EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
MPN: EP4SGX360HF35I3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2425 | $242,500.00 |
| 500 | $2150 | $1,075,000.00 |
| 1,000 | $1925 | $1,925,000.00 |
EP4SGX360HF35I3N Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM (BRAM), and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-to-performance spectrum: they offer ASIC-class throughput with mask-set-free reprogrammability, enabling hardware-level parallelism for signal processing, packet inspection, and protocol bridging. Stratix IV GX specifically targets high-speed serial connectivity, integrating hardened PCIe and SerDes IP that consume no general-purpose fabric resources.
Key features of the EP4SGX360HF35I3N include 22.4 Mbits of embedded block RAM (M9K + M144K), 1,040 embedded 18x18 multipliers organized in DSP blocks, support for up to 600 MHz fabric performance with on-chip PLLs, and dedicated PCIe Gen1/Gen2 hard IP blocks. The device is specified for the industrial temperature range (-40C to +100C) under the 'I3' speed/temperature grade, balancing timing margin against cost for non-automotive applications. The HF35 package (35 mm) uses lead-free FC-FBGA construction suitable for high-density PCB layouts requiring controlled-impedance signal routing.
Architecturally, the Stratix IV GX combines a programmable fabric with column-based I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe signaling. Embedded transceivers offer dynamic reconfiguration between protocols and data rates, while the adaptive logic module (ALM) architecture improves logic utilization compared to traditional 4-input LUT designs. Memory interfaces are supported via dedicated PHY blocks capable of DDR3 up to 1067 Mbps in the HF speed grade.
Typical applications include 10G/40G line-card bridging, video broadcast infrastructure (3G-SDI/HD-SDI aggregation), wireless baseband processing (CPRI/OBSAI fronthaul), high-speed data acquisition, and PCIe-based accelerator cards in server backplanes. The integrated transceivers make the EP4SGX360 a natural choice when board real estate and BOM consolidation matter more than raw fabric cost.
Design consideration: when targeting this device, ensure PCB stackup supports the transceiver's 8.5 Gbps channel with continuous reference planes and 100-ohm differential impedance. Thermal management is mandatory at high toggle rates due to the 35 x 35 mm package's concentrated power dissipation; the exposed-die FC-FBGA enables direct heatsink attachment via thermal interface material.
This page synthesizes distributor pricing, drop-in alternatives, and application guidance not consolidated on the manufacturer datasheet cover page.
Drop-in alternatives for EP4SGX360HF35I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360HF35I3N (same form factor and footprint) — differing in Transceivers, Package, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360HF35I3
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP4SGX360HF35C3N
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP4SGX360HF35C4N
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX360HF35C2N
✅ Drop-In✓ In Stock
$3295 / Unit
View Datasheet →EP4SGX360HF35I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| Logic Array Blocks (LABs) | 14,144 |
| User I/Os | 564 |
| Block RAM (M9K + M144K) | 22.4 Mbits |
| Embedded Multipliers (18x18) | 1,040 |
| Transceivers | Up to 24 channels |
| Max Transceiver Data Rate | 8.5 Gbps |
| PCIe Hard IP | Gen1/Gen2 x1/x2/x4 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (industrial) |
| Package | 1152-ball FC-FBGA (HF35, 35x35 mm) |
| Mounting Type | Surface Mount (BGA) |
| Lead Free | Yes |
EP4SGX360HF35I3N 1152-ball fc-fbga (hf35, 35x35 mm) Pin Configuration Guide
Pin configuration for EP4SGX360HF35I3N (1152-ball fc-fbga (hf35, 35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360HF35I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360HF35I3N is suitable for 6 applications: 10G/40G Line-Card Bridging, Wireless Baseband Processing (CPRI/OBSAI), Video Broadcast Infrastructure (3G-SDI/HD-SDI), PCIe Accelerator Cards, High-Speed Data Acquisition, Protocol Bridging and Aggregation.
10G/40G Line-Card Bridging
The EP4SGX360HF35I3N is well suited for 10G and 40G Ethernet line-card bridging because its 24 transceivers at 8.5 Gbps each provide the raw SERDES bandwidth needed to map multiple SFP+ and QSFP ports into a single fabric-based packet processor. The 353,600 logic elements support full wire-speed forwarding tables while the 22.4 Mbits of block RAM provides line-rate buffering for cut-through switching. Hardened PCIe Gen1/Gen2 IP blocks let the same FPGA hand off traffic to a switch ASIC without consuming general-purpose fabric. Designers can implement XAUI or 10GKR protocols directly using the ALTGX megafunction, and the 0.9V core supply keeps per-channel power low even with all 24 lanes active. The HF35 1152-ball FC-FBGA exposes enough I/O for parallel side-band management and reference clock distribution.
Recommended
Wireless Baseband Processing (CPRI/OBSAI)
The EP4SGX360HF35I3N fits CPRI and OBSAI fronthaul applications in 4G LTE and 5G NR base stations where its 24 SERDES channels at up to 6.144 Gbps match the line rate of CPRI Option 6 through Option 8 and OBSAI RP3. The 1,040 embedded 18x18 multipliers execute channel estimation, FFT, and turbo-decoding algorithms in parallel, while the 22.4 Mbits block RAM stores IQ sample buffers between antenna ports. Industrial -40C to +100C temperature grade handles the outdoor equipment environment without thermal derating. The HF35 package's 564 user I/Os accommodate JESD204B synchronization and backhaul Ethernet side interfaces. Quartus II DSP Builder integration accelerates development of fixed-point PHY layers, and the device's deterministic latency supports the synchronization budgets required for multi-RRU deployments.
Recommended
Video Broadcast Infrastructure (3G-SDI/HD-SDI)
The EP4SGX360HF35I3N serves broadcast video routers and processing frames because its 24 transceivers support SMPTE 424M (3G-SDI) and SMPTE 2082 (12G-SDI) with appropriate external clocking, while the 564 LVDS-capable user I/Os handle parallel HD-SDI streams and genlock distribution. Embedded block RAM aggregates video frames at 60 Hz progressive rates without external SDRAM access bottlenecks. The DSP blocks enable real-time scaling, deinterlacing, and color-space conversion operations that previously required dedicated ASSPs. Industrial temperature grade suits broadcast equipment installed in uncontrolled outdoor enclosures and production trucks. The HF35 FC-BGA package is compatible with standard high-density PCB stackups using Megtron-6 or similar low-loss dielectrics for HDMI-to-SDI bridge applications.
Recommended
PCIe Accelerator Cards
The EP4SGX360HF35I3N enables PCIe Gen2 x8 accelerator cards in server backplanes because its hardened PCIe Gen1/Gen2 IP blocks deliver up to 4 GB/s per direction without consuming fabric logic, freeing the 353,600 logic elements for application-specific compute kernels. Embedded block RAM caches intermediate results with deterministic latency critical for FPGA-based HFT, machine-learning inference, and database query acceleration. The 24 transceivers can be split between PCIe lanes and additional QSFP+ network interfaces for hybrid compute-fabric designs. The HF35 package's robust thermal envelope supports sustained operation under heavy compute loads in 1U server slots. Quartus II OpenCL SDK and HLS tools let software teams target the device without manual RTL coding.
Recommended
High-Speed Data Acquisition
The EP4SGX360HF35I3N supports wideband data acquisition in scientific instrumentation and radar systems because its 24 SERDES channels interface directly to multi-GSPS ADCs and DACs via JESD204B/C protocols at line rates up to 12.5 Gbps. The 22.4 Mbits block RAM provides sample buffering at full ADC throughput, while the 1,040 DSP blocks implement real-time digital downconversion and channelization. The device's deterministic latency supports coherent multi-channel beamforming in phased-array radar receivers. Industrial temperature grade enables deployment in field instrumentation and outdoor sensor pods. The 564 user I/Os accommodate LVDS trigger synchronization and parallel control interfaces to system controllers.
Recommended
Protocol Bridging and Aggregation
The EP4SGX360HF35I3N is a natural choice for multi-protocol bridging in industrial and telecom systems because its 24 transceivers simultaneously support PCIe, Serial RapidIO, XAUI, SATA, and custom LVDS protocols through dynamic reconfiguration. The 353,600 logic elements accommodate complex protocol state machines while maintaining deterministic throughput required by deterministic networking (DetNet) and time-sensitive networking (TSN) implementations. Embedded block RAM supports packet buffering and routing tables for aggregated traffic. The industrial -40C to +100C temperature grade handles factory-floor and outdoor edge-computing deployments. Quartus II Qsys system integration tool accelerates protocol stack assembly using pre-verified IP components.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360HF35I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360HF35I3 | EP4SGX360HF35C3N | EP4SGX360HF35C4N | EP4SGX360HF35C2N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (HF35) | 1152-ball FC-FBGA (HF35) - same | 1152-ball FC-FBGA (HF35) - same | 1152-ball FC-FBGA (HF35) - same | 1152-ball FC-FBGA (HF35) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I3 | I3 | C3 | C4 (faster) | C2 (slower) |
| Lead-Free / RoHS | Yes (N suffix) | May predate RoHS | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| User I/Os | 564 | 564 | 564 | 564 | 564 |
| Transceivers | Up to 24 @ 8.5 Gbps | Up to 24 @ 8.5 Gbps | Up to 24 @ 8.5 Gbps | Up to 24 @ 8.5 Gbps | Up to 24 @ 8.5 Gbps |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Industrial temperature grade in same HF35 footprint (vs EP4SGX360HF35C3N)
- Lead-free / RoHS compliant with N suffix (vs EP4SGX360HF35I3)
- 24-channel 8.5 Gbps transceiver integration (vs EP4SGX230KF40I3N)
Design Notes
The EP4SGX360HF35I3N in a 35x35 mm FC-FBGA package dissipates up to ~25W under worst-case utilization with all 24 transceivers active at full toggle rate. The exposed-die FC-BGA enables direct thermal attachment via a thermal interface material and a custom heatsink or heat spreader. Designers should target theta-JA below 1.5 C/W via at least 4 thermal vias under the die array, and must avoid placing heat-generating components directly adjacent to the FPGA to prevent thermal crosstalk. Industrial-grade operation up to +100C ambient requires derating by either reducing toggle rate or improving airflow. Estimated junction temperature: at 25W and theta-JA=1.5 C/W with ambient 60C, Tj equals 60 + 25 * 1.5 = 97.5C, leaving 2.5C margin to the 100C operating limit.
High-speed SERDES channels at 8.5 Gbps require continuous reference planes on adjacent PCB layers with 100-ohm differential impedance maintained to within 10% tolerance. Use low-loss dielectric material such as Megtron-6 or Rogers RO4350B for the transceiver signal layers, and avoid routing reference clock or high-speed signals over plane splits. Place AC-coupling capacitors within 200 mil of the FPGA balls and use matched-length routing with no more than 5 mil length mismatch within a lane. The HF35 1.0 mm ball pitch demands 4-mil trace width and 4-mil spacing rules, which mandates a high-end PCB house with 4/4 line/space capability and laser-drilled microvias.
Configure the Stratix IV GX transceivers using the ALTGX megafunction in Quartus II with appropriate pre-emphasis, equalization, and VOD settings matched to your channel loss profile. Perform 3D EM simulation on critical SERDES channels using tools like Ansys HFSS or Cadence PowerSI, especially for backplane applications where channel loss exceeds 15 dB at 4.25 GHz. Use a high-quality, low-jitter reference clock source such as a dedicated XO with sub-1 ps RMS phase jitter; jitter directly limits SERDES link stability at 8.5 Gbps. Implement on-die eye-margin verification via Quartus II EyeQ tool during bring-up to confirm link margin against environmental variation.
Do not assume all Stratix IV GX parts in HF35 package are drop-in compatible - the I3 vs C3 vs C4 vs C2 speed grade variants differ in temperature range and timing margin, requiring revalidation of any timing-critical paths. The N suffix on EP4SGX360HF35I3N denotes lead-free terminal finish; pre-N inventory may contain SnPb balls that violate RoHS. When migrating from Quartus II 13.1 to Quartus Prime, re-run full timing closure as the synthesis heuristics changed. Finally, do not overlook power-on sequencing: the 0.9V core must ramp monotonically within the manufacturer-specified time window or the POR circuit may not initialize properly, causing subtle configuration failures.
Compliance Information
RoHS compliant with N suffix. Not AEC-Q100 qualified (industrial only). Lead-free terminal finish (NiPdAu) per datasheet. Halogen-free status not explicitly documented.
