EPF10K100EBC356-2X - FLEX 10KE FPGA 100K Gates 356-BGA | Altera
MPN: EPF10K100EBC356-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EPF10K100EBC356-2X Overview
What is a FLEX 10KE FPGA? The FLEX 10KE family is a second-generation embedded programmable logic family that introduced the industry's first embedded array blocks (EABs) for implementing on-chip dual-port RAM, ROM, FIFO, and CAM functions alongside conventional logic. This hybrid "Logic + Embedded Array" architecture enables System-on-a-Programmable-Chip (SOPC) integration, sitting hierarchically under PLD → CPLD/FPGA → programmable logic device → semiconductor. The FLEX 10KE family is the precursor to modern SRAM-based FPGAs from Altera/Intel and remains in production for long-lifecycle industrial, telecom, and military customers.
Key features of the EPF10K100EBC356-2X include 12 embedded array blocks (EABs) providing up to 49,152 RAM bits, built-in JTAG boundary-scan test (IEEE 1149.1), 3.3 V PCI-compliant I/Os, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V mixed-voltage interfacing, in-system programmability via the Altera ByteBlaster or BitBlaster download cables, and four dedicated clock input pins plus global clock networks. The SRAM-based configuration cells allow unlimited reconfiguration, while dedicated configuration circuitry supports serial and parallel configuration modes including passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG-based configuration.
The architecture combines a fine-grained Look-Up Table (LUT)-based logic fabric with course-grained embedded array blocks, giving designers the ability to implement both random state machines and high-density memory functions on the same die. Each LAB contains 8 Logic Elements (LEs), each LE containing a 4-input LUT, a programmable register, and dedicated carry and cascade chains. The EABs can be configured as 256 x 8, 512 x 4, 1024 x 2, or 2048 x 1 memory blocks with optional parity.
Typical applications include telecom infrastructure (line-card controllers, glue logic for ATCA/cPCI backplanes), industrial automation (PLC scan engines, motor-control co-processors), military/aerospace systems requiring long-lifecycle Altera silicon, data-acquisition front-ends, and legacy designs that were migrated from FLEX 10K to FLEX 10KE to gain EAB-based embedded memory. Designers porting to newer Cyclone or MAX families will find the FLEX 10KE design flow familiar: Quartus II (legacy) or Quartus Prime Lite can target this device using compiled VHDL/Verilog netlists.
When designing with this device, observe that the 35 mm x 35 mm LBGA-356 package requires 4-layer or 6-layer PCB stack-up with 0.5 mm or 0.8 mm ball pitch and matched-length impedance control on clock and global nets. Decoupling must use at least 12 x 0.1 µF ceramic capacitors placed within 5 mm of the package, plus a 100 µF tantalum bulk capacitor on each supply rail. Configuration mode selection via MSEL pins must be hardwired before VCC ramps up, otherwise the device may enter an undefined configuration state. Designers should also budget at least 200 mA of peak inrush current during configuration, requiring a soft-start circuit on the 2.5 V regulator.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog (same-package FLEX 10KE speed-grade and -1/-2N/-3 family variants), and practical design notes that are not assembled in the manufacturer datasheet PDF.
Drop-in alternatives for EPF10K100EBC356-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EBC356-2X (same form factor and footprint) — differing in Operating Temperature, Process Technology, RoHS Status, Family, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EBC356-2
✅ Drop-In✓ In Stock
$59.95 / Unit
View Datasheet →EPF10K100EBC356-1X
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EPF10K100EBC356-1N
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$108 / Unit
View Datasheet →EPF10K100EBC356-1
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$92 / Unit
View Datasheet →EPF10K100ABI356-3
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →EPF10K100ABC356-2
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$108 / Unit
View Datasheet →EPF10K100EBC356-2X Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Number of Logic Elements/Cells | 4992 |
| Total RAM Bits | 49152 |
| Number of Logic Array Blocks (LABs) | 624 |
| Number of Gates | 100000 |
| Number of User I/Os | 274 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Core Voltage - Supply | 2.375 V to 2.625 V |
| I/O Supply Voltage | 3.3 V |
| Propagation Delay (tpd) | 0.6 ns (typical) |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Package / Case | 356-LBGA (35 mm x 35 mm) |
| Supplier Device Package | 356-BGA |
| Mounting Type | Surface Mount |
| RoHS Status | Lead free / RoHS Compliant |
| Configuration Memory | SRAM (volatile, unlimited reconfigures) |
EPF10K100EBC356-2X 356-bga Pin Configuration Guide
Pin configuration for EPF10K100EBC356-2X (356-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EBC356-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EBC356-2X is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial PLC Co-Processor, Data Acquisition Front-End, Legacy Avionics Interface Bridge, Medical Imaging Pre-Processor, Test & Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EPF10K100EBC356-2X's 100K system gates and 49,152 bits of EAB-based RAM suit telecom line-card applications where the FPGA sits between a network processor and PHY transceivers, performing cell delineation, framing, and protocol muxing. The 274 user I/Os comfortably accommodate 32-bit datapath buses plus 16-bit control/status plus 4 dedicated clock inputs, leaving margin for board-level test and JTAG access. Designers can implement dual-port FIFOs in EABs to bridge the network processor's clock domain to the PHYs without external SRAM. The 3.3 V PCI-compliant I/O bank interfaces directly to legacy cPCI/ATCA line-card mezzanines without level shifters. This is a mature, long-lifecycle role where FLEX 10KE silicon remains in production for tier-1 telecom OEMs.
Recommended
Industrial PLC Co-Processor
In industrial PLC and DCS architectures, the EPF10K100EBC356-2X serves as a co-processor offloading scan-engine housekeeping, motion-control pulse trains, and PID loop calculations from the main CPU. The FLEX 10KE's EAB-based RAM blocks implement fast lookup tables for cam profiling and PWM modulation, while the 4,992 logic elements host deterministic state machines that complete each scan in microseconds. The 0 °C to 70 °C commercial temperature range covers most factory-floor enclosures, and the LBGA-356 footprint supports 4-layer PCB stack-ups typical of PLC backplanes. Long-lifecycle FLEX silicon is critical here because industrial customers often run 15-20 year support contracts.
Recommended
Data Acquisition Front-End
The EPF10K100EBC356-2X functions as the timing-and-control engine in a multi-channel data-acquisition front-end, generating precise ADC sample clocks, demultiplexing LVDS data streams, and pre-processing samples in EAB-based FIFO buffers. Its 12 EABs deliver up to 49 kbit of dual-port RAM, sufficient to stage 1 k-sample bursts from four simultaneous ADCs before forwarding to a DSP. The SRAM-based configuration allows field firmware updates via JTAG, useful for upgrading filter coefficients or trigger logic in deployed instruments. The 3.3 V I/O banks interface cleanly to modern 16-bit ADCs while multiVolt pins support older 5 V sensors in mixed-vintage test systems.
Recommended
Legacy Avionics Interface Bridge
Avionics retrofit programs often specify the EPF10K100EBC356-2X to bridge between older MIL-STD-1553 or ARINC 429 buses and modern Ethernet-based avionics networks. The FPGA's 274 user I/Os map cleanly to a 1553 transceiver pair (4 I/Os), an ARINC 429 receiver/transmitter pair (8 I/Os), and a 16-bit Ethernet MAC FIFO interface, with margin for discrete status and reset lines. EAB-based dual-port RAMs implement the protocol-conversion FIFOs deterministically, while logic elements handle bit-timing and word-format conversion. Long lifecycle and FPGA reconfigurability are critical because avionics programs run for decades and require in-field firmware updates without hardware changes.
Recommended
Medical Imaging Pre-Processor
In ultrasound and endoscopy pre-processing pipelines, the EPF10K100EBC356-2X performs beam-forming summation, envelope detection, and pixel-rate frame buffering before handing data to a host DSP or CPU. Its 4,992 logic elements implement 32-channel digital beamformers with parallel multiply-accumulate paths, and the 12 EABs provide sufficient dual-port RAM for line-buffer memories that smooth pixel-rate bursts. The 3.3 V PCI-compliant I/Os interface to standard medical-imaging backplanes, while the 0.6 ns propagation delay enables deterministic pixel pipelines at 80 MHz. Medical OEMs value the FLEX 10KE family because its long-term supply longevity aligns with FDA-cleared device lifecycles.
Recommended
Test & Measurement Instrumentation
The EPF10K100EBC356-2X is widely deployed in bench-top test instruments such as logic analyzers, protocol exercisers, and ATE load-boards, where it serves as the pattern-generator and timing-control engine. Its 274 user I/Os fan out to multiple instrument channels, while EAB-based RAMs store stimulus vectors and capture buffers up to 49 kbit per device. The SRAM configuration supports rapid pattern updates via JTAG, critical when test engineers iterate on stimulus libraries between bench runs. The 0.6 ns propagation delay and 624 LABs deliver deterministic timing that meets the sub-nanosecond skew budgets required by high-speed serial-bus testers (PCI, PCIe Gen1, SATA, USB 2.0).
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EBC356-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EBC356-2 | EPF10K100EBC356-1X | EPF10K100EBC356-1N | EPF10K100EBC356-1 | EPF10K100ABI356-3 | EPF10K100ABC356-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA (35x35) | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same |
| Speed Grade | -2X (enhanced) | -2 (base) | -1X (slower) | -1N (slower) | -1 (slowest) | -3 (slowest) | -2 (base) |
| Temperature Grade | Commercial (0 to 70 °C) | Commercial (0 to 70 °C) | Commercial (0 to 70 °C) | Industrial (-40 to 85 °C) | Commercial (0 to 70 °C) | Industrial (-40 to 85 °C) | Commercial (0 to 70 °C) |
| Logic Elements | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| User I/Os | 274 | 274 | 274 | 274 | 274 | 274 | 274 |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Enhanced -2X timing margin over base -2 grade (vs EPF10K100EBC356-2)
- 100K-gate FLEX 10KE density with 12 EABs (vs EPF10K50EBC356-1N)
- Commercial-grade silicon for cost-sensitive volume (vs EPF10K100EBC356-1N)
Design Notes
The EPF10K100EBC356-2X draws approximately 200 mA peak inrush during configuration on the 2.5 V core rail, which demands a soft-start regulator or a current-limited LDO to prevent VCCINT sag. Once configured and operating at 80 MHz internal logic with moderate toggle rates, the steady-state Iccint is approximately 150-300 mA, scaling with utilization and clock frequency. Place at least twelve 0.1 µF X7R ceramic decoupling capacitors within 5 mm of the BGA balls (one per VCCINT/GND pair in each quadrant), plus a single 100 µF tantalum bulk capacitor on each supply rail. Estimate: assuming VCCINT = 2.5 V and Iccint = 250 mA, the steady-state core dissipation is approximately 0.625 W; total board dissipation including I/O switching is typically 1.5-2.0 W, requiring thermal relief through inner copper planes and (in dense designs) forced airflow.
The 356-LBGA package at 35 mm x 35 mm uses a FineLine BGA pitch (typically 1.27 mm) and demands a 4-layer or 6-layer PCB stack-up with matched-impedance control on clock and global nets. Use microvia-in-pad or dog-bone fan-out to break out the inner-row balls, and reserve at least two solid ground planes directly beneath the BGA for return-path integrity. All 356 balls must be soldered with no-connects tied to internal planes for mechanical reliability - never leave NC balls floating. For high-vibration environments, under-fill the BGA with a low-stress epoxy to improve thermal-cycle endurance and shock resistance.
Do not power up the EPF10K100EBC356-2X with MSEL pins floating or with an inconsistent logic level - the configuration mode (PS, PPS, PPA, JTAG) is selected at power-on and cannot be changed without a power cycle. Ensure VCCINT ramps before VCCIO per Altera's power-sequencing specification to avoid I/O latch-up; if your 2.5 V and 3.3 V rails come up simultaneously from independent regulators, add a Power-On-Reset (POR) supervisor that holds nCONFIG low until both rails are in regulation. Configuration PROMs (EPC2LC20, EPC4QC100) must be programmed with the correct MSB/LSB byte order - mixing these up results in a CRC error and CONF_DONE never going high.
Compliance Information
Lead free and RoHS compliant per Micro-Semiconductor.com product listing. Not AEC-Q100 qualified - this is a commercial-grade FPGA. REACH compliance inferred from Altera/Intel product stewardship statements.
