EP4SGX360HF35C3N - 353K LE Stratix IV GX FPGA | Altera
MPN: EP4SGX360HF35C3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1700 | $17,000.00 |
| 100 | $1485 | $148,500.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1180 | $1,180,000.00 |
EP4SGX360HF35C3N Overview
What is an FPGA (Field-Programmable Gate Array)? An FPGA is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit within the integrated circuit (IC) family. Stratix IV GX specifically is Altera's high-performance transceiver-equipped family, used in applications such as wireline backplanes, broadcast video processing, and high-performance digital signal processing where parallel logic and serial I/O must coexist on one die.
Key differentiating features of the EP4SGX360HF35C3N include transceivers rated up to 8.5 Gbps, hardware-rich DSP blocks optimized for fixed- and floating-point arithmetic, dedicated PCIe hard IP blocks, and 564 general-purpose I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device also supports partial and dynamic reconfiguration, enabling on-the-fly logic swap without halting operation.
The EP4SGX360HF35C3N uses a 0.9 V core supply, with separate PLL-supply and transceiver-supply rails. The 1152-ball FCBGA package is designed for high-density PCB designs with controlled-impedance routing for the 8 transceiver channels. Industrial-grade temperature grading supports -40 °C to +85 °C operation.
Typical applications include high-speed serial protocol bridging (PCI Express Gen1/Gen2, Serial RapidIO, XAUI, SFI), software-defined radio baseband processing, ASIC prototyping, broadcast and video processing engines, and high-throughput data acquisition systems. The wide logic capacity also suits telecom line-card aggregation and network packet processing.
When designing with the EP4SGX360HF35C3N, pay close attention to transceiver channel routing: matched-length 100-Ω differential pairs, AC-coupling capacitors at the transmitter outputs, and reference-clock jitter budgets are critical. Power sequencing for the 0.9 V core, 1.1 V PLL, and 1.2 V transceiver rails must follow the datasheet order to avoid latch-up.
This page synthesizes distributor stock and pricing for the EP4SGX360HF35C3N, surfaces same-package drop-in alternatives within the Stratix IV GX family, and provides design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for EP4SGX360HF35C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360HF35C3N (same form factor and footprint) — differing in Transceivers, Package, Speed Grade, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360HF35C3
✅ Drop-In✓ In Stock
$6850 / Unit
View Datasheet →EP4SGX360HF35C2N
✅ Drop-In✓ In Stock
$3295 / Unit
View Datasheet →EP4SGX360HF35C2
✅ Drop-In✓ In Stock
$9750 / Unit
View Datasheet →EP4SGX360FH29C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1495 / Unit
View Datasheet →EP4SGX360HF35C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| LABs / CLBs | 14,144 |
| User I/Os | 564 |
| Total Embedded Memory | 23,105,536 bits |
| Transceivers | 8 channels up to 8.5 Gbps |
| Package | 1152-ball FCBGA (HF35), 35 mm × 35 mm |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Mounting Type | Surface Mount (BGA) |
EP4SGX360HF35C3N 1152-ball fcbga (hf35), 35 mm × 35 mm Pin Configuration Guide
Pin configuration for EP4SGX360HF35C3N (1152-ball fcbga (hf35), 35 mm × 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360HF35C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360HF35C3N is suitable for 6 applications: PCI Express Gen1/Gen2 Bridge, Serial RapidIO Switch Fabric, ASIC Prototyping, Broadcast Video Processing Engine, Software-Defined Radio Baseband, High-Throughput Data Acquisition.
PCI Express Gen1/Gen2 Bridge
The EP4SGX360HF35C3N is purpose-built for PCI Express bridging: 8 transceivers at 8.5 Gbps provide multiple PCIe Gen1/Gen2 lanes without external PHYs, and the Stratix IV GX die includes dedicated PCIe hard IP that meets electrical compliance end-to-end. The 353K logic elements accommodate endpoint + DMA engine + application logic on a single device, eliminating the need for an external bridge chip. For x4 Gen2 links (20 Gbps raw) the device has plenty of transceiver headroom, and 564 user I/Os are sufficient to connect to Northbridge ASICs, memory controllers, or sibling FPGAs. Designers typically pair the FPGA with 10-µF bulk decoupling per supply rail and route each transceiver lane as a 100-Ω differential pair with matched length and AC-coupling caps at the TX outputs.
Recommended
Serial RapidIO Switch Fabric
Stratix IV GX FPGAs including the EP4SGX360HF35C3N are widely deployed in Serial RapidIO (SRIO) switch fabrics for DSP farms and wireless baseband. Each of the 8 transceivers supports 1.25 / 2.5 / 3.125 Gbaud SRIO with deterministic latency, and the 564 user I/Os enable multiple baseband cards to be aggregated in a single switch. Logic capacity is more than sufficient for a non-blocking 8-port switch plus queuing and congestion management. Power planning is critical: 0.9 V core draws 5-10 A under heavy traffic, so a 6-layer PCB with 2-oz copper inner planes and bulk capacitance near each transceiver channel is recommended.
Recommended
ASIC Prototyping
With 353,600 logic elements the EP4SGX360HF35C3N can absorb mid-size ASICs (5-10M gates) split across multiple FPGAs using proprietary partitioning or commercial tools. The 23 Mbits of embedded memory and 36 DSP blocks also support verification of memory subsystems and DSP datapaths at near-real-time speeds. Customers commonly map DDR3 controllers, SerDes, and large register files to the Stratix IV GX silicon to validate ASIC RTL before tape-out. The 1152-ball FCBGA also gives designers 564 I/Os for chip-to-chip debug probing.
Recommended
Broadcast Video Processing Engine
Broadcast video processing (3G-SDI, HDMI, DisplayPort switching, frame-rate conversion) benefits from the EP4SGX360HF35C3N's combination of high logic density, embedded memory for line buffers, and dedicated serializer/deserializer blocks. Each of the 8 transceivers can ingest a 3G-SDI stream and route it through on-die color-space conversion, scaling, and OSD overlays. The 564 user I/Os also support parallel BT.1120 / BT.656 buses from external video decoders. End customers are typically OEMs building production switchers, playout servers, and video walls where bandwidth and determinism matter more than raw GHz.
Recommended
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing for LTE, WiMAX, and tactical radio is a classic Stratix IV GX workload: LTE 20 MHz carriers require 100-300 GMACs of DSP throughput which the 36 hardware multipliers (9-bit) handle efficiently when chained. The 8 transceivers enable simultaneous observation of multiple bands via multiband antenna feeds, while the 564 user I/Os interface to ADC/DAC clusters and FPGA mezzanine cards (FMC). Power dissipation at full DSP utilization can exceed 15 W, so designers should budget for a 35 °C/W or better thermal solution.
Recommended
High-Throughput Data Acquisition
High-throughput data acquisition (DAQ) systems digitize RF, ultrasonic, or particle-physics detector streams at multi-GSPS rates and funnel them to storage or processing. The EP4SGX360HF35C3N absorbs the ADC data with its 564 user I/Os (LVDS pairs) and pushes them into 23 Mbits of on-die memory for buffering and packet assembly. The 8 transceivers then fan out the prepared data over 10 GbE or Aurora to downstream compute. A typical DAQ card stacks 4-8 ADCs (250-500 MSPS each) with one Stratix IV GX aggregator. The HF35 package's flip-chip BGA simplifies high-pin-count PCB layout and keeps signal-integrity budget healthy for LVDS at 1 Gbps.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360HF35C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360HF35C3 | EP4SGX360HF35C2N | EP4SGX360HF35C2 | EP4SGX360FH29C3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FCBGA (HF35), 35mm × 35mm | 1152-ball FCBGA (HF35), 35mm × 35mm | 1152-ball FCBGA (HF35), 35mm × 35mm | 1152-ball FCBGA (HF35), 35mm × 35mm | 1152-ball FCBGA (FH29), 29mm × 29mm |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | C3 (commercial) | C3 (commercial) | C2 (commercial, slower Fmax) | C2 (commercial, slower Fmax) | C3 (commercial) |
| User I/Os | 564 | 564 | 564 | 564 | 564 |
| Transceivers | 8 ch up to 8.5 Gbps | 8 ch up to 8.5 Gbps | 8 ch up to 8.5 Gbps | 8 ch up to 8.5 Gbps | 8 ch up to 8.5 Gbps |
| Lead-Free (N suffix) | Yes | No (contains Pb) | Yes | No (contains Pb) | Yes |
| Pin/PCB Compatibility | Reference | Drop-in (same HF35 ballmap) | Drop-in (same HF35 ballmap) | Drop-in (same HF35 ballmap) | PCB redesign required (29mm vs 35mm body) |
Key Differentiators
- Pb-free ball finish (N suffix) for RoHS-compliant manufacturing (vs EP4SGX360HF35C3)
- Higher speed grade (C3) within the same HF35 footprint (vs EP4SGX360HF35C2N)
- Identical ballmap enables seamless speed-grade upgrade/downgrade (vs EP4SGX360FH29C3N)
Design Notes
Decouple each of the 0.9 V core, 1.1 V PLL, 1.2 V transceiver, and 2.5 V/3.3 V I/O supply rails with a 4.7 µF X7R ceramic capacitor within 5 mm of the respective balls. Add a single 220 µF polymer tantalum or aluminum-polymer bulk cap per supply. Estimated: at full DSP utilization with all 8 transceivers active, total quiescent draw is approximately 8-12 A from the 0.9 V rail alone; verify thermal budget before committing to a 4-layer stack-up.
Each of the 8 transceiver channels requires matched-length 100-Ω differential routing, with length matching to within 0.13 mm (5 mil) for data rates above 5 Gbps. Place AC-coupling capacitors (typically 100 nF X7R 0402) within 12.7 mm of the transmitter output balls. Reference the Stratix IV GX PCB Design Guidelines for via-stub length limits; at 8.5 Gbps any via stub longer than 1.5 mm begins to degrade eye margin noticeably.
Estimated: at ambient 55 °C and a 15 W dissipation load, a typical 35 °C/W heatsink with 200 LFM airflow is required to keep the junction below 100 °C. The 1152-ball FCBGA has a high θJA because most heat leaves through the balls; copper coin or thermal via arrays beneath the die are strongly recommended. Without forced airflow, throttle DSP and transceiver utilization to roughly 60 % to stay within thermal limits.
Power sequencing is mandatory: bring up VCC (0.9 V) before the PLL supply (1.1 V) and the transceiver supply (1.2 V), and never exceed the datasheet-mandated 200 ms window between rails. The 'N' suffix on EP4SGX360HF35C3N indicates lead-free ball finish - mixing it with non-N variants on the same board complicates reflow profiling. Finally, do not assume that two Stratix IV GX devices from different packages share the same ballmap; HF35 (35mm) and FH29 (29mm) have identical pin counts but different physical layouts.
Compliance Information
The trailing 'N' suffix indicates Pb-free ball finish per Altera/Intel ordering convention. RoHS status assumed compliant because of the N suffix but exact certification document is not in the verified data - flagged as [DATA_NEEDED] in specs list.
