EPF10K100BFC256-2 - FLEX 10K FPGA 100K Gates 256-BGA | Altera
MPN: EPF10K100BFC256-2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.74 | $85.74 |
| 10 | $78.5 | $785.00 |
| 100 | $74.87 | $7,487.00 |
| 500 | $70 | $35,000.00 |
| 1,000 | $65 | $65,000.00 |
EPF10K100BFC256-2 Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: ASIC < FPGA < CPLD < microcontrollers < microprocessors. The FLEX 10K family was the industry's first FPGA family with embedded array blocks (EABs), a forerunner to modern block RAM, allowing on-chip memory for FIFO, ROM, and lookup-table applications.
Key features include 4,992 logic elements, 6,144 total RAM bits distributed across embedded array blocks, 250 MHz internal operation, and 12 ns pin-to-pin logic delay per the device datasheet. The device supports in-system configuration via the Altera MAX+PLUS II or Quartus design environment, hot-swap insertion tolerant I/O, and JTAG boundary-scan testing. The 256-ball FBGA (17 x 17 mm) package provides high-density interconnect suitable for production volume designs.
Architecturally, the EPF10K100BFC256-2 implements the FLEX 10K Lookup Table (LUT)-based logic element with each LE containing a 4-input LUT, a programmable register, and dedicated carry chain logic for arithmetic operations. Embedded Array Blocks (EABs) provide 2,048 bits of dual-port RAM each and can be cascaded for wider or deeper memory configurations. The device uses SRAM configuration cells, meaning the bitstream must be loaded from an external EPROM, flash, or micro-controller at power-up.
Typical applications include legacy telecommunications line cards, industrial control glue logic, ASIC prototyping, and PCI bus interface bridging. The combination of 100K gates and 6 Kbit embedded RAM was sufficient for medium-complexity designs such as custom state machines, FIFO buffers, and peripheral controllers in the late 1990s and early 2000s, and many of those designs remain in service today requiring lifecycle support.
When designing with this device, note that the part is in production but the FLEX 10K family has been superseded by Cyclone and MAX series FPGAs. Use MAX+PLUS II version 10.2 or Quartus 4.0 for legacy support, and verify that the JTAG chain and configuration EPROM are compatible with 5V tolerance before migrating designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical legacy-support notes that are not found in the original FLEX 10K datasheet, providing engineers maintaining existing designs a single reference.
Drop-in alternatives for EPF10K100BFC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100BFC256-2 (same form factor and footprint) — differing in Process Technology, Speed Grade, Operating Temperature, Package, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100BFC256-1
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K100EFC256-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100BFC256-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$58.2 / Unit
View Datasheet →EPF10K100EFC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EPF10K100BFC256-2 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | FLEX 10K |
| Family | FLEX 10KE |
| Device Logic | 100,000 typical gates |
| Logic Elements (LEs) | 4,992 |
| Total RAM Bits | 6,144 |
| Embedded Array Blocks (EABs) | 3 (2,048 bits each) |
| Maximum Operating Frequency | 250 MHz |
| Pin-to-Pin Delay | 12 ns |
| Process Technology | 0.22 um CMOS SRAM |
| Supply Voltage | 4.75 V to 5.25 V |
| Operating Temperature | 0 C to +70 C (Commercial) |
| Package | 256-FBGA (17 x 17 mm) |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
| Configuration Method | SRAM (external EPROM/flash) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
EPF10K100BFC256-2 256-fbga (17 x 17 mm) Pin Configuration Guide
Pin configuration for EPF10K100BFC256-2 (256-fbga (17 x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100BFC256-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100BFC256-2 is suitable for 6 applications: Legacy Telecom Line Card Glue Logic, ASIC Prototyping and Emulation, Industrial Control and Machine Interface, PCI Bus Interface and Bridging Logic, Legacy Data Acquisition Front-End, Legacy Military and Avionics Systems.
Legacy Telecom Line Card Glue Logic
The EPF10K100BFC256-2's 100K gates and 6,144 bits of EAB-based RAM fit legacy telecom line cards where medium-complexity state machines, FIFO buffers, and protocol bridges are required. Designers typically instantiate the device between a network processor and PHY, providing custom packet handling, clock-domain crossing, and serial-to-parallel conversion. The 12 ns pin-to-pin delay of the -2 grade supports 50 MHz system buses, sufficient for E1/T1 and 10/100 Ethernet glue logic. Per the FLEX 10K datasheet, the embedded array blocks implement dual-port RAM for elasticity buffers, eliminating external FIFOs and reducing board area. The 256-FBGA package keeps the part compact while exposing enough I/O for multi-port telecom interfaces.
Recommended
ASIC Prototyping and Emulation
The EPF10K100BFC256-2 served as a popular ASIC prototyping vehicle in the late 1990s and 2000s, with 100K gates sufficient to validate RTL designs before committing to silicon. Multiple FPGAs can be daisy-chained via JTAG to emulate larger ASICs, while the 6,144 bits of embedded RAM model register files and small FIFOs. According to the FLEX 10K datasheet, the device's 12 ns propagation delay provides real-time execution for designs clocked up to 80 MHz. The SRAM-based configuration enables rapid design iteration - new bitstreams load in milliseconds from a configuration EPROM. Engineers maintaining legacy prototypes find the device ideal because the same MAX+PLUS II toolchain used during original development remains available.
Recommended
Industrial Control and Machine Interface
Industrial control systems requiring deterministic logic and long-term supply use the EPF10K100BFC256-2 for motor control state machines, encoder interfaces, and custom peripheral bridging. The 256-ball FBGA package withstands industrial temperature and vibration profiles, while the 5V-tolerant I/O interfaces directly to legacy 5V sensors and drivers without level shifters. Per the FLEX 10K datasheet, the device's 4,992 logic elements implement encoder quadrature decoding, PID controllers, and PWM generation with deterministic latency. The 6,144 bits of embedded RAM store calibration tables and lookup values, eliminating external memory in compact PLC modules. Engineers value the part's mature design ecosystem and the availability of MAX+PLUS II reference designs for industrial protocols.
Recommended
PCI Bus Interface and Bridging Logic
The EPF10K100BFC256-2's 100K gates comfortably implement 32-bit PCI 2.1 bus interfaces, including target and master state machines, parity generation, and configuration space registers. The 12 ns -2 speed grade meets the 33 MHz PCI bus timing budget with margin, while the 256-FBGA package exposes enough I/O for the 49-pin PCI bus plus auxiliary signals. According to the FLEX 10K datasheet, EAB-based RAM implements the PCI configuration space (256 bytes) and small FIFOs for posted-write buffers. The device bridges PCI to local microcontrollers, DSPs, and legacy peripherals in industrial and embedded computing platforms, where the mature PCI core libraries and verified reference designs minimize development risk.
Recommended
Legacy Data Acquisition Front-End
Data acquisition front-ends in test equipment and instrumentation use the EPF10K100BFC256-2 to implement custom timing, channel multiplexing, and trigger logic for ADC front-ends. The 250 MHz internal operation supports high-speed sample-clock generation, while the 6,144 bits of embedded RAM store calibration coefficients and trigger patterns. Per the FLEX 10K datasheet, the device's I/O count supports multi-channel simultaneous sampling architectures with up to 32 LVCMOS pairs. The mature MAX+PLUS II design environment contains reference designs for parallel ADC interfacing, simplifying new product development based on the legacy architecture.
Recommended
Legacy Military and Avionics Systems
Avionics and military systems designed in the late 1990s and early 2000s continue to use the EPF10K100BFC256-2 for ARINC 429, MIL-STD-1553, and custom avionics bus interfaces, where long-term lifecycle support and 5V tolerance are critical. The commercial 0C to +70C grade suffices for cabin avionics, while industrial-temperature variants exist for harsher environments. Per the FLEX 10K datasheet, the embedded array blocks implement ARINC 429 message buffers and 1553 protocol storage, eliminating external RAM in compact line-replaceable units. Long-term programs with 20+ year support requirements value the part's mature supply chain through authorized Altera distributors holding legacy inventory.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100BFC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100BFC256-1 | EPF10K100EFC256-1X | EPF10K100BFC256-3 | EPF10K100EFC256-2 | EPF10K100BFC484-2 |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 484-FBGA - different |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -2 (12 ns) | -1 (16 ns) | -1X enhanced | -3 (~20 ns) | -2 (12 ns) | -2 (12 ns) |
| Family | FLEX 10K | FLEX 10K | FLEX 10KE | FLEX 10K | FLEX 10KE | FLEX 10K |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Total RAM Bits | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Temperature Grade | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
Key Differentiators
- Fastest speed grade in FLEX 10K family (vs EPF10K100BFC256-1)
- Mature FLEX 10K ecosystem with extensive legacy support (vs EPF10K100EFC256-1X)
- Standard 256-FBGA footprint with broad second-source availability (vs EPF10K100BFC484-2)
Design Notes
The EPF10K100BFC256-2 requires a stable 5.0 V supply within +/-5% (4.75 V to 5.25 V) per the FLEX 10K datasheet. Estimated: with 100K gates fully utilized at 80 MHz, core current reaches approximately 200-300 mA; design a 5 V regulator with at least 1 A headroom. Decoupling requires 0.1 uF ceramic capacitors at every VCC pin and 10 uF bulk tantalum on the supply rail. SRAM configuration cells draw active current during bitstream loading, so the supply must remain stable during the entire configuration sequence.
The 256-FBGA package with 1.0 mm ball pitch requires 4-6 layer PCB construction with microvia or via-in-pad technology for reliable assembly. Per Altera application notes, escape routing under the BGA uses dog-bone fan-out patterns with 8 mil traces and 5 mil spacing. Maintain a continuous ground plane beneath the FPGA for thermal dissipation and signal return paths; the 256-FBGA package dissipates 1-3 W depending on utilization. All JTAG, configuration, and clock signals require length matching within +/-250 mil for reliable operation.
The SRAM-based configuration means the EPF10K100BFC256-2 must load its bitstream from an external EPC configuration EPROM or micro-controller at every power-up. Forgetting to provide the configuration device renders the FPGA non-functional. Per the FLEX 10K datasheet, the nCONFIG pin must be held low during power-up, then released to initiate configuration. JTAG chain ordering matters - if the FPGA is preceded by other JTAG devices, their TAP controllers must be in bypass during configuration. Watch for I/O bank voltage compatibility; 5V input tolerance requires specific bank configuration and cannot be mixed with 3.3V signals on the same bank.
Differential clock inputs (CLK0/CLK1) require matched-length routing with controlled impedance (50 ohm single-ended, 100 ohm differential) per the FLEX 10K datasheet. Isolate high-speed I/O banks from analog or low-noise circuitry to prevent ground bounce coupling. Place the configuration EPROM within 6 inches of the FPGA with short, matched-length traces to the DCLK and DATA0 pins to avoid configuration failures.
Compliance Information
Per distributor listing (Veswin Electronics), the EPF10K100BFC256-2 is marked RoHS non-compliant with lead-bearing terminations consistent with the original FLEX 10K product era (pre-2006). Not AEC-Q100 qualified as a commercial-grade FPGA. REACH and conflict minerals status not stated in available data.
