EPF10K100EQC240-1 - FLEX 10KE FPGA 100K Gates 240-PQFP | Altera
MPN: EPF10K100EQC240-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38 | $380.00 |
| 100 | $28 | $2,800.00 |
| 500 | $22 | $11,000.00 |
| 1,000 | $18.5 | $18,500.00 |
EPF10K100EQC240-1 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing by a configuration bitstream loaded into SRAM cells. Within the broader taxonomy, FPGAs sit beside CPLDs (Complex Programmable Logic Devices) inside the PLD (Programmable Logic Device) family, and represent the highest-density, highest-performance tier of general-purpose programmable logic. FPGAs are commonly used to implement glue logic, custom datapaths, bus interfaces, and prototype ASICs before tape-out. The FLEX 10KE family specifically introduced embedded array blocks (EABs) for on-chip RAM and ROM, enabling System-on-a-Programmable-Chip (SOPC) integration.
Key features include embedded array blocks (EABs) for synchronous RAM and ROM, multi-level FastTrack interconnect routing, JTAG (IEEE 1149.1) boundary-scan test support, and built-in PCI compliance. The architecture combines 4,992 LEs distributed across 624 LABs with 12 embedded array blocks of 2,048 bits each, totaling 24 Kbits of dedicated memory expandable to 49 Kbits when using LE-based RAM. MultiVolt I/O pins support 3.3 V, 2.5 V, and 1.8 V interfaces through dedicated VCCIO banks, simplifying mixed-voltage design.
The FLEX 10KE architecture separates logic and interconnect resources into rows and columns, with each Logic Array Block containing 8 LEs, a carry chain, and a cascade chain for arithmetic and wide fan-in functions. The embedded array blocks serve as 2,048-bit memory blocks configurable as RAM, ROM, or lookup tables. Configuration data is loaded serially via a 5-pin interface or via the ByteBlaster/parallel port cable, supporting in-system programmability. Operating temperature range is 0 °C to 70 °C for the commercial grade, with the device consuming low standby current typical of SRAM-based FPGAs.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus bridges, peripheral controllers, and legacy system upgrades where migration from discrete TTL or older PLDs is required. The 189 user I/Os make the EPF10K100E well-suited to bus-intensive designs with multiple external interfaces.
When designing with this device, verify that the I/O bank voltages match those of connected peripherals, since 5 V tolerance is not provided on all pins. The 240-pin PQFP package requires careful PCB layout with adequate power and ground planes, and the -1 speed grade should be derated appropriately when calculating setup and hold margins for high-speed synchronous interfaces.
This page synthesizes distributor pricing, drop-in alternatives from the FLEX 10KE family, and practical design notes not found in the original manufacturer datasheet alone.
Drop-in alternatives for EPF10K100EQC240-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC240-1 (same form factor and footprint) — differing in Configuration Method, Family, Total RAM Bits, Package, Package / Case.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC240-1N
✅ Drop-In✓ In Stock
$55.95 / Unit
View Datasheet →EPF10K100EQC240-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EPF10K100EQC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$55.5 / Unit
View Datasheet →EPF10K100BQC240-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$119 / Unit
View Datasheet →EPF10K100BQC240-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$115 / Unit
View Datasheet →EPF10K100BQC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.95 / Unit
View Datasheet →EPF10K100EQC240-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Series | FLEX-10KE |
| Logic Elements / Cells | 4992 |
| Number of LABs / CLBs | 624 |
| Total RAM Bits | 49152 |
| Typical Gate Count | 100000 |
| Number of User I/Os | 189 |
| Supply Voltage (Core) | 2.375 V to 2.625 V |
| I/O Voltage | 3.3 V (MultiVolt: 1.8 V / 2.5 V / 3.3 V) |
| Process Technology | CMOS (0.42 µm) |
| Propagation Delay | 0.4 ns to 0.6 ns |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Package | 240-BFQFP (PQFP240, 32 x 32 mm) |
| Mounting Type | Surface Mount |
| Mounting Style | SMD / SMT |
| Configuration Method | SRAM (serial / JTAG) |
| Embedded Memory | EABs (12 blocks × 2048 bits) |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
| Status | Obsolete (EOL) |
EPF10K100EQC240-1 240-bfqfp (pqfp240, 32 x 32 mm) Pin Configuration Guide
Pin configuration for EPF10K100EQC240-1 (240-bfqfp (pqfp240, 32 x 32 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EQC240-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EQC240-1 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control Glue Logic, PCI Bus Bridges and Interfaces, Peripheral Controllers and Legacy Adapters, ASIC Prototyping and Pre-Silicon Validation, Legacy System Sustaining Engineering.
Telecommunications Line Cards
The EPF10K100EQC240-1 fits telecommunications line cards because its 100K-gate density and 189 user I/Os support multiple bus interfaces (UTOPIA, HDLC, TDM) within a single device. The 49,152 bits of embedded RAM via 12 EABs allow buffering of packet payloads and protocol headers without external memory for small data paths. Operating from a 2.5 V core with MultiVolt I/O, it interfaces directly to 3.3 V PHYs and 1.8 V DSPs without level shifters, simplifying board design. The -1 speed grade supports FastTrack interconnect clock rates suitable for T1/E1 framing and low-order SONET overhead processing, while JTAG boundary-scan enables bed-of-nails test access in volume manufacturing.
Recommended
Industrial Control Glue Logic
Industrial PLCs and motor controllers benefit from the EPF10K100EQC240-1's combination of high logic density and abundant I/Os to consolidate discrete TTL glue logic, custom state machines, and peripheral bridges into one programmable device. The 624 LABs and 4,992 LEs are sufficient for multi-axis encoder counters, PWM generators, and PROFIBUS / Modbus interface logic, replacing several CPLDs and ASICs. MultiVolt I/O enables direct connection to 3.3 V microcontrollers and 5 V sensors via external bus switches. Commercial 0 °C to 70 °C operation is acceptable for cabinet-mounted industrial equipment; for harsher environments the EPF10K100EQC240-1I (industrial) variant in the same footprint is preferred.
Recommended
PCI Bus Bridges and Interfaces
The EPF10K100EQC240-1 is well-suited for PCI bus bridge applications because it is one of the original Altera FPGAs certified for PCI compliance up to 33 MHz, with sufficient logic and I/O density to implement target or master state machines plus side-band logic. Its 189 user I/Os comfortably accommodate the 64-bit/66 MHz PCI-X extension plus parity and interrupt signals, while the embedded EABs can be configured as FIFOs for transaction buffering. The 2.5 V core and 3.3 V I/O match the standard PCI signaling environment, eliminating level translation. PCI designs using this part should follow Altera application note AN-218 for pin assignment and PCI-compliant IBIS models.
Recommended
Peripheral Controllers and Legacy Adapters
The EPF10K100EQC240-1 serves as an ideal peripheral controller in legacy system upgrades where SCSI, ISA, VME, or VESA local bus interfaces must be emulated or bridged to modern processors. With 4,992 LEs and 12 EABs, it can implement DMA engines, scatter-gather descriptors, and bus arbiters that previously required multiple discrete components. The 240-PQFP package's generous I/O count enables simultaneous connection to legacy 5 V buses (via external resistors) and 3.3 V host processors using MultiVolt I/O. Production engineers retrofitting older industrial or test equipment rely on the EPF10K100E for its mature, well-documented tool flow (Quartus II / MAX+PLUS II).
Recommended
ASIC Prototyping and Pre-Silicon Validation
Engineering teams use the EPF10K100EQC240-1 as an ASIC prototype vehicle before committing to a mask set, leveraging its 100K-gate capacity to validate design functionality, timing, and I/O behavior at near-ASIC speeds. Multiple instances can be cascaded via external interconnect for larger designs. The SRAM-based configuration allows rapid design iterations via JTAG or ByteBlaster, with cycle times under a minute for full bitstream reload. Embedded EABs let engineers prototype memory subsystems (FIFOs, dual-port RAM, ROM lookup tables) directly on the FPGA, eliminating external SRAM in validation boards. Quartus II supports post-layout timing simulation matched to the -1 speed grade.
Recommended
Legacy System Sustaining Engineering
Defense, aerospace, medical, and industrial OEMs with installed bases of FLEX 10KE-based products require sustained supply of the EPF10K100EQC240-1 for repair and refurbishment programs spanning 10-20 year lifecycles. The part's mature production history means extensive field data is available for reliability analysis, and the 240-PQFP package remains manufacturable at multiple sources. Distributors like Flip Electronics and brokers specializing in obsolete stock quote against this demand. Long-term reliability is documented in Altera's older reliability reports; for new designs, engineers should evaluate Cyclone IV or Cyclone 10 LP families as modern equivalents with active lifecycle status.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC240-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC240-1N | EPF10K100EQC240-2 | EPF10K100EQC240-3 | EPF10K100BQC240-1 | EPF10K100BQC240-3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 240-PQFP (BFQFP, 32×32 mm) | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same |
| Logic Elements / Cells | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Number of LABs / CLBs | 624 | 624 | 624 | 624 | 624 | 624 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 0 (no EABs in FLEX 10KB) | 0 (no EABs in FLEX 10KB) |
| Speed Grade | -1 (fastest) | -1 (same) | -2 (slower) | -3 (slowest) | -1 (same) | -3 (slowest) |
| Embedded Array Blocks (EABs) | 12 × 2048 bits | 12 × 2048 bits | 12 × 2048 bits | 12 × 2048 bits | None (FLEX 10KB uses LAB-based RAM) | None (FLEX 10KB uses LAB-based RAM) |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Key Differentiators
- Lead-free (RoHS) finish available in same package (vs EPF10K100EQC240-1N)
- Embedded Array Blocks (EABs) for distributed memory (vs EPF10K100BQC240-1)
- Three speed grades for cost/performance trade-off (vs EPF10K100EQC240-2 and EPF10K100EQC240-3)
Design Notes
The EPF10K100EQC240-1 requires two separate supply rails: VCCINT (2.375 V to 2.625 V, typically 2.5 V) for the core logic and configuration RAM, and VCCIO (3.3 V typical, with 1.8 V / 2.5 V MultiVolt options) for the I/O banks. Estimated: at 100% resource utilization with all 189 I/Os switching at 50 MHz, ICCINT can reach 300-500 mA; decouple each rail with 0.1 µF ceramic + 10 µF tantalum placed within 5 mm of each supply pin. Insufficient decoupling will cause configuration failures during JTAG programming or unpredictable logic glitches at high toggle rates.
The 240-PQFP / BFQFP package has gull-wing leads on 0.5 mm pitch with a 32 × 32 mm body; route signals on inner layers with 0.15 mm trace/space to escape the dense perimeter. Provide at least 4 power planes (VCCINT, VCCIO, GND, AUX) with stitching vias around the package perimeter. Add a copper heatsink pad beneath the package or thermal vias to a bottom-side copper pour, because sustained high-utilization designs can dissipate 1.5-2 W and the plastic PQFP has limited thermal conductivity (θJA ≈ 25-30 °C/W on a 4-layer PCB).
Three pitfalls recur in FLEX 10KE designs: (1) confusing the FLEX 10KE 'E' family with FLEX 10K (no E) or FLEX 10KB - the 10KE adds EABs and the 10KB has different architecture, making bitstreams incompatible; (2) assuming MultiVolt I/O tolerates 5 V input - the 10KE I/O absolute maximum is 4.6 V on 3.3 V banks and external clamping is required for 5 V interfaces; (3) failing to hold nCONFIG high during power-up ramp - if VCCINT rises slower than the configuration PROM allows, the device may enter an undefined state requiring power-cycling.
Clock inputs (CLK0-CLK3 and dedicated global clock pins) must be routed with controlled-impedance traces (50 Ω typical) and length-matched within 200 mils across the package. Avoid routing clock signals adjacent to high-toggle I/O to minimize crosstalk into the FastTrack interconnect. For PCI designs, follow Altera application note AN-218 pin recommendations to ensure IBIS model accuracy and meet PCI rev 2.1 signal-integrity requirements.
Compliance Information
EPF10K100EQC240-1 uses SnPb (tin-lead) termination finish per standard FLEX 10KE product line; the -1N suffix variant is the lead-free / RoHS-compliant option. RoHS, REACH, and conflict-mineral declarations are not in the verified web data and must be requested from the supplier. AEC-Q100 qualification is not applicable for commercial-grade FPGAs.
