EP4SGX360HF35I3 - 353.6K LE Stratix IV GX FPGA 1152-FCBGA
MPN: EP4SGX360HF35I3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $815 | $8,150.00 |
| 100 | $745 | $74,500.00 |
| 250 | $695 | $173,750.00 |
| 500 | $650 | $325,000.00 |
EP4SGX360HF35I3 Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), interconnect, and I/O cells that can be electrically reprogrammed to implement custom digital circuits. The Stratix IV family targets high-end applications such as high-speed serial interfaces, DSP, and ASIC prototyping; in the system hierarchy it sits between general-purpose microcontrollers and hard-wired ASICs, offering ASIC-class performance with the design flexibility and time-to-market advantages of software-defined logic. The 'GX' suffix identifies the transceiver-rich variant with embedded multi-gigabit transceivers.
Key features include a core voltage of 0.9 V, industrial temperature grade operation from -40 °C to +100 °C, embedded transceivers capable of multi-gigabit data rates, hard DSP blocks for high-throughput arithmetic, and 564 user I/Os distributed across multiple I/O banks. The 1152-FCBGA package provides high pin density for the large I/O count and supports LVDS, LVTTL, and other common I/O standards via dedicated circuitry.
Technical depth: the device integrates 14,144 LABs in a hierarchical architecture, embedded M20K memory blocks distributed for low-latency access, and DSP blocks optimized for high-clock-rate arithmetic. The 1152-FCBGA package with F35 speed grade provides a balance of performance and power dissipation for industrial applications. Per the verified distributor data, the Stratix IV GX series also supports configuration via serial or parallel flash, JTAG, and active serial modes.
Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR), ASIC prototyping, military radar signal processing, and high-definition video processing. The combination of high logic density, embedded transceivers, and DSP blocks makes it suitable for systems requiring parallel processing and high-bandwidth connectivity.
Design consideration: when designing with EP4SGX360HF35I3, ensure a robust thermal solution is in place given the device's power dissipation in dense logic configurations, and verify PCB layout meets Intel/Altera's FCBGA BGA breakout guidelines for signal integrity at multi-gigabit transceiver rates.
This page synthesizes distributor availability data, same-family Stratix IV drop-in alternatives, and practical design considerations for engineers evaluating or sourcing this Stratix IV GX FPGA.
Drop-in alternatives for EP4SGX360HF35I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360HF35I3 (same form factor and footprint) — differing in Package, Transceivers, Speed Grade, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360HF35I4N
✅ Drop-In✓ In Stock
$8.5 / Unit
View Datasheet →EP4SGX360HF35C4N
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX360HF35C3N
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP4SGX360HF35C2N
✅ Drop-In✓ In Stock
$3295 / Unit
View Datasheet →EP4SGX360HF35C3
✅ Drop-In✓ In Stock
$6850 / Unit
View Datasheet →EP4SGX360HF35C2
✅ Drop-In✓ In Stock
$9750 / Unit
View Datasheet →EP4SGX360HF35I3 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix IV GX |
| Family | Stratix IV GX Field Programmable Gate Array |
| Logic Elements (LEs) | 353,600 |
| Total LABs | 14,144 |
| Embedded Memory (bits) | 23,105,536 |
| User I/Os | 564 |
| Core Voltage | 0.9 V |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Package Type | 1152-Ball FCBGA (FineLine BGA) |
| Speed Grade | F35 |
| Process Technology | 40 nm |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | Yes (multi-gigabit) |
| DSP Blocks | Yes (hard DSP blocks) |
| RoHS Status | Compliant |
| Configuration Modes | Serial, Parallel, JTAG, Active Serial |
| Mounting Type | Surface Mount (BGA) |
EP4SGX360HF35I3 Pin Configuration
| Pin 1 | BGA Ball A1 — Multi-function I/O pin (bank-specific assignment per pin planner) |
| Pin 2 | BGA Ball A2 — Multi-function I/O pin (bank-specific assignment per pin planner) |
| Pin 3 | BGA Ball A3 — Multi-function I/O pin (bank-specific assignment per pin planner) |
| Pin 1152 | BGA Ball AK36 — Multi-function I/O pin (bank-specific assignment per pin planner) |
Typical Applications
EP4SGX360HF35I3 is suitable for 7 applications: High-Speed Serial Backplane Aggregation, Software-Defined Radio (SDR) Platform, ASIC Prototyping, Military Radar Signal Processing, High-Definition Video Processing, Industrial Automation and Control, Telecommunications Infrastructure.
High-Speed Serial Backplane Aggregation
The EP4SGX360HF35I3's embedded multi-gigabit transceivers and 353,600 logic elements make it ideal for aggregating multiple high-speed serial links onto a single backplane. The Stratix IV GX architecture supports line rates typically required for telecom backplanes and data center switching fabrics. Combined with 14,144 LABs, designers can implement complex aggregation logic, packet processing, and traffic management alongside the serial links. The 564 user I/Os in the 1152-FCBGA package provide ample parallel I/O for backplane side-band signals, status LEDs, and parallel management interfaces. Industrial temperature grade operation (-40 °C to +100 °C) ensures reliability in carrier-grade environments where ambient temperatures inside equipment racks can exceed 70 °C during peak loads.
Recommended
Software-Defined Radio (SDR) Platform
The combination of hard DSP blocks, multi-gigabit transceivers, and high logic density makes the EP4SGX360HF35I3 a preferred platform for software-defined radio base stations and test equipment. The Stratix IV GX DSP blocks implement high-throughput FFTs, channelizers, and modulation/demodulation functions at clock rates well above 200 MHz. Multi-gigabit transceivers interface directly to ADC/DAC converters and intermediate-frequency stages without external SerDes devices. The 23,105,536 bits of embedded memory provide low-latency sample buffering and coefficient storage for adaptive filtering. The industrial temperature grade enables deployment in outdoor tower-top radio units where temperature swings and humidity are extreme. With 564 I/Os, the device also drives parallel data converters and supports multiple antenna streams simultaneously.
Recommended
ASIC Prototyping
The EP4SGX360HF35I3 with 353,600 logic elements serves as a high-capacity ASIC prototyping platform, allowing designers to validate large ASIC designs before tape-out. The Stratix IV GX architecture supports multiple ASIC prototyping methodologies including FPGA-based emulation, structured ASIC mapping, and soft-CPU based verification. The 564 user I/Os map directly to high-pin-count ASICs in the same 1152-FCBGA footprint class. Embedded memory (23 Mbits) models large SRAM blocks in modern ASICs, and hard DSP blocks accelerate arithmetic-intensive prototype logic. Industrial temperature grade enables prototype validation under real-world environmental stress. Quartus II synthesis and place-and-route tools support multi-FPGA partitioning when ASIC designs exceed single-chip capacity.
Recommended
Military Radar Signal Processing
The EP4SGX360HF35I3's combination of high logic density, hard DSP blocks, multi-gigabit transceivers, and industrial temperature grade operation makes it suitable for military radar digital signal processing subsystems. Radar processing requires real-time FFT computation, pulse compression, moving target indication (MTI), and clutter suppression - all of which leverage the Stratix IV GX DSP architecture efficiently. Multi-gigabit transceivers interface directly to radar RF front-end ADCs and digital receiver ASICs. The 1152-FCBGA package with 564 I/Os supports multiple parallel data converter channels for phased-array radar systems. Industrial temperature range (-40 °C to +100 °C) meets MIL-STD-810 environmental requirements for airborne and ground-mobile radar platforms. The device is also suitable for synthetic aperture radar (SAR) processing where large embedded memory buffers raw signal data.
Recommended
High-Definition Video Processing
The EP4SGX360HF35I3 provides the logic density and DSP resources required for real-time high-definition video processing applications including broadcast video format conversion, video walls, and medical imaging systems. The 353,600 logic elements and 14,144 LABs support multi-stream HD/4K video pipelines with complex filtering, scaling, color space conversion, and overlay composition. Hard DSP blocks accelerate motion estimation, deinterlacing, and noise reduction algorithms. The 564 user I/Os interface to multiple HDMI/DVI/DisplayPort receivers and transmitters in parallel, while multi-gigabit transceivers handle SDI and emerging high-speed video interfaces. Industrial temperature grade enables deployment in medical imaging and broadcast equipment where consistent operation is critical.
Recommended
Industrial Automation and Control
The EP4SGX360HF35I3 supports complex industrial automation controllers requiring deterministic real-time processing, multiple communication protocols, and high I/O counts. Its industrial temperature grade (-40 °C to +100 °C) ensures reliable operation in factory-floor environments with wide temperature swings, vibration, and electrical noise. The 353,600 logic elements implement multiple industrial Ethernet protocols (PROFINET, EtherCAT, EtherNet/IP), motion control loops, and safety logic on a single device. Multi-gigabit transceivers handle high-speed backplane communication between controllers in modular automation systems. The 23 Mbits of embedded memory buffer real-time control data and store configuration parameters. With 564 user I/Os, the FPGA interfaces directly to many sensors, actuators, and fieldbus transceivers without external glue logic.
Recommended
Telecommunications Infrastructure
The EP4SGX360HF35I3 is well-suited for telecommunications infrastructure equipment including base station controllers, optical transport network (OTN) processors, and carrier Ethernet switches. The Stratix IV GX transceivers support standard telecom line rates (CPRI, OBSAI, OTU) and interface directly to optical modules and backhaul links. The 353,600 logic elements and 14,144 LABs enable complex protocol stacks, QoS scheduling, and traffic shaping on a single chip. Industrial temperature range meets NEBS environmental requirements for central office and outside-plant equipment. The 564 I/Os distribute across multiple I/O banks for mixed-voltage interfacing with line cards, control plane processors, and timing subsystems. Quartus II design tools provide telecom-specific reference designs and IP cores to accelerate development.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360HF35I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360HF35I4N | EP4SGX360HF35C4N | EP4SGX360HF35C3N | EP4SGX360HF35C2N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 | 564 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | F35 I3 | F35 I4 (faster) | F35 C4 | F35 C3 | F35 C2 (slower) |
Key Differentiators
- Highest-speed industrial-grade variant in the Stratix IV GX 360K family (vs EP4SGX360HF35C3N)
- Higher speed grade option available in same package (vs EP4SGX360HF35I4N)
- Pin-compatible with all EP4SGX360 1152-FCBGA variants (vs EP4SGX360FH29I3N)
Design Notes
Estimated: at maximum logic utilization (353.6K LEs @ 0.9V core), the Stratix IV GX EP4SGX360HF35I3 may dissipate 15-20W under worst-case activity. The 1152-FCBGA package requires a thermal management solution including heatsink with thermal interface material and adequate PCB copper area. For enclosed industrial enclosures, design for at least 100 LFM airflow across the FPGA. Junction temperature must stay below 100C for industrial-grade operation. Use Quartus II PowerPlay early power estimator to validate thermal design before PCB layout.
The 1152-ball FCBGA package requires strict PCB layout discipline per Intel/Altera's BGA breakout guidelines. Use microvia/stacked-via technology for inner-row balls, with via-in-pad for the center array. Maintain 100-ohm differential impedance for transceiver lanes and 50-ohm single-ended for general-purpose I/O. Decoupling: place 0.1uF and 10uF ceramic capacitors within 100 mils of every power pin, with bulk capacitance on each voltage rail. Multiple ground layers are essential for signal integrity at multi-gigabit rates.
Multi-gigabit transceiver channels require matched-length routing with controlled skew. Reference Intel's Stratix IV GX Transceiver User Guide for eye-diagram compliance and pre-emphasis/equalization settings. Clock distribution networks should use differential signaling with low-jitter PLLs. Isolate analog transceiver power supplies (VCCA, VCCP) from digital supplies with ferrite beads and separate regulator planes. Route high-speed serial lanes on inner stripline layers with continuous reference planes above and below.
Common pitfalls: (1) Forgetting MSL (Moisture Sensitivity Level) handling for the FCBGA package - the device must be dry-baked before reflow; (2) Underestimating configuration time - large bitstreams (Stratix IV GX 353K LE can exceed 100 Mbit) require fast configuration flash; (3) Ignoring transceiver reference clock jitter - use low-jitter crystals or oscillators; (4) Not validating thermal design with realistic workload (PowerPlay Early Power Estimator); (5) Failing to verify ball pinout against the specific device variant (I3 vs I4 vs C3) using the Quartus pin planner before PCB fab.
For multi-gigabit transceiver channels (typically 3.125 Gbps to 8.5 Gbps for Stratix IV GX), use HyperLynx or similar SI simulation tools to verify channel compliance. Pre-emphasis and equalization settings must be tuned per channel based on channel loss characteristics. Maintain 85-ohm differential impedance for AC-coupled links and 100-ohm for DC-coupled. Keep transceiver lanes away from noisy switching signals on adjacent layers. Reference Intel/Altera's Stratix IV GX Transceiver User Guide for compliance testing methodology.
Compliance Information
RoHS compliant per distributor specifications. Industrial temperature grade (I suffix) provides -40C to +100C operation. AEC-Q100 not applicable for FPGAs; this device is not automotive-qualified.
