommunications Line Cards
The EP4CGX75DF27C7N supports telecommunications line cards in low-density access multiplexers, CPRI baseband units, and small-cell base stations. Eight 3.125 Gbps transceivers carry CPRI links to remote radio heads (RRH) at up to option 3 line rates, eliminating external SERDES chips. The 73,920 LE fabric implements the PHY-layer digital front end (DFE), timing synchronization, and CPRI protocol layer. The 672-FBGA package provides enough user I/O for backplane connections, JTAG, and clock distribution. Compared to ASIC alternatives, the FPGA offers faster time-to-market for evolving CPRI specifications and easier field upgrades through SRAM-based reconfiguration.
Recommended
Test and Measurement Instrumentation
The EP4CGX75DF27C7N fits mid-range test and measurement equipment such as protocol analyzers, mixed-signal test fixtures, and arbitrary waveform generators. The 73,920 LE fabric holds custom protocol decoder logic, stimulus generators, and DSP-based signal conditioning, while the integrated transceivers capture high-speed serial data for protocol analysis. Designers typically allocate 40K LE for protocol stack, 15K LE for stimulus/response, and 15K LE for host interface. The 4.2 Mbit embedded memory serves as capture buffers. Compared to discrete logic implementations, the FPGA reduces BOM cost and enables field upgrades to support new protocol variants without hardware replacement.
Recommended
Embedded Vision and Smart Camera Systems
The EP4CGX75DF27C7N enables compact smart camera designs where on-board image processing eliminates the need for a host PC. The 73,920 LE fabric supports image preprocessing (color conversion, filtering), feature extraction (edge detection, blob analysis), and decision logic. The transceivers connect to high-speed image sensors using sub-LVDS or SLVS-EC interfaces, eliminating external bridge chips. The 4.2 Mbit embedded memory holds LUT-based gamma curves and lookup tables. The -7 speed grade handles 1080p60 pixel processing at 148.5 MHz pixel clock. Power consumption at full activity is typically 3-5W, manageable with passive heatsinking in sealed camera enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27C6N | EP4CGX75DF27C8N | EP4CGX75DF27I7N | EP4CGX110DF27C7N | EP4CGX150DF27C7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (F27, 27x27 mm, 1.0 mm pitch) | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 73,920 | 73,920 (same) | 73,920 (same) | 73,920 (same) | 109,424 (+48%) | 149,760 (+103%) |
| Memory Bits | 4,257,792 | 4,257,792 (same) | 4,257,792 (same) | 4,257,792 (same) | 5,445,120 (+28%) | 6,635,520 (+56%) |
| Transceivers (3.125 Gbps) | Up to 8 | Up to 8 (same) | Up to 8 (same) | Up to 8 (same) | Up to 8 (same) | Up to 8 (same) |
| User I/O Count | 310 | 310 (same) | 310 (same) | 310 (same) | 310 (same) | 310 (same) |
| Speed Grade | -7 | -6 (slower) | -8 (faster) | -7 (same speed, industrial temp) | -7 | -7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (same) | 0C to +85C (same) | -40C to +100C (industrial) | 0C to +85C (same) | 0C to +85C (same) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Key Differentiators
- Highest commercial-grade speed grade available in EP4CGX75 family (vs EP4CGX75DF27C6N)
- Industrial temperature range available in same package and pinout (vs EP4CGX75DF27I7N)
- Higher-density upgrade path in identical F27 package footprint (vs EP4CGX110DF27C7N)
Design Notes
The EP4CGX75DF27C7N requires multiple supply rails: VCCINT (1.2 V core), VCCD_PLL (1.2 V PLL digital), VCCA (2.5 V PLL analog), and VCCIO (1.2/1.5/1.8/2.5/3.3 V I/O banks, bank-dependent). Power sequencing per the Cyclone IV GX handbook requires VCCINT, VCCA, and VCCD_PLL to ramp together within specific timing windows; incorrect sequencing can cause permanent damage or configuration failure. Estimated: at typical industrial-machine-vision utilization (60% LE, 50% memory, all 8 transceivers active), total power consumption is approximately 3-5 W. Use at least 4-layer PCB with dedicated power planes and 10 uF + 100 nF decoupling per power pin.
The 672-FBGA package has theta_JA of approximately 12-15 C/W (with 4 thermal vias under the center ball array). At 5W total power dissipation, junction temperature rise is roughly 60-75C above ambient. For commercial 0C to +85C operation, this leaves limited thermal margin in sealed enclosures without airflow. Estimated: for sealed industrial enclosures with no airflow, design to 3W maximum continuous power and consider the EP4CGX75DF27I7N (industrial grade) if higher dissipation is required.
PCB layout for the EP4CGX75DF27C7N requires 1.0 mm pitch BGA escape routing on at least a 6-layer stackup (4 routing layers + 2 ground/power planes). All 8 transceiver channels demand 100 ohm differential impedance control and AC-coupling capacitors within 1 cm of the transmitter pins. Clock inputs require impedance-controlled traces with 50 ohm single-ended termination. Via-in-pad (VIPPO) is recommended for center ball array signals to escape the dense 1.0 mm pitch. Use the Cyclone IV GX pin connection guidelines and Quartus II Fitter reports to verify post-layout timing closure.
Common design pitfalls with the EP4CGX75DF27C7N include: (1) ignoring nCONFIG and nSTATUS pull-up requirements during board bring-up; (2) using the wrong configuration mode (AS vs PS vs JTAG) for the application, leading to configuration failure on power-up; (3) failing to connect unused transceiver channels (per datasheet, unused transceivers must be tied to specific voltages to prevent damage); (4) selecting EPCS configuration flash that is too small for the bitstream size; (5) not enabling the CRC error detection feature in Quartus II, which can mask configuration bit errors. Always validate the design with the Cyclone IV GX development kit before committing to layout.
Compliance Information
RoHS compliant and lead-free per official Altera (Intel) product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consider Cyclone IV variants with Q-grade designation. Halogen-free status not explicitly listed on the datasheet excerpt.
