EPF10K100EQC240-2N - 100K Gates FLEX-10KE FPGA, 240-PQFP | Altera
MPN: EPF10K100EQC240-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $27.2 | $2,720.00 |
| 500 | $22.5 | $11,250.00 |
| 1,000 | $18.4 | $18,400.00 |
EPF10K100EQC240-2N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be reconfigured by the designer after manufacture. FPGAs sit within the programmable logic device hierarchy above CPLDs and below ASICs in terms of integration density and per-unit cost at high volume. The FLEX 10KE architecture layers Embedded Array Blocks (EABs) for efficient RAM/ROM implementation alongside Look-Up Table (LUT)-based logic, allowing designers to build datapaths, state machines, and on-chip memory in a single device.
Key specifications include 624 Logic Array Blocks (LABs) of fast interconnect, a 2.5 V core supply (VCCINT 2.375 V to 2.625 V) with 3.3 V multi-voltage I/O support, 257,000 maximum system gates, and CMOS logic family operation. The device is configured via the passive serial or ByteBlaster load path through Altera's legacy MAX+PLUS II / Quartus tool chains, and configuration memory is volatile SRAM, requiring a serial PROM (EPC1 / EPC2) for self-load at power-up. The 240-PQFP footprint supports migration across FLEX 10K, 10KA, and 10KE density points.
Typical applications span industrial control interfaces, glue-logic replacement, bus bridges (PCI to local bus), legacy telecom glue logic, custom peripheral controllers, and ASIC prototyping. Designers choose this part when they need high gate count, on-chip RAM, and a familiar Altera tool flow at moderate logic density with commercial-grade temperature support.
Design consideration: route the JTAG chain (TCK/TMS/TDO/TDI) away from switching signals, place the 0.1 uF and 10 uF VCCINT decoupling caps within 5 mm of every supply pin, and assign the configuration mode pins (MSEL0/MSEL1) via 4.7 kohm pull-ups for passive-serial mode. The configuration data is lost at every power-down, so an external EPC1/EPC2 configuration PROM is required.
This page synthesizes distributor pricing snapshots, drop-in alternative coverage across the FLEX 10KE family, and PCB layout/design notes that go beyond the manufacturer datasheet to accelerate design-in and obsolescence risk assessment for this mature legacy Altera part.
Drop-in alternatives for EPF10K100EQC240-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC240-2N (same form factor and footprint) — differing in Package / Case, Family, Operating Temperature, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC240-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K100EQC240-1N
✅ Drop-In✓ In Stock
$55.95 / Unit
View Datasheet →EPF10K100EQC240-1
✅ Drop-In✓ In Stock
$18.5 / Unit
View Datasheet →EPF10K100BQC240-3
✅ Drop-In✓ In Stock
$16.95 / Unit
View Datasheet →EPF10K100BQC240-2
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EPF10K100EQC240-2N Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Logic Elements / Cells | 4992 |
| Total RAM Bits | 49152 |
| Number of LABs / CLBs | 624 |
| Number of Gates (Typical) | 100000 |
| Number of I/O Pins (User I/O) | 189 |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) |
| I/O Voltage | 3.3 V multi-voltage I/O |
| Operating Temperature | 0C to +70C (Commercial, N suffix) |
| Mounting Type | Surface Mount |
| Package / Case | 240-BQFP / 240-PQFP (32x32 mm) |
| Supplier Device Package | 240-PQFP (32x32) |
| Logic Family | CMOS, SRAM-based |
| Propagation Delay | 0.6 ns (typical, per datasheet support listing) |
| Configuration Method | Passive Serial / ByteBlaster; volatile SRAM (external EPC1/EPC2 PROM required) |
| RoHS Status | Lead free / RoHS Compliant |
| Lifecycle Status | Obsolete (discontinued by Altera/Intel) |
EPF10K100EQC240-2N 240-pqfp (32x32) Pin Configuration Guide
Pin configuration for EPF10K100EQC240-2N (240-pqfp (32x32) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EQC240-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EQC240-2N is suitable for 6 applications: Industrial Control Glue Logic, Legacy Telecom / Datacom Glue Logic, Custom Peripheral Controller / Bus Bridge, ASIC Prototyping and Emulation, Test & Measurement Instrumentation Front-End, Legacy Aerospace / Defense Avionics (with obsolescence planning).
Industrial Control Glue Logic
The EPF10K100EQC240-2N fits industrial control glue-logic replacement where 189 user I/Os, 100K gates of fast interconnect, and 49,152 bits of embedded SRAM (in EABs) are needed to consolidate multiple 74-series TTL chips, bus arbiters, and PWM timers into a single reconfigurable device. The 2.5 V core with 3.3 V I/O supports legacy 5 V-tolerant industrial buses with external resistors. Its commercial 0C to 70C range and PQFP package suit fan-cooled control cabinets, while SRAM-based configurability supports field firmware updates. The 624 LABs deliver deterministic timing for motor-control state machines and fieldbus protocol stacks.
Recommended
Legacy Telecom / Datacom Glue Logic
The EPF10K100EQC240-2N was widely deployed in legacy telecom line-card glue logic, where its 189 I/Os drive backplane connectors, TDM bus bridges, and HDLC controllers. The 49,152 bits of embedded SRAM store look-up tables for routing tables and timing recovery. 2.5 V core with 3.3 V I/O matched the legacy telecom power architecture of the late 1990s and early 2000s, and the FLEX 10KE's fast LAB interconnect supports synchronous TDM bus rates up to 100 MHz. Designs targeting hardware-maintenance stock should migrate to FLEX 10K-A or Cyclone families for new builds.
Recommended
Custom Peripheral Controller / Bus Bridge
The EPF10K100EQC240-2N functions as a PCI-to-local-bus bridge or custom peripheral controller in workstation and embedded computing designs. With 189 I/Os, the device exposes enough pins to multiplex a 32-bit PCI bus plus auxiliary control signals, and the 4,992 logic elements implement the entire bus-arbitration state machine plus DMA engine in a single chip. The 49,152 bits of embedded SRAM buffer scatter-gather DMA descriptors on-chip. The 240-PQFP package was the de-facto standard for industrial single-board computers of the early 2000s.
Recommended
ASIC Prototyping and Emulation
Engineers historically used the EPF10K100EQC240-2N as an ASIC prototyping vehicle for moderate-complexity ASICs in the 100K-gate range. The 4,992 logic elements and 624 LABs support full RTL synthesis with commercial EDA tools (MAX+PLUS II, Quartus). Its 189 I/O pins and 240-PQFP package provide large signal observability for logic-analyzer-based debug. Modern ASIC prototyping typically migrates to Cyclone V or Cyclone 10 GX FPGAs with multi-million gate capacity and high-speed transceivers, but legacy emulation flows still leverage this part for ASIC verification IP.
Recommended
Test & Measurement Instrumentation Front-End
The EPF10K100EQC240-2N serves as the digital front-end controller in test & measurement equipment, where 189 I/Os parallel-sample multiple data-acquisition channels and the 49,152 bits of embedded SRAM store waveform captures or look-up tables for DDS synthesis. The 2.5 V core with 3.3 V I/O matches legacy mixed-signal ASICs and ADC/DAC front-ends, and the FLEX 10KE's deterministic LAB timing enables precise trigger and gate-array logic. Designers use the configuration PROM chain to switch instrument personalities by swapping EPC2 contents in the field.
Recommended
Legacy Aerospace / Defense Avionics (with obsolescence planning)
Long-lifecycle aerospace and defense programs have deployed the EPF10K100EQC240-2N for mission computer I/O expansion and display controllers. With 189 I/Os and 49,152 bits of embedded SRAM, the device handles multiple ARINC 429 channels, MIL-STD-1553 bridges, and discrete I/O processing. The commercial 0C to 70C range is acceptable for temperature-controlled avionics bays. Long-term support programs rely on Rochester Electronics' authorized Altera/Intel lifetime inventory and obsolescence forecasting to maintain spares for 15-20 year service intervals.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC240-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC240-2 | EPF10K100EQC240-1N | EPF10K100EQC240-1 | EPF10K100BQC240-3 | EPF10K100BQC240-2 |
|---|---|---|---|---|---|---|
| Package | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 10KE (EAB-enhanced) | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KB (legacy, no EAB) | FLEX 10KB (legacy, no EAB) |
| Speed Grade | -2 | -2 (same) | -1 (slower) | -1 (slower) | -3 (slowest) | -2 (same) |
| Logic Elements | 4992 | 4992 (same) | 4992 (same) | 4992 (same) | 4992 (same) | 4992 (same) |
| Embedded SRAM Bits | 49152 (EAB-based) | 49152 (same) | 49152 (same) | 49152 (same) | 24576 (half - legacy EAB) | 24576 (half - legacy EAB) |
| User I/O Pins | 189 | 189 (same) | 189 (same) | 189 (same) | 189 (same) | 189 (same) |
| RoHS / Lead-Free | Yes (N suffix) | No (lead) | Yes (N suffix) | No (lead) | No (lead) | No (lead) |
| Operating Temperature | 0C to 70C (Commercial) | 0C to 70C (Commercial) | 0C to 70C (Commercial) | 0C to 70C (Commercial) | 0C to 70C (Commercial) | 0C to 70C (Commercial) |
Key Differentiators
- FLEX 10KE architecture with EAB-based embedded SRAM (vs EPF10K100BQC240-3)
- -2 speed grade (faster than -1 and -3 alternatives) (vs EPF10K100EQC240-1N)
- RoHS-compliant (N suffix) without sacrificing FLEX 10KE feature set (vs EPF10K100EQC240-2)
Design Notes
The EPF10K100EQC240-2N requires a clean 2.5 V core supply on VCCINT (2.375 V to 2.625 V) and a 3.3 V supply on VCCIO. Decouple every VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the pin, plus one bulk 33 uF tantalum per 6 VCCINT pins. Estimated: at 100% toggle on 189 I/Os at 100 MHz, peak core current reaches 300 mA; budget 1 A total on the 2.5 V rail for transient headroom. Inrush during configuration also requires the regulator to source the full 500 mA CC24 PROM bitstream transfer without sagging.
Common pitfalls: (1) omitting the EPC2 configuration PROM, which causes the FLEX 10KE to remain in reset after power-up because configuration data is volatile SRAM; (2) leaving MSEL0/MSEL1 floating - they must be tied via 4.7 kohm resistors to VCCIO or GND per the desired mode; (3) connecting JTAG TCK/TMS/TDO/TDI without proper series termination at high toggle rates; (4) failing to drive nCONFIG high after power-up with the recommended RC delay (typically 10 kohm + 0.1 uF for 1 ms reset pulse); (5) routing 5 V signals directly to the 3.3 V I/O without external clamping, since the FLEX 10KE is 3.3 V-tolerant but not 5 V-tolerant by default.
Place the EPC2 configuration PROM within 50 mm of the EPF10K100EQC240-2N to keep passive-serial configuration timing within Altera's specification. Use 4-layer PCB with continuous VCCINT and GND planes to support the high transient current during configuration and to control the 240-PQFP's lead inductance. Route the JTAG chain as a daisy-chain with 22 ohm series termination at each FPGA TDI pin and 10 kohm pull-up on TCK/TMS. Place the 32.768 kHz or external clock source within 25 mm of the dedicated CLK pin to minimize jitter on global clock networks.
Estimated: at 100% utilization of all 189 I/Os at 50 MHz with 20 pF loads, the EPF10K100EQC240-2N's 240-PQFP (32x32 mm) package dissipates approximately 1.8 W. With a typical theta_JA of 28 C/W on a 4-layer PCB, the junction temperature rises 50C above ambient. To stay within the 70C commercial limit, ensure ambient does not exceed 20C at full load - or attach a heatsink or airflow if industrial temperature is required. The PQFP package's exposed lead frame can dissipate up to 2.5 W with 400 LFM airflow.
Compliance Information
RoHS compliant per the N suffix and distributor listings (BESEN Chips, DigiKey product attributes). Halogen-free and conflict-minerals status not specified in the verified web data. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive qualified.
