EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel
MPN: EPF10K200EFC672-1 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EPF10K200EFC672-1 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user after manufacture. FPGAs sit at the apex of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement custom digital logic, glue logic, datapath acceleration, and full processor subsystems without the cost of an ASIC. The FLEX-10KE family extends the original FLEX-10K architecture with enhanced embedded array blocks (EABs), giving designers block-RAM-like memory in addition to distributed look-up-table logic.
Key features of the EPF10K200EFC672-1 include 470 user I/Os, a 1,248 LAB (Logic Array Block) count, a propagation delay figure of approximately 0.4 ns per logic element stage, and True-LVDS/PCI/LVTTL multi-standard I/O support. The device is offered in the commercial speed grade -1 and is compatible with the Quartus II MAX+PLUS II legacy design toolchains via the Altera Legacy Device Support path. On-chip resources include 12 EABs totaling 98,304 RAM bits, suitable for FIFO, dual-port RAM, and ROM implementations.
Typical applications for the EPF10K200EFC672-1 include telecommunications line cards, industrial control and instrumentation backplanes, legacy ASIC prototyping, glue-logic consolidation on PCBs, and PCI bus mastering peripherals. Designers still using this part typically do so for long-life industrial or avionics programs where re-qualification of newer FPGAs is not economical; Rochester Electronics is the authorized lifetime source for these legacy Altera devices.
When designing with the EPF10K200EFC672-1, ensure a 1.27 mm-pitch BGA land pattern with adequate microvia stacking, four-layer PCB minimum for signal integrity, and a stable 2.5V/3.3V/5V core/I-O supply tree. Decoupling must follow the Altera FLEX-10KE reference design with bulk tantalum plus 0.1 uF ceramic at every supply pin.
Drop-in alternatives for EPF10K200EFC672-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EFC672-1 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Family, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EFC672-2
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EPF10K200EFC672-3
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EPF10K200SFC672-1X
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EPF10K200EFC672-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX-10KE |
| Logic Elements | 9,984 |
| Typical Gates | 200,000 |
| User I/Os | 470 |
| Embedded Memory (bits) | 98,304 |
| Logic Array Blocks (LABs) | 1,248 |
| Package | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Process Technology | CMOS, SRAM-based |
| Propagation Delay | 0.4 ns |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Speed Grade | -1 |
| Mounting Type | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | 2.5 V (typical, FLEX-10KE) |
| RoHS Status | Compliant |
| Supply Voltage - Max | 3.3 V (I/O) |
| MSL Level | 3 (168 hours) |
EPF10K200EFC672-1 672-fbga (fineline bga), 27x27 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200EFC672-1 (672-fbga (fineline bga), 27x27 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200EFC672-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200EFC672-1 is suitable for 7 applications: Legacy Telecom Line Card Interface, Industrial Control and Instrumentation, ASIC Prototype and Emulation, Legacy PCI Bus Master Peripherals, Military and Avionics Retrofit Programs, Test and Measurement Instrumentation, Broadcast Video Routing and Switching.
Legacy Telecom Line Card Interface
The EPF10K200EFC672-1 fits legacy telecom line cards because its 470 user I/Os comfortably drive 32-bit parallel backplanes, TDM buses, and multi-channel serial links. The 9,984 logic elements and 12 embedded array blocks (EABs) totaling 98,304 RAM bits allow implementation of channelized framers, FIFO buffers, and HDLC controllers in a single chip. Designers retain the device because its 0.4 ns propagation delay matches tight TDM clock budgets, and the Quartus II legacy device flow preserves the bitstream for in-service upgrades.
Recommended
Industrial Control and Instrumentation
Industrial PLCs, motor controllers, and instrumentation backplanes use the EPF10K200EFC672-1 for glue-logic consolidation and custom datapath blocks. The 470 I/Os can directly interface to parallel ADC/DAC buses, encoder feedback, and opto-isolated control lines without external drivers. The FLEX-10KE EABs provide deterministic dual-port RAM for sample buffering, while the 0-70 C commercial temperature grade suits factory-floor enclosures with controlled ambient. Rochester Electronics' lifetime supply guarantees the part remains available for 15+ year industrial life cycles.
Recommended
ASIC Prototype and Emulation
Pre-silicon ASIC prototyping and system emulation leverage the EPF10K200EFC672-1's 200K-gate capacity to map large logic blocks before tape-out. The 9,984 logic elements and 12 EABs allow engineers to partition an ASIC into clock-domain-aligned blocks running at real ASIC speeds. Embedded array blocks implement register files and CAM structures while LABs handle random logic. The -1 speed grade's 0.4 ns propagation delay emulates worst-case ASIC timing paths for sign-off validation. Designers pair the part with Quartus II legacy support for bitstream compatibility with old ASIC emulation platforms.
Recommended
Legacy PCI Bus Master Peripherals
PCI bus-master cards and add-in peripherals historically employ the EPF10K200EFC672-1 because it supports the PCI 33 MHz/66 MHz I/O standard natively via dedicated I/O banks and meets PCI timing with margin. The 470 user I/Os provide ample headroom for 64-bit PCI-X bus extension, scatter-gather DMA engines, and interrupt controllers. On-chip EABs implement scatter-gather descriptor RAM. Industrial and test-and-measurement vendors continue to use this part for PCI-based DAQ cards where redesign is more expensive than re-qualifying long-life inventory.
Recommended
Military and Avionics Retrofit Programs
Long-life avionics and military programs continue to install the EPF10K200EFC672-1 because the original Altera design has been qualified under DO-254 and MIL-STD-810 processes, and re-qualifying a new FPGA is cost-prohibitive. The 470 I/Os interface to ARINC 429, MIL-STD-1553, and discrete avionics buses through external transceivers. Rochester Electronics supplies the part under AS6081 counterfeit-prevention controls with full traceability. Designers value the deterministic -1 speed grade for hard real-time flight-control loops.
Recommended
Test and Measurement Instrumentation
ATE pin-electronics, protocol analyzers, and bench instruments historically use the EPF10K200EFC672-1 to implement high-speed pattern generators, capture buffers, and protocol-state machines. The 9,984 logic elements plus 12 EABs hold deep capture RAM for parallel bus recording up to 470 channels. LVDS I/O support enables direct connection to high-speed probes without external serializers. The -1 speed grade ensures deterministic timing for sub-nanosecond test edges. Long-life supply from Rochester Electronics supports 10+ year instrument platforms.
Recommended
Broadcast Video Routing and Switching
SDI/HD-SDI routing matrices and broadcast switchers employ the EPF10K200EFC672-1 to handle parallel crosspoint switching at 270 Mb/s and 1.485 Gb/s line rates. The 470 I/Os drive multi-channel parallel video buses; EABs buffer line-rate video FIFOs. True-LVDS I/O support directly interfaces to SDI deserializer chips. Designers keep this part in long-life broadcast equipment because the architecture has been bit-for-bit validated against SDI jitter masks and SMPTE compliance requirements over years of deployment.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EFC672-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EFC672-2 | EPF10K200EFC672-3 | EPF10K200SFC672-1X |
|---|---|---|---|---|
| Package | 672-FBGA (FC672) 27x27 mm | 672-FBGA (FC672) 27x27 mm - same | 672-FBGA (FC672) 27x27 mm - same | 672-FBGA (SFC672) - same ball count |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | FLEX-10KE | FLEX-10KE - same | FLEX-10KE - same | Stratix |
| Logic Elements | 9,984 | 9,984 | 9,984 | 10,570 (Stratix equivalent) |
| User I/Os | 470 | 470 | 470 | 426 |
| Speed Grade | -1 (fastest) | -2 (medium) | -3 (slowest) | -1X |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete (Stratix original) |
Key Differentiators
- Fastest speed grade in FLEX-10KE family (vs EPF10K200EFC672-2)
- Same BGA footprint across FLEX-10KE density family (vs EPF10K130EFC672-1)
- Higher I/O count than Stratix equivalent (vs EPF10K200SFC672-1X)
Design Notes
The 672-ball FC FineLine BGA has a 1.27 mm ball pitch, which requires microvia-in-pad PCB technology. Use at minimum a 4-layer stack-up with the second layer as a continuous ground plane under the device to control impedance and provide return paths for the 470 high-speed I/Os. Power planes must be split for 2.5 V core, 3.3 V I/O banks, and 1.5 V auxiliary supplies; use islands, not splits, when high-speed LVDS traverses bank boundaries.
Estimated: at full I/O toggle with all 470 outputs driving 10 pF loads at 100 MHz, the EPF10K200EFC672-1 dissipates approximately 4 W. The FC672 BGA's exposed-die pad provides a thermal resistance of roughly 8 C/W with a 1 square inch copper ground plane on the top layer. Mount the part with sufficient airflow (200 LFM minimum) or attach a small heatsink to keep junction temperature below 100 C in the commercial grade.
Do not confuse the EPF10K200EFC672-1 (FLEX-10KE, commercial, speed grade -1) with the EPF10K200EBI600-2N (FLEX-10KE industrial, BGA-600) - the package code and temperature grade differ even though both are FLEX-10KE family. Mismatched MSEL pin strapping can leave the device in an unsupported configuration mode; refer to the FLEX-10KE Configuration Handbook for the correct MSEL[2:0] pull values for AS, AP, PS, and JTAG modes.
Route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from high-speed I/O to avoid noise coupling during configuration. Keep JTAG TCK below 10 MHz and provide a 10 kohm pull-up on nCONFIG. Place the EPC configuration EEPROM or configuration CPLD within 50 mm of the FPGA to maintain signal integrity on the parallel configuration bus.
Compliance Information
RoHS and lead-free per Altera FLEX-10KE product declaration. AEC-Q100 not applicable to FPGAs; legacy industrial/military programs rely on DO-254 or MIL-STD-810 process qualifications instead.
