EPF10K200SFC672-1 - FLEX 10KE FPGA 200K Gates 9984 Cells | Altera
MPN: EPF10K200SFC672-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198.5 | $19,850.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138.75 | $138,750.00 |
EPF10K200SFC672-1 Overview
What is a FLEX 10KE FPGA? The FLEX 10KE family belongs to the historical hierarchy of programmable logic devices (PLDs) - specifically the family of fine-grained, SRAM-based FPGAs introduced by Altera in the mid-1990s as a second-generation FLEX architecture. In the taxonomy hierarchy, an FPGA sits under Programmable Logic > PLD > CPLD/FPGA > SRAM-based FPGA > FLEX 10KE. Each logic element (LE) contains a 4-input LUT, a programmable register, and a carry chain, while groups of LEs form logic array blocks (LABs) that interconnect through a continuous FastTrack routing fabric. The 'KE' suffix denotes enhanced embedded array blocks for distributed RAM, ROM, and FIFO functions, expanding the device beyond pure glue logic into system-on-a-programmable-chip (SOPC) integration.
Key features include 9984 logic elements organized into LABs, 12 embedded array blocks (EABs) providing up to 98,304 bits of RAM, 470 user I/Os for high-pin-count board designs, multi-volt I/O support (2.5 V/3.3 V/5.0 V PCI-compliant), and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports four input clock pins plus dedicated clock lock circuitry for clock-domain management.
Architecturally, the EPF10K200SFC672-1 uses a continuous hierarchical interconnect (FastTrack) that spans rows and columns of LABs with predictable routing delays, simplifying static timing closure compared with segmented FPGA fabrics. The 0.22 µm SRAM process delivers low static power (typical Icc standby around 50 mA) and supports live reconfiguration, allowing the logic function to be updated in the field without powering down the board.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, military and aerospace signal processing, prototyping for ASIC replacement, multi-channel DMA controllers, and bus-interface bridging (PCI, VME, ISA, I²C). The 672-ball FBGA package enables the high I/O count needed for memory-bus expansion and parallel data-path applications.
When designing with the EPF10K200SFC672-1, plan for a multi-rail power design (2.5 V VCCINT plus a separate VCCIO bank supply), place decoupling capacitors within 5 mm of each power pin, and route JTAG signals with 4.7 kΩ pull-ups on TCK/TMS/TDI. Use Altera MAX+PLUS II or Quartus II (legacy) for synthesis, fitting, and timing analysis. The 672-BGA footprint requires careful PCB stack-up planning with microvia or via-in-pad technology for cost-effective assembly.
This page synthesizes distributor pricing (DigiKey, Mouser, Arrow), real-time stock and lead-time signals, drop-in and same-package alternatives, and practical design notes that go beyond what the original Altera datasheet provides.
Drop-in alternatives for EPF10K200SFC672-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC672-1 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC672-1X
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EPF10K200SFC672-2
✅ Drop-In✓ In Stock
$320 / Unit
View Datasheet →EPF10K200SFC672-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SFI672-2
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EPF10K200SFI672-1
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200EFC672-1
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200EFC672-2
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EPF10K200SFC672-1 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX 10KE (FLEX-10KS) |
| Logic Elements / Cells | 9984 |
| Total RAM Bits | 98304 |
| Number of LABs/CLBs | 1248 |
| Number of User I/Os | 470 |
| Number of Gates | 200K system gates |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (multi-volt) |
| Maximum Operating Frequency | 250 MHz |
| Propagation Delay | 0.4 ns |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| Package Type | 672-ball FBGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) + serial/parallel passive configuration |
| Embedded Array Blocks (EABs) | 12 |
| Speed Grade | -1 |
| Mounting Type | Surface Mount |
EPF10K200SFC672-1 672-ball fbga (fineline bga), 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SFC672-1 (672-ball fbga (fineline bga), 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC672-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC672-1 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Verification, Military and Aerospace Signal Processing, Multi-Channel DMA and Memory Bridging, Medical Imaging Front-End Processing.
Telecommunications Line Cards
The EPF10K200SFC672-1 is well matched to telecommunications line-card designs that require 470 user I/Os for parallel bus aggregation and fast register-rich glue logic. The device's 9984 logic cells (organized into 1248 LABs) and 12 embedded array blocks providing 98,304 bits of RAM are sufficient to implement HDLC controllers, UTOPIA-2 interfaces, and multi-channel DMA engines on a single chip. The 250 MHz internal Fmax supports 155 Mbps POS-PHY and 622 Mbps UTOPIA-3 backplane interconnects. Engineers place the device between a network processor (e.g. Intel IXP) and external SSRAM/SDRAM, configuring the LABs as FIFO bridges. The 672-FBGA package keeps the line card within typical 12-layer board real estate.
Recommended
Industrial Control and Factory Automation
In factory-automation backplanes, the EPF10K200SFC672-1 is used as a multi-protocol bridge between PLC CPUs and field-bus transceivers (Profibus, DeviceNet, CANopen). The 470 user I/Os handle dozens of discrete I/O channels and serial interfaces simultaneously, while the 12 EABs implement per-channel FIFO buffers for deterministic data hand-off. Industrial temperature designs choose the EPF10K200SFI672-1 (industrial-temp variant) for -40 °C to +85 °C operation in cabinet environments. The 0.4 ns propagation delay and 250 MHz Fmax enable real-time control loops under 1 µs. Hot-swap designs use the SRAM-based fabric for live firmware updates via JTAG without shutting down the line.
Recommended
ASIC Prototyping and Verification
Engineers have long used the EPF10K200SFC672-1 as an ASIC-prototype vehicle because its 200K gates and 9984 logic cells closely match the density of mid-1990s ASICs. The 470 user I/Os allow the prototype board to mirror production ASIC pin-out with minimal logic duplication, while the SRAM-based fabric enables rapid design-iteration cycles. Multi-FPGA prototyping platforms partition large ASIC designs across 4-8 EPF10K200S devices interconnected via board-level FastTrack equivalents. Quartus II synthesis reports map to ASIC synthesis metrics within 5-10 %, providing high-fidelity pre-tapeout verification.
Recommended
Military and Aerospace Signal Processing
Military and aerospace platforms that originally qualified the EPF10K200SFC672-1 in the late 1990s still rely on it for radar-signal preprocessing, IR-camera front-ends, and avionics bus multiplexers. The 250 MHz fabric runs 1024-point FFT cores and adaptive-beamforming filters in real time, while the embedded array blocks provide coefficient ROM for FIR/IIR filters. For airborne platforms, the EPF10K200SFC672-1's commercial 0-70 °C grade is used in temperature-controlled avionics bays; unpressurized installations upgrade to the EPF10K200SFI672-2 industrial-temp part. Long-lifecycle programmes require obsolescence management and bridge sourcing through QML-listed distributors.
Recommended
Multi-Channel DMA and Memory Bridging
The EPF10K200SFC672-1 is well suited to multi-channel DMA controller implementations that aggregate PCI, VME, and ISA bus traffic in legacy backplane systems. The 12 EABs implement independent channel FIFOs (up to 2 Kbits each) without external SRAM, while the LAB fabric implements scatter-gather descriptors and protocol-state machines. With 470 user I/Os, the device can drive 8-16 channel DMA engines concurrently at 66 MHz PCI rates. The 0.4 ns propagation delay allows the controller to maintain deterministic bus arbitration. Power-sequencing the 2.5 V VCCINT and 3.3 V VCCIO independently simplifies hot-swap insertion on VME64x backplanes.
Recommended
Medical Imaging Front-End Processing
In medical-imaging front-ends (ultrasound beamformers, MRI gradient controllers, CT detector pre-processors), the EPF10K200SFC672-1 implements channel-multiplexing, ADC-to-FIFO pipelines, and timing-critical trigger logic. The 250 MHz fabric and 98 Kbits of EAB-based RAM allow 32-64 channel acquisition pipelines running at 40 MSPS without external buffer memory. Engineers route LVDS pairs from the ADC directly to the FPGA's multi-volt I/O banks, eliminating external level translators. The 672-FBGA's 470 I/Os scale to 16-bit parallel ADC clusters feeding a downstream DSP. Long-life medical platforms maintain last-time-buy inventory to support 10-15 year service cycles.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC672-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC672-1X | EPF10K200SFC672-2 | EPF10K200SFI672-1 | EPF10K200EFC672-1 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FBGA (45x45 mm, 1.27 mm pitch) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 |
| User I/Os | 470 | 470 | 470 | 470 | 470 |
| Speed Grade | -1 | -1 | -2 (slower) | -1 | -1 |
| Temperature Grade | Commercial (0 to +70 °C) | Commercial | Commercial | Industrial (-40 to +85 °C) | Commercial |
| Family | FLEX 10KS (standard) | FLEX 10KS | FLEX 10KS | FLEX 10KS | FLEX 10KE (enhanced EABs) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same 672-FBGA pinout across all speed grades (vs EPF10K200SFC672-2)
- FLEX 10KS standard variant with 12 EABs (vs EPF10K200EFC672-1 (FLEX 10KE enhanced))
- Commercial temperature 0 to +70 °C (vs EPF10K200SFI672-1 (industrial))
Design Notes
Design a multi-rail power system: 2.5 V VCCINT must ramp before or simultaneously with VCCIO, never after — out-of-order ramp can latch-up the I/O buffers. Use a supervisor such as TPS3823 to sequence the rails. Place one 0.1 µF ceramic decoupling cap within 5 mm of every VCCINT/VCCIO ball pair, plus 10 µF tantalum bulk caps at each supply island. Total VCCINT current at 250 MHz operation is typically 0.5-1 A depending on toggle rate.
The 672-FBGA at 1.27 mm pitch requires a 6-layer minimum stack-up with 0.5 oz copper and laser-drilled microvias (8 mil pad, 4 mil via). Route signals on inner layers only — outer layers are reserved for BGA fan-out and ground pour. Maintain 50 Ω single-ended impedance on critical clock nets (TCK, clock inputs) using 4-5 mil trace width on a 4 mil dielectric. JTAG signals TCK, TMS, TDI require 4.7 kΩ pull-ups to VCCIO; TDO is push-pull.
Do not use Quartus II version 13.0 or newer — FLEX 10KE support was dropped at version 9.1. The last supported IDE is MAX+PLUS II 10.23 or Quartus II 9.1sp2. A common mistake is leaving CONF_DONE floating; it must be pulled to VCCIO via a 4.7 kΩ resistor so the configuration controller knows the bitstream load completed. The nCONFIG pin should be tied to VCCIO through a 10 kΩ pull-up and decoupled with a 1000 pF cap.
DDR clock-to-data skew on the FastTrack interconnect can exceed 200 ps; budget 250 ps of timing margin and use the Altera TimeQuest slow-corner analysis to validate setup/hold. For LVDS pairs routed to the FPGA, place 100 Ω differential termination within 5 mm of the receiver balls. SSN (simultaneous switching noise) on the 5 V PCI I/O bank can exceed 1 V if more than 16 outputs toggle simultaneously; sequence the output enables in the design to limit bank SSN.
Compliance Information
The -1 commercial-temp variant does not have a published RoHS compliance statement in the verified data; the EPF10K200SFC672-1X lead-free variant carries RoHS compliance (X suffix). REACH and conflict-mineral status not stated in the verified data; engineers should request a manufacturer letter for new EU sales.
