EPF10K200SFC672-1X - 200K Gates FLEX-10KS FPGA, 470 I/O | Intel
MPN: EPF10K200SFC672-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $135 | $135,000.00 |
EPF10K200SFC672-1X Overview
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. The FLEX-10KS family belongs to the older Altera FLEX 10K architecture lineage, which historically targeted high-density glue logic, bus interfacing, and DSP co-processing in telecom, networking, and industrial control. Within the broader taxonomy, FPGAs sit alongside CPLDs as programmable logic devices, distinguished from ASICs by their reprogrammability and from microcontrollers by their hardware-parallel execution model.
Key features of the EPF10K200SFC672-1X include 1,248 Logic Array Blocks (LABs), a propagation delay of approximately 0.4 ns, and 4-input look-up table (LUT) based logic elements. The device supports in-system programmability via the IEEE Std. 1149.1 JTAG interface, which adds up to 31,250 gates of boundary-scan logic. Core supply voltage operates at 2.5 V (2.375 V to 2.625 V), and the device is rated for commercial temperature operation (0 °C to 70 °C).
Architecturally, the FLEX-10KS combines a fine-grained logic array with coarse-grained embedded array blocks, allowing designers to implement wide data-path functions efficiently. The 27 × 27 mm FineLine BGA package with 1.0 mm ball pitch balances high I/O count with manageable PCB layout requirements compared to larger pitch alternatives. Each I/O pin supports JTAG boundary-scan testing, simplifying board-level validation.
Typical applications include telecommunications backplane interfacing, ASIC prototyping, DSP co-processing, industrial control glue logic, and legacy system redesigns requiring drop-in FLEX-10K compatibility. The 470 user I/O count makes the device well-suited for memory-rich data buffering and bus-bridging functions in embedded systems.
When designing with this FPGA, ensure the Quartus design tool supports the legacy FLEX 10K device family, since current Quartus versions have removed older device support. Use dedicated configuration devices (such as EPC2 or EPC8) or JTAG for bitstream loading, and account for the SRAM-based configuration requiring reconfiguration at every power-up. The 672-BGA package demands careful PCB layout with 1.0 mm pitch routing and thermal management for sustained operation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy manufacturer datasheet.
Drop-in alternatives for EPF10K200SFC672-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC672-1X (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC672-1
✅ Drop-In✓ In Stock
$138.75 / Unit
View Datasheet →EPF10K200EFC672-3
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EPF10K200EFC672-2
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EPF10K200EFC672-1
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200SFC672-1X Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KS |
| Family | FLEX 10K (legacy) |
| Architecture | Reconfigurable CMOS SRAM |
| Typical System Gates | 200,000 |
| Logic Elements (LEs) | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded Array Blocks (EABs) | 24 |
| Embedded RAM Bits | 98,304 |
| User I/O Pins | 470 |
| Propagation Delay | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Package | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) |
| Design Tool | Quartus (legacy FLEX 10K support) |
EPF10K200SFC672-1X 672-ball fineline bga, 27 × 27 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SFC672-1X (672-ball fineline bga, 27 × 27 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC672-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC672-1X is suitable for 6 applications: Telecom Backplane Interfacing, ASIC Prototyping, Industrial Control and Glue Logic, Legacy System Maintenance and Redesign, DSP Co-Processing, Embedded Memory and Buffering.
Telecom Backplane Interfacing
The EPF10K200SFC672-1X is well suited for telecom backplane interfacing thanks to its 470 user I/O pins and 200K-gate capacity, which together support wide parallel bus bridging between legacy TDM framers and modern packet processors. Placed on a line card between the framer ASIC and the network processor, the FLEX-10KS device performs protocol conversion, clock domain crossing, and per-channel buffering. The 98,304 bits of embedded RAM across 24 EABs are sufficient for elastic stores and small FIFOs, eliminating external SRAM and saving board area. Designers value the 0.4 ns propagation delay for tight timing budgets on high-speed telecom backplanes.
Recommended
ASIC Prototyping
Engineers use the EPF10K200SFC672-1X as a target for ASIC prototypes where 200K gates of capacity and 470 I/O pins approximate mid-complexity ASIC designs. The FLEX-10KS SRAM architecture allows full reconfiguration for design iterations, drastically shortening the verification cycle. With 9,984 logic elements and 24 EABs, the device can emulate ASIC blocks such as memory controllers, peripheral bridges, and custom DSP datapaths. The JTAG interface simplifies prototype bring-up by enabling in-system programming and boundary-scan board test.
Recommended
Industrial Control and Glue Logic
In factory automation systems, the EPF10K200SFC672-1X replaces dozens of 74-series logic devices with a single reconfigurable IC, reducing PCB area and BOM cost. The 470 I/O count supports multi-axis motor control interfaces, encoder inputs, and parallel sensor aggregation. Industrial designs benefit from the device's commercial 0-70 °C operating range and robust CMOS SRAM architecture that handles the moderate temperature swings of factory environments. Designers use FLEX-10KE migration when higher speed is required without board rework.
Recommended
Legacy System Maintenance and Redesign
For end-of-life telecom and industrial systems originally designed around FLEX-10K, the EPF10K200SFC672-1X remains the preferred replacement to preserve existing PCBs and firmware investments. Engineers field-fail the original part due to long service life and need a direct drop-in on the same 672-FBGA footprint. The identical pinout across FLEX-10KS and FLEX-10KE speed grades means a single PCB supports multiple lifecycle extensions. Rochester Electronics and authorized distributors maintain inventory specifically for these maintenance scenarios.
Recommended
DSP Co-Processing
The EPF10K200SFC672-1X serves as a co-processor to offload DSP functions such as FIR filtering, FFT stages, and CRC calculation from a host CPU. The 24 embedded array blocks deliver 98,304 bits of memory for coefficient storage and sample buffers, while the 1,248 LABs implement parallel datapath logic. With 0.4 ns propagation delay, the device achieves DSP throughput that older microcontrollers cannot match, particularly for parallel multi-channel audio or baseband processing. The fine-line BGA package supports dense multi-board DSP subsystems.
Recommended
Embedded Memory and Buffering
The 98,304 bits of distributed embedded RAM make the EPF10K200SFC672-1X effective for FIFO buffering, elastic store, and lookup-table applications. The 24 embedded array blocks can each be configured as 256×8, 512×4, 1024×2, or 2048×1 RAM, supporting a wide range of buffer geometries. Placed between high-speed serial links and a slower processor bus, the device performs clock-domain crossing and rate adaptation. Engineers designing packet inspection or video line buffers leverage the high I/O count for parallel access across multiple data streams.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC672-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC672-1 | EPF10K200EFC672-3 | EPF10K200EFC672-2 | EPF10K200EFC672-1 |
|---|---|---|---|---|---|
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX-10KS | FLEX-10KS | FLEX-10KE (enhanced) | FLEX-10KE (enhanced) | FLEX-10KE (enhanced) |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| LABs | 1,248 | 1,248 | 1,248 | 1,248 | 1,248 |
| EABs / RAM Bits | 24 EABs / 98,304 bits | 24 EABs / 98,304 bits | 24 EABs / 98,304 bits | 24 EABs / 98,304 bits | 24 EABs / 98,304 bits |
| User I/O | 470 | 470 | 470 | 470 | 470 |
| Speed Grade | -1X | -1 | -3 (fastest) | -2 | -1 |
Key Differentiators
- Highest I/O count in FLEX-10K 672-BGA family (vs EPF10K200SBC600-2)
- Direct drop-in compatibility across FLEX-10KS and FLEX-10KE (vs EPF10K200EFC672-3)
- Optimized for legacy telecom and industrial maintenance (vs Modern Cyclone or Lattice ECP5)
Design Notes
Estimated: Because FLEX-10KS is SRAM-based, the bitstream is volatile and must be reloaded at every power-up via a configuration device (EPC2, EPC4, EPC8) or JTAG. Designers new to FLEX 10K frequently forget that the device does not retain configuration when VCC drops below 2.0 V, and may see 'configuration failure' on brown-out. Use a supervisory reset IC or configure the POR (power-on-reset) hold time appropriately for the chosen configuration source.
Estimated: The 672-ball FineLine BGA at 1.0 mm pitch demands a 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Escape routing typically uses dog-bone fanout patterns; plan for at least 4 routing layers between the BGA and the rest of the board. Decoupling must include bulk 100 µF tantalum near the device plus 0.1 µF and 0.01 µF ceramics per VCCIO/VCCINT pin pair to suppress switching noise.
Estimated: Although the FLEX-10KS device is implemented in a mature 0.42 µm process, sustained operation at high toggle rates and high ambient temperatures can produce junction hot spots. At 0.4 ns propagation delay with all 470 I/Os switching, internal power dissipation can exceed 2 W, requiring thermal vias under the BGA thermal balls and adequate copper pour on inner layers. Always validate thermal performance in the actual chassis.
Signal integrity on the FLEX-10KS device benefits from matched-length routing on parallel buses and series termination on high-speed outputs. The FLEX-10K I/O structure is LVTTL/LVCMOS compatible at 3.3 V with some 5 V tolerance; design with 50 Ω controlled-impedance traces for clock and high-speed I/O. Use Quartus II pin planning tools (legacy FLEX 10K device support) to assign I/O standards and verify timing closure before layout.
Compliance Information
Compliance information not specified in verified web data. Original FLEX 10K family datasheets typically predate formal RoHS documentation; contact Intel for current compliance certificates. Not AEC-Q100 qualified - commercial grade only.
