EP4SGX70DF29I4G - Stratix IV GX 72.6K LE FPGA, 780-FBGA | Intel
MPN: EP4SGX70DF29I4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP4SGX70DF29I4G Overview
What is a Stratix IV GX FPGA? The Stratix IV GX is a high-performance, low-power 40 nm FPGA family from Intel (formerly Altera) that combines a logic fabric, embedded memory blocks (M9K/M144K), DSP blocks, and multi-gigabit transceivers (MGTs) on a single die. It sits within the broader taxonomy: FPGA -> programmable logic device -> semiconductor IC, and was engineered to displace ASICs in high-bandwidth applications such as wireline communications, broadcast video, and high-end test and measurement equipment. The EP4SGX70DF29I4G occupies the lower end of the Stratix IV GX density range, positioned between the smaller EP4SGX50/110 and the larger EP4SGX230/290/360/530 variants.
Key features include 72,600 logic elements, 7,564,880 embedded RAM bits, support for external memory interfaces (DDR/DDR2/DDR3/QDRII/RLDRAM), 384 18x18 multipliers for DSP, and PCI Express hard IP blocks. The "I" speed grade and "4" device grade designation place this part in the -40C to +100C industrial temperature range. Integrated transceivers operate up to 8.5 Gbps, enabling protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO.
Typical applications include high-speed serial interface bridging, digital signal processing for radar and software-defined radio, ASIC prototyping, high-throughput data acquisition systems, and telecom line-card implementations. The 780-FBGA (29x29 mm) flip-chip package requires careful PCB layout and controlled-impedance routing for the high-speed serial channels.
Designers should consult the Stratix IV GX handbook for transceiver channel placement rules and use Quartus II (or later) for synthesis, place-and-route, and timing closure. The exposed-die flip-chip BGA requires a thermal management strategy (heatsink or controlled airflow) for high utilization workloads.
This page synthesizes distributor pricing, drop-in-compatible Stratix IV GX variants in the same 780-FBGA package, and practical design considerations not collated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX70DF29I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX70DF29I4G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX70DF29I3G
✅ Drop-In✓ In Stock
$1080 / Unit
View Datasheet →EP4SGX70DF29C4G
✅ Drop-In✓ In Stock
$196.99 / Unit
View Datasheet →EP4SGX70DF29C4N
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP4SGX110DF29I4G
✅ Drop-In✓ In Stock
$1085 / Unit
View Datasheet →EP4SGX110DF29I3G
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →EP4SGX230HF35I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7900 / Unit
View Datasheet →EP4CGX75DF27I7N
✅ Drop-In✓ In Stock
$58.75 / Unit
View Datasheet →EP4SGX70DF29I4G Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Number of LABs/CLBs | 2,904 |
| Total RAM Bits | 7,564,880 |
| Number of I/O | 372 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Package | 780-BBGA, FCBGA (29x29 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Transceivers | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | 384 (per family) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SGX70DF29I4G 780-bbga, fcbga (29x29 mm) Pin Configuration Guide
Pin configuration for EP4SGX70DF29I4G (780-bbga, fcbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX70DF29I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX70DF29I4G is suitable for 6 applications: High-Speed Serial Interface Bridging, Digital Signal Processing for Radar and Software-Defined Radio, ASIC Prototyping and Emulation, High-Throughput Data Acquisition Systems, Telecom Line-Card and Baseband Processing, Broadcast Video Processing and Format Conversion.
High-Speed Serial Interface Bridging
The EP4SGX70DF29I4G integrates multi-gigabit transceivers supporting up to 8.5 Gbps, enabling PCIe Gen1/Gen2, XAUI, and Serial RapidIO bridging in telecom and networking line cards. With 72,600 logic elements and dedicated hard IP for PCI Express, the device bridges between ASIC/ASSP processors and backplanes. Placed on the line-card PCB with 100-ohm differential routing to the edge connector, it eliminates the need for an external PHY while consuming the transceiver voltage rails typical of Stratix IV GX designs.
Recommended
Digital Signal Processing for Radar and Software-Defined Radio
The EP4SGX70DF29I4G's 384 18x18 DSP multipliers and high memory bandwidth make it well suited for FFT-based radar processing and SDR baseband channels. Engineers implement pipelined FIR filters, FFT cores, and digital down-converters in the 7,564,880-bit embedded memory array, achieving multi-Gsps throughput. The 0.9 V core supply limits dynamic power versus older 90 nm FPGAs, while transceivers stream ADC/DAC data to/from the host processor.
Recommended
ASIC Prototyping and Emulation
With 72,600 logic elements and abundant embedded memory, the EP4SGX70DF29I4G is a classic target for ASIC and SoC prototyping of mid-complexity designs. Designers partition RTL across multiple Stratix IV GX devices, using LVDS or multi-gigabit serial links for chip-to-chip timing-accurate connections. Quartus II supports time-budget-driven synthesis and the FPGA-in-the-loop debug tooling. Compared to custom ASIC NRE, prototyping on EP4SGX70DF29I4G cuts development cost while preserving real-world timing accuracy at MHz+ clock rates.
Recommended
High-Throughput Data Acquisition Systems
The EP4SGX70DF29I4G pairs easily with multi-Gsps ADCs and DACs in scientific and test equipment. Its transceivers carry JESD204B/C high-speed serial converter data, while 7.5 Mbits of embedded RAM buffer channelizer FFT outputs. Industrial temperature grade (I4, -40C to +100C) supports outdoor or laboratory instrument deployments. The 780-FBGA exposes 372 I/O for parallel LVDS or LVCMOS data acquisition paths, enabling both narrow-bandwidth parallel and high-bandwidth serial architectures on the same PCB.
Recommended
Telecom Line-Card and Baseband Processing
Stratix IV GX devices including the EP4SGX70DF29I4G were widely adopted in 3G/4G base-station baseband cards, OTN/SONET framer/mapper designs, and CPRI front-haul links. The transceiver channels terminate CPRI or OBSAI at up to 6.144 Gbps while the logic fabric implements MAC-layer and PHY-layer functions. Industrial temperature grade and long-life product status make it a fit for telecom OEMs requiring 10+ year production continuity.
Recommended
Broadcast Video Processing and Format Conversion
Broadcast video routers, format converters, and multi-viewer systems benefit from the EP4SGX70DF29I4G's combination of logic density and high-speed serial I/O. The FPGA implements SDI de/embedders, color-space converters, and audio de-embedders while SDI transceivers handle SD/HD/3G-SDI streams. With 372 user I/O available, the device simultaneously interfaces to HDMI, DisplayPort, or analog video ADCs/DACs alongside SDI ports. The 780-FBGA footprint simplifies routing of differential pairs for jitter-sensitive video paths.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX70DF29I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX70DF29I3G | EP4SGX70DF29C4G | EP4SGX110DF29I4G | EP4SGX110DF29I3G | EP4CGX75DF27I7N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (DF29) | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF27) - different body |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Cyclone IV GX |
| Logic Elements | 72,600 | 72,600 | 72,600 | 110,000 | 110,000 | 74,448 |
| User I/O | 372 | 372 | 372 | 372 | 372 | 390 |
| Speed/Temp Grade | I4 (Industrial, fastest) | I3 (Industrial) | C4 (Commercial) | I4 (Industrial, fastest) | I3 (Industrial) | I7 (Industrial) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 60 nm |
| Approx. Unit Price (qty 1) | USD 1,850 | USD ~1,650 | USD ~1,400 | USD ~2,400 | USD ~2,150 | USD ~250 |
Key Differentiators
- Highest-speed industrial grade in 72.6K LE Stratix IV GX family (vs EP4SGX70DF29I3G)
- Industrial temperature range with full transceiver functionality (vs EP4SGX70DF29C4G)
- Lower-density sweet spot - no over-provisioned silicon cost (vs EP4SGX110DF29I4G)
Design Notes
The 780-FBGA flip-chip package dissipates significant power at high utilization; the Stratix IV GX handbook recommends a thermal interface material (TIM) plus heatsink for designs exceeding ~6 W total power. Use Quartus PowerPlay early in the design cycle to estimate junction temperature and validate against the 100C industrial limit.
The 29x29 mm BGA lands must follow Intel's recommended 1.0 mm pitch ball pattern with non-solder-mask-defined (NSMD) pads for reliability. Use microvia or stacked-via PCB construction; 4-6 layer stack-up is acceptable for low-density designs, but 8-10 layers are recommended when using all 8 transceiver channels. Maintain 100-ohm differential impedance on all MGT lanes.
Transceiver channel placement is constrained - consult the Stratix IV GX Device Handbook pin tables and use the Quartus Pin Planner before PCB layout. Each MGT quad has reference clock inputs that must be routed with controlled impedance; avoid splitting a quad across non-adjacent banks. Place decoupling capacitors on the bottom side of the PCB directly beneath the BGA with short vias.
Do not confuse the DF29 780-FBGA with the DF27 780-FBGA used on lower-cost Cyclone IV GX parts - both have 780 balls but different body sizes (29x29 vs 27x27 mm) and pinouts. Mixing these is a common PCB rework scenario. Verify the package code on the datasheet before committing to layout.
Compliance Information
RoHS and lead-free per Intel product declaration. AEC-Q100 not applicable (FPGAs are not automotive-qualified per standard). Halogen-free status not stated in available data.
